USPTO Art Unit 2898 Prosecution Statistics

Art Unit Information

Art Unit: 2898
Group: 2890
Tech Center: 2800
Total Cases: 15,813
Last Active: December 2024

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18976344CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTUREDecember 2024January 2025Allow200NoNo
18855536BONDING WIREOctober 2024March 2025Allow500NoNo
18855293VERTICAL FIELD EFFECT DEVICE AND METHOD OF MANUFACTURINGOctober 2024February 2025Allow400YesNo
18889464SEMICONDUCTOR DEVICE INCLUDING OVERLAPPING ELECTRODESSeptember 2024June 2025Allow920YesNo
18888284Device Structure for Inducing Layout Dependent Threshold Voltage ShiftSeptember 2024March 2025Allow600NoNo
18790739SEMICONDUCTOR DEVICEJuly 2024September 2024Allow200NoNo
18760980SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEMJuly 2024March 2025Allow900NoNo
18757573MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE INCLUDING GATE OXIDE LAYERJune 2024April 2025Allow1000NoNo
18755727HIGH ELECTRON MOBILITY TRANSISTOR STRUCTURE AND METHOD OF FABRICATING THE SAMEJune 2024June 2025Allow1200NoNo
18739152HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIR� BASED METROLOGY AND VACUUM BASED PICK-AND-PLACEJune 2024January 2025Allow700NoNo
18738787PARKING SPACE DETECTION METHOD AND SYSTEMJune 2024April 2025Allow1010NoNo
18736560HIGH VOLTAGE SEMICONDUCTOR DEVICE INCLUDING BURIED OXIDE LAYERJune 2024April 2025Allow1110NoNo
18735187PACKAGE AND MANUFACTURING METHOD THEREOFJune 2024June 2025Allow1301NoNo
18732879SEMICONDUCTOR DEVICE AND METHODJune 2024January 2025Allow700NoNo
18732121SYSTEM AND METHOD FOR RAILROAD TIE MANAGEMENTJune 2024January 2025Allow700NoNo
18731895IMAGE SENSORJune 2024May 2025Allow1111NoNo
18679537PIEZOELECTRIC BIOSENSOR AND RELATED METHOD OF FORMATIONMay 2024March 2025Allow1010NoNo
18677991METHOD OF MANUFACTURING A TRENCH CAPACITOR WITH WAFER BOWMay 2024January 2025Allow800NoNo
18676539MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICEMay 2024June 2025Allow1310NoNo
18673411DISPLAY DEVICEMay 2024April 2025Allow1110YesNo
18672104METHOD FOR METAL GATE CUT AND STRUCTURE THEREOFMay 2024February 2025Allow900NoNo
18671947MEMORY DEVICE AND FORMATION METHOD THEREOFMay 2024March 2025Allow900NoNo
18670140SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOFMay 2024March 2025Allow1001NoNo
18668432METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE HAVING FEATURES OF DIFFERENT DEPTHSMay 2024May 2025Allow1210NoNo
18669156RADIO FREQUENCY (RF) SEMICONDUCTOR DEVICES INCLUDING A GROUND PLANE LAYER HAVING A SUPERLATTICEMay 2024May 2025Allow1210YesNo
18666835SEMICONDUCTOR DEVICEMay 2024March 2025Allow1010NoNo
18667347TWO-ROTATION GATE-EDGE DIODE LEAKAGE REDUCTION FOR MOS TRANSISTORSMay 2024April 2025Allow1100NoNo
18663715DISPLAY DEVICEMay 2024March 2025Allow1010YesNo
18660550INTEGRATED CIRCUIT SEMICONDUCTOR DEVICEMay 2024December 2024Allow710NoNo
18656134SEMICONDUCTOR DEVICESMay 2024March 2025Allow1110NoNo
18655341MANUFACTURING METHOD OF SEMICONDUCTOR DEVICEMay 2024March 2025Allow1010NoNo
18654658STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITORMay 2024December 2024Allow800NoNo
18653243DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFERMay 2024January 2025Allow800NoNo
18648971BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAMEApril 2024June 2025Allow1311NoNo
18705273SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE WITH ENCAPSULATED PINSApril 2024June 2025Allow1420YesNo
18646280MICRO-DEVICE STRUCTURES WITH ETCH HOLESApril 2024May 2025Allow1300NoNo
18645947SEMICONDUCTOR DEVICEApril 2024February 2025Allow1010NoNo
18646015STACKED INTEGRATED CIRCUIT DEVICESApril 2024April 2025Allow1110NoNo
18645743Light-Emitting Device, Light-Emitting Apparatus, Electronic Device, and Lighting DeviceApril 2024January 2025Allow800YesNo
18643260SEMICONDUCTOR MEMORY DEVICEApril 2024January 2025Allow900NoNo
18641719POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENTApril 2024January 2025Allow900NoNo
18640867STACKED SEMICONDUCTOR DIE ARCHITECTURE WITH MULTIPLE LAYERS OF DISAGGREGATIONApril 2024June 2025Allow1410NoNo
18639156DISPLAY DEVICEApril 2024March 2025Allow1100NoNo
18637744PIXEL DEVICE ON DEEP TRENCH ISOLATION (DTI) STRUCTURE FOR IMAGE SENSORApril 2024April 2025Allow1110NoNo
18637539BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAMEApril 2024June 2025Allow1410YesNo
18636979NANOROD LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, AND DISPLAY APPARATUS INCLUDING THE SAMEApril 2024April 2025Allow1210YesNo
18632810IMAGE SENSOR AND METHOD OF FABRICATING THE SAMEApril 2024May 2025Allow1310NoNo
18630628Display PanelApril 2024February 2025Allow1110NoNo
18627932LIGHT-EMITTING DEVICEApril 2024January 2025Allow1010NoNo
18624725METAL LAYER PROTECTION DURING WET ETCHINGApril 2024January 2025Allow900NoNo
18622511LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALINGMarch 2024March 2025Allow1110YesNo
18619330DISPLAY SUBSTRATE AND DISPLAY DEVICEMarch 2024January 2025Allow1010NoNo
18611843SEMICONDUCTOR DEVICEMarch 2024March 2025Allow1201NoNo
18612228INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAMEMarch 2024March 2025Allow1101NoNo
18610267REDUCED PITCH MEMORY SUBSYSTEM FOR MEMORY DEVICEMarch 2024March 2025Allow1210NoNo
18609234INTEGRATED CIRCUITMarch 2024April 2025Allow1301NoNo
18609571METHOD FOR MANUFACTURING PACKAGE STRUCTUREMarch 2024September 2024Allow600NoNo
18606413IMAGE SENSORS WITH LIGHT CHANNELING REFLECTIVE LAYERS THEREINMarch 2024February 2025Allow1110NoNo
18605411METHOD OF MANUFACTURE AND ASSEMBLY OF XY FLEXURE MECHANISM ASSEMBLYMarch 2024November 2024Allow811YesNo
18605154INK DROPLET VOLUME MEASURING APPARATUS AND INK DROPLET VOLUME MEASURING METHOD USING THE SAME, AND THIN FILM LAYER FORMING APPARATUS USING THE MEASURING APPARATUS, AND MANUFACTURING METHOD OF DISPLAY APPARATUS USING THE THIN FILM LAYER FORMING APPARATUSMarch 2024December 2024Allow900NoNo
18603313RRAM STRUCTUREMarch 2024May 2025Allow1410NoNo
18603529METAL-INSULATOR-METAL CAPACITORMarch 2024May 2025Allow1420YesNo
18600711LOGIC DRIVE BASED ON MULTICHIP PACKAGE USING INTERCONNECTION BRIDGEMarch 2024January 2025Allow1100NoNo
18599954Light-Emitting Device, Light-Emitting Appliance, Display Device, Electronic Appliance, and Lighting DeviceMarch 2024February 2025Allow1100NoNo
18598672SEMICONDUCTOR DEVICEMarch 2024November 2024Allow800NoNo
18596076Asic Package With Photonics And Vertical Power DeliveryMarch 2024February 2025Allow1110NoNo
18594647MICRO-DEVICE STRUCTURES WITH ETCH HOLESMarch 2024July 2025Allow1610NoNo
18594944IN-PLANE AND OUT-OF-PLANE ACCELEROMETERMarch 2024June 2025Allow1500YesNo
18593505SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHOD THEREOFMarch 2024March 2025Allow1310NoNo
18591687SEMICONDUCTOR DEVICE INCLUDING GATE SEPARATION REGIONFebruary 2024September 2024Allow600NoNo
18591560DETECTION DEVICEFebruary 2024February 2025Allow1210NoNo
18587908VERTICALLY MOUNTED DIE GROUPSFebruary 2024October 2024Allow800NoNo
18584740OPTICAL DEVICE PRODUCTION METHODFebruary 2024August 2024Allow600NoNo
18581598METAL BASED HYDROGEN BARRIERFebruary 2024March 2025Allow1201NoNo
18444849SEMICONDUCTOR DEVICE HAVING MERGED EPITAXIAL FEATURES WITH ARC-LIKE BOTTOM SURFACE AND METHOD OF MAKING THE SAMEFebruary 2024March 2025Allow1311YesNo
18444742PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFFebruary 2024May 2025Allow1521NoNo
18444356SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTOR FINSFebruary 2024December 2024Allow1000NoNo
18442843LIGHT-EMITTING DEVICEFebruary 2024December 2024Allow1000NoNo
18439441DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODSFebruary 2024April 2025Allow1410NoNo
18439486DUAL-PORT SRAM STRUCTUREFebruary 2024January 2025Allow1110NoNo
18439445METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUMFebruary 2024June 2025Allow1610NoNo
18437720INTEGRATED FILLER CAPACITOR CELL DEVICE AND CORRESPONDING MANUFACTURING METHODFebruary 2024October 2024Allow800NoNo
18437321DIFFUSION BARRIER LAYER FOR SOURCE AND DRAIN STRUCTURES TO INCREASE TRANSISTOR PERFORMANCEFebruary 2024May 2025Allow1611NoNo
18436950SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEFebruary 2024October 2024Allow800YesNo
18435609DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATIONFebruary 2024October 2024Allow800NoNo
18435197STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USEFebruary 2024December 2024Allow1001NoNo
18434977DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAMEFebruary 2024August 2024Allow700NoNo
18435915METHOD FOR MANUFACTURING LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKSFebruary 2024November 2024Allow1001NoNo
18434347LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALINGFebruary 2024February 2025Allow1310YesNo
18432122LIGHT DETECTION DEVICEFebruary 2024November 2024Allow910NoNo
18431342FREQUENCY TUNING OF MULTI-QUBIT SYSTEMSFebruary 2024April 2025Allow1501NoNo
18429535CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIAFebruary 2024March 2025Allow1411NoNo
18429639PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUMFebruary 2024June 2025Allow1600NoNo
18426243SEMICONDUCTOR WAFER WITH DEVICES HAVING DIFFERENT TOP LAYER THICKNESSESJanuary 2024January 2025Allow1210NoNo
18425944SOURCE OR DRAIN STRUCTURES WITH VERTICAL TRENCHESJanuary 2024March 2025Allow1300NoNo
18423344SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICEJanuary 2024March 2025Allow1410NoNo
18423674METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH JUNCTION FET TRANSISTORS HAVING MULTI PINCH-OFF VOLTAGESJanuary 2024September 2024Allow700YesNo
18422726INTEGRATED CIRCUIT DEVICEJanuary 2024September 2024Allow800NoNo
18422220DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPSJanuary 2024May 2025Allow1611NoNo
18422049TRANSISTOR AND SEMICONDUCTOR DEVICEJanuary 2024August 2024Allow700NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2898.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
73
Examiner Affirmed
37
(50.7%)
Examiner Reversed
36
(49.3%)
Reversal Percentile
93.0%
Higher than average

What This Means

With a 49.3% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.

Strategic Value of Filing an Appeal

Total Appeal Filings
389
Allowed After Appeal Filing
174
(44.7%)
Not Allowed After Appeal Filing
215
(55.3%)
Filing Benefit Percentile
92.7%
Higher than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 44.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.

Strategic Recommendations

✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.

✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.

Art Unit 2898 - Prosecution Statistics Summary

Executive Summary

Art Unit 2898 is part of Group 2890 in Technology Center 2800. This art unit has examined 15,813 patent applications in our dataset, with an overall allowance rate of 90.5%. Applications typically reach final disposition in approximately 22 months.

Comparative Analysis

Art Unit 2898's allowance rate of 90.5% places it in the 91% percentile among all USPTO art units. This art unit has a significantly higher allowance rate than most art units at the USPTO.

Prosecution Patterns

Applications in Art Unit 2898 receive an average of 1.47 office actions before reaching final disposition (in the 22% percentile). The median prosecution time is 22 months (in the 89% percentile).

Strategic Considerations

When prosecuting applications in this art unit, consider the following:

  • The art unit's allowance rate suggests a more favorable examination environment compared to the USPTO average.
  • With fewer office actions than average, plan for relatively streamlined prosecution.
  • The median prosecution time is shorter than average and should be factored into your continuation and client communication strategies.
  • Review individual examiner statistics within this art unit to identify examiners with particularly favorable or challenging prosecution patterns.

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.