Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18599954 | Light-Emitting Device, Light-Emitting Appliance, Display Device, Electronic Appliance, and Lighting Device | March 2024 | February 2025 | Allow | 11 | 0 | 0 | No | No |
| 18414135 | Memory Cell and Memory Array Select Transistor | January 2024 | June 2025 | Allow | 17 | 1 | 0 | No | No |
| 18535893 | PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION | December 2023 | July 2024 | Allow | 7 | 0 | 0 | No | No |
| 18519294 | SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE | November 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18494384 | DUAL GATE CONTROL FOR TRENCH SHAPED THIN FILM TRANSISTORS | October 2023 | September 2024 | Allow | 11 | 0 | 1 | No | No |
| 18492504 | 3D SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING SAME | October 2023 | August 2024 | Allow | 10 | 1 | 0 | No | No |
| 18381119 | CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS | October 2023 | June 2025 | Allow | 20 | 2 | 1 | No | No |
| 18483466 | NON-VOLATILE MEMORY DEVICE | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18374770 | COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKING THE SAME | September 2023 | June 2024 | Allow | 8 | 1 | 0 | No | No |
| 18370150 | SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT | September 2023 | April 2025 | Allow | 19 | 1 | 1 | No | No |
| 18232739 | ELECTROSTATIC DISCHARGE (ESD) ARRAY WITH CIRCUIT CONTROLLED SWITCHES | August 2023 | February 2024 | Allow | 6 | 0 | 0 | No | No |
| 18359181 | 3D MEMORY WITH GRAPHITE CONDUCTIVE STRIPS | July 2023 | March 2024 | Allow | 7 | 0 | 0 | No | No |
| 18358289 | TRI-GATE ORTHOGONAL CHANNEL TRANSISTOR AND METHODS OF FORMING THE SAME | July 2023 | February 2024 | Allow | 7 | 0 | 0 | No | No |
| 18356064 | THREE-DIMENSIONAL (3D) SEMICONDUCTOR MEMORY DEVICE | July 2023 | February 2024 | Allow | 7 | 0 | 0 | No | No |
| 18353351 | METHOD AND STRUCTURE FOR REDUCE OTP CELL AREA AND LEAKAGE | July 2023 | February 2024 | Allow | 7 | 0 | 0 | No | No |
| 18349350 | METHODS AND APPARATUS FOR MACHINE LEARNING PREDICTIONS OF MANUFACTURE PROCESSES | July 2023 | May 2024 | Allow | 10 | 1 | 0 | No | No |
| 18346589 | Structure and Method for Enhancing Robustness of ESD Device | July 2023 | January 2024 | Allow | 7 | 0 | 0 | No | No |
| 18199630 | Integrated Assemblies, and Methods of Forming Integrated Assemblies | May 2023 | December 2023 | Allow | 7 | 0 | 0 | No | No |
| 18317690 | INTEGRATED CIRCUIT AND METHOD OF FORMING SAME | May 2023 | January 2024 | Allow | 8 | 0 | 0 | No | No |
| 18142109 | METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT | May 2023 | December 2023 | Allow | 7 | 0 | 0 | No | No |
| 18306508 | INTEGRATED CIRCUIT DEVICE AND METHOD | April 2023 | April 2025 | Allow | 24 | 2 | 1 | No | No |
| 18135552 | MEMORY STRUCTURE AND FABRICATION METHOD THEREOF | April 2023 | November 2023 | Allow | 7 | 0 | 0 | No | No |
| 18181791 | ELECTRONIC COMPONENT | March 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18178775 | METHOD FOR FORMING CHIP PACKAGE STRUCTURE | March 2023 | May 2024 | Allow | 14 | 1 | 1 | No | No |
| 18178523 | SEMICONDUCTOR STRUCTURE INTEGRATED WITH MAGNETIC TUNNELING JUNCTION | March 2023 | October 2023 | Allow | 8 | 0 | 0 | No | No |
| 18171497 | A MEMORY CELL AND MEMORY ARRAY SELECT TRANSISTOR | February 2023 | October 2023 | Allow | 8 | 0 | 0 | No | No |
| 18165117 | SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE | February 2023 | February 2025 | Allow | 25 | 2 | 0 | Yes | No |
| 18106170 | PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION | February 2023 | July 2023 | Allow | 6 | 0 | 0 | No | No |
| 18097994 | METHOD AND SYSTEM FOR FABRICATING FIDUCIALS FOR PROCESSING OF SEMICONDUCTOR DEVICES | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18149746 | HIGH-SPEED READOUT IMAGE SENSOR | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18068203 | SELF-ALIGNED EPITAXY LAYER | December 2022 | March 2024 | Allow | 15 | 0 | 0 | No | No |
| 18063878 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | December 2022 | May 2025 | Allow | 29 | 0 | 0 | No | No |
| 17988454 | STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-DIMENSIONAL NAND | November 2022 | August 2024 | Allow | 21 | 2 | 0 | Yes | No |
| 17983024 | THREE-DIMENSIONAL (3D) SEMICONDUCTOR MEMORY DEVICE | November 2022 | May 2023 | Allow | 6 | 0 | 0 | No | No |
| 17983007 | 3D SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING SAME | November 2022 | August 2023 | Allow | 9 | 1 | 0 | No | No |
| 18052307 | MEMORY DEVICE COMPRISING A TOP VIA ELECTRODE AND METHODS OF MAKING SUCH A MEMORY DEVICE | November 2022 | July 2023 | Allow | 9 | 0 | 0 | No | No |
| 17977336 | PCM CELL WITH RESISTANCE DRIFT CORRECTION | October 2022 | September 2023 | Allow | 10 | 2 | 0 | Yes | No |
| 17952336 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | September 2022 | March 2025 | Allow | 30 | 0 | 0 | Yes | No |
| 17933016 | METHOD FOR THE MANUFACTURE OF INTEGRATED DEVICES INCLUDING A DIE FIXED TO A LEADFRAME | September 2022 | May 2023 | Allow | 8 | 0 | 0 | No | No |
| 17897302 | ELECTROSTATIC PROTECTION CIRCUIT AND MANUFACTURING METHOD THEREOF, ARRAY SUBSTRATE AND DISPLAY DEVICE | August 2022 | May 2024 | Allow | 21 | 1 | 1 | No | No |
| 17895182 | MEMORY DEVICE | August 2022 | September 2023 | Allow | 13 | 0 | 0 | No | No |
| 17884263 | Interconnect Structure | August 2022 | January 2025 | Allow | 29 | 2 | 1 | No | No |
| 17879106 | REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | August 2022 | April 2025 | Allow | 32 | 0 | 0 | No | No |
| 17876103 | SYSTEM AND METHOD FOR REDUCING CELL AREA AND CURRENT LEAKAGE IN ANTI-FUSE CELL ARRAY | July 2022 | June 2023 | Allow | 11 | 0 | 1 | No | No |
| 17811713 | NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS | July 2022 | September 2024 | Allow | 26 | 2 | 1 | Yes | No |
| 17811690 | Metal Gate with Silicon Sidewall Spacers | July 2022 | January 2025 | Allow | 30 | 3 | 0 | Yes | No |
| 17856366 | INTERCONNECTION STRUCTURE OF INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | July 2022 | October 2024 | Allow | 27 | 2 | 1 | Yes | No |
| 17789789 | GAN/TWO-DIMENSIONAL ALN HETEROJUNCTION RECTIFIER ON SILICON SUBSTRATE AND PREPARATION METHOD THEREFOR | June 2022 | September 2024 | Allow | 26 | 0 | 0 | No | No |
| 17852003 | METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBSTRATES AND CORRESPONDING STRUCTURES | June 2022 | April 2023 | Allow | 10 | 0 | 0 | No | No |
| 17850276 | STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-DIMENSIONAL NAND | June 2022 | July 2024 | Allow | 25 | 2 | 0 | No | No |
| 17845036 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | June 2022 | January 2025 | Allow | 31 | 4 | 0 | Yes | No |
| 17839612 | SEMICONDUCTOR MEMORY DEVICES | June 2022 | June 2025 | Allow | 36 | 2 | 1 | Yes | No |
| 17780520 | MICRO-LENS ARRAY HAVING COLOR-CONVERSION FUNCTION, MICRO-LED DISPLAY MODULE INCLUDING MICRO-LENS ARRAY, AND METHOD FOR MANUFACTURING MICRO-LENS ARRAY | May 2022 | April 2025 | Allow | 34 | 0 | 0 | No | No |
| 17752207 | Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells | May 2022 | May 2025 | Allow | 35 | 0 | 1 | No | No |
| 17752717 | VIA STRUCTURES HAVING TAPERED PROFILES FOR EMBEDDED INTERCONNECT BRIDGE SUBSTRATES | May 2022 | March 2023 | Allow | 10 | 0 | 0 | No | No |
| 17750549 | METHODS AND APPARATUS FOR MACHINE LEARNING PREDICTIONS OF MANUFACTURE PROCESSES | May 2022 | March 2023 | Allow | 10 | 0 | 0 | No | No |
| 17745883 | DISPLAY APPARATUS | May 2022 | April 2025 | Allow | 35 | 1 | 0 | No | No |
| 17727809 | ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS | April 2022 | August 2024 | Allow | 28 | 0 | 1 | No | No |
| 17721385 | LIGHT-EMITTING PANEL, METHOD FOR FABRICATING THE LIGHT-EMITTING PANEL, AND DISPLAY DEVICE | April 2022 | July 2025 | Allow | 39 | 0 | 1 | No | No |
| 17706103 | DISPLAY DEVICES AND METHODS OF MANUFACTURING DISPLAY DEVICES | March 2022 | July 2024 | Allow | 27 | 0 | 0 | No | No |
| 17655791 | METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE | March 2022 | March 2023 | Allow | 12 | 0 | 0 | No | No |
| 17760739 | DISPLAY DEVICE | March 2022 | March 2025 | Allow | 36 | 0 | 0 | No | No |
| 17694363 | COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKING THE SAME | March 2022 | August 2023 | Allow | 17 | 0 | 0 | Yes | No |
| 17635993 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | February 2022 | February 2025 | Allow | 36 | 0 | 0 | No | No |
| 17670593 | CHEMICAL BONDING METHOD AND JOINED STRUCTURE | February 2022 | July 2022 | Allow | 5 | 0 | 0 | No | No |
| 17668304 | ELECTRONIC DEVICES INCLUDING SUPPORT PILLARS IN SLOT REGIONS, AND RELATED MEMORY DEVICES, SYSTEMS, AND METHODS | February 2022 | April 2025 | Allow | 38 | 2 | 1 | Yes | No |
| 17667467 | CIRCUIT BOARD WITH BRIDGE CHIPLETS | February 2022 | October 2024 | Allow | 32 | 4 | 0 | Yes | No |
| 17590224 | BOND PAD STRUCTURE FOR BONDING IMPROVEMENT | February 2022 | September 2023 | Allow | 20 | 0 | 1 | No | No |
| 17628942 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | January 2022 | June 2024 | Allow | 28 | 0 | 0 | No | No |
| 17576265 | Organic Light Emitting Display Having Touch Sensors and Method of Fabricating the Same, and Display Device | January 2022 | April 2024 | Allow | 27 | 2 | 1 | Yes | No |
| 17572793 | SEMICONDUCTOR DEVICE WITH SPACER OVER BONDING PAD | January 2022 | January 2023 | Allow | 12 | 0 | 0 | Yes | No |
| 17647294 | COAXIAL CONTACTS FOR 3D LOGIC AND MEMORY | January 2022 | February 2023 | Allow | 13 | 0 | 0 | No | No |
| 17646765 | Deep Trench Isolations and Methods of Forming the Same | January 2022 | May 2024 | Allow | 28 | 2 | 1 | No | No |
| 17567492 | Semiconductor Device and Method | January 2022 | July 2024 | Allow | 30 | 2 | 0 | Yes | No |
| 17556247 | SEMICONDUCTOR DEVICE HAVING A METALLIZATION STRUCTURE | December 2021 | September 2023 | Allow | 20 | 1 | 0 | No | No |
| 17553776 | MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME | December 2021 | February 2025 | Allow | 38 | 2 | 1 | Yes | No |
| 17618392 | LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING SAME | December 2021 | January 2025 | Allow | 38 | 2 | 0 | Yes | No |
| 17618108 | DISPLAY DEVICE MANUFACTURING METHOD, AND SUBSTRATE FOR MANUFACTURE OF DISPLAY DEVICE | December 2021 | April 2024 | Allow | 28 | 0 | 0 | No | No |
| 17618106 | OPTOELECTRONIC COUPLING PLATFORMS AND SENSORS | December 2021 | September 2024 | Allow | 34 | 0 | 0 | No | No |
| 17618031 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS | December 2021 | April 2025 | Allow | 41 | 2 | 0 | No | No |
| 17610252 | SIMULTANEOUS CAPTURE OF MULTIPLE PHASES FOR IMAGING DEVICES | November 2021 | May 2025 | Abandon | 42 | 2 | 0 | No | No |
| 17609368 | III-V SEMICONDUCTOR DEVICE WITH INTEGRATED PROTECTION FUNCTIONS | November 2021 | May 2024 | Allow | 30 | 0 | 0 | No | No |
| 17499741 | MICRO LIGHT-EMITTING DIODE DISPLAY FABRICATION AND ASSEMBLY | October 2021 | April 2024 | Abandon | 30 | 2 | 0 | No | No |
| 17493251 | PILLAR-SHAPED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | October 2021 | June 2024 | Allow | 32 | 0 | 1 | No | No |
| 17492487 | DUAL GATE CONTROL FOR TRENCH SHAPED THIN FILM TRANSISTORS | October 2021 | August 2023 | Allow | 23 | 0 | 1 | No | No |
| 17449515 | PHASE CHANGE MEMORY WITH CONDUCTIVE RINGS | September 2021 | November 2024 | Allow | 38 | 2 | 1 | Yes | No |
| 17484828 | APPLICATIONS OF BACK-END-OF-LINE (BEOL) CAPACITORS IN COMPUTE-IN-MEMORY (CIM) CIRCUITS | September 2021 | December 2022 | Allow | 15 | 0 | 0 | Yes | No |
| 17598028 | SiC SEMICONDUCTOR DEVICE | September 2021 | July 2024 | Allow | 34 | 1 | 0 | No | No |
| 17480379 | MEMORY AND ITS MANUFACTURING METHOD | September 2021 | March 2025 | Abandon | 42 | 2 | 1 | No | No |
| 17439054 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | September 2021 | September 2024 | Allow | 36 | 2 | 0 | No | No |
| 17436941 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, CURED FILM, METHOD FOR PRODUCING CURED FILM, ORGANIC EL DISPLAY DEVICE AND ELECTRONIC COMPONENT | September 2021 | January 2024 | Allow | 28 | 0 | 0 | No | No |
| 17465300 | DEVICE AND METHOD OF FABRICATING MULTIGATE DEVICES HAVING DIFFERENT CHANNEL CONFIGURATIONS | September 2021 | March 2025 | Allow | 42 | 2 | 1 | No | No |
| 17446585 | TEST STRUCTURE FOR VOID AND TOPOGRAPHY MONITORING IN A FLASH MEMORY DEVICE | August 2021 | June 2025 | Allow | 45 | 2 | 1 | Yes | No |
| 17459748 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | August 2021 | May 2024 | Allow | 32 | 0 | 1 | No | No |
| 17459788 | SPACER STRUCTURE FOR SEMICONDUCTOR DEVICE | August 2021 | September 2024 | Allow | 37 | 1 | 1 | Yes | No |
| 17460156 | Memory Devices and Methods of Forming Memory Devices | August 2021 | July 2024 | Allow | 35 | 5 | 1 | Yes | No |
| 17459480 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | August 2021 | April 2024 | Allow | 31 | 0 | 1 | No | No |
| 17406758 | BONDED MEMORY DEVICES AND METHODS OF MAKING THE SAME | August 2021 | May 2025 | Allow | 45 | 2 | 1 | No | No |
| 17400264 | SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE | August 2021 | May 2024 | Abandon | 33 | 2 | 0 | No | No |
| 17394140 | ENHANCING SIMULATED ANNEALING WITH QUANTUM ANNEALING | August 2021 | August 2023 | Allow | 24 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner MOVVA, AMAR.
With a 37.5% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 43.8% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner MOVVA, AMAR works in Art Unit 2898 and has examined 838 patent applications in our dataset. With an allowance rate of 88.3%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 26 months.
Examiner MOVVA, AMAR's allowance rate of 88.3% places them in the 65% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by MOVVA, AMAR receive 1.51 office actions before reaching final disposition. This places the examiner in the 37% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by MOVVA, AMAR is 26 months. This places the examiner in the 63% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +5.6% benefit to allowance rate for applications examined by MOVVA, AMAR. This interview benefit is in the 31% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 33.9% of applications are subsequently allowed. This success rate is in the 68% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 16.5% of cases where such amendments are filed. This entry rate is in the 11% percentile among all examiners. Strategic Recommendation: This examiner rarely enters after-final amendments compared to other examiners. You should generally plan to file an RCE or appeal rather than relying on after-final amendment entry. Per MPEP § 714.12, primary examiners have discretion in entering after-final amendments, and this examiner exercises that discretion conservatively.
When applicants request a pre-appeal conference (PAC) with this examiner, 47.1% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 39% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 77.1% of appeals filed. This is in the 64% percentile among all examiners. Of these withdrawals, 48.1% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 61% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.2% of allowed cases (in the 52% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 5.7% of allowed cases (in the 81% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.