Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18616199 | ISOLATION STRUCTURE AND MEMORY DEVICE | March 2024 | February 2026 | Allow | 23 | 4 | 0 | No | No |
| 18510707 | BCD DEVICE LAYOUT AREA DEFINED BY A DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FORMING THE SAME | November 2023 | August 2025 | Allow | 21 | 2 | 0 | No | No |
| 18368820 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | September 2023 | February 2026 | Allow | 29 | 3 | 0 | Yes | No |
| 18236955 | ELECTRONIC DEVICE | August 2023 | August 2025 | Allow | 24 | 2 | 0 | No | No |
| 18366752 | SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR DIES HAVING DIFFERENT LATTICE DIRECTIONS AND METHOD OF FORMING THE SAME | August 2023 | October 2025 | Allow | 26 | 2 | 0 | No | No |
| 18364483 | SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE | August 2023 | December 2025 | Abandon | 28 | 3 | 0 | No | No |
| 18358167 | BCD DEVICE LAYOUT AREA DEFINED BY A DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FORMING THE SAME | July 2023 | November 2025 | Allow | 27 | 3 | 0 | No | No |
| 18221184 | MULTIPLE DIE PACKAGE USING AN EMBEDDED BRIDGE CONNECTING DIES | July 2023 | September 2025 | Allow | 26 | 2 | 0 | No | No |
| 18344565 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | June 2023 | July 2025 | Allow | 25 | 2 | 0 | No | No |
| 18212719 | PRINTED CIRCUIT FILM, DISPLAY DEVICE, AND METHOD OF FABRICATING PRINTED CIRCUIT FILM | June 2023 | May 2025 | Allow | 23 | 2 | 0 | No | No |
| 18338572 | SOURCE CONTACT FORMATION OF MOSFET WITH GATE SHIELD BUFFER FOR PITCH REDUCTION | June 2023 | October 2024 | Allow | 16 | 1 | 0 | No | No |
| 18329203 | SEMICONDUCTOR PACKAGE WITH GUIDE PIN | June 2023 | September 2025 | Allow | 28 | 3 | 0 | No | No |
| 18202062 | COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED FEATURES | May 2023 | January 2026 | Abandon | 32 | 3 | 0 | No | No |
| 18313492 | MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS | May 2023 | August 2025 | Allow | 27 | 3 | 0 | No | No |
| 18309905 | SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER | May 2023 | April 2025 | Allow | 24 | 2 | 0 | No | No |
| 18306119 | POWER SEMICONDUCTOR DEVICE WITH A DOUBLE ISLAND SURFACE MOUNT PACKAGE | April 2023 | December 2024 | Allow | 19 | 1 | 0 | No | No |
| 18303173 | Multiple Threshold Voltage Implementation Through Lanthanum Incorporation | April 2023 | November 2025 | Allow | 31 | 3 | 0 | No | No |
| 18134418 | DIFFUSED TIP EXTENSION TRANSISTOR | April 2023 | April 2025 | Abandon | 24 | 3 | 0 | No | No |
| 18096704 | PROCESS FOR REDUCING PATTERN-INDUCED WAFER DEFORMATION | January 2023 | April 2025 | Allow | 27 | 3 | 0 | No | No |
| 18086326 | FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF | December 2022 | August 2023 | Allow | 8 | 1 | 0 | No | No |
| 18082727 | Semiconductor Manufacturing Apparatus and Manufacturing Method for Semiconductor Device | December 2022 | April 2025 | Allow | 28 | 4 | 0 | No | No |
| 17958040 | SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE | September 2022 | July 2025 | Allow | 33 | 1 | 1 | No | No |
| 17931285 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | September 2022 | December 2024 | Allow | 27 | 3 | 0 | Yes | No |
| 17942233 | SEMICONDUCTOR DEVICE STRUCTURES ISOLATED BY POROUS SEMICONDUCTOR MATERIAL | September 2022 | July 2025 | Allow | 34 | 2 | 1 | No | No |
| 17939998 | SEMICONDUCTOR DEVICE | September 2022 | November 2025 | Abandon | 38 | 1 | 0 | No | No |
| 17903846 | SEMICONDUCTOR DEVICE | September 2022 | September 2025 | Allow | 36 | 1 | 0 | No | No |
| 17894572 | SEMICONDUCTOR DEVICE | August 2022 | September 2025 | Allow | 36 | 1 | 0 | No | No |
| 17886002 | RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE | August 2022 | July 2025 | Allow | 35 | 1 | 1 | No | No |
| 17818417 | LAYOUT FOR INTEGRATED CIRCUIT AND THE INTEGRATED CIRCUIT | August 2022 | October 2023 | Allow | 14 | 1 | 0 | No | No |
| 17817365 | FORMATION OF TRENCH SILICIDE SOURCE OR DRAIN CONTACTS WITHOUT GATE DAMAGE | August 2022 | August 2025 | Allow | 36 | 5 | 0 | Yes | No |
| 17815181 | STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES | July 2022 | June 2024 | Allow | 23 | 2 | 0 | Yes | No |
| 17795524 | LIGHT-EMITTING PANEL, METHOD FOR FABRICATING SAME, AND DISPLAY DEVICE | July 2022 | March 2026 | Allow | 44 | 2 | 0 | No | No |
| 17872338 | ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CENTRAL INTERMETALLIC MESH STRUCTURE AND MESH-FREE EXTERIOR STRUCTURES | July 2022 | December 2025 | Allow | 41 | 2 | 1 | No | No |
| 17814297 | TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION | July 2022 | April 2025 | Allow | 33 | 3 | 0 | No | No |
| 17868831 | TUNING THRESHOLD VOLTAGE IN NANOSHEET TRANSITOR DEVICES | July 2022 | August 2025 | Allow | 37 | 3 | 0 | No | No |
| 17809480 | TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION | June 2022 | February 2024 | Allow | 20 | 4 | 0 | No | No |
| 17836180 | Epitaxial Growth Method for FDSOI Hybrid Region | June 2022 | July 2025 | Allow | 37 | 4 | 0 | No | No |
| 17832541 | Mixed Dielectric Materials for Improving Signal Integrity of Integrated Electronics Packages | June 2022 | September 2025 | Allow | 40 | 1 | 1 | No | No |
| 17781264 | METHOD FOR THE LOCALIZED DEPOSITION OF A MATERIAL ON A METAL ELEMENT | May 2022 | July 2025 | Allow | 38 | 1 | 0 | No | No |
| 17741467 | SENSOR AND METHOD OF FORMING THE SAME | May 2022 | July 2023 | Allow | 15 | 1 | 0 | No | No |
| 17310514 | ORGANIC EL DISPLAY PANEL AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY PANEL | April 2022 | March 2025 | Allow | 43 | 1 | 0 | Yes | No |
| 17706880 | MEMORY-ELEMENT-INCLUDING SEMICONDUCTOR DEVICE | March 2022 | March 2025 | Abandon | 36 | 1 | 0 | No | No |
| 17703057 | METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND DOUBLE-SIDED COOLING TYPE POWER MODULE | March 2022 | February 2026 | Allow | 47 | 6 | 1 | No | No |
| 17698106 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME AND APPLICATION THEREOF | March 2022 | June 2025 | Abandon | 39 | 2 | 0 | No | No |
| 17654620 | Method of Forming Semiconductor Device | March 2022 | August 2023 | Allow | 17 | 1 | 0 | No | No |
| 17639914 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET | March 2022 | July 2025 | Allow | 41 | 3 | 0 | Yes | No |
| 17680437 | Structures for Providing Electrical Isolation in Semiconductor Devices | February 2022 | May 2025 | Allow | 39 | 4 | 0 | Yes | No |
| 17651792 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | February 2022 | April 2025 | Abandon | 38 | 2 | 0 | Yes | No |
| 17675108 | SEMICONDUCTOR DEVICE WITH SILICIDE STRUCTURES SURROUNDING EPITAXIAL STRUCTURES AND METHOD OF MAKING THE SAME | February 2022 | March 2025 | Allow | 37 | 1 | 1 | No | No |
| 17636455 | BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD | February 2022 | September 2024 | Abandon | 30 | 1 | 0 | No | No |
| 17675846 | SEMICONDUCTOR DEVICE | February 2022 | July 2025 | Allow | 41 | 4 | 0 | Yes | No |
| 17672144 | MANUFACTURING METHOD FOR FORMING SEMICONDUCTOR DEVICE | February 2022 | December 2025 | Allow | 46 | 2 | 0 | No | No |
| 17669375 | APPARATUS INCLUDING TRANSPARENT MATERIAL FOR TRANSPARENT PROCESS PERFORMANCE AND METHOD USING THEREOF | February 2022 | December 2025 | Allow | 46 | 2 | 1 | Yes | No |
| 17667558 | POWER SEMICONDUCTOR DEVICE | February 2022 | April 2025 | Allow | 38 | 4 | 0 | No | No |
| 17667989 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE | February 2022 | February 2025 | Allow | 37 | 1 | 0 | No | No |
| 17650380 | PREPARATION METHOD FOR SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR MEMORY | February 2022 | April 2025 | Allow | 39 | 1 | 1 | No | No |
| 17586254 | PROCESS OF SURFACE TREATMENT OF SOI WAFER | January 2022 | March 2024 | Abandon | 26 | 1 | 0 | No | No |
| 17630030 | Installing an Electronic Assembly | January 2022 | September 2024 | Abandon | 32 | 1 | 0 | No | No |
| 17580710 | Light Emitting Apparatus, Method For Manufacturing Light Emitting Apparatus, And Projector | January 2022 | April 2025 | Allow | 38 | 1 | 1 | No | No |
| 17579788 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | January 2022 | July 2025 | Allow | 42 | 2 | 1 | No | No |
| 17577194 | METHOD FOR MAKING DEEP TRENCH ISOLATION OF CIS DEVICE, AND SEMICONDUCTOR DEVICE STRUCTURE | January 2022 | October 2025 | Allow | 45 | 2 | 1 | No | No |
| 17576084 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | January 2022 | February 2024 | Abandon | 25 | 0 | 1 | No | No |
| 17647903 | BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDED BODY, AND BONDED BODY AND PASTED BODY | January 2022 | April 2025 | Allow | 39 | 2 | 0 | No | No |
| 17575124 | SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME | January 2022 | August 2025 | Allow | 43 | 2 | 1 | No | No |
| 17562350 | EMBEDDED PACKAGING STRUCTURE | December 2021 | August 2025 | Allow | 44 | 4 | 0 | Yes | No |
| 17549650 | DISPLAY PANEL AND ELECTRONIC APPARATUS INCLUDING THE SAME | December 2021 | January 2025 | Abandon | 37 | 5 | 0 | Yes | No |
| 17643402 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | December 2021 | December 2023 | Abandon | 24 | 4 | 0 | No | No |
| 17544081 | SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD OF FORMING THE SAME | December 2021 | January 2026 | Allow | 49 | 3 | 0 | Yes | No |
| 17533000 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | November 2021 | March 2023 | Allow | 16 | 1 | 1 | No | No |
| 17529871 | METHOD FOR MANUFACTURING LOGIC DEVICE ISOLATION IN EMBEDDED STORAGE PROCESS | November 2021 | April 2023 | Allow | 17 | 1 | 0 | No | No |
| 17529496 | SEMICONDUCTOR DEVICE WITH CONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME | November 2021 | February 2023 | Allow | 15 | 1 | 0 | No | No |
| 17529514 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH TAPERING IMPURITY REGION | November 2021 | March 2023 | Allow | 16 | 1 | 0 | No | No |
| 17521881 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | November 2021 | May 2025 | Allow | 42 | 3 | 0 | No | No |
| 17609403 | METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | November 2021 | July 2025 | Allow | 44 | 2 | 0 | No | No |
| 17609093 | A METHOD FOR MANUFACTURING AN ELECTRONIC POWER MODULE | November 2021 | October 2025 | Allow | 47 | 3 | 0 | No | No |
| 17517406 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | November 2021 | June 2023 | Allow | 19 | 2 | 0 | No | No |
| 17513400 | STEAM OXIDATION INITIATION FOR HIGH ASPECT RATIO CONFORMAL RADICAL OXIDATION | October 2021 | November 2023 | Allow | 25 | 1 | 0 | Yes | No |
| 17499853 | ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF | October 2021 | January 2024 | Allow | 27 | 1 | 1 | No | No |
| 17495372 | SEMICONDUCTOR DEVICE | October 2021 | October 2023 | Allow | 24 | 1 | 0 | No | No |
| 17492356 | SILVER NANOPARTICLES SYNTHESIS METHOD FOR LOW TEMPERATURE AND PRESSURE SINTERING | October 2021 | September 2025 | Allow | 48 | 5 | 2 | Yes | No |
| 17487783 | LIGHT-EMITTING COMPONENT | September 2021 | June 2023 | Allow | 20 | 2 | 0 | No | No |
| 17487779 | SEMICONDUCTOR STRUCTURE PREPARATION PROCESS AND SEMICONDUCTOR STRUCTURE | September 2021 | March 2025 | Abandon | 42 | 3 | 0 | Yes | No |
| 17485993 | A LOW-COST METHOD OF MAKING A HARD MASK FOR HIGH RESOLUTION AND LOW DIMENSIONAL VARIATIONS FOR THE FABRICATION AND MANUFACTURING OF MICRO- AND NANO-DEVICES AND - SYSTEMS | September 2021 | December 2023 | Allow | 27 | 1 | 0 | No | No |
| 17485189 | METHOD FOR MANUFACTURING FDSOI | September 2021 | January 2023 | Allow | 16 | 1 | 0 | No | No |
| 17480434 | BCD DEVICE LAYOUT AREA DEFINED BY A DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FORMING THE SAME | September 2021 | August 2023 | Allow | 23 | 1 | 1 | No | No |
| 17477629 | SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR DIES HAVING DIFFERENT LATTICE DIRECTIONS AND METHOD OF FORMING THE SAME | September 2021 | October 2025 | Allow | 49 | 4 | 1 | Yes | No |
| 17473964 | DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME | September 2021 | September 2023 | Abandon | 25 | 1 | 1 | No | No |
| 17470078 | LEADFRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | September 2021 | July 2023 | Allow | 22 | 1 | 1 | No | No |
| 17464299 | HIGH SENSITIVITY SEMICONDUCTOR DEVICE FOR DETECTING FLUID CHEMICAL SPECIES AND RELATED MANUFACTURING METHOD | September 2021 | January 2023 | Allow | 17 | 1 | 0 | No | No |
| 17463131 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD | August 2021 | September 2025 | Allow | 48 | 3 | 1 | Yes | No |
| 17460971 | SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | August 2021 | July 2023 | Allow | 23 | 2 | 0 | Yes | No |
| 17434492 | BONDED BODY AND METHOD FOR MANUFACTURING SAME | August 2021 | February 2024 | Allow | 29 | 1 | 0 | No | No |
| 17412596 | MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS | August 2021 | February 2023 | Allow | 18 | 1 | 0 | No | No |
| 17412007 | METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | August 2021 | October 2023 | Allow | 25 | 1 | 1 | No | No |
| 17407576 | SEMICONDUCTOR STORAGE DEVICE | August 2021 | December 2023 | Allow | 28 | 1 | 0 | No | No |
| 17403072 | METHOD OF PRODUCING ANISOTROPIC CONDUCTIVE FILM AND ANISOTROPIC CONDUCTIVE FILM | August 2021 | August 2023 | Allow | 23 | 2 | 0 | No | No |
| 17398613 | QUANTUM COMPUTING DEVICES WITH AN INCREASED CHANNEL MOBILITY | August 2021 | January 2023 | Allow | 18 | 1 | 0 | No | No |
| 17392997 | METHOD OF 3D LOGIC FABRICATION TO SEQUENTIALLY DECREASE PROCESSING TEMPERATURE AND MAINTAIN MATERIAL THERMAL THRESHOLDS | August 2021 | May 2023 | Allow | 21 | 1 | 0 | No | No |
| 17391987 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | August 2021 | September 2023 | Allow | 25 | 2 | 0 | No | No |
| 17390694 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | July 2021 | March 2026 | Allow | 55 | 3 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner ISAAC, STANETTA D.
With a 100.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 54.2% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner ISAAC, STANETTA D works in Art Unit 2898 and has examined 580 patent applications in our dataset. With an allowance rate of 90.5%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 25 months.
Examiner ISAAC, STANETTA D's allowance rate of 90.5% places them in the 74% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by ISAAC, STANETTA D receive 2.25 office actions before reaching final disposition. This places the examiner in the 63% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by ISAAC, STANETTA D is 25 months. This places the examiner in the 80% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a -29.2% benefit to allowance rate for applications examined by ISAAC, STANETTA D. This interview benefit is in the 1% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 32.2% of applications are subsequently allowed. This success rate is in the 68% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 40.6% of cases where such amendments are filed. This entry rate is in the 62% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 163.6% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 91% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 84.0% of appeals filed. This is in the 78% percentile among all examiners. Of these withdrawals, 61.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 46.2% are granted (fully or in part). This grant rate is in the 40% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 2.6% of allowed cases (in the 78% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.8% of allowed cases (in the 58% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.