Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19253263 | RELAXED WURTZITE INGAN LAYERS | June 2025 | November 2025 | Allow | 4 | 1 | 0 | No | No |
| 19199129 | CRASH MITIGATION IN ACTIVE MEMS COOLING SYSTEMS | May 2025 | October 2025 | Allow | 6 | 0 | 2 | No | No |
| 19180420 | METHOD OF PREPARING A STRUCTURED SUBSTRATE FOR DIRECT BONDING | April 2025 | November 2025 | Allow | 7 | 0 | 1 | No | No |
| 18976344 | CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE | December 2024 | January 2025 | Allow | 2 | 0 | 0 | No | No |
| 18960184 | Embedded Digital Sensor Structure | November 2024 | May 2025 | Allow | 5 | 1 | 1 | Yes | No |
| 18957152 | METAL OXIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICE | November 2024 | July 2025 | Allow | 8 | 1 | 1 | Yes | No |
| 18855536 | BONDING WIRE | October 2024 | March 2025 | Allow | 5 | 0 | 0 | No | No |
| 18855293 | VERTICAL FIELD EFFECT DEVICE AND METHOD OF MANUFACTURING | October 2024 | February 2025 | Allow | 4 | 0 | 0 | Yes | No |
| 18896610 | METHOD FOR THE PRODUCTION OF IMPROVED SIC-SUBSTRATES AND SIC-EPILAYERS | September 2024 | September 2025 | Allow | 11 | 2 | 1 | No | No |
| 18889464 | SEMICONDUCTOR DEVICE INCLUDING OVERLAPPING ELECTRODES | September 2024 | June 2025 | Allow | 9 | 2 | 0 | Yes | No |
| 18888284 | Device Structure for Inducing Layout Dependent Threshold Voltage Shift | September 2024 | March 2025 | Allow | 6 | 0 | 0 | No | No |
| 18796736 | DISPLAY DEVICE | August 2024 | January 2026 | Allow | 18 | 0 | 0 | No | No |
| 18790739 | SEMICONDUCTOR DEVICE | July 2024 | September 2024 | Allow | 2 | 0 | 0 | No | No |
| 18780607 | SEMICONDUCTOR DEVICE INCLUDING END INSULATING LAYER | July 2024 | August 2025 | Allow | 13 | 3 | 0 | Yes | No |
| 18779427 | METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE | July 2024 | September 2025 | Allow | 14 | 1 | 0 | No | No |
| 18727080 | Array Substrate and Liquid Crystal Display Panel | July 2024 | August 2025 | Allow | 14 | 2 | 0 | No | No |
| 18760442 | SEMICONDUCTOR STORAGE DEVICE WITH OVERLAPPING CONTACTS AND SURROUNDING INSULATING LAYER | July 2024 | October 2025 | Allow | 15 | 1 | 0 | No | No |
| 18760980 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM | July 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18757573 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE INCLUDING GATE OXIDE LAYER | June 2024 | April 2025 | Allow | 10 | 0 | 0 | No | No |
| 18758239 | METHOD FOR TRANSPORTING WAFERS | June 2024 | March 2026 | Allow | 21 | 1 | 0 | No | No |
| 18756235 | METHOD AND STRUCTURES PERTAINING TO IMPROVED FERROELECTRIC RANDOM-ACCESS MEMORY (FeRAM) | June 2024 | January 2026 | Allow | 18 | 1 | 1 | No | No |
| 18757483 | METHOD OF FORMING MEMORY DEVICE | June 2024 | August 2025 | Allow | 14 | 0 | 1 | No | No |
| 18755727 | HIGH ELECTRON MOBILITY TRANSISTOR STRUCTURE AND METHOD OF FABRICATING THE SAME | June 2024 | June 2025 | Allow | 12 | 0 | 0 | No | No |
| 18757386 | INTERFACIAL DUAL PASSIVATION LAYER FOR A FERROELECTRIC DEVICE AND METHODS OF FORMING THE SAME | June 2024 | January 2026 | Allow | 18 | 0 | 0 | No | No |
| 18751695 | SEMICONDUCTOR DEVICE STRUCTURE WITH MOVABLE MEMBRANE | June 2024 | September 2025 | Allow | 15 | 1 | 0 | Yes | No |
| 18739152 | HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18738787 | PARKING SPACE DETECTION METHOD AND SYSTEM | June 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18736560 | HIGH VOLTAGE SEMICONDUCTOR DEVICE INCLUDING BURIED OXIDE LAYER | June 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18735187 | PACKAGE AND MANUFACTURING METHOD THEREOF | June 2024 | June 2025 | Allow | 13 | 0 | 1 | No | No |
| 18732879 | SEMICONDUCTOR DEVICE AND METHOD | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18732121 | SYSTEM AND METHOD FOR RAILROAD TIE MANAGEMENT | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18731895 | IMAGE SENSOR | June 2024 | May 2025 | Allow | 11 | 1 | 1 | No | No |
| 18679722 | DISPLAY APPARATUS AND METHOD OF FABRICATING DISPLAY APPARATUS | May 2024 | September 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18679537 | PIEZOELECTRIC BIOSENSOR AND RELATED METHOD OF FORMATION | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18677913 | SEMICONDUCTOR STRUCTURE | May 2024 | July 2025 | Allow | 14 | 1 | 1 | No | No |
| 18677991 | METHOD OF MANUFACTURING A TRENCH CAPACITOR WITH WAFER BOW | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18677952 | FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME | May 2024 | February 2026 | Allow | 21 | 1 | 0 | Yes | No |
| 18677474 | STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROMIGRATION | May 2024 | January 2026 | Allow | 20 | 0 | 0 | No | No |
| 18676539 | MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE | May 2024 | June 2025 | Allow | 13 | 2 | 0 | No | No |
| 18675249 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | May 2024 | February 2026 | Allow | 20 | 1 | 0 | No | No |
| 18674953 | SEMICONDUCTOR STRUCTURE | May 2024 | July 2025 | Allow | 13 | 1 | 0 | No | No |
| 18673411 | DISPLAY DEVICE | May 2024 | April 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18672104 | METHOD FOR METAL GATE CUT AND STRUCTURE THEREOF | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18671947 | MEMORY DEVICE AND FORMATION METHOD THEREOF | May 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18671580 | Air Gap Seal for Interconnect Air Gap and Method of Fabricating Thereof | May 2024 | January 2026 | Allow | 20 | 1 | 1 | No | No |
| 18670140 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | May 2024 | March 2025 | Allow | 10 | 0 | 1 | No | No |
| 18668432 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE HAVING FEATURES OF DIFFERENT DEPTHS | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18669156 | RADIO FREQUENCY (RF) SEMICONDUCTOR DEVICES INCLUDING A GROUND PLANE LAYER HAVING A SUPERLATTICE | May 2024 | May 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18668816 | INTEGRATED CIRCUIT STRUCTURE | May 2024 | December 2025 | Allow | 18 | 1 | 1 | No | No |
| 18666835 | SEMICONDUCTOR DEVICE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18667347 | TWO-ROTATION GATE-EDGE DIODE LEAKAGE REDUCTION FOR MOS TRANSISTORS | May 2024 | April 2025 | Allow | 11 | 0 | 0 | No | No |
| 18663715 | DISPLAY DEVICE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | Yes | No |
| 18661700 | METHOD OF FABRICATING PACKAGE STRUCTURE | May 2024 | October 2025 | Allow | 17 | 1 | 0 | No | No |
| 18660550 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | May 2024 | December 2024 | Allow | 7 | 1 | 0 | No | No |
| 18657927 | Forming 3D Transistors Using 2D Van Der WAALS Materials | May 2024 | February 2026 | Allow | 21 | 1 | 1 | No | No |
| 18658201 | Three-dimensional Heterogeneous Integrated Millimeter-wave System Package Structure | May 2024 | December 2025 | Abandon | 20 | 2 | 1 | No | No |
| 18657243 | SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER | May 2024 | January 2026 | Allow | 21 | 1 | 1 | No | No |
| 18657752 | SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN EPITAXIAL LAYER | May 2024 | January 2026 | Allow | 21 | 1 | 0 | No | No |
| 18655341 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18656134 | SEMICONDUCTOR DEVICES | May 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18655356 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE | May 2024 | February 2026 | Allow | 21 | 2 | 0 | No | No |
| 18654658 | STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR | May 2024 | December 2024 | Allow | 8 | 0 | 0 | No | No |
| 18653243 | DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18652013 | SEMICONDUCTOR POWER DEVICE AND METHOD FOR PRODUCING SAME | May 2024 | July 2025 | Allow | 14 | 2 | 0 | No | No |
| 18652094 | Semiconductor Component Including an Electronic Component Based on Polycrystalline Silicon | May 2024 | July 2025 | Allow | 15 | 2 | 0 | No | No |
| 18649366 | MICROELECTRONIC DEVICES WITH SOURCE REGION VERTICAL EXTENSION BETWEEN UPPER AND LOWER CHANNEL REGIONS, AND RELATED METHODS | April 2024 | July 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18648515 | INTERCONNECT STRUCTURE | April 2024 | September 2025 | Allow | 17 | 2 | 1 | Yes | No |
| 18648971 | BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME | April 2024 | June 2025 | Allow | 13 | 1 | 1 | No | No |
| 18705273 | SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE WITH ENCAPSULATED PINS | April 2024 | June 2025 | Allow | 14 | 2 | 0 | Yes | No |
| 18646280 | MICRO-DEVICE STRUCTURES WITH ETCH HOLES | April 2024 | May 2025 | Allow | 13 | 0 | 0 | No | No |
| 18645947 | SEMICONDUCTOR DEVICE | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18646015 | STACKED INTEGRATED CIRCUIT DEVICES | April 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18645743 | Light-Emitting Device, Light-Emitting Apparatus, Electronic Device, and Lighting Device | April 2024 | January 2025 | Allow | 8 | 0 | 0 | Yes | No |
| 18644109 | Electronic device including detection element and insulation layer recess structure | April 2024 | December 2025 | Allow | 20 | 2 | 0 | Yes | No |
| 18643260 | SEMICONDUCTOR MEMORY DEVICE | April 2024 | January 2025 | Allow | 9 | 0 | 0 | No | No |
| 18641719 | POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT | April 2024 | January 2025 | Allow | 9 | 0 | 0 | No | No |
| 18641745 | Interconnect Structure Including Contact Via Over Barrier Layer | April 2024 | August 2025 | Allow | 16 | 1 | 0 | No | No |
| 18641532 | DISPLAY DEVICE, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | April 2024 | January 2026 | Allow | 21 | 1 | 1 | Yes | No |
| 18640142 | DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF | April 2024 | December 2025 | Allow | 20 | 1 | 1 | No | No |
| 18640867 | STACKED SEMICONDUCTOR DIE ARCHITECTURE WITH MULTIPLE LAYERS OF DISAGGREGATION | April 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18639156 | DISPLAY DEVICE | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18637744 | PIXEL DEVICE ON DEEP TRENCH ISOLATION (DTI) STRUCTURE FOR IMAGE SENSOR | April 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18637539 | BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME | April 2024 | June 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18636979 | NANOROD LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, AND DISPLAY APPARATUS INCLUDING THE SAME | April 2024 | April 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18633866 | MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE AND METHOD FOR CREATING A LAYOUT THEREOF | April 2024 | July 2025 | Allow | 15 | 2 | 0 | No | No |
| 18633060 | IMAGE SENSOR AND ELECTRONIC APPARATUS | April 2024 | January 2026 | Allow | 21 | 2 | 0 | No | No |
| 18632810 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | April 2024 | May 2025 | Allow | 13 | 3 | 0 | Yes | No |
| 18630628 | Display Panel | April 2024 | February 2025 | Allow | 11 | 1 | 0 | No | No |
| 18630585 | THIN FILM TRANSISTOR INCLUDING A COMPOSITIONALLY-MODULATED ACTIVE REGION AND METHODS FOR FORMING THE SAME | April 2024 | November 2025 | Allow | 19 | 1 | 1 | No | No |
| 18627932 | LIGHT-EMITTING DEVICE | April 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18624725 | METAL LAYER PROTECTION DURING WET ETCHING | April 2024 | January 2025 | Allow | 9 | 0 | 0 | No | No |
| 18624721 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2024 | July 2025 | Allow | 15 | 2 | 0 | Yes | No |
| 18622511 | LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING | March 2024 | March 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18619330 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18616199 | ISOLATION STRUCTURE AND MEMORY DEVICE | March 2024 | February 2026 | Allow | 23 | 4 | 0 | No | No |
| 18615681 | SEMICONDUCTOR DEVICE WITH DUAL SLIT STRUCTURES AND OFFSET CONTACT PLUG FOR ENHANCED VERTICAL CONNECTIVITY | March 2024 | September 2025 | Allow | 18 | 2 | 0 | No | No |
| 18612228 | INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME | March 2024 | March 2025 | Allow | 11 | 0 | 1 | No | No |
| 18611843 | SEMICONDUCTOR DEVICE | March 2024 | March 2025 | Allow | 12 | 0 | 1 | No | No |
| 18610267 | REDUCED PITCH MEMORY SUBSYSTEM FOR MEMORY DEVICE | March 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18609234 | INTEGRATED CIRCUIT | March 2024 | April 2025 | Allow | 13 | 0 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2898.
With a 44.1% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 42.4% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Art Unit 2898 is part of Group 2890 in Technology Center 2800. This art unit has examined 14,703 patent applications in our dataset, with an overall allowance rate of 89.8%. Applications typically reach final disposition in approximately 23 months.
Art Unit 2898's allowance rate of 89.8% places it in the 89% percentile among all USPTO art units. This art unit has a significantly higher allowance rate than most art units at the USPTO.
Applications in Art Unit 2898 receive an average of 1.57 office actions before reaching final disposition (in the 26% percentile). The median prosecution time is 23 months (in the 89% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.