Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19245137 | 3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH MEMORY ARRAYS AND CONNECTIVITY STRUCTURES | June 2025 | March 2026 | Allow | 9 | 0 | 0 | No | No |
| 19059193 | TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCALATION-DOPING OF LARGE-AREA MULTI- LAYERED GRAPHENE SHEETS FOR TRANSPARENT CONDUCTOR APPLICATIONS, INCLUDING SOLAR CELLS AND DISPLAYS | February 2025 | May 2025 | Allow | 2 | 1 | 0 | No | No |
| 18779059 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS | July 2024 | June 2025 | Allow | 10 | 0 | 0 | No | No |
| 18744533 | TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCALATION-DOPING OF LARGE-AREA MULTI- LAYERED GRAPHENE SHEETS FOR TRANSPARENT CONDUCTOR APPLICATIONS, INCLUDING SOLAR CELLS AND DISPLAYS | June 2024 | December 2024 | Allow | 6 | 1 | 0 | No | No |
| 18739083 | 3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH MEMORY ARRAYS AND CONNECTIVITY STRUCTURES | June 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18613834 | METHOD OF MAKING HIGH ASPECT RATIO OPENINGS IN A SEMICONDUCTOR DEVICE USING ION IMPLANTATED REGROWN CLADDING MASK | March 2024 | October 2025 | Allow | 19 | 0 | 0 | No | No |
| 18607380 | GRAPHENE BEOL INTEGRATION INTERCONNECTION STRUCTURES | March 2024 | October 2024 | Allow | 7 | 1 | 0 | No | No |
| 18596625 | SEMICONDUCTOR PACKAGES | March 2024 | June 2025 | Allow | 15 | 1 | 0 | No | No |
| 18586918 | POWER CELL FOR SEMICONDUCTOR DEVICES | February 2024 | May 2025 | Allow | 15 | 1 | 0 | No | No |
| 18587406 | MULTI-WAFER INTEGRATION | February 2024 | July 2025 | Allow | 16 | 1 | 0 | No | No |
| 18437665 | MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING SUPPORT PILLARS | February 2024 | April 2025 | Allow | 14 | 1 | 0 | No | No |
| 18432543 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF | February 2024 | December 2024 | Allow | 10 | 0 | 0 | No | No |
| 18429926 | LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS | February 2024 | December 2024 | Allow | 10 | 0 | 0 | No | No |
| 18428844 | DEEP TRENCH CAPACITOR FUSE STRUCTURE FOR HIGH VOLTAGE BREAKDOWN DEFENSE AND METHODS FOR FORMING THE SAME | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18415211 | MULTI-BIT STRUCTURE | January 2024 | November 2024 | Allow | 10 | 0 | 0 | No | No |
| 18411032 | MEMORY CELL AND SEMICONDUCTOR MEMORY DEVICE WITH THE SAME | January 2024 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18409447 | INTEGRATED CIRCUIT DEVICES HAVING IMPROVED CONTACT PLUG STRUCTURES THEREIN | January 2024 | October 2024 | Allow | 9 | 0 | 0 | No | No |
| 18408892 | METHOD FOR MRAM TOP ELECTRODE CONNECTION | January 2024 | June 2025 | Allow | 17 | 2 | 0 | No | No |
| 18404496 | 3D PRINTED SEMICONDUCTOR PACKAGE | January 2024 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18404619 | DIELECTRIC ISOLATION LAYER BETWEEN A NANOWIRE TRANSISTOR AND A SUBSTRATE | January 2024 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18404204 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING | January 2024 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18389769 | 3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH CONNECTIVITY STRUCTURES | December 2023 | April 2024 | Allow | 4 | 0 | 0 | No | No |
| 18389752 | 3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH CONNECTIVITY STRUCTURES | December 2023 | May 2024 | Allow | 5 | 1 | 0 | No | No |
| 18523145 | LIQUID CRYSTAL DISPLAY DEVICE | November 2023 | January 2025 | Allow | 13 | 0 | 0 | No | No |
| 18522727 | Integrated Standard Cell Structure | November 2023 | February 2025 | Allow | 14 | 1 | 0 | No | No |
| 18521560 | SUB 60NM ETCHLESS MRAM DEVICES BY ION BEAM ETCHING FABRICATED T-SHAPED BOTTOM ELECTRODE | November 2023 | May 2025 | Allow | 17 | 2 | 0 | No | No |
| 18519513 | SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION | November 2023 | June 2025 | Allow | 19 | 2 | 0 | No | No |
| 18519486 | SEMICONDUCTOR DEVICE, METHOD OF AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE | November 2023 | August 2024 | Allow | 9 | 0 | 0 | No | No |
| 18516751 | MAGNETIC TUNNEL JUNCTION STRUCTURES AND RELATED METHODS | November 2023 | January 2025 | Allow | 14 | 1 | 0 | No | No |
| 18510808 | MULTI-LEVEL MAGNETIC TUNNEL JUNCTION NOR DEVICE WITH WRAP-AROUND GATE ELECTRODES AND METHODS FOR FORMING THE SAME | November 2023 | September 2024 | Allow | 10 | 0 | 0 | Yes | No |
| 18507152 | SPACER SCHEME AND METHOD FOR MRAM | November 2023 | January 2025 | Allow | 15 | 1 | 0 | No | No |
| 18505998 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | November 2023 | January 2025 | Allow | 14 | 1 | 0 | No | No |
| 18506122 | LAYOUT OF STATIC RANDOM ACCESS MEMORY PERIPHERY CIRCUIT | November 2023 | August 2024 | Allow | 9 | 0 | 0 | No | No |
| 18492811 | SEMICONDUCTOR MEMORY STRUCTURE AND INTERCONNECT STRUCTURE OF SEMICONDUCTOR MEMORY STRUCTURE | October 2023 | July 2024 | Allow | 9 | 0 | 0 | No | No |
| 18287466 | SILICON CARBIDE SEMICONDUCTOR DEVICE | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18484466 | MEMORY DEVICE AND SEMICONDUCTOR DIE, AND METHOD OF FABRICATING MEMORY DEVICE | October 2023 | January 2025 | Allow | 15 | 1 | 0 | No | No |
| 18474173 | MAGNETIC TUNNEL JUNCTION DEVICES | September 2023 | January 2025 | Allow | 16 | 1 | 0 | No | No |
| 18244535 | DISPLAY DEVICE | September 2023 | January 2026 | Allow | 28 | 0 | 0 | No | No |
| 18461019 | IMAGE DISPLAY DEVICE AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE | September 2023 | January 2026 | Allow | 29 | 0 | 0 | No | No |
| 18239859 | SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FOR PREPARING THE SAME | August 2023 | November 2025 | Allow | 26 | 0 | 0 | No | No |
| 18456519 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | August 2023 | November 2025 | Allow | 27 | 0 | 0 | No | No |
| 18238520 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | August 2023 | February 2025 | Allow | 18 | 2 | 0 | No | No |
| 18454970 | CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS | August 2023 | January 2025 | Allow | 17 | 1 | 0 | No | No |
| 18452886 | MAGNETIC MEMORY DEVICES | August 2023 | December 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18450798 | SEMICONDUCTOR STRUCTURE AND LAYOUT STRUCTURE | August 2023 | October 2025 | Allow | 26 | 0 | 0 | No | No |
| 18447739 | THREE DIMENSIONAL INTEGRATED CIRCUIT WITH MONOLITHIC INTER-TIER VIAS (MIV) | August 2023 | April 2025 | Allow | 20 | 1 | 1 | No | No |
| 18447840 | Integrated Circuit Layout, Integrated Circuit, and Method for Fabricating the Same | August 2023 | December 2024 | Allow | 16 | 1 | 0 | No | No |
| 18447187 | REDUCED AREA STANDARD CELL ABUTMENT CONFIGURATIONS | August 2023 | January 2025 | Allow | 17 | 1 | 0 | No | No |
| 18363768 | PACKAGE STRUCTURE | August 2023 | December 2024 | Allow | 16 | 1 | 0 | No | No |
| 18228846 | FABRICATING DUAL DAMASCENE STRUCTURES USING MULTILAYER PHOTOSENSITIVE DIELECTRICS | August 2023 | October 2025 | Allow | 26 | 0 | 0 | No | No |
| 18362817 | MRAM MEMORY CELL LAYOUT FOR MINIMIZING BITCELL AREA | July 2023 | December 2024 | Allow | 16 | 1 | 0 | No | No |
| 18227113 | THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE | July 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18360055 | UNDER-CUT VIA ELECTRODE FOR SUB 60NM ETCHLESS MRAM DEVICES BY DECOUPLING THE VIA ETCH PROCESS | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18355273 | INTEGRATED CIRCUIT DEVICE AND METHOD | July 2023 | February 2025 | Allow | 19 | 2 | 0 | No | No |
| 18223069 | POWER PLANNING METHOD, CHIP DEVICE, AND NON-TRANSITORY COMPUTER READABLE MEDIUM | July 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18351471 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | July 2023 | December 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 18349685 | SEMICONDUCTOR DEVICE | July 2023 | October 2025 | Allow | 27 | 0 | 0 | No | No |
| 18348282 | METHOD FOR SELECTIVELY DEPOSITING A CONDUCTIVE COATING OVER A PATTERNING COATING AND DEVICE INCLUDING A CONDUCTIVE COATING | July 2023 | October 2024 | Allow | 15 | 1 | 0 | No | No |
| 18218197 | Metal-Oxide-Metal (MOM) Capacitors for Integrated Circuit Monitoring | July 2023 | December 2024 | Allow | 17 | 1 | 1 | No | No |
| 18347536 | SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME | July 2023 | March 2025 | Allow | 20 | 1 | 1 | No | No |
| 18346520 | METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE USING COMPOSITE HARD MASKS FOR FORMATION OF DEEP VIA OPENINGS | July 2023 | March 2026 | Allow | 32 | 0 | 0 | No | No |
| 18346504 | METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE USING COMPOSITE HARD MASKS FOR FORMATION OF DEEP VIA OPENINGS | July 2023 | February 2026 | Allow | 31 | 0 | 0 | No | No |
| 18346700 | INTEGRATED CIRCUIT LAYOUT AND METHOD | July 2023 | May 2024 | Allow | 10 | 0 | 0 | No | No |
| 18217012 | SEMICONDUCTOR DEVICE | June 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18216793 | SEMICONDUCTOR DEVICE WITH SHALLOW CONTACTS AND METHOD FOR FABRICATING THE SAME | June 2023 | July 2025 | Allow | 24 | 0 | 0 | No | No |
| 18341893 | MACHINE-READABLE CODE IN INTEGRATED CIRCUIT | June 2023 | March 2026 | Allow | 33 | 1 | 0 | No | No |
| 18341111 | INTERCONNECT SUBSTRATE | June 2023 | January 2026 | Allow | 31 | 1 | 0 | No | No |
| 18340602 | BACK-TO-BACK SOLID STATE LIGHTING DEVICES AND ASSOCIATED METHODS | June 2023 | August 2024 | Allow | 14 | 0 | 0 | No | No |
| 18213105 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | June 2023 | January 2026 | Allow | 31 | 1 | 0 | No | No |
| 18332769 | DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF | June 2023 | October 2024 | Allow | 16 | 1 | 0 | No | No |
| 18332938 | Nanowire Stack GAA Device with Inner Spacer and Methods for Producing the Same | June 2023 | October 2024 | Allow | 16 | 1 | 0 | No | No |
| 18333498 | MEMORY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE | June 2023 | November 2024 | Allow | 17 | 1 | 0 | No | No |
| 18332494 | SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER | June 2023 | August 2024 | Allow | 14 | 0 | 0 | No | No |
| 18332653 | TUNABLE GROUND CONNECTION TO MAJORANA ZERO MODES | June 2023 | September 2025 | Allow | 27 | 0 | 0 | No | No |
| 18331465 | FREQUENCY ALLOCATION IN MULTI-QUBIT CIRCUITS | June 2023 | September 2024 | Allow | 16 | 0 | 0 | No | No |
| 18205438 | Display Device | June 2023 | July 2024 | Allow | 14 | 1 | 0 | No | No |
| 18205030 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | June 2023 | February 2026 | Allow | 33 | 1 | 0 | No | No |
| 18204773 | FORMATION FOR MEMORY CELLS | June 2023 | August 2025 | Allow | 26 | 0 | 0 | No | No |
| 18324400 | METAL-INSULATOR-SILICIDE CAPACITORS | May 2023 | February 2026 | Allow | 33 | 1 | 0 | No | No |
| 18254162 | MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME | May 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18320390 | SEMICONDUCTOR CIRCUIT FOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | May 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18319137 | SEMICONDUCTOR DEVICE INCLUDING CUMULATIVE SEALING STRUCTURES | May 2023 | December 2024 | Allow | 19 | 1 | 0 | No | No |
| 18317986 | VOLTAGE REGULATOR HAVING VARIABLE OUTPUT CAPACITANCE AND METHODS FOR FORMING THE SAME | May 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18317567 | Electronic device and method for manufacturing the same | May 2023 | December 2025 | Allow | 31 | 1 | 0 | No | No |
| 18143706 | SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FOR PREPARING THE SAME | May 2023 | July 2025 | Allow | 26 | 0 | 0 | No | No |
| 18312782 | NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | May 2023 | June 2024 | Allow | 14 | 0 | 0 | No | No |
| 18312219 | INTEGRATED CIRCUIT DEVICE | May 2023 | March 2024 | Allow | 10 | 0 | 0 | No | No |
| 18309756 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | April 2023 | August 2024 | Allow | 15 | 1 | 0 | No | No |
| 18308643 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | April 2023 | August 2024 | Allow | 15 | 1 | 0 | No | No |
| 18139199 | SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP | April 2023 | October 2024 | Allow | 17 | 1 | 0 | No | No |
| 18306227 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | April 2023 | February 2024 | Allow | 10 | 0 | 0 | No | No |
| 18304335 | NON-VOLATILE MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | April 2023 | July 2024 | Allow | 15 | 1 | 0 | No | No |
| 18249890 | METHOD OF PREPARING PROGRAMMABLE DIODE, PROGRAMMABLE DIODE AND FERROELECTRIC MEMORY | April 2023 | October 2025 | Allow | 30 | 1 | 0 | No | No |
| 18302825 | POWER SEMICONDUCTOR MODULE | April 2023 | July 2025 | Allow | 26 | 0 | 0 | No | No |
| 18302960 | BACK-END-OF-LINE CMOS INVERTER HAVING TWIN CHANNELS AND ONE GATE ELECTRODE AND METHODS OF FORMING THE SAME | April 2023 | October 2025 | Allow | 30 | 0 | 0 | No | No |
| 18135758 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | April 2023 | June 2024 | Allow | 14 | 1 | 0 | No | No |
| 18302101 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | April 2023 | January 2024 | Allow | 9 | 0 | 0 | No | No |
| 18299281 | SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR | April 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18299043 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18193267 | RADIO FREQUENCY (RF) SWITCH WITH DRAIN/SOURCE CONTACTS | March 2023 | November 2025 | Allow | 31 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner HO, TU TU V.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 30.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner HO, TU TU V works in Art Unit 2818 and has examined 2,505 patent applications in our dataset. With an allowance rate of 94.9%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 16 months.
Examiner HO, TU TU V's allowance rate of 94.9% places them in the 84% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by HO, TU TU V receive 0.90 office actions before reaching final disposition. This places the examiner in the 7% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by HO, TU TU V is 16 months. This places the examiner in the 98% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +2.0% benefit to allowance rate for applications examined by HO, TU TU V. This interview benefit is in the 22% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 38.8% of applications are subsequently allowed. This success rate is in the 89% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 71.8% of cases where such amendments are filed. This entry rate is in the 93% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 150.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 89% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 90.9% of appeals filed. This is in the 83% percentile among all examiners. Of these withdrawals, 90.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 69.3% are granted (fully or in part). This grant rate is in the 76% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 11.4% of allowed cases (in the 94% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 13.8% of allowed cases (in the 91% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.