Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18731895 | IMAGE SENSOR | June 2024 | May 2025 | Allow | 11 | 1 | 1 | No | No |
| 18677913 | SEMICONDUCTOR STRUCTURE | May 2024 | July 2025 | Allow | 14 | 1 | 1 | No | No |
| 18673411 | DISPLAY DEVICE | May 2024 | April 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18660550 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | May 2024 | December 2024 | Allow | 7 | 1 | 0 | No | No |
| 18648515 | INTERCONNECT STRUCTURE | April 2024 | September 2025 | Allow | 17 | 2 | 1 | Yes | No |
| 18640867 | STACKED SEMICONDUCTOR DIE ARCHITECTURE WITH MULTIPLE LAYERS OF DISAGGREGATION | April 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18630628 | Display Panel | April 2024 | February 2025 | Allow | 11 | 1 | 0 | No | No |
| 18609639 | FINFET CIRCUIT DEVICES WITH WELL ISOLATION | March 2024 | July 2025 | Allow | 15 | 2 | 0 | No | No |
| 18600776 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | March 2024 | September 2025 | Allow | 18 | 2 | 0 | No | No |
| 18587908 | VERTICALLY MOUNTED DIE GROUPS | February 2024 | October 2024 | Allow | 8 | 0 | 0 | No | No |
| 18422220 | DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS | January 2024 | May 2025 | Allow | 16 | 1 | 1 | No | No |
| 18407760 | SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL | January 2024 | March 2025 | Allow | 14 | 1 | 1 | No | No |
| 18397105 | ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE | December 2023 | December 2024 | Allow | 11 | 1 | 0 | No | No |
| 18522991 | Method for Fabricating a Power Semiconductor Device | November 2023 | September 2025 | Abandon | 21 | 2 | 1 | No | No |
| 18520337 | PROTECTIVE ELEMENTS FOR BONDED STRUCTURES | November 2023 | June 2025 | Allow | 19 | 2 | 1 | No | No |
| 18518634 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF | November 2023 | October 2025 | Allow | 23 | 2 | 1 | No | No |
| 18508663 | SEMICONDUCTOR PACKAGE | November 2023 | January 2025 | Allow | 14 | 1 | 1 | Yes | No |
| 18508007 | SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION | November 2023 | March 2025 | Allow | 16 | 1 | 1 | Yes | No |
| 18504231 | SEMICONDUCTOR DEVICE | November 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18496920 | MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE | October 2023 | January 2025 | Allow | 15 | 1 | 1 | No | No |
| 18381297 | SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE | October 2023 | November 2024 | Allow | 13 | 1 | 1 | No | No |
| 18488052 | DUMMY PATTERN STRUCTURE FOR REDUCING DISHING | October 2023 | March 2025 | Allow | 17 | 1 | 1 | No | No |
| 18378892 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE | October 2023 | December 2024 | Allow | 15 | 2 | 1 | No | No |
| 18379029 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | October 2023 | January 2025 | Allow | 15 | 2 | 0 | No | No |
| 18482002 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | October 2023 | March 2025 | Abandon | 18 | 2 | 1 | No | No |
| 18473273 | VERTICALLY MOUNTED DIE GROUPS | September 2023 | December 2024 | Allow | 14 | 1 | 1 | No | No |
| 18467840 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE | September 2023 | June 2024 | Allow | 9 | 0 | 0 | No | No |
| 18465038 | APPARATUSES COMPRISING TRANSISTORS INCLUDING EXTENSION REGIONS | September 2023 | March 2025 | Allow | 18 | 2 | 0 | Yes | No |
| 18462522 | DISPLAY DEVICE | September 2023 | February 2025 | Allow | 17 | 1 | 1 | No | No |
| 18457324 | NANOCOMPOSITE-SEEDED EPITAXIAL GROWTH OF SINGLE-DOMAIN LITHIUM NIOBATE THIN FILMS FOR SURFACE ACOUSTIC WAVE DEVICES | August 2023 | March 2026 | Allow | 31 | 1 | 0 | No | No |
| 18232861 | LIGHT-EMITTING ELEMENT | August 2023 | December 2024 | Allow | 16 | 1 | 0 | No | No |
| 18446554 | DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING | August 2023 | February 2025 | Allow | 19 | 3 | 0 | Yes | No |
| 18446732 | SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE | August 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18446014 | MULTI-TIM PACKAGES AND METHOD FORMING SAME | August 2023 | January 2026 | Allow | 30 | 4 | 1 | No | No |
| 18446076 | STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE | August 2023 | January 2026 | Allow | 29 | 3 | 1 | Yes | No |
| 18446051 | PACKAGES WITH MULTIPLE TYPES OF UNDERFILL AND METHOD FORMING THE SAME | August 2023 | July 2025 | Allow | 23 | 3 | 1 | Yes | No |
| 18366139 | Molded Dies in Semiconductor Packages and Methods of Forming Same | August 2023 | April 2025 | Allow | 20 | 2 | 1 | No | No |
| 18366179 | DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS | August 2023 | February 2025 | Allow | 18 | 1 | 1 | No | No |
| 18362992 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | August 2023 | November 2024 | Allow | 16 | 1 | 1 | No | No |
| 18356350 | SEMICONDUCTOR PACKAGE | July 2023 | May 2024 | Allow | 10 | 1 | 0 | No | No |
| 18219828 | DISPLAY APPARATUS INCLUDING A BLOCKING LAYER AND METHOD OF MANUFACTURING THE SAME | July 2023 | October 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 18218596 | METHOD OF MANUFACTURING ELECTRONIC DEVICE | July 2023 | January 2026 | Abandon | 30 | 4 | 0 | Yes | No |
| 18346927 | TFT CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME | July 2023 | August 2024 | Allow | 13 | 1 | 0 | No | No |
| 18341486 | Selective Etching to Increase Threshold Voltage Spread | June 2023 | September 2025 | Allow | 26 | 4 | 0 | Yes | No |
| 18332056 | Varying Temperature Anneal for Film and Structures Formed Thereby | June 2023 | August 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18203677 | IMAGE SENSOR INCLUDING LANDING STRUCTURE HAVING SAME MATERIAL AS GATE ELECTRODES | May 2023 | March 2026 | Allow | 33 | 0 | 1 | No | No |
| 18324743 | BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS | May 2023 | September 2024 | Allow | 16 | 1 | 1 | Yes | No |
| 18317376 | CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SINGLE ROIC | May 2023 | March 2024 | Allow | 10 | 0 | 0 | No | No |
| 18144969 | IMAGE SENSOR | May 2023 | March 2024 | Allow | 10 | 0 | 1 | No | No |
| 18142888 | SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | May 2023 | November 2025 | Allow | 30 | 0 | 1 | Yes | No |
| 18311839 | GATE ALL AROUND SEMICONDUCTOR STRUCTURE WITH DIFFUSION BREAK | May 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18311304 | NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING | May 2023 | January 2026 | Allow | 32 | 1 | 0 | No | No |
| 18142357 | SILVER SINTERED MOLYBDENUM (SSM) PACKAGING FOR POWER SEMICONDUCTOR DEVICES | May 2023 | February 2026 | Allow | 34 | 1 | 1 | No | No |
| 18309181 | INTEGRATED CIRCUIT STRUCTURE | April 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18305370 | PACKAGE STRUCTURE | April 2023 | December 2024 | Allow | 20 | 2 | 1 | Yes | No |
| 18303152 | PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING | April 2023 | May 2024 | Allow | 13 | 0 | 1 | No | No |
| 18299150 | SEMICONDUCTOR DEVICES INCLUDING A CONTACT STRUCTURE THAT CONTACTS A DUMMY CHANNEL STRUCTURE | April 2023 | February 2024 | Allow | 10 | 1 | 0 | No | No |
| 18298104 | A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | April 2023 | June 2024 | Allow | 14 | 1 | 0 | No | No |
| 18125928 | SEMICONDUCTOR PACKAGE | March 2023 | January 2026 | Allow | 34 | 1 | 1 | Yes | No |
| 18188597 | IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | March 2023 | November 2025 | Allow | 32 | 0 | 1 | No | No |
| 18124752 | REINFORCEMENT STRUCTURES FOR CHIP-INTERPOSER AND INTERPOSER-SUBSTRATE BONDING AND METHODS OF MAKING THE SAME | March 2023 | February 2026 | Allow | 35 | 1 | 1 | No | No |
| 18187386 | DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRONICS PACKAGE | March 2023 | March 2026 | Allow | 36 | 2 | 1 | No | No |
| 18120920 | CONFINED EPITAXIAL REGIONS FOR SEMICONDUCTOR DEVICES | March 2023 | May 2024 | Allow | 14 | 1 | 0 | No | No |
| 18114919 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | February 2023 | March 2024 | Allow | 13 | 1 | 0 | No | No |
| 18112323 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE | February 2023 | February 2026 | Allow | 36 | 1 | 1 | Yes | No |
| 18167077 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | February 2023 | December 2023 | Allow | 10 | 0 | 0 | No | No |
| 18097748 | NON-STOICHIOMETRIC RESISTIVE SWITCHING MEMORY DEVICE AND FABRICATION METHODS | January 2023 | October 2024 | Allow | 21 | 2 | 1 | Yes | No |
| 18096088 | PACKAGING STRUCTURE AND PACKAGING METHOD | January 2023 | January 2026 | Allow | 36 | 1 | 1 | No | No |
| 18152452 | ADVANCED ELECTRONIC DEVICE STRUCTURES USING SEMICONDUCTOR STRUCTURES AND SUPERLATTICES | January 2023 | December 2024 | Allow | 23 | 3 | 0 | Yes | No |
| 18065799 | NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | December 2022 | December 2023 | Allow | 12 | 0 | 0 | No | No |
| 18080610 | STACKED SEMICONDUCTOR DIE ARCHITECTURE WITH MULTIPLE LAYERS OF DISAGGREGATION | December 2022 | February 2024 | Allow | 14 | 1 | 0 | No | No |
| 17987188 | Light-Emitting Device | November 2022 | October 2023 | Allow | 11 | 3 | 0 | No | No |
| 17986306 | Semiconductor Package Having an Electrically Insulating Core with Exposed Glass Fibres | November 2022 | February 2024 | Allow | 15 | 1 | 0 | No | No |
| 18054919 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | November 2022 | February 2026 | Allow | 39 | 1 | 1 | No | No |
| 18047412 | Semiconductor Device with Multi-Layer Dielectric | October 2022 | March 2024 | Allow | 17 | 1 | 0 | No | No |
| 17964584 | SEMICONDUCTOR DEVICE | October 2022 | October 2024 | Allow | 25 | 3 | 0 | No | No |
| 17961025 | MEMORY ARRAY STRUCTURES | October 2022 | February 2026 | Allow | 40 | 1 | 1 | No | No |
| 17953522 | SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHANNEL LAYER AND METHOD OF MANUFACTURING THE SAME | September 2022 | January 2026 | Allow | 40 | 1 | 1 | Yes | No |
| 17934685 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METHOD OF MAKING THE SAME | September 2022 | August 2025 | Allow | 35 | 0 | 1 | No | No |
| 17822420 | MEMORY DEVICES INCLUDING OXIDE SEMICONDUCTOR MATERIAL | August 2022 | August 2024 | Allow | 24 | 2 | 1 | No | No |
| 17894257 | DISPLAY DEVICE | August 2022 | February 2024 | Allow | 18 | 1 | 0 | Yes | No |
| 17820968 | PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC CHIP LAYERS | August 2022 | February 2026 | Allow | 42 | 0 | 1 | No | No |
| 17885838 | SEMICONDUCTOR DEVICE | August 2022 | February 2026 | Abandon | 42 | 1 | 1 | No | No |
| 17882374 | ELECTRONIC DEVICE | August 2022 | November 2025 | Allow | 40 | 1 | 0 | No | No |
| 17817705 | SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES | August 2022 | November 2024 | Allow | 28 | 3 | 1 | Yes | No |
| 17817195 | ORGANIC LIGHT-EMITTING DIODE DISPLAY | August 2022 | December 2024 | Allow | 28 | 5 | 0 | Yes | No |
| 17878340 | SEMICONDUCTOR FABRICATION METHOD WITH IMPROVED DEPOSITION QUALITY AND SEMICONDUCTOR STRUCTURE THEREOF | August 2022 | March 2026 | Allow | 44 | 2 | 1 | Yes | No |
| 17876237 | INTEGRATION OF SELECTOR ON CONFINED PHASE CHANGE MEMORY | July 2022 | February 2024 | Allow | 19 | 1 | 0 | Yes | No |
| 17873157 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | July 2022 | July 2024 | Allow | 24 | 2 | 1 | Yes | No |
| 17795407 | DISPLAY DEVICE | July 2022 | March 2025 | Allow | 32 | 0 | 0 | No | No |
| 17871496 | APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM | July 2022 | December 2025 | Allow | 41 | 2 | 1 | No | No |
| 17871272 | SEMICONDUCTOR DEVICE WITH MULTI-LAYER DIELECTRIC AND METHODS OF FORMING THE SAME | July 2022 | March 2024 | Allow | 20 | 1 | 1 | No | No |
| 17867819 | BACKSIDE CAPACITOR TECHNIQUES | July 2022 | March 2024 | Allow | 20 | 1 | 1 | Yes | No |
| 17864786 | Back Plate and Method for Manufacturing the Same, Display Substrate and Method for Manufacturing the Same, and Display Device | July 2022 | June 2025 | Abandon | 35 | 4 | 1 | No | No |
| 17811896 | INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME | July 2022 | January 2024 | Allow | 19 | 1 | 1 | No | No |
| 17857304 | SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS | July 2022 | May 2025 | Allow | 35 | 0 | 1 | No | No |
| 17839494 | SEMICONDUCTOR STRUCTURES AND METHOD OF MANUFACTURING THE SAME | June 2022 | December 2023 | Allow | 18 | 2 | 1 | Yes | No |
| 17752976 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | May 2022 | May 2025 | Allow | 35 | 0 | 1 | Yes | No |
| 17752503 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | May 2022 | March 2025 | Allow | 34 | 1 | 0 | No | No |
| 17743222 | POWER SEMICONDUCTOR MODULE | May 2022 | October 2025 | Allow | 41 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner GREEN, TELLY D.
With a 100.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 37.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner GREEN, TELLY D works in Art Unit 2898 and has examined 294 patent applications in our dataset. With an allowance rate of 96.6%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 28 months.
Examiner GREEN, TELLY D's allowance rate of 96.6% places them in the 87% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by GREEN, TELLY D receive 1.78 office actions before reaching final disposition. This places the examiner in the 39% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by GREEN, TELLY D is 28 months. This places the examiner in the 70% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a -4.7% benefit to allowance rate for applications examined by GREEN, TELLY D. This interview benefit is in the 6% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 32.2% of applications are subsequently allowed. This success rate is in the 68% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 33.6% of cases where such amendments are filed. This entry rate is in the 50% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 150.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 90% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 75.0% of appeals filed. This is in the 65% percentile among all examiners. Of these withdrawals, 83.3% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 53.8% are granted (fully or in part). This grant rate is in the 55% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 12.9% of allowed cases (in the 96% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 3.5% of allowed cases (in the 76% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.