Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18792115 | EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME | August 2024 | March 2025 | Allow | 8 | 1 | 0 | No | No |
| 18678213 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME | May 2024 | May 2025 | Allow | 12 | 0 | 0 | No | No |
| 18597502 | DISPLAY PANEL AND DISPLAY DEVICE | March 2024 | February 2025 | Allow | 11 | 1 | 0 | No | No |
| 18584241 | PREPARATION METHOD OF DISPLAY PANEL, DISPLAY PANEL AND DISPLAYING DEVICE | February 2024 | April 2025 | Allow | 13 | 1 | 0 | No | No |
| 18443906 | DUAL ZONE HEATERS FOR METALLIC PEDESTALS | February 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18438575 | FORMING METAL CONTACTS ON METAL GATES | February 2024 | February 2025 | Allow | 13 | 0 | 0 | No | No |
| 18401099 | CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS | December 2023 | January 2025 | Allow | 13 | 1 | 0 | No | No |
| 18521610 | Heterogeneous Dielectric Bonding Scheme | November 2023 | March 2025 | Allow | 15 | 0 | 0 | No | No |
| 18507721 | FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS | November 2023 | April 2025 | Allow | 17 | 1 | 0 | No | No |
| 18501939 | DRIVE CIRCUIT SUBSTRATE, LED DISPLAY PANEL AND METHOD OF FORMING THE SAME, AND DISPLAY DEVICE | November 2023 | November 2024 | Allow | 12 | 0 | 0 | No | No |
| 18480310 | SEMICONDUCTOR PACKAGE | October 2023 | November 2024 | Allow | 13 | 0 | 0 | No | No |
| 18368882 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | September 2023 | March 2025 | Allow | 18 | 1 | 0 | No | No |
| 18451388 | BONDED STRUCTURE WITH INTERCONNECT STRUCTURE | August 2023 | April 2025 | Allow | 20 | 2 | 0 | Yes | No |
| 18359890 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18357814 | SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18355463 | OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18354792 | SEMICONDUCTOR DEVICE INCLUDING A STRUCTURE FOR HIGHER INTERGRATION | July 2023 | September 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18014272 | BONDING MEMBER FOR SEMICONDUCTOR DEVICE | July 2023 | July 2024 | Allow | 18 | 0 | 0 | No | No |
| 18353019 | RELIABLE HYBRID BONDED APPARATUS | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18214216 | THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE | June 2023 | July 2024 | Allow | 13 | 1 | 0 | No | No |
| 18341052 | CHIP PACKAGE STRUCTURE WITH NICKEL LAYER | June 2023 | June 2024 | Allow | 12 | 1 | 0 | No | No |
| 18340832 | Semiconductor Package Including Test Pad and Bonding Pad Structure for Die Connection and Methods for Forming the Same | June 2023 | May 2024 | Allow | 11 | 1 | 0 | No | No |
| 18335413 | DAISY-CHAIN SEAL RING STRUCTURE | June 2023 | August 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18200580 | SEMICONDUCTOR STRUCTURE | May 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18142410 | HYBRID SYSTEM INCLUDING PHOTONIC AND ELECTRONIC INTEGRATED CIRCUITS AND COOLING PLATE | May 2023 | May 2024 | Allow | 13 | 1 | 0 | Yes | No |
| 18302428 | Dummy Fin Structures and Methods of Forming Same | April 2023 | July 2024 | Allow | 15 | 1 | 0 | No | No |
| 18194792 | Semiconductor Package and Method for Manufacturing the Same | April 2023 | May 2024 | Allow | 13 | 1 | 0 | No | No |
| 18126205 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | March 2023 | November 2023 | Allow | 8 | 1 | 0 | No | No |
| 18179056 | INTEGRATED CIRCUIT DEVICE | March 2023 | July 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 18162671 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | January 2023 | May 2024 | Allow | 16 | 1 | 0 | No | No |
| 18087819 | PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS OF USING THE SAME | December 2022 | May 2024 | Allow | 17 | 1 | 0 | No | No |
| 18067117 | Forming Metal Contacts on Metal Gates | December 2022 | October 2023 | Allow | 10 | 0 | 0 | Yes | No |
| 18073574 | MAGNETIC TUNNEL JUNCTION (MTJ) DEVICE AND FORMING METHOD THEREOF | December 2022 | January 2024 | Allow | 13 | 1 | 0 | No | No |
| 17982713 | SEMICONDUCTOR DEVICES AND RELATED METHODS | November 2022 | December 2023 | Allow | 13 | 1 | 0 | No | No |
| 17980568 | SEMICONDUCTOR STRUCTURE | November 2022 | May 2025 | Allow | 30 | 0 | 0 | No | No |
| 18048825 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | October 2022 | January 2024 | Allow | 15 | 1 | 0 | No | No |
| 17969694 | INTEGRATED CIRCUITS | October 2022 | February 2025 | Allow | 28 | 1 | 0 | No | No |
| 17966864 | SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER | October 2022 | January 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 17932401 | METHODS OF FORMING STACKED SEMICONDUCTORS DIE ASSEMBLIES | September 2022 | November 2023 | Allow | 14 | 1 | 0 | Yes | No |
| 17943215 | SEMICONDUCTOR STRUCTURE | September 2022 | April 2023 | Allow | 7 | 1 | 0 | No | No |
| 17930988 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | September 2022 | April 2025 | Allow | 32 | 0 | 0 | No | No |
| 17903060 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME | September 2022 | April 2025 | Allow | 31 | 0 | 0 | No | No |
| 17929790 | BONDING STRUCTURE USING TWO OXIDE LAYERS WITH DIFFERENT STRESS LEVELS, AND RELATED METHOD | September 2022 | March 2025 | Allow | 31 | 0 | 0 | No | No |
| 17898330 | PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS | August 2022 | February 2025 | Allow | 30 | 0 | 0 | No | No |
| 17898356 | EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS | August 2022 | March 2025 | Allow | 31 | 0 | 0 | No | No |
| 17895321 | Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus | August 2022 | March 2025 | Allow | 31 | 0 | 0 | No | No |
| 17893218 | SEMICONDUCTOR STRUCTURE, METHOD FOR FORMING SAME, AND WAFER ON WAFER BONDING METHOD | August 2022 | March 2025 | Allow | 30 | 1 | 0 | No | No |
| 17890262 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | August 2022 | May 2025 | Allow | 33 | 1 | 0 | No | No |
| 17888906 | SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES | August 2022 | August 2023 | Allow | 12 | 1 | 0 | No | No |
| 17888771 | BONDING APPARATUS AND METHOD OF CONTROLLING THE SAME | August 2022 | June 2025 | Allow | 34 | 1 | 0 | No | No |
| 17819639 | INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY | August 2022 | December 2024 | Allow | 28 | 0 | 0 | No | No |
| 17884524 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | August 2022 | June 2023 | Allow | 10 | 1 | 0 | No | No |
| 17883595 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | August 2022 | February 2025 | Allow | 30 | 1 | 0 | No | No |
| 17881739 | SEAL RING FOR HYBRID-BOND | August 2022 | April 2023 | Allow | 9 | 1 | 0 | No | No |
| 17876376 | EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS | July 2022 | October 2024 | Allow | 26 | 1 | 0 | Yes | No |
| 17876176 | SHIFTED VIA-CHAIN ELECTRICAL-TEST MEASUREMENTS FOR HYBRID BONDING ALIGNMENT CORRELATION | July 2022 | February 2025 | Allow | 31 | 0 | 0 | No | No |
| 17875034 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | July 2022 | April 2023 | Allow | 8 | 1 | 0 | No | No |
| 17874332 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | July 2022 | January 2025 | Allow | 30 | 1 | 0 | No | No |
| 17794719 | SEMICONDUCTOR PHOTOMULTIPLIER MODULE COMPRISING A STACKED CONFIGURATION OF A SENSOR CHIP AND ELECTRONIC READOUT CHIPS | July 2022 | February 2025 | Allow | 31 | 0 | 0 | No | No |
| 17867804 | Transistor Gate Structures and Methods of Forming the Same | July 2022 | May 2025 | Allow | 34 | 1 | 0 | No | No |
| 17866209 | CONNECTOR AND METHOD FOR FORMING THE SAME | July 2022 | January 2025 | Allow | 30 | 0 | 0 | No | No |
| 17863400 | PACKAGING METHOD AND PACKAGE STRUCTURE | July 2022 | November 2024 | Allow | 28 | 0 | 0 | No | No |
| 17863648 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | July 2022 | April 2025 | Allow | 33 | 1 | 0 | No | No |
| 17811649 | INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND SEMICONDUCTOR DEVICE USING THE SAME | July 2022 | April 2023 | Allow | 9 | 1 | 0 | No | No |
| 17861556 | Thermal Structure for Semiconductor Device and Method of Forming the Same | July 2022 | December 2024 | Allow | 29 | 0 | 0 | No | No |
| 17841510 | STEP-STACKED NANOWIRE CMOS STRUCTURE FOR LOW POWER LOGIC DEVICE AND METHOD OF MANUFACTURING THE SAME | June 2022 | January 2025 | Allow | 31 | 1 | 0 | No | No |
| 17840081 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING HYBRID BONDING PAD | June 2022 | January 2025 | Allow | 31 | 1 | 0 | No | No |
| 17839386 | METHOD AND APPARATUS FOR USE IN IMPROVING LINEARITY OF MOSFETS USING AN ACCUMULATED CHARGE SINK | June 2022 | December 2023 | Allow | 18 | 1 | 0 | No | No |
| 17805818 | MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE DEVICE STACKS AND RELATED METHODS | June 2022 | March 2023 | Allow | 9 | 1 | 0 | Yes | No |
| 17827219 | SEMICONDUCTOR STRUCTURE WITH HYBRID NANOSTRUCTURES | May 2022 | May 2023 | Allow | 12 | 1 | 1 | No | No |
| 17824787 | Polarizer-Free Displays | May 2022 | January 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 17756244 | METHOD FOR FORMING A HANDLING SUBSTRATE FOR A COMPOSITE STRUCTURE INTENDED FOR RF APPLICATIONS AND HANDLING SUBSTRATE | May 2022 | May 2025 | Allow | 36 | 1 | 0 | No | No |
| 17733939 | TRANSISTOR INCLUDING A DISCONTINUOUS BARRIER LAYER | April 2022 | June 2025 | Allow | 38 | 1 | 1 | No | No |
| 17661152 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | April 2022 | January 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 17724755 | Indium Gallium Nitride (inGaN) Relaxed Templates Employed as a Substrate for Nitride-Based Devices and Related Methods | April 2022 | April 2025 | Allow | 36 | 1 | 0 | No | No |
| 17659350 | METHODS OF FORMING THERMALLY STABLE CARBON FILM | April 2022 | March 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17768863 | DISPLAY DEVICE | April 2022 | September 2024 | Allow | 29 | 0 | 0 | No | No |
| 17717520 | CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER | April 2022 | March 2023 | Allow | 11 | 1 | 0 | No | No |
| 17717249 | MICRO-LIGHT-EMITTING DIODE DISPLAY PANEL | April 2022 | July 2024 | Allow | 27 | 0 | 0 | No | No |
| 17766319 | VERTICAL FIELD-EFFECT TRANSISTOR AND METHOD FOR FORMING SAME | April 2022 | September 2024 | Allow | 30 | 1 | 0 | No | No |
| 17708716 | DIRECT BONDING AND DEBONDING OF CARRIER | March 2022 | May 2025 | Allow | 38 | 1 | 0 | No | No |
| 17706879 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | March 2022 | June 2024 | Allow | 27 | 0 | 0 | No | No |
| 17764187 | METHOD OF MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND MOBILE TERMINAL | March 2022 | December 2024 | Allow | 33 | 1 | 0 | No | No |
| 17696357 | OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER | March 2022 | April 2023 | Allow | 13 | 1 | 0 | Yes | No |
| 17694035 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | March 2022 | November 2022 | Allow | 8 | 0 | 0 | No | No |
| 17642046 | DEVICE AND METHOD FOR JOINING SUBSTRATES | March 2022 | June 2024 | Allow | 27 | 1 | 0 | No | No |
| 17690964 | ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS | March 2022 | March 2023 | Allow | 12 | 1 | 0 | No | No |
| 17689419 | SEMICONDUCTOR DEVICES INCLUDING SUBSTRATES BONDED TO EACH OTHER AND METHODS FOR FABRICATING THE SAME | March 2022 | December 2024 | Allow | 34 | 1 | 0 | No | No |
| 17685886 | POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | March 2022 | September 2024 | Allow | 31 | 1 | 0 | Yes | No |
| 17684473 | METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION FILMS | March 2022 | April 2025 | Allow | 38 | 1 | 0 | No | No |
| 17680477 | DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME | February 2022 | February 2023 | Allow | 11 | 1 | 0 | No | No |
| 17679010 | MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS | February 2022 | May 2025 | Allow | 38 | 1 | 0 | No | No |
| 17676866 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | February 2022 | June 2024 | Allow | 28 | 0 | 0 | No | No |
| 17674751 | ORGANIC PHOTODETECTOR AND ELECTRONIC DEVICE INCLUDING THE SAME | February 2022 | September 2024 | Allow | 31 | 0 | 0 | No | No |
| 17636030 | PIXEL STRUCTURE, DRIVING METHOD THEREOF, DISPLAY PANEL, AND DISPLAY APPARATUS | February 2022 | May 2024 | Allow | 27 | 0 | 0 | No | No |
| 17669236 | TECHNOLOGIES FOR PLASMA OXIDATION PROTECTION DURING HYBRID BONDING OF SEMICONDUCTOR DEVICES | February 2022 | September 2024 | Allow | 31 | 1 | 0 | No | No |
| 17634081 | CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD | February 2022 | September 2023 | Allow | 19 | 1 | 0 | No | No |
| 17591429 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | February 2022 | June 2024 | Allow | 29 | 1 | 0 | No | No |
| 17630766 | INTEGRATED SEMICONDUCTOR DEVICE | January 2022 | May 2024 | Allow | 28 | 0 | 0 | No | No |
| 17586723 | METHOD FOR BONDING SEMICONDUCTOR DEVICES, METHOD FOR FORMING SEMICONDUCTOR STRUCTURE AND SYSTEM FOR PERFORMING THE METHOD | January 2022 | October 2023 | Allow | 20 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner NGUYEN, NIKI HOANG.
With a 50.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 26.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner NGUYEN, NIKI HOANG works in Art Unit 2818 and has examined 1,231 patent applications in our dataset. With an allowance rate of 92.4%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 19 months.
Examiner NGUYEN, NIKI HOANG's allowance rate of 92.4% places them in the 78% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by NGUYEN, NIKI HOANG receive 1.08 office actions before reaching final disposition. This places the examiner in the 15% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by NGUYEN, NIKI HOANG is 19 months. This places the examiner in the 92% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +5.6% benefit to allowance rate for applications examined by NGUYEN, NIKI HOANG. This interview benefit is in the 31% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 28.6% of applications are subsequently allowed. This success rate is in the 43% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 48.2% of cases where such amendments are filed. This entry rate is in the 67% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 138.5% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 87% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 88.9% of appeals filed. This is in the 80% percentile among all examiners. Of these withdrawals, 68.8% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 25.5% are granted (fully or in part). This grant rate is in the 16% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 6.2% of allowed cases (in the 91% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 4.9% of allowed cases (in the 79% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.