Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18670140 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | May 2024 | March 2025 | Allow | 10 | 0 | 1 | No | No |
| 18646015 | STACKED INTEGRATED CIRCUIT DEVICES | April 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18611843 | SEMICONDUCTOR DEVICE | March 2024 | March 2025 | Allow | 12 | 0 | 1 | No | No |
| 18612228 | INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME | March 2024 | March 2025 | Allow | 11 | 0 | 1 | No | No |
| 18603313 | RRAM STRUCTURE | March 2024 | May 2025 | Allow | 14 | 1 | 0 | No | No |
| 18581598 | METAL BASED HYDROGEN BARRIER | February 2024 | March 2025 | Allow | 12 | 0 | 1 | No | No |
| 18444849 | SEMICONDUCTOR DEVICE HAVING MERGED EPITAXIAL FEATURES WITH ARC-LIKE BOTTOM SURFACE AND METHOD OF MAKING THE SAME | February 2024 | March 2025 | Allow | 13 | 1 | 1 | Yes | No |
| 18429535 | CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA | February 2024 | March 2025 | Allow | 14 | 1 | 1 | No | No |
| 18422049 | TRANSISTOR AND SEMICONDUCTOR DEVICE | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18403076 | HIGH VOLTAGE DEVICE WITH GATE EXTENSIONS | January 2024 | September 2024 | Allow | 9 | 1 | 0 | No | No |
| 18398190 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | December 2023 | September 2024 | Allow | 9 | 1 | 0 | No | No |
| 18395706 | SEMICONDUCTOR PACKAGE | December 2023 | September 2024 | Allow | 8 | 0 | 1 | No | No |
| 18536767 | TRANSISTOR | December 2023 | October 2024 | Allow | 10 | 1 | 0 | No | No |
| 18529096 | SEMICONDUCTOR DEVICE | December 2023 | July 2024 | Allow | 8 | 0 | 0 | No | No |
| 18523515 | Ultra-High Voltage Resistor with Voltage Sense | November 2023 | September 2024 | Allow | 10 | 1 | 0 | No | No |
| 18522601 | SEMICONDUCTOR PACKAGE | November 2023 | January 2025 | Allow | 13 | 1 | 1 | No | No |
| 18520247 | ASYMMETRIC SOURCE/DRAIN EPITAXY | November 2023 | January 2025 | Allow | 14 | 1 | 1 | No | No |
| 18517298 | MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONNECT STRUCTURE | November 2023 | December 2024 | Allow | 12 | 0 | 1 | No | No |
| 18516521 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | November 2023 | October 2024 | Allow | 11 | 1 | 1 | No | No |
| 18501576 | SEMICONDUCTOR DEVICE INCLUDING BURIED CONTACT AND METHOD FOR MANUFACTURING THE SAME | November 2023 | August 2024 | Allow | 10 | 0 | 1 | No | No |
| 18498756 | Diamond Semiconductor System And Method | October 2023 | December 2024 | Allow | 14 | 1 | 0 | No | No |
| 18494163 | INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS | October 2023 | March 2025 | Allow | 16 | 2 | 0 | No | No |
| 18370883 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH DEEPLY DEPLETED CHANNEL | September 2023 | April 2025 | Allow | 19 | 2 | 0 | No | No |
| 18368939 | SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS | September 2023 | May 2024 | Allow | 8 | 1 | 0 | No | No |
| 18461373 | SEMICONDUCTOR DEVICE INCLUDING A THROUGH SILICON VIA STRUCTURE AND METHOD OF FABRICATING THE SAME | September 2023 | April 2025 | Allow | 19 | 2 | 1 | Yes | No |
| 18461347 | SEMICONDUCTOR DEVICE INCLUDING A THROUGH SILICON VIA STRUCTURE AND METHOD OF FABRICATING THE SAME | September 2023 | June 2025 | Allow | 21 | 3 | 0 | Yes | No |
| 18241856 | Multilayered Seed for Perpendicular Magnetic Structure Including an Oxide Layer | September 2023 | July 2024 | Allow | 10 | 1 | 0 | No | No |
| 18447572 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT | August 2023 | November 2024 | Allow | 15 | 0 | 1 | No | No |
| 18232200 | Through-Circuit Vias In Interconnect Structures | August 2023 | July 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18365388 | DISPLAY DEVICE | August 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18364082 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | August 2023 | September 2024 | Allow | 14 | 2 | 0 | No | No |
| 18359507 | Semiconductor Device and Method of Manufacturing | July 2023 | April 2025 | Allow | 20 | 1 | 1 | No | No |
| 18357823 | Method for Forming Source/Drain Contacts | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18221600 | PHOTOVOLTAIC CELL AND LAMINATE METALLIZATION | July 2023 | May 2024 | Allow | 10 | 0 | 0 | No | No |
| 18219086 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | July 2023 | April 2025 | Allow | 21 | 3 | 1 | No | No |
| 18217147 | Thin Film Transistor Array Substrate and Electronic Device Including the Same | June 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18209490 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | June 2023 | May 2024 | Allow | 11 | 1 | 0 | No | No |
| 18209492 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | June 2023 | April 2024 | Allow | 10 | 1 | 0 | No | No |
| 18329126 | METHOD FOR FORMING SOURCE/DRAIN CONTACTS UTILIZING AN INHIBITOR | June 2023 | August 2024 | Allow | 14 | 1 | 0 | No | No |
| 18327291 | STACKED INTEGRATED CIRCUIT DEVICES | June 2023 | February 2024 | Allow | 9 | 1 | 0 | No | No |
| 18312586 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | May 2023 | January 2025 | Allow | 20 | 1 | 1 | No | No |
| 18307607 | METHODS FOR MANUFACTURING A PLURALITY OF SEMICONDUCTOR STRUCTURES AND SYSTEM IN PACKAGE | April 2023 | March 2024 | Allow | 11 | 0 | 1 | No | No |
| 18298172 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME | April 2023 | June 2024 | Allow | 14 | 0 | 0 | No | No |
| 18124748 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH COPPER-MANGANESE LINER | March 2023 | October 2023 | Allow | 7 | 1 | 0 | No | No |
| 18172802 | PARALLEL STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME | February 2023 | December 2023 | Allow | 10 | 0 | 0 | No | No |
| 18108042 | TRANSISTOR AND SEMICONDUCTOR DEVICE | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18164153 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | February 2023 | December 2023 | Allow | 10 | 2 | 0 | No | No |
| 18162725 | CLAMPING CIRCUIT INTEGRATED ON GALLIUM NITRIDE SEMICONDUCTOR DEVICE AND RELATED SEMICONDUCTOR DEVICE | February 2023 | February 2024 | Allow | 13 | 1 | 1 | No | No |
| 18104307 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | February 2023 | November 2023 | Allow | 9 | 1 | 0 | No | No |
| 18071288 | COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD | November 2022 | December 2024 | Allow | 25 | 2 | 0 | No | No |
| 18053487 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME | November 2022 | February 2024 | Allow | 15 | 0 | 0 | No | No |
| 17978390 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | November 2022 | September 2024 | Allow | 22 | 1 | 0 | Yes | No |
| 17972100 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | October 2022 | April 2023 | Allow | 6 | 0 | 0 | No | No |
| 18048915 | LATERALLY-DIFFUSED METAL-OXIDE SEMICONDUCTOR TRANSISTOR AND METHOD THEREFOR | October 2022 | December 2023 | Allow | 14 | 1 | 0 | No | No |
| 18046418 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | October 2022 | October 2023 | Allow | 12 | 1 | 0 | No | No |
| 17963062 | SEMICONDUCTOR DEVICES | October 2022 | August 2023 | Allow | 10 | 1 | 1 | No | No |
| 17762206 | LATERAL DOUBLE-DIFFUSED METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR | October 2022 | September 2023 | Allow | 18 | 0 | 0 | No | No |
| 17947282 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | September 2022 | November 2023 | Allow | 14 | 1 | 1 | Yes | No |
| 17943654 | HIGH VOLTAGE TRANSISTOR DEVICE AND METHOD FOR FABRICATING THE SAME | September 2022 | September 2023 | Allow | 12 | 1 | 0 | No | No |
| 17893225 | SEMICONDUCTOR DEVICE | August 2022 | November 2023 | Allow | 14 | 0 | 1 | No | No |
| 17883750 | SEMICONDUCTOR DEVICE WITH GALVANICALLY ISOLATED SEMICONDUCTOR CHIPS | August 2022 | July 2023 | Allow | 12 | 1 | 0 | No | No |
| 17881106 | DIODE | August 2022 | September 2023 | Allow | 13 | 1 | 0 | No | No |
| 17815997 | Through-Circuit Vias In Interconnect Structures | July 2022 | March 2024 | Allow | 20 | 1 | 1 | Yes | No |
| 17875918 | Semiconductor Device and Method of Manufacture | July 2022 | April 2025 | Allow | 32 | 0 | 0 | No | No |
| 17874406 | RRAM STRUCTURE | July 2022 | December 2023 | Allow | 17 | 1 | 1 | No | No |
| 17873962 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | July 2022 | November 2023 | Allow | 15 | 0 | 1 | No | No |
| 17863749 | TWO DIMENSIONAL STRUCTURE TO CONTROL FLASH OPERATION AND METHODS FOR FORMING THE SAME | July 2022 | September 2023 | Allow | 15 | 1 | 0 | No | No |
| 17810817 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | July 2022 | August 2023 | Allow | 14 | 1 | 1 | No | No |
| 17852371 | METHOD FOR FABRICATING TRANSISTOR STRUCTURE | June 2022 | June 2023 | Allow | 11 | 1 | 0 | No | No |
| 17844896 | THIN FILM STRUCTURE INCLUDING METHOD OF MANUFACTURING | June 2022 | January 2025 | Allow | 31 | 0 | 1 | No | No |
| 17842138 | CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA | June 2022 | November 2023 | Allow | 17 | 1 | 1 | No | No |
| 17830690 | ALUMINUM ALLOY FILM AND SEMICONDUCTOR DEVICE USING THE SAME | June 2022 | August 2024 | Allow | 26 | 1 | 0 | Yes | No |
| 17830191 | CIRCUIT ASSEMBLY | June 2022 | April 2024 | Allow | 23 | 1 | 1 | No | No |
| 17826528 | Ultra Narrow Trench Patterning with Dry Plasma Etching | May 2022 | September 2023 | Allow | 16 | 0 | 1 | No | No |
| 17752154 | Multilayered Seed for Perpendicular Magnetic Structure Including an Oxide Layer | May 2022 | June 2023 | Allow | 12 | 1 | 1 | No | No |
| 17750709 | PHOTORELAY | May 2022 | October 2023 | Abandon | 16 | 2 | 0 | No | No |
| 17749363 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | May 2022 | February 2023 | Allow | 9 | 0 | 0 | No | No |
| 17747033 | SEMICONDUCTOR DEVICE HAVING WIDE TUNING RANGE VARACTOR AND METHOD OF MANUFACTURING THE SAME | May 2022 | May 2025 | Allow | 36 | 2 | 1 | Yes | No |
| 17775847 | LIGHT-EMITTING ELEMENT, DISPLAY DEVICE AND SURFACE-EMITTING DEVICE | May 2022 | June 2025 | Allow | 37 | 1 | 0 | No | No |
| 17738809 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE MANUFACTURED ACCORDING TO THE SAME | May 2022 | January 2025 | Allow | 32 | 0 | 1 | No | No |
| 17737431 | GROUP III NITRIDE-BASED MONOLITHIC MICROWAVE INTEGRATED CIRCUITS INCLUDING STATIC RANDOM ACCESS MEMORY BLOCKS WITH ASSOCIATED ADDRESSING AND BUFFERING CIRCUITS | May 2022 | March 2025 | Allow | 35 | 0 | 1 | No | No |
| 17734344 | HIGH VOLTAGE DEVICE WITH GATE EXTENSIONS | May 2022 | October 2023 | Allow | 18 | 1 | 0 | No | No |
| 17772120 | LIGHT EMITTING DISPLAY DEVICE | April 2022 | February 2025 | Allow | 34 | 0 | 1 | No | No |
| 17660025 | RECESSED ACCESS DEVICE | April 2022 | December 2022 | Allow | 8 | 0 | 0 | No | No |
| 17725163 | SEMICONDUCTOR PACKAGE | April 2022 | January 2025 | Allow | 33 | 1 | 1 | Yes | No |
| 17723577 | DISPLAY PANEL, PREPARATION METHOD OF DISPLAY PANEL, AND DISPLAY DEVICE | April 2022 | December 2024 | Allow | 32 | 0 | 1 | No | No |
| 17769809 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS | April 2022 | March 2025 | Allow | 35 | 1 | 0 | No | No |
| 17723427 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | April 2022 | March 2023 | Allow | 11 | 0 | 0 | No | No |
| 17719393 | GaN-Based High Electron Mobility Transistors and Fabrication Method Thereof | April 2022 | July 2024 | Allow | 27 | 0 | 0 | No | No |
| 17718790 | DISPLAY DEVICE | April 2022 | March 2025 | Allow | 35 | 1 | 1 | No | No |
| 17718055 | RF SWITCH DEVICE | April 2022 | October 2023 | Allow | 18 | 1 | 1 | No | No |
| 17714892 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | April 2022 | January 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 17713794 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD, AND ELECTRONIC APPLIANCE | April 2022 | August 2023 | Allow | 16 | 1 | 0 | No | No |
| 17765714 | METHOD FOR MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE | March 2022 | January 2025 | Allow | 34 | 1 | 1 | No | No |
| 17657010 | DUAL VERTICAL GATE AND IMAGE SENSOR INCLUDING THE SAME | March 2022 | January 2025 | Allow | 34 | 1 | 1 | No | No |
| 17764479 | DISPLAY PANEL | March 2022 | January 2025 | Allow | 34 | 1 | 0 | No | No |
| 17704022 | TRENCH POWER SEMICONDUCTOR DEVICE | March 2022 | October 2024 | Allow | 30 | 1 | 0 | No | No |
| 17656008 | MODULE AND METHOD FOR MANUFACTURING SAME | March 2022 | January 2025 | Allow | 34 | 0 | 1 | No | No |
| 17701171 | DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME | March 2022 | March 2025 | Allow | 36 | 1 | 1 | No | No |
| 17655831 | MEMORY DEVICE, AND SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | March 2022 | March 2025 | Allow | 36 | 1 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner LUU, CHUONG A.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 57.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner LUU, CHUONG A works in Art Unit 2898 and has examined 1,269 patent applications in our dataset. With an allowance rate of 94.2%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 18 months.
Examiner LUU, CHUONG A's allowance rate of 94.2% places them in the 83% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by LUU, CHUONG A receive 1.24 office actions before reaching final disposition. This places the examiner in the 22% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by LUU, CHUONG A is 18 months. This places the examiner in the 95% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +3.9% benefit to allowance rate for applications examined by LUU, CHUONG A. This interview benefit is in the 25% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 37.2% of applications are subsequently allowed. This success rate is in the 81% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 50.2% of cases where such amendments are filed. This entry rate is in the 71% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 200.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 97% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 95% percentile among all examiners. Of these withdrawals, 61.1% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 38.2% are granted (fully or in part). This grant rate is in the 36% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.5% of allowed cases (in the 59% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 2.8% of allowed cases (in the 70% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.