Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18749274 | HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18745970 | DISPLAY DEVICE | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18732430 | HIGH VOLTAGE LIGHT-EMITTING DEVICE | June 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18676431 | DISPLAY PANEL AND DISPLAY DEVICE | May 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18669679 | SEMICONDUCTOR MEMORY DEVICE | May 2024 | February 2026 | Allow | 21 | 2 | 0 | No | No |
| 18658378 | LIGHT-EMITTING DIODE UNIT FOR DISPLAY COMPRISING PLURALITY OF PIXELS AND DISPLAY DEVICE HAVING SAME | May 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18631072 | INTEGRATED CIRCUIT PACKAGE STRUCTURE WITH CONDUCTIVE STAIR STRUCTURE | April 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18617449 | INTEGRATED CIRCUIT DIE PAD CAVITY | March 2024 | June 2025 | Abandon | 15 | 1 | 0 | No | No |
| 18588699 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | February 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18442173 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A PIN IN THE FORM OF A DRILLING SCREW | February 2024 | April 2025 | Allow | 14 | 2 | 0 | No | No |
| 18429629 | COMPACT POWER MODULE | February 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18415251 | BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES OF DEVICES | January 2024 | December 2024 | Allow | 11 | 0 | 0 | No | No |
| 18411197 | Replacement Gate Methods That Include Treating Spacers to Widen Gate | January 2024 | June 2025 | Allow | 17 | 0 | 0 | No | No |
| 18402661 | SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME | January 2024 | November 2024 | Allow | 11 | 1 | 0 | No | No |
| 18398049 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THE SAME | December 2023 | December 2024 | Allow | 12 | 1 | 0 | No | No |
| 18390603 | Embedded Package with Electrically Isolating Dielectric Liner | December 2023 | November 2024 | Allow | 11 | 1 | 0 | No | No |
| 18538138 | ORGANIC LIGHT-EMITTING DIODE DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | December 2023 | July 2024 | Allow | 7 | 0 | 0 | No | No |
| 18527712 | EXTENDABLE INNER LEAD FOR LEADED PACKAGE | December 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18520872 | DEVICE LAYER INTERCONNECTS | November 2023 | September 2025 | Allow | 22 | 1 | 0 | No | No |
| 18512331 | SEMICONDUCTOR DEVICES | November 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18389506 | Semiconductor Package and Passive Element with Interposer | November 2023 | July 2024 | Allow | 8 | 0 | 0 | No | No |
| 18557765 | ELECTRONIC-COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18557526 | COMPONENT MOUNTING SUBSTRATE | October 2023 | March 2026 | Allow | 29 | 0 | 0 | No | No |
| 18382598 | CHANNELIZED FILTER USING SEMICONDUCTOR FABRICATION | October 2023 | July 2024 | Allow | 9 | 0 | 0 | No | No |
| 18491456 | SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES | October 2023 | October 2025 | Allow | 24 | 0 | 0 | No | No |
| 18484533 | SEMICONDUCTOR DEVICE HAVING DISMANTLABLE STRUCTURE AND METHOD THEREFOR | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18373849 | HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE | September 2023 | April 2024 | Allow | 6 | 0 | 0 | No | No |
| 18373405 | SEMICONDUCTOR PACKAGE | September 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18472271 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | September 2023 | May 2024 | Allow | 8 | 0 | 0 | No | No |
| 18463354 | FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE | September 2023 | August 2024 | Allow | 11 | 1 | 0 | No | No |
| 18240512 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | August 2023 | November 2025 | Allow | 27 | 0 | 0 | No | No |
| 18452695 | SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOCIATED SYSTEMS AND METHODS | August 2023 | March 2024 | Allow | 7 | 0 | 0 | No | No |
| 18452875 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | August 2023 | February 2026 | Allow | 30 | 0 | 0 | No | No |
| 18234271 | LIGHT-EMITTING DIODE UNIT FOR DISPLAY COMPRISING PLURALITY OF PIXELS AND DISPLAY DEVICE HAVING SAME | August 2023 | April 2024 | Allow | 8 | 0 | 0 | No | No |
| 18448284 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | August 2023 | June 2024 | Allow | 10 | 0 | 0 | No | No |
| 18447832 | SEMICONDUCTOR DEVICE | August 2023 | February 2026 | Allow | 31 | 1 | 0 | No | No |
| 18231774 | SEMICONDUCTOR DEVICE PACKAGE | August 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18231764 | LIGHT EMITTING DEVICE FOR DISPLAY AND LIGHT EMITTING PACKAGE HAVING THE SAME | August 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18357008 | SEMICONDUCTOR MEMORY MODULE AND COMPUTER SYSTEM INCLUDING THE SAME | July 2023 | January 2026 | Allow | 30 | 1 | 0 | No | No |
| 18218547 | LIGHT EMITTING DEVICE MODULE AND DISPLAY APPARATUS HAVING THE SAME | July 2023 | March 2026 | Allow | 32 | 2 | 0 | No | No |
| 18342394 | POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICONDUCTOR MODULE | June 2023 | October 2025 | Allow | 28 | 0 | 0 | No | No |
| 18214181 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | June 2023 | January 2024 | Allow | 7 | 0 | 0 | No | No |
| 18212514 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | June 2023 | October 2025 | Allow | 28 | 0 | 0 | No | No |
| 18337039 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | June 2023 | January 2025 | Allow | 19 | 0 | 0 | No | No |
| 18332957 | PACKAGE STRUCTURE FOR HEAT DISSIPATION | June 2023 | February 2024 | Allow | 8 | 1 | 0 | No | No |
| 18204555 | WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING THE SAME | June 2023 | April 2025 | Allow | 22 | 1 | 0 | No | No |
| 18327851 | PACKAGE | June 2023 | January 2024 | Allow | 7 | 0 | 0 | No | No |
| 18323427 | SEMICONDUCTOR DEVICE HAVING A LOW-K GATE SIDE INSULATING LAYER | May 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18323157 | SEMICONDUCTOR MODULE | May 2023 | January 2026 | Allow | 32 | 1 | 0 | No | No |
| 18316193 | LIGHT SOURCE DEVICE AND MANUFACTURING METHOD OF LIGHT SOURCE DEVICE | May 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18314459 | POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE ARRANGEMENT | May 2023 | February 2026 | Allow | 33 | 1 | 0 | No | No |
| 18312383 | CAPACITOR, AND DEVICE COMPRISING THE SAME, AND METHOD OF PREPARING THE SAME | May 2023 | August 2025 | Allow | 27 | 0 | 1 | No | No |
| 18141265 | STRUCTURE AND METHOD FOR BONDED WAFER BARRIER | April 2023 | January 2026 | Allow | 33 | 1 | 0 | No | No |
| 18138245 | Power Semiconductor Module Arrangements and Methods for Producing Power Semiconductor Module Arrangements | April 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18305374 | INTEGRATED CIRCUIT PACKAGE STRUCTURE WITH CONDUCTIVE STAIR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | April 2023 | January 2024 | Allow | 9 | 1 | 0 | No | No |
| 18305074 | SEMICONDUCTOR DEVICE STRUCTURE WITH SILICIDE LAYER | April 2023 | February 2024 | Allow | 9 | 0 | 0 | No | No |
| 18303741 | LIGHT EMITTING DEVICE, MANUFACTURING METHOD OF LIGHT EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, ILLUMINATION DEVICE, MOVING BODY, AND WEARABLE DEVICE | April 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18136499 | SEMICONDUCTOR PACKAGES | April 2023 | January 2026 | Allow | 33 | 1 | 0 | Yes | No |
| 18248194 | SEMICONDUCTOR APPARATUS | April 2023 | September 2025 | Allow | 29 | 0 | 0 | No | No |
| 18131336 | BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES OF DEVICES | April 2023 | November 2023 | Allow | 8 | 0 | 0 | No | No |
| 18296056 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | April 2023 | November 2025 | Allow | 32 | 0 | 0 | No | No |
| 18130552 | MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE | April 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18193603 | SEMICONDUCTOR DEVICE | March 2023 | September 2025 | Allow | 30 | 0 | 0 | No | No |
| 18190355 | INTEGRATED DEVICE PACKAGE WITH OPENING IN CARRIER | March 2023 | February 2026 | Allow | 35 | 1 | 0 | No | No |
| 18123467 | CHANNELIZED FILTER USING SEMICONDUCTOR FABRICATION | March 2023 | July 2023 | Allow | 4 | 0 | 0 | No | No |
| 18181171 | SEMICONDUCTOR DEVICE AND METHOD FOR DETERMINING DETERIORATION OF SEMICONDUCTOR DEVICE | March 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18118835 | HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES | March 2023 | April 2024 | Allow | 13 | 0 | 0 | Yes | No |
| 18118697 | SEMICONDUCTOR DEVICE | March 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18117601 | SEMICONDUCTOR PACKAGE | March 2023 | August 2023 | Allow | 5 | 0 | 0 | No | No |
| 18115122 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | February 2023 | July 2023 | Allow | 4 | 0 | 0 | No | No |
| 18176035 | SEMICONDUCTOR MODULE | February 2023 | October 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 18173912 | SEMICONDUCTOR APPARATUS | February 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18173545 | STORAGE WAFER AND MANUFACTURING METHOD OF STORAGE WAFER | February 2023 | February 2026 | Allow | 36 | 1 | 0 | No | No |
| 18022418 | DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE | February 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18164607 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | February 2023 | April 2024 | Allow | 14 | 1 | 0 | No | No |
| 18159754 | POWER MODULE, PREPARATION MOLD, AND DEVICE | January 2023 | September 2025 | Allow | 31 | 0 | 0 | No | No |
| 18006695 | SEMICONDUCTOR APPARATUS | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18017415 | PACKAGING STRUCTURE AND PACKAGING METHOD OF HIGH-POWER RADIO FREQUENCY DEVICE | January 2023 | September 2025 | Allow | 32 | 1 | 0 | No | No |
| 18154722 | CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES | January 2023 | October 2025 | Allow | 33 | 0 | 0 | No | No |
| 18151731 | FAN-OUT SEMICONDUCTOR PACKAGES | January 2023 | August 2024 | Allow | 19 | 1 | 0 | Yes | No |
| 18093331 | ELECTRONIC DEVICE | January 2023 | June 2024 | Allow | 18 | 1 | 0 | No | No |
| 18013474 | POWER MODULE HAVING AT LEAST THREE POWER UNITS | December 2022 | December 2025 | Allow | 35 | 1 | 0 | No | No |
| 18145961 | INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR FOR RADIOFREQUENCY POWER DEVICES AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | December 2022 | December 2025 | Allow | 36 | 1 | 0 | No | No |
| 18087690 | LIGHT EMITTING DEVICE HAVING CANTILEVER ELECTRODE, LED DISPLAY PANEL AND LED DISPLAY APPARATUS HAVING THE SAME | December 2022 | September 2023 | Allow | 9 | 0 | 0 | No | No |
| 18078923 | HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE | December 2022 | July 2025 | Allow | 32 | 0 | 0 | No | No |
| 18063923 | MICRO-LED WITH FIELD-EFFECT ISOLATION | December 2022 | October 2025 | Allow | 34 | 1 | 0 | No | No |
| 17989897 | SUBSTRATE-BASED PACKAGE SEMICONDUCTOR DEVICE WITH SIDE WETTABLE FLANKS | November 2022 | July 2025 | Allow | 32 | 0 | 0 | No | No |
| 18056508 | SEMICONDUCTOR MEMORY DEVICE | November 2022 | February 2024 | Allow | 15 | 2 | 0 | No | No |
| 18056442 | POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN | November 2022 | February 2026 | Allow | 39 | 1 | 0 | No | No |
| 17925719 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | November 2022 | May 2025 | Allow | 30 | 0 | 0 | No | No |
| 17978749 | Automotive LED Light Source with Glass Lens Over a Glass Converter Plate Containing Phosphor | November 2022 | April 2024 | Allow | 17 | 1 | 0 | No | No |
| 18051141 | CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME | October 2022 | May 2025 | Allow | 30 | 0 | 0 | No | No |
| 17977904 | SEMICONDUCTOR DEVICE | October 2022 | April 2025 | Allow | 30 | 0 | 0 | No | No |
| 18045677 | NO-GEL PRESSURE SENSOR PACKAGE | October 2022 | May 2023 | Allow | 7 | 0 | 0 | No | No |
| 17918287 | SEMICONDUCTOR DEVICE | October 2022 | July 2025 | Allow | 33 | 1 | 0 | No | No |
| 17916858 | SEMICONDUCTOR DEVICE | October 2022 | May 2025 | Allow | 32 | 1 | 0 | No | No |
| 17957899 | RIBBON BONDING GROUND PLANE FOR RADIO FREQUENCY PERFORMANCE IMPROVEMENT IN ELECTRO-OPTICAL DEVICES | September 2022 | June 2025 | Allow | 32 | 0 | 0 | No | No |
| 17956819 | SEMICONDUCTOR MODULE, SEMICONDUCTOR APPARATUS, AND VEHICLE | September 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17930934 | SEMICONDUCTOR DEVICE | September 2022 | July 2025 | Allow | 34 | 1 | 0 | No | No |
| 17930021 | EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DEVICE ASSEMBLIES, ELECTRONIC SYSTEMS, AND PROCESSES | September 2022 | August 2025 | Allow | 35 | 0 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner ULLAH, ELIAS.
With a 75.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 51.4% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner ULLAH, ELIAS works in Art Unit 2893 and has examined 917 patent applications in our dataset. With an allowance rate of 92.5%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 19 months.
Examiner ULLAH, ELIAS's allowance rate of 92.5% places them in the 78% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by ULLAH, ELIAS receive 1.15 office actions before reaching final disposition. This places the examiner in the 13% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by ULLAH, ELIAS is 19 months. This places the examiner in the 95% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +2.3% benefit to allowance rate for applications examined by ULLAH, ELIAS. This interview benefit is in the 23% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 30.5% of applications are subsequently allowed. This success rate is in the 60% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 37.3% of cases where such amendments are filed. This entry rate is in the 56% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 146.7% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 89% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 78.9% of appeals filed. This is in the 71% percentile among all examiners. Of these withdrawals, 56.7% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 63.1% are granted (fully or in part). This grant rate is in the 68% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.7% of allowed cases (in the 63% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 34% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.