Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18628152 | SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18592500 | METHOD FOR MANUFACTURING BACK-CONTACT SOLAR CELL AND BACK-CONTACT SOLAR CELL | February 2024 | January 2025 | Allow | 10 | 1 | 1 | No | No |
| 18414623 | LIQUID CRYSTAL DISPLAY DEVICE | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18413434 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | January 2024 | September 2024 | Allow | 8 | 0 | 0 | No | No |
| 18403817 | SEMICONDUCTOR MEMORY DEVICE | January 2024 | September 2024 | Allow | 8 | 0 | 0 | No | No |
| 18402144 | VERTICAL NON-VOLATILE MEMORY DEVICES HAVING A MULTI-STACK STRUCTURE WITH ENHANCED PHOTOLITHOGRAPHIC ALIGNMENT CHARACTERISTICS | January 2024 | March 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18399205 | MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE | December 2023 | April 2025 | Allow | 16 | 1 | 1 | No | No |
| 18506567 | SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF | November 2023 | June 2025 | Allow | 19 | 3 | 0 | No | No |
| 18374587 | MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE | September 2023 | March 2025 | Allow | 17 | 1 | 0 | No | No |
| 18220323 | SEMICONDUCTOR DEVICES | July 2023 | April 2025 | Allow | 21 | 2 | 0 | Yes | No |
| 18328014 | Semiconductor Structures and Methods of Forming the Same | June 2023 | June 2025 | Allow | 24 | 4 | 0 | Yes | No |
| 18327065 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | June 2023 | February 2025 | Allow | 20 | 1 | 0 | No | No |
| 18203056 | METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT | May 2023 | November 2024 | Abandon | 17 | 1 | 0 | Yes | No |
| 18315799 | Method and Structure for CMOS-MEMS Thin Film Encapsulation | May 2023 | June 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18138953 | RECESS FRAME STRUCTURE FOR REDUCTION OF SPURIOUS SIGNALS IN A BULK ACOUSTIC WAVE RESONATOR | April 2023 | February 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18179537 | SEMICONDUCTOR MEMORY DEVICE | March 2023 | July 2025 | Allow | 28 | 0 | 0 | No | No |
| 18172097 | SEMICONDUCTOR MEMORY DEVICE | February 2023 | May 2025 | Allow | 27 | 0 | 0 | No | No |
| 18166374 | LED LAMP | February 2023 | April 2025 | Allow | 26 | 3 | 0 | No | No |
| 18152769 | METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR STRUCTURE | January 2023 | June 2025 | Allow | 30 | 1 | 0 | No | No |
| 18151973 | SEMICONDUCTOR MEMORY DEVICE | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 17994650 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | November 2022 | May 2025 | Allow | 29 | 0 | 0 | No | No |
| 17967441 | MEMORY DEVICE HAVING 2-TRANSISTOR VERTICAL MEMORY CELL AND SHARED CHANNEL REGION | October 2022 | February 2025 | Allow | 28 | 2 | 0 | No | No |
| 17912501 | CARRIER DEVICE, SEMICONDUCTOR APPARATUS, AND RESIDUAL CHARGE DETECTION METHOD | September 2022 | March 2025 | Allow | 30 | 2 | 0 | Yes | No |
| 17931430 | MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES, ELECTRONIC SYSTEMS, AND METHODS | September 2022 | April 2025 | Allow | 31 | 0 | 0 | No | No |
| 17941900 | Integrated Assemblies Having Metal-Containing Liners Along Bottoms of Trenches, and Methods of Forming Integrated Assemblies | September 2022 | April 2024 | Allow | 19 | 1 | 0 | Yes | No |
| 17823330 | JOSEPHSON TRANSISTOR | August 2022 | May 2025 | Allow | 33 | 1 | 0 | No | No |
| 17819817 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR MEMORY | August 2022 | November 2024 | Allow | 27 | 0 | 0 | No | No |
| 17886731 | SEMICONDUCTOR MEMORY DEVICE | August 2022 | April 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 17818007 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | August 2022 | March 2025 | Allow | 31 | 1 | 0 | No | No |
| 17881747 | SEMICONDUCTOR MEMORY DEVICE OF 2T-1C STRUCTURE AND METHOD OF FABRICATING THE SAME | August 2022 | February 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 17874512 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | July 2022 | June 2024 | Allow | 22 | 1 | 0 | Yes | No |
| 17874274 | SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME | July 2022 | August 2024 | Allow | 25 | 1 | 0 | Yes | No |
| 17872143 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD | July 2022 | February 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 17871844 | MOS DEVICES WITH INCREASED SHORT CIRCUIT ROBUSTNESS | July 2022 | February 2025 | Abandon | 31 | 2 | 0 | Yes | No |
| 17870426 | SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC STRESSOR | July 2022 | June 2024 | Allow | 23 | 1 | 0 | Yes | No |
| 17862638 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | July 2022 | March 2025 | Allow | 32 | 1 | 1 | Yes | No |
| 17860284 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | July 2022 | April 2024 | Allow | 22 | 2 | 0 | Yes | No |
| 17857441 | SEMICONDUCTOR DEVICES | July 2022 | April 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 17807895 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | June 2022 | February 2025 | Allow | 32 | 1 | 0 | No | No |
| 17842101 | SELF-ALIGNED DIELECTRIC LINER STRUCTURE FOR PROTECTION IN MEMS COMB ACTUATOR | June 2022 | March 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 17806265 | METHOD OF MANUFACTURING RADIOGRAPHIC IMAGING APPARATUS | June 2022 | January 2025 | Allow | 31 | 1 | 0 | No | No |
| 17829939 | CMOS OVER ARRAY OF 3-D DRAM DEVICE | June 2022 | January 2024 | Allow | 20 | 2 | 0 | Yes | No |
| 17713705 | SEMICONDUCTOR DEVICES | April 2022 | April 2025 | Allow | 36 | 2 | 0 | Yes | No |
| 17712674 | MEMORY DEVICE HAVING SHARED ACCESS LINE FOR 2-TRANSISTOR VERTICAL MEMORY CELL | April 2022 | April 2024 | Allow | 24 | 2 | 0 | Yes | No |
| 17762235 | HEAT DISSIPATION SHEET, HEAT DISSIPATION SHEET LAYERED BODY, STRUCTURE, AND METHOD FOR DISSIPATING HEAT FROM HEAT-GENERATING ELEMENT | March 2022 | March 2025 | Allow | 35 | 2 | 0 | No | No |
| 17637974 | MASK PLATE AND METHOD FOR PERFORMING EVAPORATION BY USING THE SAME | February 2022 | March 2025 | Allow | 36 | 2 | 0 | No | No |
| 17676380 | Semiconductor Device and Method of Manufacture | February 2022 | April 2024 | Allow | 26 | 2 | 0 | Yes | No |
| 17673819 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | February 2022 | October 2024 | Allow | 32 | 2 | 0 | No | No |
| 17672977 | ETCHING PROCESS | February 2022 | December 2024 | Abandon | 34 | 1 | 0 | No | No |
| 17650511 | METHOD FOR PROCESSING SEMICONDUCTOR DEVICE | February 2022 | February 2025 | Abandon | 36 | 1 | 0 | No | No |
| 17584567 | METHOD OF PROCESSING SUBSTRATE | January 2022 | June 2024 | Allow | 29 | 1 | 0 | Yes | No |
| 17647902 | CAPACITORS WITH ELECTRODES HAVING A PORTION OF MATERIAL REMOVED, AND RELATED SEMICONDUCTOR DEVICES, SYSTEMS, AND METHODS | January 2022 | September 2024 | Allow | 32 | 2 | 0 | Yes | No |
| 17568856 | LDMOS TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | January 2022 | August 2024 | Allow | 31 | 5 | 0 | Yes | No |
| 17565896 | INLINE WAFER DEFECT DETECTION SYSTEM AND METHOD | December 2021 | October 2024 | Allow | 34 | 1 | 0 | No | No |
| 17564699 | CAPACITOR, ELECTRONIC DEVICE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME | December 2021 | December 2024 | Allow | 36 | 4 | 0 | Yes | No |
| 17557146 | METHOD AND APPARATUS FOR COATING PHOTORESIST OVER A SUBSTRATE | December 2021 | June 2024 | Allow | 30 | 0 | 1 | No | No |
| 17558323 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | December 2021 | June 2024 | Allow | 30 | 2 | 0 | Yes | No |
| 17554968 | SEMICONDUCTOR CHIP DEVICE INTEGRATING THERMAL PIPES IN THREE-DIMENSIONAL PACKAGING | December 2021 | April 2025 | Allow | 40 | 5 | 0 | Yes | No |
| 17549494 | SEMICONDUCTOR DEVICE HAVING WORD LINE EMBEDDED IN GATE TRENCH | December 2021 | August 2024 | Allow | 32 | 3 | 0 | Yes | No |
| 17643277 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | December 2021 | February 2024 | Allow | 26 | 2 | 0 | Yes | No |
| 17537544 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | November 2021 | February 2024 | Allow | 27 | 2 | 0 | Yes | No |
| 17451172 | THREE ELECTRODE CAPACITOR STRUCTURE USING SPACED CONDUCTIVE PILLARS | October 2021 | March 2024 | Allow | 29 | 3 | 0 | Yes | No |
| 17496690 | RECESSED THIN-CHANNEL THIN-FILM TRANSISTOR | October 2021 | January 2024 | Allow | 27 | 2 | 0 | Yes | No |
| 17471055 | METHOD OF MANUFACTURING POLYCRYSTALLINE SILICON LAYER, DISPLAY DEVICE, AND METHOD OF MANUFACTURING DISPLAY DEVICE | September 2021 | April 2024 | Abandon | 31 | 3 | 0 | Yes | No |
| 17461051 | SEMICONDUCTOR MEMORY DEVICE | August 2021 | February 2024 | Allow | 29 | 3 | 0 | Yes | No |
| 17461004 | METHOD AND SYSTEM FOR ADJUSTING THE GAP BETWEEN A WAFER AND A TOP PLATE IN A THIN-FILM DEPOSITION PROCESS | August 2021 | November 2024 | Allow | 39 | 2 | 1 | Yes | No |
| 17445775 | COMPENSATION METHOD FOR OVERLAY DEVIATION | August 2021 | August 2024 | Allow | 35 | 2 | 0 | Yes | No |
| 17408985 | CAPPING LAYER FOR GATE ELECTRODES | August 2021 | April 2024 | Allow | 31 | 3 | 0 | Yes | No |
| 17405150 | Rapid Thermal Processing System With Cooling System | August 2021 | May 2024 | Allow | 32 | 1 | 0 | Yes | No |
| 17444775 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND FILM FORMING APPARATUS | August 2021 | August 2024 | Allow | 37 | 3 | 0 | Yes | No |
| 17428712 | LASER PROCESSING MACHINE, PROCESSING METHOD, AND LASER LIGHT SOURCE | August 2021 | April 2024 | Allow | 33 | 1 | 0 | Yes | No |
| 17369838 | ETCH APPARATUS FOR COMPENSATING SHIFTED OVERLAYERS | July 2021 | June 2024 | Allow | 36 | 1 | 0 | Yes | No |
| 17305233 | PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS AND PRINTED CIRCUIT BOARDS | July 2021 | January 2025 | Allow | 42 | 4 | 0 | Yes | No |
| 17347412 | SEMICONDUCTOR DEVICES INCLUDING FERROELECTRIC MATERIALS | June 2021 | June 2024 | Allow | 36 | 2 | 0 | Yes | No |
| 17328394 | Polysilicon Design for Replacement Gate Technology | May 2021 | May 2025 | Allow | 48 | 4 | 0 | Yes | No |
| 17324435 | METHOD TO IMPROVE WAFER EDGE UNIFORMITY | May 2021 | June 2024 | Allow | 36 | 1 | 0 | Yes | No |
| 17316367 | SEMICONDUCTOR PACKAGE AND RELATED METHODS | May 2021 | November 2024 | Allow | 43 | 5 | 0 | Yes | Yes |
| 17316316 | Showerhead for Process Tool | May 2021 | September 2024 | Allow | 40 | 3 | 0 | Yes | No |
| 17307911 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE | May 2021 | December 2024 | Abandon | 44 | 4 | 0 | Yes | No |
| 17212693 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | March 2021 | February 2024 | Allow | 35 | 3 | 1 | Yes | No |
| 17208905 | GROWTH OF CUBIC CRYSTALLINE PHASE STRUCTURE ON SILICON SUBSTRATES AND DEVICES COMPRISING THE CUBIC CRYSTALLINE PHASE STRUCTURE | March 2021 | August 2024 | Allow | 41 | 6 | 0 | Yes | No |
| 17205509 | DISPLAY DEVICE MANUFACTURING APPARATUS AND METHOD | March 2021 | August 2024 | Allow | 41 | 3 | 1 | Yes | No |
| 17249140 | HIGH MODULATION SPEED PIN-TYPE PHOTODIODE | February 2021 | December 2024 | Allow | 46 | 6 | 0 | Yes | No |
| 17163945 | SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF | February 2021 | January 2024 | Allow | 35 | 1 | 0 | Yes | No |
| 17058939 | EXCITONIC DEVICE AND OPERATING METHODS THEREOF | November 2020 | February 2025 | Abandon | 50 | 4 | 0 | No | No |
| 17052055 | SHARP, VERTICALLY ALIGNED NANOWIRE ELECTRODE ARRAYS, HIGH-YIELD FABRICATION AND INTRACELLULAR RECORDING | October 2020 | June 2024 | Allow | 44 | 2 | 0 | Yes | No |
| 16970273 | CORE-SHELL SEMICONDUCTOR NANOPARTICLES, PRODUCTION METHOD THEREOF, AND LIGHT-EMITTING DEVICE | August 2020 | November 2024 | Allow | 51 | 8 | 0 | Yes | No |
| 16927327 | POLISHING SLURRY, METHOD FOR MANUFACTURING A DISPLAY DEVICE USING THE SAME AND DISPLAY DEVICE | July 2020 | June 2024 | Allow | 47 | 4 | 1 | Yes | No |
| 16860839 | TERAHERTZ TRANSISTOR | April 2020 | January 2025 | Allow | 56 | 6 | 0 | Yes | Yes |
| 16747663 | STRETCHABLE AND FLEXIBLE SENSING DEVICE | January 2020 | April 2024 | Allow | 51 | 6 | 0 | Yes | No |
| 16557784 | MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE | August 2019 | January 2025 | Allow | 60 | 6 | 0 | Yes | No |
| 16431885 | SYNAPSE ARRAY | June 2019 | December 2020 | Abandon | 18 | 7 | 0 | Yes | No |
| 16406657 | REDUCING LINE EDGE ROUGHNESS AND MITIGATING DEFECTS BY WAFER FREEZING | May 2019 | May 2024 | Allow | 60 | 4 | 0 | Yes | No |
| 15793631 | SEMICONDUCTOR RESISTOR STRUCTURES EMBEDDED IN A MIDDLE-OF-THE-LINE (MOL) DIELECTRIC | October 2017 | April 2018 | Allow | 6 | 0 | 0 | No | No |
| 15443075 | SEMICONDUCTOR DEVICE | February 2017 | July 2017 | Allow | 4 | 0 | 0 | Yes | No |
| 15261291 | MULTI-ANGLED DEPOSITION AND MASKING FOR CUSTOM SPACER TRIM AND SELECTED SPACER REMOVAL | September 2016 | January 2018 | Allow | 16 | 1 | 1 | No | No |
| 15167306 | MIS (METAL-INSULATOR-SEMICONDUCTOR) CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES | May 2016 | September 2016 | Allow | 4 | 0 | 0 | No | No |
| 15067803 | AIR-CORE INDUCTORS AND TRANSFORMERS | March 2016 | November 2017 | Allow | 20 | 1 | 1 | No | No |
| 15044963 | ORGANIC LIGHT-EMITTING DIODE (OLED) DISPLAY AND METHOD OF MANUFACTURING THE SAME | February 2016 | July 2016 | Allow | 4 | 0 | 0 | No | No |
| 14957588 | Composite substrates of silicon and ceramic | December 2015 | June 2016 | Allow | 6 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CHIN, EDWARD.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 75.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner CHIN, EDWARD works in Art Unit 2893 and has examined 127 patent applications in our dataset. With an allowance rate of 92.9%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 31 months.
Examiner CHIN, EDWARD's allowance rate of 92.9% places them in the 79% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by CHIN, EDWARD receive 2.05 office actions before reaching final disposition. This places the examiner in the 68% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by CHIN, EDWARD is 31 months. This places the examiner in the 37% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a -0.6% benefit to allowance rate for applications examined by CHIN, EDWARD. This interview benefit is in the 9% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 29.7% of applications are subsequently allowed. This success rate is in the 48% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 30.1% of cases where such amendments are filed. This entry rate is in the 35% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 200.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 97% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 94% percentile among all examiners. Of these withdrawals, 75.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 61% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.8% of allowed cases (in the 65% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 30% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.