Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18743906 | CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | June 2024 | December 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18664389 | AMORPHOUS BOTTOM ELECTRODE STRUCTURE FOR MIM CAPACITORS | May 2024 | September 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18655567 | SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING | May 2024 | September 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18632439 | CONTROL OF LOCOS STRUCTURE THICKNESS WITHOUT A MASK | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18629967 | SCHOTTKY BARRIER DIODE WITH REDUCED LEAKAGE CURRENT AND METHOD OF FORMING THE SAME | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18613151 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | March 2024 | July 2025 | Allow | 16 | 1 | 0 | No | No |
| 18442794 | SEMICONDUCTOR DEVICE ISOLATION FEATURES | February 2024 | January 2025 | Allow | 11 | 0 | 0 | No | No |
| 18440452 | METHODS FOR DEPOSITING AN OXIDE FILM ON A SUBSTRATE BY A CYCLICAL DEPOSITION PROCESS AND RELATED DEVICE STRUCTURES | February 2024 | September 2025 | Allow | 19 | 1 | 0 | No | No |
| 18434954 | SEMICONDUCTOR DEVICES INCLUDING CAPACITOR AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES | February 2024 | March 2025 | Allow | 13 | 0 | 0 | No | No |
| 18434711 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | February 2024 | June 2025 | Allow | 16 | 1 | 0 | No | No |
| 18407020 | MULTI-FIN VERTICAL FIELD EFFECT TRANSISTOR AND SINGLE-FIN VERTICAL FIELD EFFECT TRANSISTOR ON A SINGLE INTEGRATED CIRCUIT CHIP | January 2024 | July 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18406155 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | January 2024 | June 2025 | Allow | 17 | 0 | 1 | No | No |
| 18398378 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | December 2023 | January 2025 | Allow | 13 | 0 | 0 | No | No |
| 18534219 | TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | December 2023 | March 2025 | Allow | 15 | 1 | 0 | No | No |
| 18526290 | Semiconductor Structure Cutting Process and Structures Formed Thereby | December 2023 | September 2024 | Allow | 10 | 0 | 0 | No | No |
| 18523174 | GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS WITH BURIED P-TYPE LAYERS AND PROCESS FOR MAKING THE SAME | November 2023 | August 2025 | Allow | 20 | 1 | 0 | No | No |
| 18521404 | METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER | November 2023 | August 2025 | Allow | 21 | 2 | 0 | No | No |
| 18514010 | ANTI-OXIDATION LAYER TO PREVENT DIELECTRIC LOSS FROM PLANARIZATION PROCESS | November 2023 | March 2025 | Allow | 15 | 1 | 0 | No | No |
| 18513619 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | November 2023 | February 2025 | Allow | 15 | 1 | 0 | No | No |
| 18502244 | INTEGRATED CIRCUIT PACKAGE SUPPORTS | November 2023 | August 2024 | Allow | 10 | 0 | 0 | No | No |
| 18499258 | DEVICES INCLUDING STACKED NANOSHEET TRANSISTORS | November 2023 | January 2025 | Allow | 15 | 1 | 0 | Yes | No |
| 18490456 | PASSIVATION OF INFRARED DETECTORS USING OXIDE LAYER | October 2023 | August 2024 | Allow | 10 | 0 | 0 | No | No |
| 18376763 | CONTINUOUS GATE AND FIN SPACER FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | October 2023 | October 2025 | Allow | 25 | 3 | 0 | No | No |
| 18451137 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | August 2023 | March 2026 | Allow | 31 | 0 | 1 | No | No |
| 18450443 | DISPLAY DEVICE | August 2023 | February 2026 | Allow | 30 | 0 | 0 | No | No |
| 18366287 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | August 2023 | February 2026 | Allow | 30 | 0 | 1 | No | No |
| 18365517 | DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL | August 2023 | August 2024 | Allow | 12 | 0 | 0 | No | No |
| 18362030 | SEMICONDUCTOR DEVICE | July 2023 | March 2025 | Allow | 20 | 2 | 0 | No | No |
| 18362083 | Method of Fabricating Redistribution Circuit Structure | July 2023 | August 2024 | Allow | 12 | 0 | 0 | No | No |
| 18227357 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | July 2023 | November 2025 | Allow | 27 | 0 | 0 | Yes | No |
| 18360474 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE WORD LINES INCLUDING A RESPECTIVE FLUORINE-FREE CAPPING SUBLAYER AND METHODS OF FORMING THE SAME | July 2023 | February 2026 | Allow | 30 | 0 | 1 | No | No |
| 18359122 | CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF | July 2023 | December 2025 | Allow | 29 | 4 | 0 | Yes | No |
| 18355997 | Gate Structure and Method with Enhanced Gate Contact and Threshold Voltage | July 2023 | June 2024 | Allow | 11 | 0 | 0 | No | No |
| 18344580 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | June 2023 | November 2024 | Allow | 17 | 1 | 0 | No | No |
| 18333470 | THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS | June 2023 | October 2025 | Allow | 28 | 0 | 0 | No | No |
| 18315836 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS INCLUDING THE SAME | May 2023 | June 2024 | Allow | 14 | 0 | 0 | Yes | No |
| 18195269 | FORMING NANOSHEET TRANSISTOR USING SACRIFICIAL SPACER AND INNER SPACERS | May 2023 | March 2024 | Allow | 11 | 0 | 0 | No | No |
| 18133086 | DISPLAY DEVICE | April 2023 | August 2025 | Abandon | 28 | 3 | 0 | No | No |
| 18130573 | Digital Isolator Structure and Method for Forming the Same | April 2023 | February 2026 | Allow | 34 | 0 | 1 | No | No |
| 18295433 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE | April 2023 | October 2025 | Allow | 30 | 0 | 0 | No | No |
| 18295010 | FILL FINS FOR SEMICONDUCTOR DEVICES | April 2023 | September 2025 | Allow | 30 | 3 | 0 | Yes | No |
| 18128433 | METHOD AND SYSTEM FOR MIXED GROUP V PRECURSOR PROCESS | March 2023 | October 2025 | Allow | 30 | 0 | 0 | No | No |
| 18025812 | VARIABLE CAPACITOR AND INTEGRATED CIRCUIT | March 2023 | September 2025 | Allow | 31 | 0 | 0 | No | No |
| 18119043 | METHOD FOR MANUFACTURING CAPACITOR STRUCTURE | March 2023 | May 2024 | Allow | 14 | 1 | 0 | No | No |
| 18119009 | CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | March 2023 | May 2024 | Allow | 14 | 1 | 0 | No | No |
| 18117539 | SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DUMMY SUBSTRATES | March 2023 | April 2025 | Allow | 26 | 3 | 1 | No | No |
| 18116318 | SILICON CAPACITOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | March 2023 | February 2026 | Allow | 35 | 0 | 1 | No | No |
| 18115165 | POWER SEMICONDUCTOR DEVICE | February 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18173934 | Method For Growing Multiple Layers of Source Drain Epitaxial Silicon in FDSOI Process | February 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18108755 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH BOTTOM CAPACITOR ELECTRODE HAVING CROWN-SHAPED STRUCTURE AND INTERCONNECT PORTION | February 2023 | November 2023 | Allow | 9 | 0 | 0 | No | No |
| 18162775 | METAL-INSULATOR-METAL (MIM) CAPACITORS WITH CURVED ELECTRODE | February 2023 | January 2026 | Allow | 36 | 1 | 1 | Yes | No |
| 18104711 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | February 2023 | November 2025 | Allow | 34 | 0 | 1 | No | No |
| 18103201 | INTEGRATION SCHEME FOR FABRICATING HIGH PRECISION, LOW CAPACITOR WITH UNLANDED VIA | January 2023 | January 2026 | Allow | 35 | 1 | 1 | Yes | No |
| 18101134 | STRUCTURES AND METHODS OF FABRICATING ELECTRONIC DEVICES USING SEPARATION AND CHARGE DEPLETION TECHNIQUES | January 2023 | November 2023 | Allow | 9 | 0 | 0 | No | No |
| 18156024 | FORMING WRAP AROUND CONTACT WITH SELF-ALIGNED BACKSIDE CONTACT | January 2023 | January 2026 | Allow | 36 | 1 | 1 | Yes | No |
| 18153652 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | January 2023 | June 2025 | Allow | 29 | 3 | 0 | No | No |
| 18152870 | METHOD FOR MANUFACTURING GATE OF NAND FLASH | January 2023 | September 2025 | Allow | 32 | 1 | 0 | No | No |
| 18151940 | MASK ASSEMBLY AND APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS | January 2023 | July 2024 | Allow | 18 | 1 | 0 | No | No |
| 18094088 | HIGH RESISTANCE POLY RESISTOR | January 2023 | February 2024 | Allow | 14 | 0 | 1 | No | No |
| 18149226 | LOW RESISTIVITY DRAM BURIED WORD LINE STACK | January 2023 | February 2024 | Allow | 13 | 0 | 0 | No | No |
| 18149197 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | January 2023 | September 2025 | Allow | 33 | 1 | 0 | No | No |
| 18149225 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | January 2023 | December 2025 | Allow | 35 | 1 | 1 | No | No |
| 18088631 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | December 2022 | February 2024 | Allow | 13 | 1 | 0 | No | No |
| 18002513 | METHOD AND APPARATUS TO MITIGATE WORD LINE STAIRCASE ETCH STOP LAYER THICKNESS VARIATIONS IN 3D NAND DEVICES | December 2022 | May 2025 | Allow | 29 | 0 | 0 | No | No |
| 18067776 | METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR | December 2022 | May 2025 | Allow | 29 | 0 | 0 | No | No |
| 18080976 | HIGH VOLTAGE ISOLATED MICROELECTRONIC DEVICE | December 2022 | February 2024 | Allow | 14 | 0 | 1 | Yes | No |
| 18078064 | CAPACITOR ON FIN STRUCTURE AND FABRICATING METHOD OF THE SAME | December 2022 | March 2026 | Allow | 39 | 2 | 1 | No | No |
| 18072307 | NON-VOLATILE MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME | November 2022 | June 2025 | Allow | 31 | 0 | 1 | No | No |
| 18057894 | SEMICONDUCTOR DEVICES INCLUDING CAPACITOR AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES | November 2022 | November 2023 | Allow | 11 | 0 | 0 | No | No |
| 17985965 | ELECTRONIC FUSES WITH AN AIRGAP UNDER THE FUSE LINK | November 2022 | December 2025 | Allow | 37 | 1 | 1 | No | No |
| 17981561 | STRUCTURES AND METHODS FOR MEMORY CELLS | November 2022 | October 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17979345 | STACKED TRANSISTORS WITH DIFFERENT CHANNEL WIDTHS | November 2022 | October 2024 | Allow | 23 | 2 | 0 | No | No |
| 17967354 | LOW WARP FAN-OUT PROCESSING METHOD AND PRODUCTION OF SUBSTRATES THEREFOR | October 2022 | September 2023 | Allow | 11 | 0 | 0 | No | No |
| 17995791 | METHOD FOR MANUFACTURING A SeOI INTEGRATED CIRCUIT CHIP | October 2022 | September 2025 | Allow | 35 | 1 | 0 | No | No |
| 17958922 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | October 2022 | January 2026 | Allow | 39 | 1 | 1 | No | No |
| 17937360 | METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS | September 2022 | January 2026 | Allow | 40 | 1 | 1 | No | No |
| 17956157 | SELECTIVE OXIDATION OF A SUBSTRATE | September 2022 | June 2025 | Allow | 32 | 0 | 1 | No | No |
| 17936846 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | September 2022 | August 2025 | Allow | 34 | 0 | 1 | No | No |
| 17943336 | METHODS FOR DEPOSITING AN OXIDE FILM ON A SUBSTRATE BY A CYCLICAL DEPOSITION PROCESS AND RELATED DEVICE STRUCTURES | September 2022 | October 2023 | Allow | 13 | 0 | 0 | No | No |
| 17941534 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | September 2022 | November 2025 | Allow | 38 | 1 | 1 | No | No |
| 17929911 | ELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES EXHIBITING A WEAVE PATTERN, AND RELATED MEMORY DEVICES, SYSTEMS, AND METHODS | September 2022 | January 2026 | Allow | 40 | 1 | 1 | No | No |
| 17898827 | SELF-SUPPORTING SGD STADIUM | August 2022 | February 2026 | Allow | 42 | 2 | 1 | No | No |
| 17892157 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD | August 2022 | August 2025 | Allow | 36 | 1 | 0 | No | No |
| 17891028 | ENHANCED DEPOSITION RATE BY THERMAL ISOLATION COVER FOR GIS MANIPULATOR | August 2022 | February 2025 | Allow | 30 | 0 | 0 | No | No |
| 17890969 | CONTINUOUS GATE AND FIN SPACER FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | August 2022 | June 2023 | Allow | 10 | 0 | 0 | No | No |
| 17886380 | INNOVATIVE FAN-OUT PANEL LEVEL PACKAGE (FOPLP) WARPAGE CONTROL | August 2022 | March 2024 | Allow | 19 | 1 | 0 | No | No |
| 17818279 | SUPPORT STRUCTURES FOR THREE DIMENSIONAL MEMORY ARRAYS | August 2022 | April 2025 | Allow | 33 | 0 | 1 | Yes | No |
| 17877056 | SEMICONDUCTOR MEMORY DEVICE | July 2022 | May 2024 | Allow | 21 | 2 | 0 | Yes | No |
| 17874732 | Semiconductor Device and Method | July 2022 | November 2023 | Allow | 16 | 1 | 0 | No | No |
| 17872417 | Semiconductor Structure Cutting Process and Structures Formed Thereby | July 2022 | August 2023 | Allow | 13 | 0 | 0 | No | No |
| 17869826 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | July 2022 | June 2023 | Allow | 11 | 0 | 0 | No | No |
| 17867369 | TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | July 2022 | September 2023 | Allow | 14 | 0 | 0 | No | No |
| 17863273 | NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE | July 2022 | October 2024 | Allow | 27 | 3 | 0 | No | No |
| 17862609 | SEMICONDUCTOR DEVICES AND RELATED METHODS | July 2022 | August 2025 | Allow | 37 | 6 | 0 | No | No |
| 17859425 | GALLIUM NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS WITH P-TYPE LAYERS AND PROCESS FOR MAKING THE SAME | July 2022 | July 2024 | Allow | 24 | 2 | 0 | No | No |
| 17857699 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | July 2022 | June 2023 | Allow | 11 | 0 | 0 | No | No |
| 17809956 | Cell Manufacturing | June 2022 | May 2024 | Allow | 22 | 2 | 0 | No | No |
| 17788555 | DISPLAY PANEL AND DISPLAY DEVICE | June 2022 | May 2025 | Allow | 35 | 1 | 0 | No | No |
| 17848008 | VERTICAL MEMORY DEVICES AND METHOD OF FABRICATION THEREOF | June 2022 | August 2025 | Allow | 38 | 1 | 1 | No | No |
| 17846371 | SEMICONDUCTOR MODULE, ELECTRICAL COMPONENT, AND CONNECTION STRUCTURE OF THE SEMICONDUCTOR MODULE AND THE ELECTRICAL COMPONENT | June 2022 | December 2024 | Allow | 30 | 0 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner BODNAR, JOHN A.
With a 16.7% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 44.4% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner BODNAR, JOHN A works in Art Unit 2893 and has examined 574 patent applications in our dataset. With an allowance rate of 82.4%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 25 months.
Examiner BODNAR, JOHN A's allowance rate of 82.4% places them in the 55% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by BODNAR, JOHN A receive 2.03 office actions before reaching final disposition. This places the examiner in the 53% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by BODNAR, JOHN A is 25 months. This places the examiner in the 80% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +11.4% benefit to allowance rate for applications examined by BODNAR, JOHN A. This interview benefit is in the 46% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 24.5% of applications are subsequently allowed. This success rate is in the 36% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 34.9% of cases where such amendments are filed. This entry rate is in the 52% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 100.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 74% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 68.4% of appeals filed. This is in the 54% percentile among all examiners. Of these withdrawals, 53.8% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 48% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.3% of allowed cases (in the 57% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.8% of allowed cases (in the 59% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.