Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19199129 | CRASH MITIGATION IN ACTIVE MEMS COOLING SYSTEMS | May 2025 | October 2025 | Allow | 6 | 0 | 2 | No | No |
| 18976344 | CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE | December 2024 | January 2025 | Allow | 2 | 0 | 0 | No | No |
| 18960184 | Embedded Digital Sensor Structure | November 2024 | May 2025 | Allow | 5 | 1 | 1 | Yes | No |
| 18738787 | PARKING SPACE DETECTION METHOD AND SYSTEM | June 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18655356 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE | May 2024 | February 2026 | Allow | 21 | 2 | 0 | No | No |
| 18652013 | SEMICONDUCTOR POWER DEVICE AND METHOD FOR PRODUCING SAME | May 2024 | July 2025 | Allow | 14 | 2 | 0 | No | No |
| 18641745 | Interconnect Structure Including Contact Via Over Barrier Layer | April 2024 | August 2025 | Allow | 16 | 1 | 0 | No | No |
| 18637744 | PIXEL DEVICE ON DEEP TRENCH ISOLATION (DTI) STRUCTURE FOR IMAGE SENSOR | April 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18609571 | METHOD FOR MANUFACTURING PACKAGE STRUCTURE | March 2024 | September 2024 | Allow | 6 | 0 | 0 | No | No |
| 18605411 | METHOD OF MANUFACTURE AND ASSEMBLY OF XY FLEXURE MECHANISM ASSEMBLY | March 2024 | November 2024 | Allow | 8 | 1 | 1 | Yes | No |
| 18594944 | IN-PLANE AND OUT-OF-PLANE ACCELEROMETER | March 2024 | June 2025 | Allow | 15 | 0 | 0 | Yes | No |
| 18591687 | SEMICONDUCTOR DEVICE INCLUDING GATE SEPARATION REGION | February 2024 | September 2024 | Allow | 6 | 0 | 0 | No | No |
| 18590533 | PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE, AND MEMS DEVICE | February 2024 | September 2025 | Abandon | 18 | 1 | 0 | No | No |
| 18584740 | OPTICAL DEVICE PRODUCTION METHOD | February 2024 | August 2024 | Allow | 6 | 0 | 0 | No | No |
| 18437720 | INTEGRATED FILLER CAPACITOR CELL DEVICE AND CORRESPONDING MANUFACTURING METHOD | February 2024 | October 2024 | Allow | 8 | 0 | 0 | No | No |
| 18434977 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | February 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18530207 | MICROELECTROMECHANICAL ACTUATOR ON INSULATING SUBSTRATE | December 2023 | March 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18529765 | SUBSTRATE WARPAGE REDUCTION | December 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18517694 | MICRO-NANO CHANNEL STRUCTURE, SENSOR AND MANUFACTURING METHOD THEREOF, AND MICROFLUIDIC DEVICE | November 2023 | April 2025 | Allow | 17 | 1 | 0 | No | No |
| 18509704 | Light-Emitting Element, Display Module, Lighting Module, Light-Emitting Device, Display Device, Electronic Appliance, and Lighting Device | November 2023 | August 2024 | Allow | 9 | 0 | 0 | No | No |
| 18383223 | MEMS PACKAGING ENABLING VERTICAL DISPLACEMENT OF SENSOR AND ACTUATOR ROTOR | October 2023 | October 2025 | Allow | 24 | 1 | 2 | Yes | No |
| 18487561 | MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER | October 2023 | June 2025 | Allow | 20 | 0 | 0 | No | No |
| 18378664 | METHOD OF FORMING MICRO-ELECTROMECHANICAL SYSTEM DEVICE | October 2023 | December 2024 | Allow | 14 | 1 | 0 | No | No |
| 18471404 | TRAINING NEURAL NETWORKS USING PRIORITY QUEUES | September 2023 | February 2025 | Allow | 17 | 1 | 0 | No | No |
| 18470541 | DISPLAY DEVICE | September 2023 | March 2026 | Allow | 30 | 0 | 1 | No | No |
| 18467897 | SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION METHODS | September 2023 | June 2024 | Allow | 9 | 1 | 0 | Yes | No |
| 18243208 | ORGANIC COMPOUNDS AND ORGANIC LIGHT EMITTING DIODE COMPRISING THE SAME | September 2023 | November 2025 | Allow | 27 | 0 | 0 | No | No |
| 18242267 | MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMICONDUCTOR PROCESS | September 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18241749 | ORGANOMETALLIC COMPOUND, LIGHT-EMITTING DEVICE INCLUDING THE ORGANOMETALLIC COMPOUND, AND ELECTRONIC APPARATUS INCLUDING THE LIGHT-EMITTING DEVICE | September 2023 | November 2025 | Allow | 27 | 0 | 0 | No | No |
| 18457155 | CHEMICALLY-SENSITIVE FIELD EFFECT TRANSISTORS, SYSTEMS, AND METHODS FOR MANUFACTURING AND USING THE SAME | August 2023 | January 2025 | Allow | 17 | 0 | 0 | No | No |
| 18546686 | ELECTRONIC COMPONENT SEALING LID | August 2023 | November 2025 | Allow | 27 | 0 | 0 | No | No |
| 18365449 | SEMICONDUCTOR DEVICE COMPRISING DIFFERENT TYPES OF MICROELECTROMECHANICAL SYSTEMS DEVICES | August 2023 | January 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18261685 | IMAGING DEVICE | July 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18353875 | SEMICONDUCTOR DEVICE | July 2023 | May 2025 | Allow | 22 | 2 | 0 | Yes | No |
| 18348664 | MEMS DEVICE AND METHOD OF MANUFACTURING MEMS DEVICE | July 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18269627 | ORGANIC LIGHT RECEIVING ELEMENT AND LIGHT RECEIVING DEVICE | June 2023 | March 2026 | Allow | 33 | 1 | 0 | No | No |
| 18337588 | DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT | June 2023 | September 2025 | Allow | 27 | 0 | 0 | No | No |
| 18337942 | MICROMECHANICAL COMPONENT FOR A SENSOR AND/OR MICROPHONE DEVICE | June 2023 | November 2025 | Allow | 29 | 1 | 0 | No | No |
| 18337954 | DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT | June 2023 | September 2025 | Allow | 27 | 0 | 0 | No | No |
| 18210679 | MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION POINT | June 2023 | November 2025 | Allow | 29 | 2 | 1 | Yes | No |
| 18210640 | Microelectromechanical Acoustic Pressure-Generating Device with Improved Drive | June 2023 | August 2025 | Allow | 26 | 0 | 0 | No | No |
| 18256984 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | June 2023 | March 2026 | Allow | 33 | 0 | 1 | No | No |
| 18200885 | MEMS TRANSDUCER | May 2023 | January 2025 | Allow | 20 | 1 | 0 | No | No |
| 18196741 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | May 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18252585 | IMAGE PICKUP ELEMENT AND ELECTRONIC DEVICE | May 2023 | March 2026 | Abandon | 34 | 1 | 0 | No | No |
| 18310593 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | May 2023 | November 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 18142373 | MEMS SENSOR PACKAGE AND ITS MANUFACTURING METHOD | May 2023 | January 2026 | Allow | 33 | 2 | 0 | No | No |
| 18310388 | ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE | May 2023 | January 2026 | Allow | 33 | 1 | 0 | No | No |
| 18309506 | SEMICONDUCTOR DEVICE WITH DIELECTRIC SPACER LINER ON SOURCE/DRAIN CONTACT | April 2023 | August 2025 | Allow | 28 | 1 | 0 | No | No |
| 18033976 | ION MICROTRAP ASSEMBLY AND METHOD OF MAKING OF MAKING SUCH AN ASSEMBLY | April 2023 | November 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 18303698 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC WALL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | April 2023 | February 2026 | Allow | 34 | 1 | 1 | No | No |
| 18303109 | METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE | April 2023 | February 2024 | Allow | 10 | 0 | 0 | Yes | No |
| 18136554 | METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR PACKAGE | April 2023 | December 2025 | Allow | 32 | 2 | 1 | No | No |
| 18246790 | PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE | March 2023 | December 2025 | Allow | 32 | 1 | 0 | No | No |
| 18186335 | DISPLAY PANEL | March 2023 | July 2024 | Allow | 16 | 1 | 1 | No | No |
| 18044571 | ELECTROSTATICALLY DRIVEN COMB STRUCTURE OF MEMS, MICRO-MIRROR USING SAME AND PREPARATION METHOD THEREFOR | March 2023 | June 2024 | Allow | 15 | 0 | 0 | Yes | No |
| 18024565 | MEMS SWITCH DEVICE AND ELECTRONIC APPARATUS | March 2023 | October 2025 | Allow | 32 | 1 | 0 | No | No |
| 18116397 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD WITH HIGH-VOLTAGE ISOLATION CAPACITOR | March 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18177251 | STRUCTURE WITH UPPER FEATURES OF ADJACENT METAL STRUCTURES WITH SIDEWALL SPACERS PROVIDING VOID-FREE DIELECTRIC FILLING | March 2023 | October 2025 | Allow | 31 | 1 | 1 | No | No |
| 18112788 | LIGHT-EMITTING DEVICE | February 2023 | January 2026 | Allow | 35 | 1 | 1 | No | No |
| 18021582 | MEMS DEVICE, METHOD FOR MANUFACTURING MEMS DEVICE AND ELECTRONIC DEVICE | February 2023 | November 2025 | Allow | 33 | 1 | 0 | No | No |
| 18168968 | PROFILE CONTROL OF ISOLATION STRUCTURES IN SEMICONDUCTOR DEVICES | February 2023 | August 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 18108154 | PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS | February 2023 | February 2026 | Allow | 36 | 1 | 1 | No | No |
| 18165434 | FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS | February 2023 | March 2024 | Allow | 13 | 1 | 0 | No | No |
| 18165321 | SEMICONDUCTOR STRUCTURE AND METHOD OF OVERLAY MEASUREMENT OF SEMICONDUCTOR STRUCTURE | February 2023 | March 2026 | Allow | 37 | 2 | 1 | No | No |
| 18162694 | SEMICONDUCTOR DEVICE AND THE MANUFACTURING METHOD THEREOF | January 2023 | August 2025 | Allow | 30 | 1 | 0 | No | No |
| 18159379 | LOW-IMPACT OUT-OF-PLANE MOTION LIMITER MEMS DEVICE | January 2023 | January 2026 | Allow | 36 | 1 | 1 | No | No |
| 18156322 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | January 2023 | August 2025 | Allow | 31 | 1 | 0 | No | No |
| 18153795 | COMPACT ENHANCED SENSITIVITY TEMPERATURE SENSOR USING AN ENCAPSULATED CLAMPED-CLAMPED MEMS BEAM RESONATOR | January 2023 | June 2025 | Allow | 29 | 0 | 0 | No | No |
| 18151631 | METHOD FOR PRODUCING A BONDING PAD FOR A MICROMECHANICAL SENSOR ELEMENT | January 2023 | May 2025 | Allow | 28 | 0 | 0 | Yes | No |
| 18151921 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | January 2023 | February 2026 | Allow | 37 | 2 | 1 | No | No |
| 18151962 | EARLY-IMPACT OUT-OF-PLANE MOTION LIMITER FOR MEMS DEVICE | January 2023 | January 2026 | Allow | 37 | 1 | 1 | No | No |
| 18092683 | INTEGRATION OF RADIO FREQUENCY FRONT-END FOR SIZE REDUCTION AND IMPROVED PERFORMANCE | January 2023 | October 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 18087602 | MEMS BUMP STOPPER SURFACE FEATURES | December 2022 | January 2026 | Allow | 37 | 2 | 1 | No | No |
| 18068821 | PHASE CHANGE HETEROSTRUCTURE, AND PHASE CHANGE MEMORY DEVICE INCLUDING THE SAME | December 2022 | March 2026 | Allow | 39 | 2 | 0 | Yes | No |
| 18085513 | MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE | December 2022 | July 2025 | Allow | 31 | 1 | 0 | No | No |
| 18082580 | PIEZOELECTRIC SINGLE-CRYSTAL ELEMENT, MEMS DEVICE USING SAME, AND METHOD FOR MANUFACTURING SAME | December 2022 | September 2025 | Allow | 33 | 1 | 0 | No | No |
| 18010935 | ABSOLUTE PRESSURE SENSING MEMS MICROPHONE, MICROPHONE UNIT AND ELECTRONIC DEVICE | December 2022 | February 2026 | Allow | 38 | 2 | 0 | No | No |
| 18065978 | Semiconductor Device | December 2022 | November 2025 | Allow | 35 | 2 | 0 | No | No |
| 18081177 | Nanowire Structures Having Non-Discrete Source and Drain Regions | December 2022 | June 2024 | Allow | 18 | 1 | 1 | No | No |
| 18079704 | METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICE | December 2022 | February 2024 | Allow | 14 | 1 | 0 | No | No |
| 18073879 | MEMS SOUND TRANSDUCER WITH A DAMPING LAYER MADE OF ADHESIVE | December 2022 | August 2025 | Allow | 32 | 0 | 1 | No | No |
| 18071723 | LIGHT-EMITTING ELEMENT, METHOD OF ALIGNING THE SAME, AND DISPLAY DEVICE | November 2022 | December 2025 | Allow | 37 | 1 | 1 | No | No |
| 18060329 | MEMS DEVICE HAVING A MECHANICAL BARRIER STRUCTURE | November 2022 | July 2025 | Allow | 31 | 1 | 1 | No | No |
| 17994471 | MICRO ELECTRO MECHANICAL SYSTEM PROBE AND MANUFACTURING METHOD THEREOF | November 2022 | December 2025 | Abandon | 36 | 0 | 1 | No | No |
| 17993899 | CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Manufacturing Method Thereof | November 2022 | December 2024 | Allow | 24 | 1 | 1 | No | No |
| 18058565 | Semiconductor Device and Method of Making a MEMS Semiconductor Package | November 2022 | March 2026 | Abandon | 39 | 1 | 1 | No | No |
| 18057435 | METHOD FOR MAKING A QUANTUM DEVICE | November 2022 | December 2025 | Allow | 37 | 2 | 0 | No | No |
| 17991317 | LIGHT-COLLECTING STRUCTURES FOR A LIGHT-EMITTING ARRAY | November 2022 | October 2025 | Allow | 35 | 1 | 1 | Yes | No |
| 17989910 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | November 2022 | July 2025 | Allow | 32 | 1 | 0 | No | No |
| 17985993 | LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING THEREOF | November 2022 | February 2024 | Allow | 15 | 1 | 0 | No | No |
| 18053622 | LIGHT EMITTING ELEMENT | November 2022 | July 2025 | Allow | 32 | 1 | 0 | No | No |
| 18053669 | ACOUSTIC TRANSDUCER WITH IMPROVED LOW-FREQUENCY RESPONSE | November 2022 | February 2026 | Allow | 40 | 2 | 1 | Yes | No |
| 18052289 | MEMS FOR HIGHLY EFFICIENT INTERACTION WITH A VOLUME FLOW | November 2022 | September 2025 | Allow | 35 | 1 | 1 | No | No |
| 17973896 | Microelectromechanical Devices For Higher Order Passive Temperature Compensation and Methods of Designing Thereof | October 2022 | October 2025 | Allow | 36 | 1 | 1 | Yes | No |
| 18049017 | LIGHT EMITTING DIODE DEVICE | October 2022 | April 2025 | Allow | 30 | 0 | 0 | Yes | No |
| 18046774 | MEMS Device Built On Substrate With Ruthenium Based Contact Surface Material | October 2022 | July 2024 | Allow | 21 | 1 | 1 | No | No |
| 17962408 | PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES | October 2022 | June 2024 | Abandon | 20 | 1 | 0 | No | No |
| 17933439 | PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE FROM A SINGLE SEMICONDUCTOR WAFER AND RELATED MEMS DEVICE | September 2022 | December 2025 | Allow | 39 | 1 | 1 | No | No |
| 17823629 | SENSOR | August 2022 | July 2025 | Allow | 34 | 0 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner HOSSAIN, MOAZZAM.
With a 83.3% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 62.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner HOSSAIN, MOAZZAM works in Art Unit 2898 and has examined 521 patent applications in our dataset. With an allowance rate of 85.8%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 24 months.
Examiner HOSSAIN, MOAZZAM's allowance rate of 85.8% places them in the 63% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by HOSSAIN, MOAZZAM receive 1.66 office actions before reaching final disposition. This places the examiner in the 33% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by HOSSAIN, MOAZZAM is 24 months. This places the examiner in the 84% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +15.6% benefit to allowance rate for applications examined by HOSSAIN, MOAZZAM. This interview benefit is in the 55% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 37.1% of applications are subsequently allowed. This success rate is in the 84% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 40.1% of cases where such amendments are filed. This entry rate is in the 62% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 92.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 68% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 64.7% of appeals filed. This is in the 45% percentile among all examiners. Of these withdrawals, 63.6% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 44.4% are granted (fully or in part). This grant rate is in the 38% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.2% of allowed cases (in the 52% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 34% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.