Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19320623 | METHOD TO PRODUCE A 3D MULTILAYER SEMICONDUCTOR DEVICE AND STRUCTURE | September 2025 | March 2026 | Allow | 6 | 0 | 0 | No | No |
| 19260224 | COMPLEMENTARY SEMICONDUCTOR DEVICES USING HALIDE PEROVSKITE THIN FILMS | July 2025 | November 2025 | Allow | 5 | 1 | 0 | No | No |
| 19218716 | SILICON CARBIDE DETECTOR AND FABRICATION METHOD THEREOF | May 2025 | December 2025 | Allow | 6 | 1 | 1 | No | No |
| 19119588 | MANUFACTURING METHOD FOR A POWER SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE | April 2025 | September 2025 | Allow | 6 | 1 | 0 | No | No |
| 19109527 | POWER MODULE COMPRISING A SEMICONDUCTOR MODULE COMPONENT AND AN ALIGNMENT PART, AND METHOD FOR FORMING THE POWER MODULE | March 2025 | June 2025 | Allow | 3 | 0 | 0 | No | No |
| 19036506 | MICROSTRUCTURE ENHANCED ABSORPTION PHOTOSENSITIVE DEVICES | January 2025 | October 2025 | Allow | 9 | 1 | 0 | Yes | No |
| 19030244 | DISPLAY DEVICE | January 2025 | March 2025 | Allow | 2 | 0 | 0 | Yes | No |
| 18956395 | FE-FET STRUCTURE WITH BURIED ELECTRODE | November 2024 | July 2025 | Allow | 8 | 1 | 1 | No | No |
| 18867459 | Semiconductor device AND manufacturing METHOD THEREOF | November 2024 | April 2025 | Allow | 5 | 0 | 0 | No | No |
| 18949173 | ACENTRIC NON-ROUND ELECTRICAL INTERCONNECTIONS | November 2024 | August 2025 | Allow | 9 | 1 | 1 | Yes | No |
| 18939075 | FACE BONDED SEMICONDUCTOR DEVICE WITH THROUGH OXIDE VIA AND METAL PLUG | November 2024 | November 2025 | Allow | 12 | 2 | 1 | Yes | No |
| 18931666 | SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT STRUCTURE WITH METAL JUMP STRUCTURE CONNECTING ADJACENT METAL LINES | October 2024 | June 2025 | Allow | 8 | 1 | 1 | Yes | No |
| 18929113 | VERTICAL MEMORY DEVICES | October 2024 | October 2025 | Allow | 12 | 0 | 0 | No | No |
| 18922192 | SEMICONDUCTOR DIE ASSEMBLIES WITH DECOMPOSABLE MATERIALS AND ASSOCIATED METHODS AND SYSTEMS | October 2024 | October 2025 | Allow | 12 | 0 | 0 | No | No |
| 18908950 | STRUCTURES WITH DEEP TRENCH ISOLATION REGIONS FOR A HIGH-VOLTAGE FIELD-EFFECT TRANSISTOR | October 2024 | February 2025 | Allow | 5 | 1 | 0 | No | No |
| 18905089 | OPTICAL SENSING APPARATUS | October 2024 | February 2025 | Allow | 4 | 1 | 0 | Yes | No |
| 18829143 | HOMOGENEOUS OPTOELECTRONIC RESERVOIR COMPUTING SYSTEM BASED ON NITROGEN-DOPED GE-SB-TE MATERIAL | September 2024 | August 2025 | Abandon | 11 | 1 | 0 | No | No |
| 18822880 | MICROSTRUCTURE ENHANCED ABSORPTION PHOTOSENSITIVE DEVICES | September 2024 | January 2025 | Allow | 4 | 1 | 0 | Yes | No |
| 18810963 | LEAD FRAME DEVICE WITH SHARED TERMINAL | August 2024 | July 2025 | Allow | 11 | 1 | 1 | No | No |
| 18809802 | BIASING AND READOUT METHODS FOR HIGH-SPEED RESISTIVE GATE SENSOR | August 2024 | February 2026 | Allow | 18 | 1 | 1 | No | No |
| 18808758 | SEMICONDUCTOR DEVICE INCLUDING BACKSIDE CONTACT STRUCTURE WITH SILICIDE LAYER FORMED IN FEOL PROCESS | August 2024 | June 2025 | Allow | 10 | 2 | 1 | Yes | No |
| 18808892 | SEMICONDUCTOR MODULE | August 2024 | October 2024 | Allow | 2 | 0 | 0 | No | No |
| 18806772 | PHOTODETECTORS WITH MULTIPLE LIGHT-ABSORBING SEMICONDUCTOR LAYERS | August 2024 | February 2025 | Allow | 6 | 1 | 0 | No | No |
| 18806478 | HERMETIC MICROELECTRONIC MODULE USING A SHEATH | August 2024 | August 2025 | Allow | 12 | 2 | 1 | No | No |
| 18793939 | METHOD TO PRODUCE A 3D MULTILAYER SEMICONDUCTOR DEVICE AND STRUCTURE | August 2024 | July 2025 | Allow | 11 | 1 | 0 | No | No |
| 18834521 | ARRANGEMENT FOR A SEMICONDUCTOR ARRANGEMENT COMPRISING AT LEAST ONE PASSIVE COMPONENT AND A SUBSTRATE | July 2024 | July 2025 | Allow | 12 | 1 | 1 | Yes | No |
| 18788822 | WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING | July 2024 | October 2025 | Allow | 14 | 0 | 0 | No | No |
| 18787689 | ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF | July 2024 | September 2024 | Allow | 1 | 0 | 0 | No | No |
| 18783965 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | July 2024 | July 2025 | Allow | 11 | 1 | 0 | No | No |
| 18777478 | HIGH-SENSITIVITY AVALANCHE PHOTODETECTORS | July 2024 | January 2025 | Allow | 6 | 1 | 0 | No | No |
| 18774282 | SEMICONDUCTOR DEVICE HAVING A BACKSIDE METALLIZATION LAYER AND A PROTECTION LAYER | July 2024 | January 2026 | Allow | 18 | 2 | 0 | No | No |
| 18772320 | THIN FILM RESISTOR WITH VIABAR STRUCTURE | July 2024 | November 2025 | Allow | 16 | 3 | 1 | Yes | No |
| 18768451 | QUANTUM DOT LIGHT EMITTING STRUCTURE, METHOD FOR MANUFACTURING THE SAME, ARRAY SUBSTRATE, AND DISPLAY DEVICE | July 2024 | August 2025 | Allow | 13 | 1 | 0 | No | No |
| 18768308 | DISPLAY DEVICE HAVING A SEMICONDUCTOR LAYER STRUCTURE INCLUDING A THIRD PORTION EXTENDING IN A THIRD DIRECTION DIRECTLY CONNECTING TO A FIRST PORTION AND A SECOND PORTION THAT EXTEND IN DIFFERENT DIRECTIONS | July 2024 | December 2025 | Allow | 18 | 2 | 0 | Yes | No |
| 18766974 | ECCENTRIC VIA STRUCTURES FOR STRESS REDUCTION | July 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18765489 | INDUCTORS WITH AIRGAP ELECTRICAL ISOLATION | July 2024 | October 2024 | Allow | 4 | 1 | 0 | No | No |
| 18766279 | PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS | July 2024 | November 2025 | Allow | 16 | 2 | 0 | No | No |
| 18761691 | METHOD FOR MAKING MEMORY DEVICE INCLUDING A SUPERLATTICE GETTERING LAYER | July 2024 | February 2025 | Allow | 8 | 2 | 0 | No | No |
| 18760656 | TRANSISTOR GATE STRUCTURES AND METHODS OF FORMING THE SAME | July 2024 | September 2025 | Allow | 14 | 0 | 0 | No | No |
| 18754507 | Work Function Control In Gate Structures | June 2024 | December 2025 | Allow | 18 | 2 | 0 | Yes | No |
| 18754367 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC EQUIPMENT | June 2024 | February 2025 | Allow | 8 | 0 | 1 | No | No |
| 18754418 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | June 2024 | January 2025 | Allow | 6 | 0 | 1 | No | No |
| 18753697 | METHOD FOR ION IMPLANTATION THAT ADJUSTS A TARGET'S TILT ANGLE BASED ON A DISTRIBUTION OF EJECTED IONS FROM A TARGET | June 2024 | December 2025 | Allow | 18 | 1 | 0 | No | No |
| 18749274 | HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18746818 | INPUT/OUTPUT SEMICONDUCTOR DEVICES | June 2024 | August 2025 | Allow | 14 | 1 | 0 | No | No |
| 18745743 | ARRAY OF HEAT-SINKED POWER SEMICONDUCTORS | June 2024 | January 2026 | Allow | 19 | 2 | 0 | No | No |
| 18745613 | Semiconductor Package and Method | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18745704 | GATE-ALL-AROUND STRUCTURE WITH SELF SUBSTRATE ISOLATION AND METHODS OF FORMING THE SAME | June 2024 | July 2025 | Allow | 13 | 1 | 0 | No | No |
| 18745970 | DISPLAY DEVICE | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18743906 | CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | June 2024 | December 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18744087 | SEMICONDUCTOR DEVICE | June 2024 | January 2025 | Allow | 8 | 0 | 0 | Yes | No |
| 18741166 | ETCH PROFILE CONTROL OF ISOLATION TRENCH | June 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18741029 | HIGH PERFORMANCE IMAGE SENSOR | June 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18740503 | PACKAGE STRUCTURE | June 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18738438 | 3D NAND - HIGH ASPECT RATIO STRINGS AND CHANNELS | June 2024 | July 2025 | Allow | 14 | 1 | 0 | No | No |
| 18734053 | DISPLAY DEVICE | June 2024 | March 2025 | Allow | 9 | 1 | 0 | No | No |
| 18732767 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE HAVING VERTICAL MISALIGNMENT | June 2024 | July 2025 | Allow | 13 | 1 | 0 | No | No |
| 18733499 | GATE-ALL-AROUND STRUCTURE AND METHODS OF FORMING THE SAME | June 2024 | September 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18732484 | Power Semiconductor Packaging and Manufacturing Method Thereof | June 2024 | August 2024 | Allow | 3 | 0 | 0 | No | No |
| 18732430 | HIGH VOLTAGE LIGHT-EMITTING DEVICE | June 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18731392 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | June 2024 | March 2025 | Allow | 9 | 1 | 0 | No | No |
| 18731454 | TRENCH GATE HIGH VOLTAGE TRANSISTOR FOR EMBEDDED MEMORY | June 2024 | July 2025 | Allow | 13 | 1 | 0 | No | No |
| 18676730 | THIN FILM TRANSISTOR INCLUDING A DIELECTRIC DIFFUSION BARRIER AND METHODS FOR FORMING THE SAME | May 2024 | October 2025 | Allow | 17 | 0 | 0 | No | No |
| 18675367 | STRUCTURES FOR A FIELD-EFFECT TRANSISTOR THAT INCLUDE A SPACER STRUCTURE | May 2024 | March 2025 | Allow | 9 | 2 | 1 | Yes | No |
| 18676431 | DISPLAY PANEL AND DISPLAY DEVICE | May 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18675750 | MANUFACTURING METHOD OF AN ELECTRONIC DEVICE | May 2024 | July 2025 | Allow | 14 | 2 | 0 | No | No |
| 18675098 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | May 2024 | August 2025 | Allow | 14 | 1 | 0 | No | No |
| 18674989 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION THEREOF | May 2024 | October 2025 | Allow | 16 | 1 | 0 | No | No |
| 18673308 | CAPACITOR COMPRISING ANTI-FERROELECTRIC LAYERS AND HIGH-K DIELECTRIC LAYERS | May 2024 | February 2026 | Allow | 21 | 1 | 1 | No | No |
| 18673521 | SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND ISOLATION STRUCTURES | May 2024 | February 2025 | Allow | 8 | 1 | 0 | No | No |
| 18672936 | STACKING CMOS STRUCTURE | May 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18671652 | SEMICONDUCTOR MODULE | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18671619 | LIGHT EMITTING DIODE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18669566 | METHOD FOR FORMING A SEMICONDUCTOR DIE AND A PHOTOELECTRIC DEVICE INTEGRATED IN A SAME PACKAGE | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18669679 | SEMICONDUCTOR MEMORY DEVICE | May 2024 | February 2026 | Allow | 21 | 2 | 0 | No | No |
| 18669153 | LIGHT-EMITTING MODULE AND DISPLAY APPARATUS | May 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18667666 | SELECTIVE AREA METAL PROCESS FOR IMPROVED METALLURGICAL BONDING OF ALUMINUM TO COPPER FOR INTEGRATED PASSIVE DEVICES IN A SEMICONDUCTOR DEVICE | May 2024 | November 2024 | Allow | 6 | 0 | 1 | No | No |
| 18667417 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | May 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18667720 | FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF | May 2024 | June 2025 | Allow | 13 | 2 | 0 | No | No |
| 18667311 | SEMICONDUCTOR DEVICE | May 2024 | November 2025 | Allow | 18 | 0 | 0 | No | No |
| 18665649 | DISPLAY APPARATUS | May 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18664389 | AMORPHOUS BOTTOM ELECTRODE STRUCTURE FOR MIM CAPACITORS | May 2024 | September 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18664483 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME | May 2024 | December 2024 | Allow | 8 | 0 | 0 | No | No |
| 18665023 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | May 2024 | October 2025 | Allow | 17 | 1 | 0 | No | No |
| 18663479 | ACTIVE MATRIX SUBSTRATE | May 2024 | November 2025 | Allow | 18 | 0 | 0 | No | No |
| 18662615 | METHOD OF FORMING SOURCE/DRAIN EPITAXIAL STACKS | May 2024 | September 2025 | Allow | 16 | 2 | 0 | No | No |
| 18662959 | DISPLAY DEVICE | May 2024 | February 2026 | Allow | 21 | 3 | 0 | No | No |
| 18659476 | DISPLAY DEVICE | May 2024 | March 2025 | Allow | 10 | 0 | 0 | Yes | No |
| 18660198 | SEMICONDUCTOR DEVICE | May 2024 | February 2025 | Allow | 9 | 0 | 0 | Yes | No |
| 18657993 | SEMICONDUCTOR DEVICE | May 2024 | January 2025 | Allow | 8 | 1 | 0 | No | No |
| 18658378 | LIGHT-EMITTING DIODE UNIT FOR DISPLAY COMPRISING PLURALITY OF PIXELS AND DISPLAY DEVICE HAVING SAME | May 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18657751 | Semiconductor Structure and Method of Fabricating the Same | May 2024 | June 2025 | Allow | 13 | 2 | 1 | Yes | No |
| 18656622 | ESD Structure for a Display Substrate Edge | May 2024 | March 2025 | Allow | 10 | 0 | 0 | No | No |
| 18655567 | SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING | May 2024 | September 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18656362 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | May 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18655318 | METHOD FOR REMOVING RESIST LAYER, METHOD OF FORMING A PATTERN AND METHOD OF MANUFACTURING A PACKAGE | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18654802 | LIGHT-EMITTING ELEMENT, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE HAVING LIGHT-EMITTING ELEMENT | May 2024 | June 2025 | Allow | 13 | 1 | 0 | Yes | No |
| 18653473 | SEMICONDUCTOR STRUCTURE INCLUDING SECTIONED WELL REGION | May 2024 | October 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18652529 | METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS | May 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18652167 | NON-VOLATILE STORAGE DEVICE | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2893.
With a 37.6% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 32.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Art Unit 2893 is part of Group 2890 in Technology Center 2800. This art unit has examined 17,917 patent applications in our dataset, with an overall allowance rate of 84.0%. Applications typically reach final disposition in approximately 25 months.
Art Unit 2893's allowance rate of 84.0% places it in the 78% percentile among all USPTO art units. This art unit has a significantly higher allowance rate than most art units at the USPTO.
Applications in Art Unit 2893 receive an average of 1.72 office actions before reaching final disposition (in the 36% percentile). The median prosecution time is 25 months (in the 80% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.