USPTO Group 2810 Prosecution Statistics

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18874035LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAMEMarch 2025June 2025Allow600NoNo
19063218DEVICE FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS) BASED ON ARRAY WATER JET-BASED EJECTIONFebruary 2025April 2025Allow200NoNo
19021887FABRICATION METHOD FOR PACKAGE STRUCTUREJanuary 2025March 2025Allow200NoNo
19004132SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTUREDecember 2024May 2025Allow510NoNo
18879209METHOD FOR CONTROLLING SURFACE CHARACTERISTICS AND THICKNESS OF MULTILAYER TRANSITION METAL DICHALCOGENIDE THIN FILMDecember 2024March 2025Allow300NoNo
19001454METHOD FOR PREPARING PEROVSKITE SOLAR CELL BY IN-SITU INJECTION OF SELF-ASSEMBLED MOLECULEDecember 2024March 2025Allow200NoNo
189915043D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY CELLSDecember 2024July 2025Allow610NoNo
18985575METHOD FOR MANUFACTURING AN OXRAM-TYPE RESISTIVE MEMORY CELL AND ASSOCIATED OXRAM-TYPE MEMORY CELLDecember 2024June 2025Allow500YesNo
18980888SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTUREDecember 2024April 2025Allow410NoNo
18981113SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTUREDecember 2024April 2025Allow410NoNo
18979543Semiconductor Structure and Manufacturing Method ThereofDecember 2024February 2025Allow200NoNo
18973101METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH TRANSISTORS AND MEMORY CELLSDecember 2024July 2025Allow710NoNo
18872218VERTICAL IGBT WITH COMPLEMENTARY CHANNEL FOR HOLE EXTRACTIONDecember 2024April 2025Allow400NoNo
189590333D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERSNovember 2024June 2025Allow700NoNo
18957406FORMATION OF AN ARRAY OF NANOSTRUCTURESNovember 2024April 2025Allow510YesNo
18866425MOSFET DEVICENovember 2024June 2025Allow700NoNo
18865498METHOD FOR TRANSFERRING A LAYER FROM A SOURCE SUBSTRATE TO A DESTINATION SUBSTRATENovember 2024May 2025Allow610NoNo
18943851ORGANIC COMPOUND AND OLED HAVING SAME AND ORGANICA LIGHT-EMITTING APPARATUSNovember 2024February 2025Allow300NoNo
189428863D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERSNovember 2024June 2025Allow700NoNo
18937369TRENCH GATE SILICON CARBIDE MOSFET DEVICE AND FABRICATION METHOD THEREOFNovember 2024December 2024Allow200NoNo
18934307Integrated Structure having a P-type Semiconductor Diffusion Barrier Layer Forming a Van Der Waals Junction with a P-type Substrate and Electronic Device Including the SameNovember 2024February 2025Allow400NoNo
18931868SEMICONDUCTOR STRUCTURE INTEGRATING LOGIC ELEMENT AND MEMORY ELEMENTOctober 2024January 2025Allow200NoNo
18860313ORGANIC COMPOUND, COMPOSITION, ORGANIC ELECTROLUMINESCENT DEVICE, AND ELECTRONIC APPARATUSOctober 2024February 2025Allow400NoNo
18922186BACK-GATE EFFECT CONTROL VIA DOPINGOctober 2024June 2025Allow710YesNo
18911535INTEGRATED POLYPHASE HYDROGEL AND PREPARATION METHOD AND APPLICATION THEREOF IN FLEXIBLE AND STRETCHABLE SUPERCAPACITOROctober 2024April 2025Allow601NoNo
18910873PROCESS TECHNIQUE FOR EMBEDDED MEMORYOctober 2024June 2025Allow812NoNo
18907921Advanced Low Electrostatic Field TransistorOctober 2024February 2025Allow500YesNo
18898465Transistors, Method for Making the Same, Electrostatic Discharge Protection Circuit, and Electronic DeviceSeptember 2024January 2025Allow410NoNo
18892142STRUCTURES AND METHODS FOR INTEGRATED COLD PLATE IN XPUS AND MEMORYSeptember 2024December 2024Allow300NoNo
18887821ELECTRICAL CONTACT CAVITY STRUCTURE AND METHODS OF FORMING THE SAMESeptember 2024February 2025Allow510YesNo
188290793D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY CELLSSeptember 2024January 2025Allow410NoNo
18823093Backside Integrated Voltage Regulator For Integrated CircuitsSeptember 2024November 2024Allow210NoNo
18822980DIFFUSION BARRIER FOR INTERCONNECTSSeptember 2024April 2025Allow710NoNo
18823309METHOD FOR MANUFACTURING A COLOUR-CONVERSION OPTOELECTRONIC DEVICE, INCLUDING A STEP OF POLARISING AN ELECTRET LAYER IN A LOCALISED MANNER BY MEANS OF THE UPPER ELECTRODES OF THE DIODESSeptember 2024February 2025Allow610NoNo
18816975STACKABLE AND EMBEDDABLE VERTICAL CAPACITORS IN SEMICONDUCTOR DEVICES AND METHOD OF FABRICATIONAugust 2024May 2025Allow902NoNo
18837220VOLTAGE-CONTROLLED THREE-TERMINAL MAGNON TRANSISTOR, AND CONTROL AND PREPARATION METHOD THEREOFAugust 2024March 2025Allow700NoNo
18792957FUSED RING CARBAZOLE TETRADENTATE METAL PLATINUM (II) COMPLEX AND USE THEREOFAugust 2024June 2025Allow1000NoNo
18792267THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICONAugust 2024May 2025Allow920YesNo
18792115EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAMEAugust 2024March 2025Allow810NoNo
18788835Light-Emitting Element, Display Device, Electronic Device, and Lighting DeviceJuly 2024September 2024Allow200NoNo
18786636MEMORY STRUCTURES AND METHODS OF FORMING THE SAMEJuly 2024March 2025Allow810NoNo
18785583SILICON CARBIDE SPLIT-GATE MOSFETS INTEGRATING HIGH-SPEED FREEWHEELING DIODES AND PREPARATION METHODS THEREOFJuly 2024February 2025Allow720NoNo
187790593D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHSJuly 2024June 2025Allow1000NoNo
18777737SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICESJuly 2024February 2025Allow700NoNo
18778322Integrated circuit packages having stress-relieving featuresJuly 2024November 2024Allow410NoNo
18729977HIGH-SPEED LAYOUT METHOD AND LAYOUT DEVICE FOR PHOTOVOLTAIC MODULESJuly 2024November 2024Allow400NoNo
18774563TRENCH MOS RECTIFIER WITH TERMINATION STRUCTUREJuly 2024December 2024Allow501YesNo
18774623ORGANIC ELECTROLUMINESCENCE ELEMENT AND ELECTRONIC DEVICEJuly 2024December 2024Allow500NoNo
18773010Semiconductor Package with Integrated CapacitorsJuly 2024April 2025Allow910NoNo
18770678MAGNETIC TUNNEL JUNCTION (MTJ) ELEMENT AND ITS FABRICATION PROCESSJuly 2024March 2025Allow800NoNo
18728862NITROGEN-CONTAINING COMPOUND, ELECTRONIC ELEMENT AND ELECTRONIC DEVICEJuly 2024February 2025Allow700NoNo
18769958Conductive Feature FormationJuly 2024March 2025Allow800NoNo
18769902HIGH-ELECTRON-MOBILITY TRANSISTORS WITH INACTIVE GATE BLOCKSJuly 2024September 2024Allow310NoNo
18770547NOVEL PHASE CHANGE RANDOM ACCESS MEMORY DEVICEJuly 2024April 2025Allow910NoNo
18769413METHOD FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS) USING SLIDING-ON-MEMBRANE PIN EJECTIONJuly 2024March 2025Allow811NoNo
18769404DEVICE AND METHOD FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS) BASED ON ARRAY WATER JET-BASED EJECTIONJuly 2024November 2024Allow401NoNo
18768561METHOD FOR FORMING SEMICONDUCTOR STRUCTUREJuly 2024May 2025Allow1000NoNo
18769187HYBRID INTEGRATED CIRCUIT PACKAGESJuly 2024March 2025Allow800NoNo
18766944DISPLAY DEVICEJuly 2024April 2025Allow910NoNo
18766867Semiconductor Transistor Devices Having Double-sided Interconnect StructuresJuly 2024June 2025Allow1110NoNo
18766644TRANSISTOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOFJuly 2024April 2025Allow900NoNo
18766596TRENCH ISOLATION STRUCTURES WITH VARYING DEPTHS AND METHOD OF FORMING THE SAMEJuly 2024December 2024Allow510NoNo
18764426THREE-STATE MEMORY DEVICEJuly 2024April 2025Allow1000YesNo
18764641LIGHT EMITTING ELEMENTJuly 2024June 2025Allow1110YesNo
18764971SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANCE AND METHOD FOR MANUFACTURING THE SAMEJuly 2024June 2025Allow1110NoNo
18764868SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFJuly 2024June 2025Allow1110NoNo
18763686SEMICONDUCTOR PACKAGEJuly 2024April 2025Allow1010NoNo
18763075SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS FOR MANUFACTURING THE SAMEJuly 2024March 2025Allow810NoNo
18762679SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOFJuly 2024January 2025Allow700NoNo
18762560Manufacturing Method for a Power MOSFET with Gate-Source ESD Diode StructureJuly 2024October 2024Allow310NoNo
18761373SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMINGJuly 2024June 2025Allow1110NoNo
18761377BOND PAD STRUCTURE FOR BONDING IMPROVEMENTJuly 2024January 2025Allow700NoNo
18761675DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH DEVICEJuly 2024June 2025Allow1110NoNo
18761779SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL SEMICONDUCTOR MATERIALJuly 2024May 2025Allow1001NoNo
18760829INCREASING SOURCE/DRAIN DOPANT CONCENTRATION TO REDUCED RESISTANCEJuly 2024March 2025Allow900YesNo
18761200SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAMEJuly 2024June 2025Allow1110NoNo
18760244Memory Arrays Comprising Strings Of Memory Cells With Conductive IslandsJuly 2024May 2025Allow1010NoNo
18760041TEMPERATURE SENSING AND COMPUTING DEVICE AND ARRAY BASED ON TaOx ELECTRONIC MEMRISTORJuly 2024February 2025Allow720NoNo
18758898SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTUREJune 2024June 2025Allow1110NoNo
18759611FORMING SEMICONDUCTOR STRUCTURES WITH TWO-DIMENSIONAL MATERIALSJune 2024May 2025Allow1010NoNo
18758386DISPLAY DEVICE WITH SLITS AND ISLAND-SHAPED PROTRUDING PORTIONS IN THE BENDING REGIONSJune 2024February 2025Allow700NoNo
18758926FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAMEJune 2024April 2025Allow900NoNo
18757558MANUFACTURING METHOD OF SEMICONDUCTOR DEVICEJune 2024March 2025Allow810NoNo
18757497ELECTRONIC DEVICE HAVING STACKED STRUCTURES AND METHOD FOR MANUFACTURING THE SAMEJune 2024May 2025Allow1110NoNo
18755693LAYOUT PATTERN OF MAGNETORESISTIVE RANDOM ACCESS MEMORYJune 2024March 2025Allow900NoNo
18756008METHOD AND STRUCTURE FOR BARRIER-LESS PLUGJune 2024February 2025Allow801NoNo
18756564HAND-WORN WORKWEAR UNIT FOR SCANNING BARCODESJune 2024August 2024Allow200NoNo
18756149ARRAY SUBSTRATE STRUCTUREJune 2024June 2025Allow1110YesNo
18754754DISPLAY DEVICE WITH TOUCH SENSING LAYERJune 2024April 2025Allow1010NoNo
18754448IMAGE SENSOR AND MANUFACTURING PROCESS THEREOFJune 2024March 2025Allow900NoNo
18755342MULTI-GATE DEVICE AND RELATED METHODSJune 2024March 2025Allow801NoNo
18755281MULTI-GATE DEVICE AND RELATED METHODSJune 2024January 2025Allow700NoNo
18755298FUSE CELL STRUCTUREJune 2024June 2025Allow1210NoNo
18753052CHIP STRUCTURE WITH CONDUCTIVE LAYERJune 2024May 2025Allow1010NoNo
18753892PACKAGING OF A SEMICONDUCTOR DEVICE WITH A PLURALITY OF LEADSJune 2024May 2025Allow1010NoNo
18752866MAGNETIC MEMORY DEVICE INCLUDING MAGNETIC TUNNEL JUNCTION PATTERNS WITH NON-UNIFORM WIDTHSJune 2024June 2025Allow1111YesNo
18752381SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOFJune 2024March 2025Allow910NoNo
18752112Self-Aligned Metal Gate for Multigate DeviceJune 2024May 2025Allow1110NoNo
18751724CHIP PACKAGE STRUCTURE WITH LIDJune 2024May 2025Allow1010NoNo
18751953SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTUREJune 2024January 2025Allow700NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for group 2810.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
1075
Examiner Affirmed
728
(67.7%)
Examiner Reversed
347
(32.3%)
Reversal Percentile
42.9%
Lower than average

What This Means

With a 32.3% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.

Strategic Value of Filing an Appeal

Total Appeal Filings
4854
Allowed After Appeal Filing
1763
(36.3%)
Not Allowed After Appeal Filing
3091
(63.7%)
Filing Benefit Percentile
72.2%
Higher than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 36.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.

Strategic Recommendations

Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.

Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.

Group 2810 - Prosecution Statistics Summary

Executive Summary

Group 2810 is part of Technology Center 2800. This group has examined 154,276 patent applications in our dataset, with an overall allowance rate of 85.0%. Applications typically reach final disposition in approximately 22 months.

Prosecution Patterns

Applications in Group 2810 receive an average of 1.48 office actions before reaching final disposition. The median prosecution time is 22 months.

Strategic Overview

This group-level data aggregates statistics across multiple art units. For more targeted prosecution strategies, review the individual art unit and examiner statistics within this group.

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.