Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19109527 | POWER MODULE COMPRISING A SEMICONDUCTOR MODULE COMPONENT AND AN ALIGNMENT PART, AND METHOD FOR FORMING THE POWER MODULE | March 2025 | June 2025 | Allow | 3 | 0 | 0 | No | No |
| 19030244 | DISPLAY DEVICE | January 2025 | March 2025 | Allow | 2 | 0 | 0 | Yes | No |
| 18867459 | Semiconductor device AND manufacturing METHOD THEREOF | November 2024 | April 2025 | Allow | 5 | 0 | 0 | No | No |
| 18908950 | STRUCTURES WITH DEEP TRENCH ISOLATION REGIONS FOR A HIGH-VOLTAGE FIELD-EFFECT TRANSISTOR | October 2024 | February 2025 | Allow | 5 | 1 | 0 | No | No |
| 18905089 | OPTICAL SENSING APPARATUS | October 2024 | February 2025 | Allow | 4 | 1 | 0 | Yes | No |
| 18822880 | MICROSTRUCTURE ENHANCED ABSORPTION PHOTOSENSITIVE DEVICES | September 2024 | January 2025 | Allow | 4 | 1 | 0 | Yes | No |
| 18808892 | SEMICONDUCTOR MODULE | August 2024 | October 2024 | Allow | 2 | 0 | 0 | No | No |
| 18806772 | PHOTODETECTORS WITH MULTIPLE LIGHT-ABSORBING SEMICONDUCTOR LAYERS | August 2024 | February 2025 | Allow | 6 | 1 | 0 | No | No |
| 18787689 | ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF | July 2024 | September 2024 | Allow | 1 | 0 | 0 | No | No |
| 18777478 | HIGH-SENSITIVITY AVALANCHE PHOTODETECTORS | July 2024 | January 2025 | Allow | 6 | 1 | 0 | No | No |
| 18766974 | ECCENTRIC VIA STRUCTURES FOR STRESS REDUCTION | July 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18765489 | INDUCTORS WITH AIRGAP ELECTRICAL ISOLATION | July 2024 | October 2024 | Allow | 4 | 1 | 0 | No | No |
| 18761691 | METHOD FOR MAKING MEMORY DEVICE INCLUDING A SUPERLATTICE GETTERING LAYER | July 2024 | February 2025 | Allow | 8 | 2 | 0 | No | No |
| 18754367 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC EQUIPMENT | June 2024 | February 2025 | Allow | 8 | 0 | 1 | No | No |
| 18754418 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | June 2024 | January 2025 | Allow | 6 | 0 | 1 | No | No |
| 18749274 | HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18745613 | Semiconductor Package and Method | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18745970 | DISPLAY DEVICE | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18744087 | SEMICONDUCTOR DEVICE | June 2024 | January 2025 | Allow | 8 | 0 | 0 | Yes | No |
| 18741166 | ETCH PROFILE CONTROL OF ISOLATION TRENCH | June 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18741029 | HIGH PERFORMANCE IMAGE SENSOR | June 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18740503 | PACKAGE STRUCTURE | June 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18734053 | DISPLAY DEVICE | June 2024 | March 2025 | Allow | 9 | 1 | 0 | No | No |
| 18732484 | Power Semiconductor Packaging and Manufacturing Method Thereof | June 2024 | August 2024 | Allow | 3 | 0 | 0 | No | No |
| 18732430 | HIGH VOLTAGE LIGHT-EMITTING DEVICE | June 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18731392 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | June 2024 | March 2025 | Allow | 9 | 1 | 0 | No | No |
| 18675367 | STRUCTURES FOR A FIELD-EFFECT TRANSISTOR THAT INCLUDE A SPACER STRUCTURE | May 2024 | March 2025 | Allow | 9 | 2 | 1 | Yes | No |
| 18676431 | DISPLAY PANEL AND DISPLAY DEVICE | May 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18673521 | SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND ISOLATION STRUCTURES | May 2024 | February 2025 | Allow | 8 | 1 | 0 | No | No |
| 18672936 | STACKING CMOS STRUCTURE | May 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18671652 | SEMICONDUCTOR MODULE | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18671619 | LIGHT EMITTING DIODE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18669566 | METHOD FOR FORMING A SEMICONDUCTOR DIE AND A PHOTOELECTRIC DEVICE INTEGRATED IN A SAME PACKAGE | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18669153 | LIGHT-EMITTING MODULE AND DISPLAY APPARATUS | May 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18667666 | SELECTIVE AREA METAL PROCESS FOR IMPROVED METALLURGICAL BONDING OF ALUMINUM TO COPPER FOR INTEGRATED PASSIVE DEVICES IN A SEMICONDUCTOR DEVICE | May 2024 | November 2024 | Allow | 6 | 0 | 1 | No | No |
| 18667417 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | May 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18667720 | FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF | May 2024 | June 2025 | Allow | 13 | 2 | 0 | No | No |
| 18665649 | DISPLAY APPARATUS | May 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18664483 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME | May 2024 | December 2024 | Allow | 8 | 0 | 0 | No | No |
| 18659476 | DISPLAY DEVICE | May 2024 | March 2025 | Allow | 10 | 0 | 0 | Yes | No |
| 18660198 | SEMICONDUCTOR DEVICE | May 2024 | February 2025 | Allow | 9 | 0 | 0 | Yes | No |
| 18657993 | SEMICONDUCTOR DEVICE | May 2024 | January 2025 | Allow | 8 | 1 | 0 | No | No |
| 18658378 | LIGHT-EMITTING DIODE UNIT FOR DISPLAY COMPRISING PLURALITY OF PIXELS AND DISPLAY DEVICE HAVING SAME | May 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18657751 | Semiconductor Structure and Method of Fabricating the Same | May 2024 | June 2025 | Allow | 13 | 2 | 1 | Yes | No |
| 18656622 | ESD Structure for a Display Substrate Edge | May 2024 | March 2025 | Allow | 10 | 0 | 0 | No | No |
| 18656362 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | May 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18655318 | METHOD FOR REMOVING RESIST LAYER, METHOD OF FORMING A PATTERN AND METHOD OF MANUFACTURING A PACKAGE | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18654802 | LIGHT-EMITTING ELEMENT, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE HAVING LIGHT-EMITTING ELEMENT | May 2024 | June 2025 | Allow | 13 | 1 | 0 | Yes | No |
| 18652529 | METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS | May 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18652167 | NON-VOLATILE STORAGE DEVICE | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18650166 | MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18650445 | DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18650181 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE | April 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18646951 | SEMICONDUCTOR PACKAGE | April 2024 | March 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18647307 | INTEGRATED CIRCUIT CHIP INCLUDING GATE ELECTRODE WITH OBLIQUE CUT SURFACE, AND MANUFACTURING METHOD OF THE SAME | April 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18648314 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | April 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18645441 | DISPLAY PANEL AND DISPLAY DEVICE | April 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18645891 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | April 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18644937 | ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME | April 2024 | May 2025 | Allow | 13 | 1 | 1 | No | No |
| 18643144 | SEMICONDUCTOR PACKAGE | April 2024 | March 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18644068 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | April 2024 | April 2025 | Allow | 12 | 1 | 0 | No | No |
| 18643839 | DISPLAY DEVICE | April 2024 | April 2025 | Allow | 12 | 1 | 1 | No | No |
| 18641643 | MULTI-CHIP DEVICE AND METHOD OF FORMATION | April 2024 | April 2025 | Allow | 12 | 0 | 0 | Yes | No |
| 18641581 | SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER | April 2024 | May 2025 | Allow | 13 | 2 | 0 | Yes | No |
| 18640136 | DISPLAY DEVICE | April 2024 | July 2024 | Allow | 3 | 1 | 0 | No | No |
| 18637874 | SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME | April 2024 | June 2025 | Allow | 14 | 2 | 0 | No | No |
| 18635039 | Flexible Photovoltaic Cell, and Methods and Systems of Producing It | April 2024 | February 2025 | Allow | 10 | 0 | 0 | Yes | No |
| 18632439 | CONTROL OF LOCOS STRUCTURE THICKNESS WITHOUT A MASK | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18633194 | DISPLAY DEVICE AND ELECTRONIC APPARATUS | April 2024 | December 2024 | Allow | 8 | 0 | 0 | No | No |
| 18632281 | Electronic device having flexible substrate with opening | April 2024 | May 2025 | Allow | 14 | 1 | 0 | No | No |
| 18631072 | INTEGRATED CIRCUIT PACKAGE STRUCTURE WITH CONDUCTIVE STAIR STRUCTURE | April 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18631351 | LIGHT-EMITTING DEVICE | April 2024 | April 2025 | Allow | 12 | 0 | 0 | No | No |
| 18629967 | SCHOTTKY BARRIER DIODE WITH REDUCED LEAKAGE CURRENT AND METHOD OF FORMING THE SAME | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18631008 | LIGHT EMITTING DIODE PACKAGE, DIVISIONAL DISPLAY MODULE, AND DISPLAY PANEL | April 2024 | April 2025 | Allow | 13 | 1 | 0 | No | No |
| 18628804 | INTERPOSER WITH WARPAGE-RELIEF TRENCHES | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18628152 | SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18628478 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18626777 | SEMICONDUCTOR DEVICE | April 2024 | April 2025 | Allow | 12 | 1 | 0 | No | No |
| 18625783 | LIGHT EMITTING DEVICE AND LED DISPLAY APPARATUS INCLUDING THE SAME | April 2024 | June 2025 | Allow | 14 | 2 | 0 | Yes | No |
| 18626038 | METHOD FOR PREPARING HIGH-RESOLUTION QUANTUM DOT (QD) PIXELATED LIGHT-EMITTING FILM | April 2024 | August 2024 | Allow | 5 | 0 | 0 | No | No |
| 18625946 | IMAGING DEVICE | April 2024 | May 2025 | Allow | 13 | 1 | 0 | No | No |
| 18623973 | LIGHT-EMITTING DEVICE | April 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18622992 | METHOD TO PRODUCE A 3D MULTILAYER SEMICONDUCTOR DEVICE AND STRUCTURE | March 2024 | July 2024 | Allow | 4 | 1 | 0 | No | No |
| 18623010 | SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURING THE SAME | March 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18622091 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | March 2024 | June 2025 | Allow | 15 | 0 | 0 | No | No |
| 18621323 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | March 2024 | February 2025 | Allow | 10 | 0 | 0 | Yes | No |
| 18621840 | SEMICONDUCTOR MEMORY DEVICES WITH DIELECTRIC FIN STRUCTURES | March 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18618259 | SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS | March 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18618750 | SILICON-ON-INSULATOR METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTOR (SOI MOSFET) STRUCTURE | March 2024 | May 2024 | Allow | 2 | 0 | 0 | No | No |
| 18617746 | NANO-FET SEMICONDUCTOR DEVICE AND METHOD OF FORMING | March 2024 | March 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18616371 | ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY PANEL | March 2024 | May 2025 | Allow | 13 | 1 | 0 | No | No |
| 18617449 | INTEGRATED CIRCUIT DIE PAD CAVITY | March 2024 | June 2025 | Abandon | 15 | 1 | 0 | No | No |
| 18615303 | METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH THROUGH SILICON VIA | March 2024 | December 2024 | Allow | 8 | 0 | 0 | No | No |
| 18615049 | SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME | March 2024 | November 2024 | Allow | 8 | 0 | 0 | No | No |
| 18614472 | SEMICONDUCTOR SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18613390 | ARRAY SUBSTRATE AND DISPLAY DEVICE | March 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18610619 | METHODS FOR SPINDLE MECHANISM MONITORING AND MAINTENANCE IN PROCESSING A SEMICONDUCTOR SUBSTRATE | March 2024 | May 2025 | Allow | 14 | 1 | 0 | No | No |
| 18610416 | DISPLAY DEVICE | March 2024 | June 2025 | Allow | 15 | 1 | 0 | No | No |
| 18610185 | ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | March 2024 | September 2024 | Allow | 6 | 0 | 0 | No | No |
| 18609982 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | March 2024 | May 2025 | Allow | 14 | 2 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2893.
With a 37.6% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 34.1% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Art Unit 2893 is part of Group 2890 in Technology Center 2800. This art unit has examined 18,897 patent applications in our dataset, with an overall allowance rate of 85.7%. Applications typically reach final disposition in approximately 24 months.
Art Unit 2893's allowance rate of 85.7% places it in the 81% percentile among all USPTO art units. This art unit has a significantly higher allowance rate than most art units at the USPTO.
Applications in Art Unit 2893 receive an average of 1.60 office actions before reaching final disposition (in the 31% percentile). The median prosecution time is 24 months (in the 80% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.