Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18991504 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY CELLS | December 2024 | July 2025 | Allow | 6 | 1 | 0 | No | No |
| 18973101 | METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH TRANSISTORS AND MEMORY CELLS | December 2024 | July 2025 | Allow | 7 | 1 | 0 | No | No |
| 18866425 | MOSFET DEVICE | November 2024 | June 2025 | Allow | 7 | 0 | 0 | No | No |
| 18942886 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | November 2024 | June 2025 | Allow | 7 | 0 | 0 | No | No |
| 18931868 | SEMICONDUCTOR STRUCTURE INTEGRATING LOGIC ELEMENT AND MEMORY ELEMENT | October 2024 | January 2025 | Allow | 2 | 0 | 0 | No | No |
| 18892142 | STRUCTURES AND METHODS FOR INTEGRATED COLD PLATE IN XPUS AND MEMORY | September 2024 | December 2024 | Allow | 3 | 0 | 0 | No | No |
| 18829079 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY CELLS | September 2024 | January 2025 | Allow | 4 | 1 | 0 | No | No |
| 18823309 | METHOD FOR MANUFACTURING A COLOUR-CONVERSION OPTOELECTRONIC DEVICE, INCLUDING A STEP OF POLARISING AN ELECTRET LAYER IN A LOCALISED MANNER BY MEANS OF THE UPPER ELECTRODES OF THE DIODES | September 2024 | February 2025 | Allow | 6 | 1 | 0 | No | No |
| 18837220 | VOLTAGE-CONTROLLED THREE-TERMINAL MAGNON TRANSISTOR, AND CONTROL AND PREPARATION METHOD THEREOF | August 2024 | March 2025 | Allow | 7 | 0 | 0 | No | No |
| 18792115 | EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME | August 2024 | March 2025 | Allow | 8 | 1 | 0 | No | No |
| 18788835 | Light-Emitting Element, Display Device, Electronic Device, and Lighting Device | July 2024 | September 2024 | Allow | 2 | 0 | 0 | No | No |
| 18779059 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS | July 2024 | June 2025 | Allow | 10 | 0 | 0 | No | No |
| 18764868 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | July 2024 | June 2025 | Allow | 11 | 1 | 0 | No | No |
| 18762679 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | July 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18761377 | BOND PAD STRUCTURE FOR BONDING IMPROVEMENT | July 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18761675 | DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH DEVICE | July 2024 | June 2025 | Allow | 11 | 1 | 0 | No | No |
| 18761779 | SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL SEMICONDUCTOR MATERIAL | July 2024 | May 2025 | Allow | 10 | 0 | 1 | No | No |
| 18757558 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | June 2024 | March 2025 | Allow | 8 | 1 | 0 | No | No |
| 18757497 | ELECTRONIC DEVICE HAVING STACKED STRUCTURES AND METHOD FOR MANUFACTURING THE SAME | June 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18756149 | ARRAY SUBSTRATE STRUCTURE | June 2024 | June 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18755281 | MULTI-GATE DEVICE AND RELATED METHODS | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18755298 | FUSE CELL STRUCTURE | June 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18752866 | MAGNETIC MEMORY DEVICE INCLUDING MAGNETIC TUNNEL JUNCTION PATTERNS WITH NON-UNIFORM WIDTHS | June 2024 | June 2025 | Allow | 11 | 1 | 1 | Yes | No |
| 18751359 | PACKAGE | June 2024 | May 2025 | Allow | 10 | 1 | 0 | No | No |
| 18750589 | SELECTIVE LINER ON BACKSIDE VIA AND METHOD THEREOF | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18750379 | Gate Isolation Feature and Manufacturing Method Thereof | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18748228 | SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD | June 2024 | June 2025 | Allow | 11 | 1 | 0 | No | No |
| 18749576 | Manufacturing Method for a Power MOSFET with Gate-Source ESD Diode Structure | June 2024 | January 2025 | Allow | 7 | 1 | 1 | No | No |
| 18746944 | THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE INTERCONNECT STRUCTURES | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18747341 | Power MOSFET with Gate-Source ESD Diode Structure | June 2024 | December 2024 | Allow | 6 | 1 | 1 | No | No |
| 18741794 | METHOD OF FORMING SEMICONDUCTOR DEVICE | June 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18742692 | OHMIC CONTACTS FOR A HIGH-ELECTRON-MOBILITY TRANSISTOR | June 2024 | August 2024 | Allow | 2 | 0 | 0 | No | No |
| 18740752 | DISPLAY SUBSTRATE AND DISPLAY PANEL | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18740823 | NONDESTRUCTIVE CHARACTERIZATION FOR CRYSTALLINE WAFERS | June 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18739083 | 3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH MEMORY ARRAYS AND CONNECTIVITY STRUCTURES | June 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18738441 | LIGHT EMITTING SUBSTRATE, WIRING SUBSTRATE AND DISPLAY DEVICE | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18736423 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY CELLS | June 2024 | August 2024 | Allow | 3 | 0 | 0 | No | No |
| 18734212 | METHOD OF MAKING AMPHI-FET STRUCTURE AND METHOD OF DESIGNING | June 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18732662 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | June 2024 | April 2025 | Allow | 10 | 1 | 1 | No | No |
| 18733052 | MICROELECTRONIC ASSEMBLIES | June 2024 | May 2025 | Allow | 12 | 1 | 1 | No | No |
| 18733821 | Power MOSFET with Gate-Source ESD Diode Structure | June 2024 | January 2025 | Allow | 8 | 1 | 1 | No | No |
| 18680742 | Integrated Assemblies and Methods of Forming Integrated Assemblies | May 2024 | June 2025 | Allow | 13 | 2 | 0 | No | No |
| 18679945 | DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE | May 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18678553 | TRANSISTOR, METHOD OF MANUFACTURING TRANSISTOR, AND DISPLAY DEVICE USING THE SAME | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18679303 | LIGHT EMITTING DIODE, LIGHT EMITTING DIODE MODULE, AND DISPLAY DEVICE INCLUDING THE SAME | May 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18678213 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME | May 2024 | May 2025 | Allow | 12 | 0 | 0 | No | No |
| 18677553 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND MEMORY CELLS | May 2024 | September 2024 | Allow | 4 | 1 | 0 | No | No |
| 18677589 | MAGNETIC DEVICE AND MAGNETIC RANDOM ACCESS MEMORY | May 2024 | March 2025 | Allow | 9 | 0 | 1 | No | No |
| 18674329 | POWER STORAGE PACK, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | May 2024 | August 2024 | Allow | 3 | 0 | 1 | No | No |
| 18674507 | METHOD FOR FORMING TRANSISTOR DEVICES HAVING SOURCE REGION SEGMENTS AND BODY REGION SEGMENTS | May 2024 | June 2025 | Allow | 13 | 1 | 0 | Yes | No |
| 18673746 | NANO-SHEET-BASED COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICES WITH ASYMMETRIC INNER SPACERS | May 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18671441 | METHOD FOR MANUFACTURING A TWO-TERMINAL MEMORY DEVICE | May 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18671431 | TWO-TERMINAL MEMORY DEVICE | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18669541 | MEMORY DEVICES | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18670557 | SEMICONDUCTOR DEVICE WITH METAL CAP ON GATE | May 2024 | May 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18670223 | FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18669237 | DEVICES INCLUDING CHANNEL MATERIALS AND PASSIVATION MATERIALS | May 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18668221 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | May 2024 | October 2024 | Allow | 5 | 0 | 0 | No | No |
| 18667068 | Light-Emitting Element, Display Device, Electronic Device, and Lighting Device | May 2024 | May 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18665199 | Dipole-Engineered High-K Gate Dielectric and Method Forming Same | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18661054 | LIGHT EMITTING DEVICE FOR DISPLAY AND UNIT PIXEL HAVING THE SAME | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18659388 | METHOD TO EMBED PLANAR FETS WITH FINFETS | May 2024 | April 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18657854 | NON-VOLATILE MEMORY DEVICE | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18658794 | SEMICONDUCTOR DEVICE INCLUDING BARRIER LAYER BETWEEN ACTIVE REGION AND SEMICONDUCTOR LAYER AND METHOD OF FORMING THE SAME | May 2024 | June 2025 | Allow | 13 | 1 | 1 | Yes | No |
| 18656574 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | May 2024 | April 2025 | Allow | 12 | 2 | 0 | No | No |
| 18654796 | ELECTRONIC DEVICE | May 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18654066 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS | May 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18650668 | FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18647252 | SUPPORTS FOR SEMICONDUCTOR STRUCTURES | April 2024 | April 2025 | Allow | 11 | 2 | 0 | No | No |
| 18645415 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18645434 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18645368 | PACKAGE STRUCTURE | April 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18645895 | CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION | April 2024 | April 2025 | Allow | 12 | 1 | 1 | No | No |
| 18643497 | PHASE-CHANGE MEMORY DEVICES | April 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18640328 | ORGANIC ELECTROLUMINESCENT DEVICES | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18640616 | DEVICES RELATED TO SWITCH BODY CONNECTIONS TO ACHIEVE SOFT BREAKDOWN | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18638933 | SEMICONDUCTOR APPARATUS AND EQUIPMENT | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18635894 | ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18634893 | METHODS AND MATERIAL DEPOSITION SYSTEMS FOR FORMING SEMICONDUCTOR LAYERS | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18633037 | FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | April 2024 | May 2025 | Allow | 14 | 1 | 0 | No | No |
| 18632631 | ELECTRONIC DEVICE | April 2024 | April 2025 | Allow | 12 | 1 | 0 | No | No |
| 18631243 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CIRCUIT | April 2024 | April 2025 | Allow | 12 | 0 | 1 | Yes | No |
| 18630264 | QUANTUM DOTS AND DEVICES INCLUDING THE SAME | April 2024 | February 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18629823 | APPARATUS AND CIRCUITS INCLUDING TRANSISTORS WITH DIFFERENT THRESHOLD VOLTAGES AND METHODS OF FABRICATING THE SAME | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18629442 | METHODS FOR FABRICATION, MANUFACTURE AND PRODUCTION OF AN AUTONOMOUS ELECTRICAL POWER SOURCE | April 2024 | May 2025 | Allow | 13 | 1 | 0 | No | No |
| 18626684 | LIGHT EMITTING DIODE PACKAGE | April 2024 | May 2025 | Allow | 13 | 1 | 0 | No | No |
| 18625630 | STORAGE ELEMENT, SEMICONDUCTOR DEVICE, MAGNETIC RECORDING ARRAY, AND METHOD OF MANUFACTURING STORAGE ELEMENT | April 2024 | June 2025 | Abandon | 15 | 1 | 0 | No | No |
| 18624411 | Integrated Circuit Package For High Bandwidth Memory | April 2024 | January 2025 | Allow | 10 | 0 | 0 | No | No |
| 18620591 | VERTICAL INTERCONNECT STRUCTURES IN THREE-DIMENSIONAL INTEGRATED CIRCUITS | March 2024 | November 2024 | Allow | 8 | 0 | 0 | No | No |
| 18619133 | PIXEL ARRANGEMENT STRUCTURE, ORGANIC ELECTROLUMINESCENT DISPLAY PANEL, METAL MASK AND DISPLAY DEVICE | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18617007 | MEMORY CELLS WITH SIDEWALL AND BULK REGIONS IN VERTICAL STRUCTURES | March 2024 | October 2024 | Allow | 6 | 0 | 0 | No | No |
| 18616449 | SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER LAYER | March 2024 | April 2025 | Allow | 13 | 1 | 0 | No | No |
| 18617517 | ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES | March 2024 | November 2024 | Allow | 8 | 0 | 0 | No | No |
| 18616481 | METAL OXIDE FILM AND METHOD FOR FORMING METAL OXIDE FILM | March 2024 | January 2025 | Allow | 10 | 0 | 0 | No | No |
| 18614735 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | March 2024 | October 2024 | Allow | 6 | 0 | 0 | No | No |
| 18613142 | OPTICAL SENSING SYSTEM | March 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18612650 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | March 2024 | November 2024 | Allow | 8 | 0 | 0 | No | No |
| 18611718 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | March 2024 | February 2025 | Allow | 11 | 1 | 0 | No | No |
| 18612701 | SEMICONDUCTOR DEVICE WITH DOPED STRUCTURE | March 2024 | December 2024 | Allow | 9 | 0 | 0 | No | No |
| 18612304 | SEMICONDUCTOR DEVICE | March 2024 | May 2025 | Allow | 14 | 1 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2818.
With a 43.1% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 43.2% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Art Unit 2818 is part of Group 2810 in Technology Center 2800. This art unit has examined 31,583 patent applications in our dataset, with an overall allowance rate of 90.7%. Applications typically reach final disposition in approximately 19 months.
Art Unit 2818's allowance rate of 90.7% places it in the 92% percentile among all USPTO art units. This art unit has a significantly higher allowance rate than most art units at the USPTO.
Applications in Art Unit 2818 receive an average of 1.16 office actions before reaching final disposition (in the 7% percentile). The median prosecution time is 19 months (in the 95% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.