Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18671619 | LIGHT EMITTING DIODE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18652529 | METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS | May 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18650166 | MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18614472 | SEMICONDUCTOR SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18600146 | MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE | March 2024 | November 2024 | Allow | 8 | 0 | 1 | No | No |
| 18433367 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | February 2024 | January 2025 | Allow | 12 | 1 | 0 | No | No |
| 18430140 | METHODS OF MANUFACTURING SEMICONDUCTOR CHIP INCLUDING CRACK PROPAGATION GUIDE | February 2024 | June 2025 | Allow | 17 | 1 | 0 | No | No |
| 18428994 | Implantations for Forming Source/Drain Regions of Different Transistors | January 2024 | May 2025 | Allow | 15 | 1 | 0 | No | No |
| 18402018 | FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME | January 2024 | April 2025 | Allow | 15 | 2 | 0 | No | No |
| 18535536 | Cu3Sn VIA METALLIZATION IN ELECTRICAL DEVICES FOR LOW-TEMPERATURE 3D-INTEGRATION | December 2023 | March 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18515274 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | November 2023 | October 2024 | Allow | 11 | 0 | 1 | No | No |
| 18503681 | Enhanced Ignition in Inductively Coupled Plasmas For Workpiece Processing | November 2023 | March 2025 | Allow | 16 | 1 | 0 | No | No |
| 18383667 | METHOD TO IMPROVE PROFILE CONTROL DURING SELECTIVE ETCHING OF SILICON NITRIDE SPACERS | October 2023 | October 2024 | Allow | 12 | 1 | 0 | No | No |
| 18485709 | Structure and Method for Sealing a Silicon IC | October 2023 | November 2024 | Allow | 13 | 2 | 0 | No | No |
| 18378885 | SEMICONDUCTOR DEVICE WITH WIRE BOND AND METHOD FOR PREPARING THE SAME | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18481975 | PACKAGE STRUCTURE | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18365009 | CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES | August 2023 | November 2024 | Allow | 15 | 1 | 0 | No | No |
| 18228134 | COMPOSITE OXIDE SEMICONDUCTOR AND TRANSISTOR | July 2023 | May 2024 | Allow | 9 | 0 | 0 | No | No |
| 18362797 | IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC ADHESION AND PREVENTING METAL DIFFUSION | July 2023 | June 2024 | Allow | 11 | 0 | 0 | No | No |
| 18360694 | METHOD OF FORMING A HIGH ELECTRON MOBILITY TRANSISTOR | July 2023 | October 2024 | Allow | 14 | 1 | 0 | No | No |
| 18359012 | SELF-ALIGNED INTERCONNECT STRUCTURE | July 2023 | February 2025 | Allow | 19 | 2 | 0 | No | No |
| 18224209 | INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | July 2023 | May 2025 | Allow | 21 | 2 | 1 | Yes | No |
| 18347067 | WAFER BONDING ALIGNMENT | July 2023 | December 2024 | Allow | 17 | 0 | 0 | No | No |
| 18217223 | METHOD FOR LOW-COST, HIGH-BANDWIDTH MONOLITHIC SYSTEM INTEGRATION BEYOND RETICLE LIMIT | June 2023 | June 2025 | Allow | 23 | 2 | 1 | No | No |
| 18329302 | Integrated Circuit Package and Method of Forming Thereof | June 2023 | September 2024 | Allow | 15 | 1 | 0 | No | No |
| 18322462 | STRETCHABLE DISPLAY DEVICE | May 2023 | August 2024 | Allow | 14 | 1 | 0 | No | No |
| 18144902 | SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME | May 2023 | April 2024 | Allow | 11 | 1 | 0 | No | No |
| 18306137 | SYSTEMS AND METHODS FOR MITIGATING CRACK PROPAGATION IN SEMICONDUCTOR DIE MANUFACTURING | April 2023 | February 2025 | Allow | 22 | 2 | 0 | No | No |
| 18128622 | SEMICONDUCTOR WAFER THINNED BY STEALTH LASING | March 2023 | November 2023 | Allow | 7 | 0 | 0 | No | No |
| 18127203 | CRACKSTOP STRUCTURES | March 2023 | March 2025 | Allow | 24 | 1 | 1 | Yes | No |
| 18175398 | METHODS OF FORMING A MICROELECTRONIC DEVICE | February 2023 | October 2023 | Allow | 8 | 0 | 0 | No | No |
| 18166922 | SEMICONDUCTOR DEVICE WITH A DIELECTRIC BETWEEN PORTIONS | February 2023 | August 2024 | Allow | 18 | 2 | 0 | Yes | No |
| 18106028 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES BY FILLING GROOVES FORMED IN A FRONT SIDE SURFACE OF A WAFER WITH A SIDE FACE PROTECTION MATERIAL | February 2023 | May 2024 | Allow | 15 | 2 | 0 | No | No |
| 18164629 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18163338 | METHOD OF FORMING PACKAGE STRUCTURE | February 2023 | January 2024 | Allow | 11 | 1 | 0 | No | No |
| 18146222 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | December 2022 | August 2023 | Allow | 8 | 1 | 0 | No | No |
| 18063280 | Implantations for Forming Source/Drain Regions of Different Transistors | December 2022 | September 2023 | Allow | 10 | 0 | 0 | No | No |
| 18061990 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | December 2022 | August 2023 | Allow | 8 | 0 | 0 | No | No |
| 17990953 | MICRO LIGHT EMITTING DEVICE ARRAY AND METHOD OF MANUFACTURING THE SAME | November 2022 | August 2024 | Allow | 20 | 2 | 0 | Yes | No |
| 17756325 | METHOD FOR MANUFACTURING A FUNCTIONAL CHIP SUITABLE FOR BEING ASSEMBLED TO WIRE ELEMENTS | October 2022 | December 2024 | Allow | 31 | 0 | 0 | No | No |
| 17966687 | ELECTRONIC DEVICE | October 2022 | August 2024 | Allow | 22 | 2 | 0 | No | No |
| 17961056 | SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE | October 2022 | March 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 17945631 | METHOD TO IMPROVE PROFILE CONTROL DURING SELECTIVE ETCHING OF SILICON NITRIDE SPACERS | September 2022 | July 2023 | Allow | 10 | 0 | 0 | No | No |
| 17944596 | METHODS FOR FORMING METAL GAPFILL WITH LOW RESISTIVITY | September 2022 | December 2024 | Allow | 27 | 0 | 0 | No | No |
| 17944678 | SEMICONDUCTOR DEVICE | September 2022 | June 2025 | Allow | 33 | 1 | 0 | No | No |
| 17944361 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | September 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17930544 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF FORMING PATTERN | September 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17821556 | METHOD OF PROCESSING MONOCRYSTALLINE SILICON WAFER | August 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17820838 | PACKAGE SUBSTRATE, PACKAGE SUBSTRATE PROCESSING METHOD, AND PACKAGED CHIP | August 2022 | May 2025 | Allow | 33 | 0 | 1 | No | No |
| 17890080 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | August 2022 | April 2025 | Allow | 32 | 0 | 1 | No | No |
| 17819004 | DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | August 2022 | June 2024 | Allow | 22 | 0 | 0 | No | No |
| 17818736 | Passivation Structure With Increased Thickness for Metal Pads | August 2022 | April 2024 | Allow | 20 | 1 | 0 | No | No |
| 17884286 | WARPAGE CONTROL OF SEMICONDUCTOR DIE | August 2022 | February 2024 | Allow | 18 | 1 | 0 | No | No |
| 17876255 | METHOD OF FORMING SOURCE/DRAIN EPITAXIAL STACKS | July 2022 | October 2023 | Allow | 14 | 1 | 0 | No | No |
| 17875533 | MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD | July 2022 | February 2024 | Allow | 18 | 1 | 0 | No | No |
| 17868946 | SELF-ALIGNED INTERCONNECT STRUCTURE | July 2022 | June 2023 | Allow | 11 | 0 | 0 | No | No |
| 17865705 | DIE CORNER PROTECTION BY USING POLYMER DEPOSITION TECHNOLOGY | July 2022 | March 2024 | Allow | 20 | 2 | 0 | No | No |
| 17864325 | HIGH ELECTRON MOBILITY TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF | July 2022 | June 2025 | Allow | 35 | 1 | 1 | No | No |
| 17856039 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | July 2022 | January 2024 | Abandon | 18 | 1 | 0 | No | No |
| 17845971 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE | June 2022 | June 2025 | Allow | 36 | 1 | 1 | No | No |
| 17841526 | DEEP TRENCH PROTECTION | June 2022 | June 2025 | Allow | 36 | 5 | 0 | No | No |
| 17827198 | Enhanced Ignition in Inductively Coupled Plasmas For Workpiece Processing | May 2022 | August 2023 | Allow | 14 | 1 | 0 | No | No |
| 17750961 | MECHANISMS FOR FORMING IMAGE-SENSOR DEVICE WITH DEEP-TRENCH ISOLATION STRUCTURE | May 2022 | January 2024 | Allow | 19 | 1 | 0 | No | No |
| 17664484 | Bonding with Pre-Deoxide Process and Apparatus for Performing the Same | May 2022 | July 2025 | Allow | 37 | 1 | 0 | No | No |
| 17664067 | FLEXIBLE SUBSTRATE | May 2022 | October 2024 | Allow | 29 | 0 | 0 | No | No |
| 17748261 | SEMICONDUCTOR MEMORY DEVICES | May 2022 | August 2023 | Allow | 14 | 0 | 0 | No | No |
| 17744760 | MICRO LIGHT EMITTING DEVICE DISPLAY APPARATUS | May 2022 | November 2024 | Allow | 30 | 0 | 0 | No | No |
| 17725643 | COMPOSITE OXIDE SEMICONDUCTOR AND TRANSISTOR | April 2022 | March 2023 | Allow | 11 | 0 | 0 | No | No |
| 17716934 | MULTI-CHIP PACKAGING | April 2022 | September 2024 | Allow | 29 | 3 | 0 | No | No |
| 17715380 | MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES | April 2022 | March 2024 | Abandon | 24 | 2 | 0 | No | No |
| 17655828 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | March 2022 | September 2024 | Abandon | 30 | 1 | 0 | No | No |
| 17693792 | CHANNEL FOR DECREASING DAMPING ASYMMETRY | March 2022 | February 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17686934 | DISPLAY PANEL AND ELECTRONIC DEVICE INCLUDING THE SAME | March 2022 | September 2024 | Allow | 31 | 0 | 0 | No | No |
| 17669265 | ROBUST MOLD INTEGRATED SUBSTRATE | February 2022 | February 2025 | Allow | 36 | 1 | 0 | No | No |
| 17668246 | DUAL SOLDER METHODOLOGIES FOR ULTRAHIGH DENSITY FIRST LEVEL INTERCONNECTIONS | February 2022 | October 2023 | Allow | 20 | 1 | 0 | No | No |
| 17587657 | MULTI-CHIP PACKAGING | January 2022 | July 2023 | Allow | 17 | 1 | 0 | No | No |
| 17631147 | PHOTOSENSOR, SENSOR UNIT, AND OBJECT DETECTION APPARATUS USING PHOTOSENSOR | January 2022 | January 2025 | Allow | 36 | 1 | 0 | Yes | No |
| 17578699 | DEVICE ISOLATION | January 2022 | September 2024 | Abandon | 32 | 2 | 1 | Yes | No |
| 17648130 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | January 2022 | September 2024 | Allow | 32 | 1 | 1 | No | No |
| 17568133 | MEMORY ARRAYS WITH VERTICAL TRANSISTORS AND THE FORMATION THEREOF | January 2022 | June 2025 | Allow | 41 | 1 | 1 | Yes | No |
| 17567639 | METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES | January 2022 | August 2023 | Allow | 20 | 2 | 0 | No | No |
| 17563187 | IMAGING DISPLAY DEVICE AND ELECTRONIC DEVICE | December 2021 | April 2023 | Allow | 16 | 1 | 0 | No | No |
| 17558915 | METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING STRESSED ACTIVE REGIONS THEREIN | December 2021 | July 2023 | Allow | 19 | 1 | 1 | No | No |
| 17552261 | MANUFACTURABLE LASER DIODES ON A LARGE AREA GALLIUM AND NITROGEN CONTAINING SUBSTRATE | December 2021 | March 2023 | Allow | 15 | 1 | 0 | No | No |
| 17551712 | FINFET TRANSISTOR | December 2021 | October 2023 | Allow | 22 | 1 | 0 | No | No |
| 17546449 | BACKSIDE AND SIDEWALL METALLIZATION OF SEMICONDUCTOR DEVICES | December 2021 | November 2023 | Allow | 23 | 0 | 1 | No | No |
| 17534814 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH EMI PROTECTION STRUCTURE | November 2021 | December 2022 | Allow | 13 | 1 | 0 | No | No |
| 17611614 | METHOD OF FABRICATING A CONDUCTIVE LAYER ON AN IC USING NON-LITHOGRAPHIC FABRICATION TECHNIQUES | November 2021 | March 2025 | Allow | 40 | 1 | 1 | Yes | No |
| 17523635 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | November 2021 | May 2024 | Allow | 30 | 1 | 1 | Yes | No |
| 17512958 | IC HAVING ELECTRICALLY ISOLATED WARPAGE PREVENTION STRUCTURES | October 2021 | August 2023 | Allow | 22 | 0 | 1 | No | No |
| 17605733 | Guard Ring Structure, Semiconductor Structure And Manufacturing Method | October 2021 | March 2025 | Allow | 40 | 2 | 1 | No | No |
| 17594346 | METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS | October 2021 | February 2024 | Allow | 29 | 0 | 1 | No | No |
| 17493820 | SEMICONDUCTOR DEVICE WITH WIRE BOND AND METHOD FOR PREPARING THE SAME | October 2021 | October 2023 | Allow | 24 | 0 | 1 | No | No |
| 17593967 | RADIATION SENSOR ELEMENT AND METHOD | September 2021 | March 2022 | Allow | 5 | 0 | 0 | No | No |
| 17483076 | METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) | September 2021 | October 2023 | Allow | 25 | 0 | 0 | No | No |
| 17473285 | METHODS OF FORMING CIRCUIT-PROTECTION DEVICES | September 2021 | February 2024 | Allow | 29 | 2 | 0 | No | No |
| 17469362 | METHODS OF MANUFACTURING SEMICONDUCTOR CHIP INCLUDING CRACK PROPAGATION GUIDE | September 2021 | October 2023 | Allow | 26 | 0 | 0 | No | No |
| 17460347 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | August 2021 | August 2023 | Allow | 24 | 0 | 1 | No | No |
| 17410455 | DISPLAY DEVICE | August 2021 | September 2024 | Allow | 37 | 1 | 1 | No | No |
| 17432433 | DISPLAYING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | August 2021 | January 2024 | Allow | 29 | 0 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner NGUYEN, THANH T.
With a 46.7% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 28.6% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner NGUYEN, THANH T works in Art Unit 2893 and has examined 1,076 patent applications in our dataset. With an allowance rate of 85.0%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 23 months.
Examiner NGUYEN, THANH T's allowance rate of 85.0% places them in the 56% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by NGUYEN, THANH T receive 1.55 office actions before reaching final disposition. This places the examiner in the 39% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by NGUYEN, THANH T is 23 months. This places the examiner in the 77% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +6.8% benefit to allowance rate for applications examined by NGUYEN, THANH T. This interview benefit is in the 35% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 27.6% of applications are subsequently allowed. This success rate is in the 38% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 35.0% of cases where such amendments are filed. This entry rate is in the 44% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 84.2% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 63% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 65.9% of appeals filed. This is in the 41% percentile among all examiners. Of these withdrawals, 34.5% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 49.4% are granted (fully or in part). This grant rate is in the 59% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 4.8% of allowed cases (in the 89% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 2.4% of allowed cases (in the 68% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.