Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19180420 | METHOD OF PREPARING A STRUCTURED SUBSTRATE FOR DIRECT BONDING | April 2025 | November 2025 | Allow | 7 | 0 | 1 | No | No |
| 18418720 | NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | January 2024 | January 2026 | Allow | 24 | 2 | 1 | Yes | No |
| 18416095 | NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | January 2024 | July 2025 | Allow | 18 | 1 | 1 | No | No |
| 18389517 | LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH | November 2023 | October 2025 | Abandon | 23 | 0 | 1 | No | No |
| 18480347 | DISPLAY DEVICE INCLUDING A FINGER PRINT SENSOR | October 2023 | December 2025 | Allow | 26 | 1 | 1 | Yes | No |
| 18243664 | THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY | September 2023 | September 2025 | Allow | 24 | 1 | 1 | Yes | No |
| 18344025 | PROCESSING METHOD | June 2023 | March 2026 | Allow | 33 | 0 | 0 | No | No |
| 18320936 | ENCAPSULATION PROCESS METHOD FOR WAFER-LEVEL LIGHT-EMITTING DIODE DIES | May 2023 | January 2026 | Allow | 32 | 0 | 0 | No | No |
| 18317303 | METHOD OF PROCESSING WAFER AND LASER APPLYING APPARATUS | May 2023 | October 2025 | Allow | 29 | 0 | 1 | No | No |
| 18311961 | METHOD OF PROCESSING WAFER AND LASER APPLYING APPARATUS | May 2023 | October 2025 | Allow | 30 | 0 | 1 | No | No |
| 18133303 | METHODS OF FORMING SEMICONDUCTOR DIES WITH PERIMETER PROFILES FOR STACKED DIE PACKAGES | April 2023 | December 2025 | Abandon | 32 | 1 | 1 | No | No |
| 18183963 | METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE | March 2023 | July 2025 | Allow | 28 | 1 | 1 | No | No |
| 18178923 | WAFER PROCESSING METHOD | March 2023 | November 2025 | Allow | 33 | 0 | 1 | No | No |
| 18177253 | METHOD OF MANUFACTURING PACKAGE DEVICE | March 2023 | August 2025 | Allow | 30 | 0 | 0 | No | No |
| 18168383 | Semiconductor Device and Method of Manufacture | February 2023 | December 2025 | Allow | 34 | 1 | 0 | No | No |
| 18165347 | METHOD FOR MAKING SEMICONDUCTOR PACKAGES | February 2023 | January 2026 | Allow | 36 | 1 | 1 | Yes | No |
| 18159117 | WAFER PROCESSING METHOD | January 2023 | March 2026 | Allow | 38 | 2 | 0 | No | No |
| 18149062 | DISPLAY PANEL AND DISPLAY DEVICE | December 2022 | January 2026 | Allow | 37 | 1 | 1 | No | No |
| 18065082 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | December 2022 | May 2025 | Allow | 30 | 0 | 0 | No | No |
| 18065041 | STRUCTURES FOR THREE-TERMINAL MEMORY CELLS | December 2022 | August 2025 | Allow | 32 | 1 | 1 | No | No |
| 18009052 | IMAGE SENSOR WITH NANOSTRUCTURE-BASED CAPACITORS | December 2022 | November 2025 | Abandon | 36 | 0 | 1 | No | No |
| 17960981 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | October 2022 | August 2025 | Allow | 34 | 2 | 0 | Yes | No |
| 17961136 | Carbon Assisted Semiconductor Dicing And Method | October 2022 | January 2026 | Allow | 40 | 3 | 1 | Yes | No |
| 17950242 | METHOD OF ELECTROSTATIC CHUCK MOTION CONTROL FOR WAFER BREAKAGE PREVENTION | September 2022 | June 2025 | Allow | 33 | 1 | 1 | Yes | No |
| 17934350 | METHOD OF MANUFACTURING LAYERED DEVICE CHIP ASSEMBLY | September 2022 | April 2025 | Allow | 31 | 0 | 0 | No | No |
| 17950048 | METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER | September 2022 | August 2025 | Allow | 35 | 1 | 0 | No | No |
| 17931591 | METHOD OF PROCESSING PLATE-SHAPED WORKPIECE | September 2022 | July 2025 | Allow | 34 | 1 | 0 | Yes | No |
| 17890092 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | August 2022 | October 2025 | Allow | 38 | 2 | 0 | Yes | No |
| 17884279 | INFRARED IMAGE SENSOR COMPONENT MANUFACTURING METHOD | August 2022 | December 2025 | Allow | 41 | 2 | 1 | No | No |
| 17815791 | METHOD OF PROCESSING WORKPIECE | July 2022 | June 2025 | Allow | 35 | 0 | 0 | No | No |
| 17876151 | BONDING LAYER AND PROCESS OF MAKING | July 2022 | March 2025 | Allow | 32 | 0 | 1 | No | No |
| 17815407 | ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZATION | July 2022 | April 2024 | Allow | 21 | 1 | 1 | Yes | No |
| 17870037 | NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | July 2022 | July 2025 | Allow | 36 | 5 | 1 | Yes | No |
| 17857381 | METHODS FOR CONTROLLING CONTACT RESISTANCE IN COBALT-TITANIUM STRUCTURES | July 2022 | March 2025 | Allow | 32 | 0 | 0 | No | No |
| 17835056 | SURFACE PROCESSING METHOD AND PROCESSING SYSTEM | June 2022 | February 2026 | Allow | 45 | 3 | 0 | No | No |
| 17830592 | SEMICONDUCTOR PACKAGE WITH SOLDERABLE SIDEWALL | June 2022 | November 2025 | Abandon | 41 | 1 | 1 | No | No |
| 17743971 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | May 2022 | February 2026 | Allow | 45 | 2 | 0 | Yes | No |
| 17742159 | MEMORY DEVICE, CIRCUIT STRUCTURE AND PRODUCTION METHOD THEREOF | May 2022 | November 2025 | Abandon | 42 | 1 | 1 | No | No |
| 17725012 | METHOD OF MANUFACTURING METAL OXIDE FILM AND DISPLAY DEVICE INCLUDING METAL OXIDE FILM | April 2022 | September 2025 | Abandon | 41 | 4 | 1 | Yes | No |
| 17718359 | DISPLAY DEVICE | April 2022 | February 2026 | Abandon | 46 | 2 | 1 | No | No |
| 17766771 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE | April 2022 | December 2025 | Abandon | 44 | 2 | 0 | No | No |
| 17704620 | PATTERN DESIGN FOR INTEGRATED CIRCUITS AND METHOD FOR INSPECTING THE PATTERN DESIGN FOR INTEGRATED CIRCUITS | March 2022 | July 2025 | Allow | 40 | 1 | 1 | Yes | No |
| 17694494 | FLEXIBLE DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF | March 2022 | September 2025 | Allow | 42 | 3 | 0 | No | No |
| 17638053 | Method of Manufacturing and Passivating a Die | February 2022 | September 2025 | Abandon | 43 | 2 | 1 | No | No |
| 17652124 | SEMICONDUCTOR DEVICE | February 2022 | December 2025 | Abandon | 46 | 2 | 1 | Yes | No |
| 17623232 | DISPLAY PANEL AND DISPLAY DEVICE | December 2021 | October 2025 | Allow | 46 | 3 | 0 | Yes | No |
| 17497417 | NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | October 2021 | February 2025 | Allow | 41 | 2 | 1 | Yes | No |
| 17598265 | DISPLAY PANEL AND DISPLAY DEVICE | September 2021 | August 2024 | Allow | 35 | 2 | 0 | No | No |
| 17448708 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | September 2021 | July 2025 | Allow | 46 | 2 | 1 | No | No |
| 17386554 | WAFER WITH TEST STRUCTURE AND METHOD OF DICING WAFER | July 2021 | March 2026 | Allow | 56 | 5 | 1 | No | No |
| 17358814 | METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT | June 2021 | August 2024 | Allow | 38 | 2 | 0 | No | No |
| 17279158 | METHOD FOR SINGULATING A SEMICONDUCTOR COMPONENT HAVING A PN JUNCTION AND SEMICONDUCTOR COMPONENT HAVING A PN JUNCTION | March 2021 | March 2025 | Abandon | 48 | 2 | 0 | No | No |
| 17248514 | STRUCTURE AND METHOD FOR ELECTRONIC DIE SINGULATION USING ALIGNMENT STRUCTURES AND MULTI-STEP SINGULATION | January 2021 | March 2025 | Allow | 50 | 2 | 1 | No | No |
| 17148624 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | January 2021 | June 2025 | Allow | 53 | 5 | 1 | No | No |
| 17145752 | ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIATED SYSTEMS AND METHODS | January 2021 | June 2024 | Allow | 41 | 2 | 0 | No | No |
| 17101642 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | November 2020 | July 2025 | Allow | 55 | 3 | 1 | Yes | No |
| 17053697 | METHOD FOR SERVERING AN EPITAXIALLY GROWN SEMICONDUCTOR BODY, AND SEMICONDUCTOR CHIP | November 2020 | October 2025 | Abandon | 60 | 3 | 0 | No | No |
| 17000232 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | August 2020 | October 2025 | Allow | 60 | 4 | 1 | No | No |
| 16960831 | SEMICONDUCTOR DEVICE PRODUCTION METHOD | July 2020 | May 2024 | Allow | 46 | 2 | 0 | Yes | No |
| 16923591 | EXPANDING METHOD AND EXPANDING APPARATUS | July 2020 | March 2025 | Allow | 56 | 4 | 1 | Yes | No |
| 16871189 | SEMICONDUCTOR SUBSTRATE AND METHOD OF DICING THE SAME | May 2020 | April 2025 | Allow | 60 | 4 | 1 | Yes | No |
| 16800462 | FIN TUNNELING FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF | February 2020 | August 2024 | Abandon | 54 | 4 | 0 | No | No |
| 16725189 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE | December 2019 | April 2024 | Allow | 52 | 3 | 1 | Yes | No |
| 16661633 | PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES | October 2019 | July 2024 | Abandon | 57 | 4 | 1 | Yes | No |
| 16596507 | METHODS OF FORMING A DEVICE, AND RELATED DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS | October 2019 | March 2022 | Allow | 29 | 5 | 1 | No | No |
| 16591750 | FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM | October 2019 | May 2024 | Abandon | 56 | 4 | 1 | Yes | No |
| 16587814 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE | September 2019 | February 2025 | Allow | 60 | 5 | 1 | Yes | No |
| 15725535 | METHOD FOR FORMING BUMP STRUCTURE | October 2017 | January 2026 | Abandon | 60 | 10 | 0 | Yes | No |
| 15671223 | PHOTODETECTOR AND METHOD OF FORMING THE PHOTODETECTOR ON STACKED TRENCH ISOLATION REGIONS | August 2017 | August 2018 | Allow | 12 | 0 | 1 | No | No |
| 15584981 | METHOD FOR VIA PLATING WITH SEED LAYER | May 2017 | April 2018 | Allow | 11 | 10 | 0 | Yes | No |
| 15338734 | DNA SEQUENCING USING MOSFET TRANSISTORS | October 2016 | April 2018 | Allow | 17 | 1 | 1 | Yes | No |
| 14944436 | GATE STACK INTEGRATED METAL RESISTORS | November 2015 | September 2016 | Allow | 10 | 1 | 1 | Yes | No |
| 14839235 | CHEMOEPITAXY-BASED DIRECTED SELF ASSEMBLY PROCESS WITH TONE INVERSION FOR UNIDIRECTIONAL WIRING | August 2015 | February 2017 | Allow | 18 | 0 | 0 | No | No |
| 14814083 | INTEGRATION OF ELECTROMECHANICAL AND CMOS DEVICES IN FRONT-END-OF-LINE USING REPLACEMENT METAL GATE PROCESS FLOW | July 2015 | July 2016 | Allow | 12 | 0 | 1 | Yes | No |
| 14813254 | INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION | July 2015 | December 2016 | Allow | 17 | 2 | 1 | No | No |
| 14813330 | SEMICONDUCTOR STRUCTURE WITH A SILICON GERMANIUM ALLOY FIN AND SILICON GERMANIUM ALLOY PAD STRUCTURE | July 2015 | April 2017 | Allow | 21 | 2 | 1 | Yes | No |
| 14596284 | DNA SEQUENCING USING MOSFET TRANSISTORS | January 2015 | March 2018 | Allow | 38 | 2 | 1 | Yes | No |
| 14396842 | METHOD FOR HETEROEPITAXIAL GROWTH OF III METAL-FACE POLARITY III-NITRIDES ON SUBSTRATES WITH DIAMOND CRYSTAL STRUCTURE AND III-NITRIDE SEMICONDUCTORS | October 2014 | September 2018 | Allow | 47 | 4 | 1 | Yes | No |
| 14479652 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | September 2014 | June 2017 | Allow | 33 | 3 | 0 | Yes | No |
| 14383065 | METHODS FOR MANUFACTURING ISOLATED DEEP TRENCH AND HIGH-VOLTAGE LED CHIP | September 2014 | May 2015 | Allow | 8 | 1 | 0 | No | No |
| 14323036 | CONTROL OF O-INGRESS INTO GATE STACK DIELECTRIC LAYER USING OXYGEN PERMEABLE LAYER | July 2014 | December 2016 | Allow | 30 | 2 | 1 | Yes | No |
| 14149969 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | January 2014 | November 2015 | Allow | 22 | 1 | 0 | No | No |
| 14148063 | MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS | January 2014 | September 2015 | Allow | 20 | 1 | 0 | No | No |
| 14071894 | HIGH PRODUCTIVITY COMBINATORIAL WORKFLOW FOR POST GATE ETCH CLEAN DEVELOPMENT | November 2013 | December 2014 | Allow | 13 | 2 | 0 | Yes | No |
| 13957572 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING PHOTO KEY | August 2013 | August 2015 | Allow | 25 | 1 | 1 | No | No |
| 13992046 | METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT AND COMPONENT | July 2013 | January 2015 | Allow | 19 | 1 | 0 | Yes | No |
| 13947543 | ALIGNMENT OF INTEGRATED CIRCUIT CHIP STACK | July 2013 | July 2015 | Allow | 23 | 2 | 1 | Yes | No |
| 13929256 | THIN BODY SWITCH TRANSISTOR | June 2013 | August 2015 | Allow | 26 | 2 | 1 | Yes | No |
| 13919533 | TRANSPARENT CONTACTS ORGANIC SOLAR PANEL BY SPRAY | June 2013 | October 2014 | Allow | 15 | 1 | 0 | Yes | No |
| 13809433 | METHOD FOR DISPOSING FINE OBJECTS, APPARATUS FOR ARRANGING FINE OBJECTS, ILLUMINATING APPARATUS AND DISPLAY APPARATUS | March 2013 | August 2015 | Allow | 31 | 3 | 0 | Yes | No |
| 13614662 | FINFET WITH FULLY SILICIDED GATE | September 2012 | May 2013 | Allow | 8 | 1 | 0 | No | No |
| 13595873 | Non-melt thin-wafer laser thermal annealing methods | August 2012 | September 2016 | Allow | 49 | 5 | 1 | Yes | No |
| 13571470 | METHODS OF IN-SITU VAPOR PHASE DEPOSITION OF SELF-ASSEMBLED MONOLAYERS AS COPPER ADHESION PROMOTERS AND DIFFUSION BARRIERS | August 2012 | December 2013 | Allow | 16 | 1 | 0 | No | No |
| 13562564 | HIGH PRODUCTIVITY COMBINATORIAL WORKFLOW FOR POST GATE ETCH CLEAN DEVELOPMENT | July 2012 | August 2013 | Allow | 12 | 0 | 0 | No | No |
| 13562398 | METHOD FOR PLATING A SEMICONDUCTOR PACKAGE LEAD | July 2012 | December 2013 | Allow | 17 | 1 | 1 | No | No |
| 13561661 | UNDERFILL ADHESION MEASUREMENTS AT A MICROSCOPIC SCALE | July 2012 | March 2014 | Allow | 20 | 2 | 0 | No | No |
| 13546828 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | July 2012 | March 2014 | Allow | 21 | 2 | 0 | No | No |
| 13521694 | STRUCTURE MANUFACTURING METHOD AND LIQUID DISCHARGE HEAD SUBSTRATE MANUFACTURING METHOD | July 2012 | May 2013 | Allow | 10 | 0 | 0 | Yes | No |
| 13519945 | CASTING COMPOSITION AS DIFFUSION BARRIER FOR WATER MOLECULES | June 2012 | May 2015 | Allow | 34 | 5 | 0 | No | No |
| 13528509 | METHOD FOR CLEANING & PASSIVATING GALLIUM ARSENIDE SURFACE AUTOLOGOUS OXIDE AND DEPOSITING AL2O3 DIELECTRIC | June 2012 | January 2013 | Allow | 7 | 0 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner PETERSON, ERIK T.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner PETERSON, ERIK T works in Art Unit 2898 and has examined 58 patent applications in our dataset. With an allowance rate of 89.7%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 31 months.
Examiner PETERSON, ERIK T's allowance rate of 89.7% places them in the 72% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by PETERSON, ERIK T receive 2.50 office actions before reaching final disposition. This places the examiner in the 73% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by PETERSON, ERIK T is 31 months. This places the examiner in the 56% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +0.0% benefit to allowance rate for applications examined by PETERSON, ERIK T. This interview benefit is in the 15% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 23.8% of applications are subsequently allowed. This success rate is in the 34% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 28.6% of cases where such amendments are filed. This entry rate is in the 41% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
This examiner withdraws rejections or reopens prosecution in 50.0% of appeals filed. This is in the 18% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 40.0% are granted (fully or in part). This grant rate is in the 30% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 28% percentile). This examiner makes examiner's amendments less often than average. You may need to make most claim amendments yourself.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 34% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.