Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18640136 | DISPLAY DEVICE | April 2024 | July 2024 | Allow | 3 | 1 | 0 | No | No |
| 18446546 | STATIC RANDOM ACCESS MEMORY WITH PRE-CHARGE CIRCUIT | August 2023 | May 2025 | Allow | 21 | 1 | 1 | Yes | No |
| 17787582 | TRANSISTOR-TYPE SENSOR | June 2022 | May 2025 | Abandon | 35 | 1 | 0 | No | No |
| 17829515 | SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS DISPOSED AND METHOD FOR PREPARING THE SAME | June 2022 | June 2025 | Allow | 37 | 3 | 0 | No | No |
| 17779279 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | May 2022 | May 2025 | Allow | 36 | 1 | 0 | No | No |
| 17660461 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | April 2022 | June 2025 | Abandon | 38 | 1 | 1 | No | No |
| 17765439 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | March 2022 | June 2025 | Abandon | 38 | 0 | 1 | No | No |
| 17708670 | DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME | March 2022 | April 2025 | Allow | 37 | 1 | 1 | Yes | No |
| 17706230 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | March 2022 | June 2025 | Allow | 38 | 2 | 1 | Yes | No |
| 17693576 | Air-Core Transformer Package with Ferrite Electro-Magnetic Interference (EMI) Shielding of Integrated-Circuit (IC) Chip | March 2022 | May 2025 | Allow | 38 | 1 | 1 | No | No |
| 17653941 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | March 2022 | March 2025 | Abandon | 36 | 2 | 1 | Yes | No |
| 17683382 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | March 2022 | January 2025 | Allow | 34 | 2 | 0 | Yes | No |
| 17681453 | SEMICONDUCTOR DEVICE | February 2022 | March 2025 | Allow | 37 | 3 | 0 | Yes | No |
| 17679603 | SEMICONDUCTOR DEVICE HAVING ELECTRIC COMPONENT BUILT IN CIRCUIT BOARD | February 2022 | May 2024 | Allow | 26 | 3 | 0 | Yes | No |
| 17651965 | SEMICONDUCTOR PACKAGE | February 2022 | January 2025 | Allow | 35 | 3 | 0 | Yes | No |
| 17674204 | SEMICONDUCTOR PACKAGE WITH BALANCED WIRING STRUCTURE | February 2022 | March 2025 | Allow | 37 | 4 | 0 | Yes | No |
| 17665810 | SEMICONDUCTOR PACKAGE | February 2022 | October 2024 | Allow | 32 | 2 | 1 | Yes | No |
| 17590954 | SEMICONDUCTOR PACKAGE AND SUBSTRATE FOR SEMICONDUCTOR PACKAGE | February 2022 | February 2025 | Allow | 37 | 2 | 1 | Yes | No |
| 17581963 | SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE | January 2022 | June 2025 | Allow | 41 | 3 | 1 | No | No |
| 17573648 | Three-dimensional Integrated Circuit | January 2022 | February 2025 | Abandon | 37 | 1 | 0 | No | No |
| 17616807 | SEMICONDUCTOR DEVICE | December 2021 | March 2025 | Abandon | 39 | 2 | 0 | Yes | No |
| 17457661 | SEMICONDUCTOR DEVICE | December 2021 | June 2025 | Allow | 43 | 2 | 2 | Yes | No |
| 17610445 | WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | November 2021 | May 2025 | Allow | 42 | 2 | 1 | Yes | No |
| 17516812 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | November 2021 | June 2025 | Abandon | 43 | 2 | 0 | No | No |
| 17607346 | SEMICONDUCTOR DEVICE | October 2021 | June 2024 | Allow | 32 | 1 | 0 | No | No |
| 17604047 | PHOTODIODE MANUFACTURING METHOD AND PHOTODIODE THEREOF | October 2021 | February 2025 | Abandon | 40 | 2 | 0 | No | No |
| 17479095 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE | September 2021 | May 2025 | Allow | 44 | 3 | 1 | Yes | No |
| 17440268 | Electronic Molded Package | September 2021 | June 2024 | Allow | 33 | 1 | 0 | No | No |
| 17438943 | SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFACTURING SAME | September 2021 | May 2025 | Allow | 44 | 3 | 0 | Yes | No |
| 17470060 | PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE USING THE SAME, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | September 2021 | November 2024 | Allow | 38 | 1 | 1 | Yes | No |
| 17436454 | SEMICONDUCTOR PACKAGE HAVING SIDE WALL PLATING | September 2021 | September 2024 | Allow | 37 | 2 | 0 | No | No |
| 17409809 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD | August 2021 | September 2024 | Allow | 37 | 1 | 1 | Yes | No |
| 17361657 | DISPLAY PANEL, ACTIVE MATRIX SUBSTRATE , AND METHOD FOR REPAIRING WHITE DEFECT OF DISPLAY PANEL | June 2021 | October 2024 | Allow | 40 | 2 | 1 | No | No |
| 17416595 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | June 2021 | October 2024 | Allow | 40 | 2 | 0 | No | No |
| 17344350 | MONOLITHIC SURFACE MOUNT PASSIVE COMPONENT | June 2021 | September 2024 | Allow | 39 | 3 | 1 | Yes | No |
| 17294685 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE | May 2021 | February 2025 | Allow | 45 | 4 | 1 | No | No |
| 17228229 | IMAGE SENSING DEVICE INCLUDING LIGHT RECEPTION ALIGNMENT MARKS | April 2021 | February 2025 | Allow | 46 | 4 | 0 | No | No |
| 17223025 | MAGNETORESISTIVE RANDOM ACCESS MEMORY | April 2021 | September 2024 | Allow | 41 | 3 | 0 | No | No |
| 17221896 | DISPLAY DEVICE | April 2021 | April 2024 | Allow | 36 | 1 | 0 | No | No |
| 17202001 | SEMICONDUCTOR LIGHT-EMITTING DEVICE | March 2021 | April 2025 | Abandon | 49 | 4 | 1 | Yes | No |
| 17197672 | NON-VOLATILE SEMICONDUCTOR DEVICE WITH IMPROVED WRITING SPEED | March 2021 | September 2024 | Allow | 42 | 3 | 1 | No | No |
| 17169554 | MEMORY DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF | February 2021 | January 2025 | Allow | 48 | 3 | 1 | Yes | No |
| 17160462 | SEMICONDUCTOR PACKAGE WITH STIFFENER | January 2021 | December 2024 | Allow | 46 | 3 | 0 | Yes | No |
| 17160349 | MAGNETORESISTIVE ELEMENT HAVING A COMPOSITE RECORDING STRUCTURE | January 2021 | August 2024 | Abandon | 42 | 3 | 0 | Yes | No |
| 17146331 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | January 2021 | October 2024 | Allow | 45 | 4 | 1 | Yes | No |
| 17129135 | MICROELECTRONIC STRUCTURES INCLUDING BRIDGES | December 2020 | November 2024 | Allow | 47 | 1 | 1 | No | No |
| 15336565 | SEMICONDUCTOR DEVICE HAVING INSULATING LAYERS CONTAINING OXYGEN AND A BARRIER LAYER CONTAINING MANGANESE | October 2016 | April 2017 | Allow | 5 | 1 | 0 | No | No |
| 15150938 | POWER SEMICONDUCTOR MODULE AND COMPOSITE MODULE | May 2016 | July 2017 | Allow | 14 | 0 | 0 | No | No |
| 14833148 | UNIVERSAL BGA SUBSTRATE | August 2015 | May 2017 | Allow | 21 | 2 | 1 | No | No |
| 14695193 | NANOWIRE LED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | April 2015 | July 2015 | Allow | 3 | 0 | 0 | No | No |
| 14672713 | SEMICONDUCTOR DEVICE WITH EXTERNAL CONNECTION BUMPS | March 2015 | June 2016 | Allow | 15 | 1 | 0 | No | No |
| 14422990 | ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME | February 2015 | November 2016 | Allow | 21 | 1 | 1 | No | No |
| 14422972 | ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME | February 2015 | May 2017 | Allow | 27 | 2 | 1 | Yes | No |
| 14483584 | PHOTODIODE STRUCTURES | September 2014 | December 2016 | Allow | 27 | 2 | 1 | Yes | No |
| 14305527 | STACKED SEMICONDUCTOR PACKAGE | June 2014 | July 2015 | Allow | 13 | 0 | 0 | No | No |
| 14071119 | LIGHT EMITTING DEVICE, ADHESIVE HAVING SURFACE ROUGHNESS, AND LIGHTING SYSTEM HAVING THE SAME | November 2013 | July 2015 | Allow | 20 | 1 | 0 | No | No |
| 14059629 | NANOWIRE LED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | October 2013 | March 2015 | Allow | 16 | 1 | 1 | No | No |
| 14049915 | SEMICONDUCTOR DEVICE STACK WITH BONDING LAYER AND WIRE RETAINING MEMBER | October 2013 | October 2014 | Allow | 12 | 1 | 0 | No | No |
| 13729270 | SEMICONDUCTOR DEVICE WITH WIRELESS COMMUNICATION | December 2012 | July 2014 | Allow | 19 | 2 | 0 | No | No |
| 13686436 | ELECTRICAL DEVICE WITH PROTRUDING CONTACT ELEMENTS AND OVERHANG REGIONS OVER A CAVITY | November 2012 | June 2013 | Allow | 7 | 3 | 0 | Yes | No |
| 13551610 | WAFER-LEVEL DEVICE PACKAGING | July 2012 | July 2015 | Allow | 35 | 2 | 1 | No | No |
| 13020235 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | February 2011 | November 2014 | Allow | 45 | 1 | 1 | No | No |
| 13019390 | SEMICONDUCTOR DEVICE WITH SURFACE ELECTRODES | February 2011 | October 2014 | Allow | 44 | 1 | 1 | No | No |
| 12980772 | STACKED SEMICONDUCTOR PACKAGE | December 2010 | March 2014 | Allow | 38 | 2 | 0 | Yes | Yes |
| 12980533 | MODULE SUBSTRATE WITH FEATURE FOR REPLACEMENT OF FAULTY CHIPS, SEMICONDUCTOR MODULE HAVING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE | December 2010 | June 2014 | Allow | 42 | 2 | 1 | Yes | No |
| 12978813 | PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME | December 2010 | February 2014 | Allow | 38 | 3 | 0 | No | No |
| 12892947 | SEMICONDUCTOR STRUCTURE HAVING METAL OXIDE OR NIRTRIDE PASSIVATION LAYER ON FILL LAYER AND METHOD FOR MAKING SAME | September 2010 | January 2014 | Allow | 39 | 1 | 1 | No | No |
| 12655407 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | December 2009 | October 2015 | Allow | 60 | 6 | 1 | No | No |
| 12624490 | MULTI CHIP SEMICONDUCTOR DEVICE | November 2009 | December 2013 | Allow | 49 | 2 | 0 | No | No |
| 12622329 | SEMICONDUCTOR MODULE WITH EDGE TERMINATION AND PROCESS FOR ITS FABRICATION | November 2009 | May 2014 | Allow | 53 | 3 | 1 | No | No |
| 12621749 | INTEGRATED CIRCUIT PACKAGE WITH STAND-OFF LEGS | November 2009 | March 2015 | Allow | 60 | 5 | 1 | Yes | No |
| 12535489 | SEMICONDUCTOR DEVICE HAVING INSULATING LAYERS CONTAINING OXYGEN AND A BARRIER LAYER CONTAINING MANGANESE | August 2009 | May 2014 | Allow | 57 | 5 | 1 | Yes | No |
| 12458454 | Stacked wafer level package and method of manufacturing the same | July 2009 | November 2013 | Allow | 52 | 5 | 1 | No | No |
| 12485428 | Lead Frame Apparatus and Method for Improved Wire Bonding | June 2009 | December 2013 | Allow | 54 | 4 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner ARROYO, TERESA M.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 100.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner ARROYO, TERESA M works in Art Unit 2893 and has examined 73 patent applications in our dataset. With an allowance rate of 86.3%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 38 months.
Examiner ARROYO, TERESA M's allowance rate of 86.3% places them in the 59% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by ARROYO, TERESA M receive 2.15 office actions before reaching final disposition. This places the examiner in the 73% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by ARROYO, TERESA M is 38 months. This places the examiner in the 12% percentile for prosecution speed. Applications take longer to reach final disposition with this examiner compared to most others.
Conducting an examiner interview provides a +1.4% benefit to allowance rate for applications examined by ARROYO, TERESA M. This interview benefit is in the 16% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 37.5% of applications are subsequently allowed. This success rate is in the 82% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 33.3% of cases where such amendments are filed. This entry rate is in the 41% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 200.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 97% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 94% percentile among all examiners. Of these withdrawals, 100.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 0.0% are granted (fully or in part). This grant rate is in the 3% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 26% percentile). This examiner makes examiner's amendments less often than average. You may need to make most claim amendments yourself.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 6.3% of allowed cases (in the 82% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.