Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18942886 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | November 2024 | June 2025 | Allow | 7 | 0 | 0 | No | No |
| 18931868 | SEMICONDUCTOR STRUCTURE INTEGRATING LOGIC ELEMENT AND MEMORY ELEMENT | October 2024 | January 2025 | Allow | 2 | 0 | 0 | No | No |
| 18892142 | STRUCTURES AND METHODS FOR INTEGRATED COLD PLATE IN XPUS AND MEMORY | September 2024 | December 2024 | Allow | 3 | 0 | 0 | No | No |
| 18738441 | LIGHT EMITTING SUBSTRATE, WIRING SUBSTRATE AND DISPLAY DEVICE | June 2024 | February 2025 | Allow | 8 | 0 | 0 | No | No |
| 18679945 | DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE | May 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18668221 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | May 2024 | October 2024 | Allow | 5 | 0 | 0 | No | No |
| 18635894 | ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18624411 | Integrated Circuit Package For High Bandwidth Memory | April 2024 | January 2025 | Allow | 10 | 0 | 0 | No | No |
| 18620591 | VERTICAL INTERCONNECT STRUCTURES IN THREE-DIMENSIONAL INTEGRATED CIRCUITS | March 2024 | November 2024 | Allow | 8 | 0 | 0 | No | No |
| 18604695 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | March 2024 | May 2024 | Allow | 2 | 0 | 0 | No | No |
| 18605573 | SEMICONDUCTOR PACKAGE HAVING PADS WITH STEPPED STRUCTURE | March 2024 | November 2024 | Allow | 8 | 0 | 0 | No | No |
| 18439743 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | February 2024 | April 2025 | Allow | 14 | 1 | 0 | No | No |
| 18403866 | SINGLE CRYSTALLINE SILICON STACK FORMATION AND BONDING TO A CMOS WAFER | January 2024 | October 2024 | Allow | 9 | 0 | 0 | No | No |
| 18395546 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | December 2023 | February 2024 | Allow | 2 | 0 | 0 | No | No |
| 18542230 | POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES | December 2023 | January 2025 | Allow | 13 | 1 | 0 | No | No |
| 18518706 | SHARED WELL STRUCTURE MANUFACTURING METHOD | November 2023 | December 2024 | Allow | 13 | 0 | 0 | No | No |
| 18518466 | SEMICONDUCTOR PACKAGE | November 2023 | March 2025 | Allow | 15 | 0 | 0 | No | No |
| 18481865 | Organic Light Emitting Display Device and Lighting Apparatus for Vehicles Using the Same | October 2023 | July 2024 | Allow | 9 | 0 | 0 | No | No |
| 18481869 | Organic Light Emitting Display Device and Lighting Apparatus for Vehicles Using the Same | October 2023 | September 2024 | Allow | 11 | 1 | 0 | No | No |
| 18481862 | Organic Light Emitting Display Device and Lighting Apparatus for Vehicles Using the Same | October 2023 | April 2025 | Allow | 19 | 1 | 0 | No | No |
| 18374576 | HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS | September 2023 | June 2024 | Allow | 9 | 0 | 0 | No | No |
| 18368987 | SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS | September 2023 | May 2024 | Allow | 8 | 0 | 0 | No | No |
| 18236325 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | August 2023 | November 2023 | Allow | 3 | 0 | 0 | No | No |
| 18235079 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | August 2023 | January 2025 | Allow | 17 | 1 | 1 | No | No |
| 18366481 | COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE | August 2023 | December 2024 | Allow | 16 | 0 | 0 | No | No |
| 18229139 | THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PASSIVE DEVICE AND METHODS OF MAKING THE SAME | August 2023 | May 2024 | Allow | 10 | 0 | 0 | No | No |
| 18362957 | SEMICONDUCTOR DEVICE HAVING MORE SIMILAR CELL DENSITIES IN ALTERNATING ROWS | July 2023 | April 2024 | Allow | 8 | 0 | 0 | No | No |
| 18226129 | LOW COST PACKAGE WARPAGE SOLUTION | July 2023 | August 2024 | Allow | 13 | 0 | 1 | No | No |
| 18224794 | HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS | July 2023 | April 2024 | Allow | 9 | 0 | 0 | No | No |
| 18355906 | PSPI-based Patterning Method for RDL | July 2023 | March 2025 | Allow | 20 | 1 | 0 | No | No |
| 18355470 | CRACK STOP RING TRENCH TO PREVENT EPITAXY CRACK PROPAGATION | July 2023 | May 2024 | Allow | 10 | 0 | 0 | No | No |
| 18353307 | SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT | July 2023 | April 2025 | Allow | 21 | 1 | 0 | No | No |
| 18343687 | FERROELECTRIC MFM INDUCTOR AND RELATED CIRCUITS | June 2023 | March 2025 | Allow | 20 | 1 | 1 | No | No |
| 18214524 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | June 2023 | August 2023 | Allow | 1 | 0 | 0 | No | No |
| 18340881 | CHIP STACKING AND PACKAGING STRUCTURE | June 2023 | November 2023 | Allow | 4 | 0 | 0 | No | No |
| 18340680 | THREE-DIMENSIONAL DEVICE COOLING | June 2023 | April 2025 | Allow | 21 | 1 | 1 | No | No |
| 18337320 | FLEXIBLE DISPLAY APPARATUS | June 2023 | March 2024 | Allow | 9 | 0 | 0 | No | No |
| 18334390 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | June 2023 | August 2024 | Allow | 15 | 0 | 1 | No | No |
| 18205916 | THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS | June 2023 | February 2025 | Allow | 20 | 1 | 1 | No | No |
| 18327076 | PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF | June 2023 | August 2024 | Allow | 14 | 0 | 1 | No | No |
| 18325104 | PACKAGE AND MANUFACTURING METHOD THEREOF | May 2023 | December 2024 | Allow | 18 | 1 | 1 | No | No |
| 18313826 | SLT Integrated Circuit Capacitor Structure and Methods | May 2023 | April 2024 | Allow | 11 | 0 | 0 | No | No |
| 18312877 | Semiconductor Device and Method of Manufacture | May 2023 | December 2023 | Allow | 8 | 0 | 0 | No | No |
| 18313012 | Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof | May 2023 | July 2024 | Allow | 15 | 1 | 0 | No | No |
| 18311434 | SEMICONDUCTOR DIE WITH WARPAGE RELEASE LAYER STRUCTURE IN PACKAGE AND FABRICATING METHOD THEREOF | May 2023 | December 2024 | Allow | 19 | 1 | 1 | No | No |
| 18141415 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | April 2023 | June 2023 | Allow | 2 | 0 | 0 | No | No |
| 18301817 | DIE TO DIE INTERFACE CIRCUIT | April 2023 | June 2024 | Allow | 14 | 0 | 1 | No | No |
| 18133463 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | April 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18297293 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | April 2023 | May 2024 | Allow | 13 | 0 | 0 | No | No |
| 18190936 | SEMICONDUCTOR AND CIRCUIT STRUCTURES, AND RELATED METHODS | March 2023 | December 2024 | Allow | 20 | 1 | 1 | No | No |
| 18123876 | SEMICONDUCTOR ASSEMBLIES INCLUDING COMBINATION MEMORY AND METHODS OF MANUFACTURING THE SAME | March 2023 | April 2025 | Allow | 25 | 1 | 0 | No | No |
| 18182489 | SRAM Circuits with Aligned Gate Electrodes | March 2023 | March 2024 | Allow | 12 | 0 | 0 | No | No |
| 18110446 | PACKAGE STRUCTURES HAVING UNDERFILLS | February 2023 | November 2023 | Allow | 9 | 0 | 0 | No | No |
| 18109120 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | February 2023 | August 2024 | Allow | 18 | 1 | 0 | No | No |
| 18106911 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND LIGHTING APPARATUS FOR VEHICLES USING THE SAME | February 2023 | September 2024 | Allow | 20 | 0 | 0 | No | No |
| 18105826 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | February 2023 | April 2023 | Allow | 2 | 0 | 0 | No | No |
| 18094861 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | January 2023 | November 2023 | Allow | 11 | 0 | 0 | No | No |
| 18151029 | SEMICONDUCTOR DEVICES WITH REINFORCED SUBSTRATES | January 2023 | September 2024 | Allow | 21 | 1 | 0 | Yes | No |
| 18092994 | SEMICONDUCTOR PACKAGE HAVING PADS WITH STEPPED STRUCTURE | January 2023 | December 2023 | Allow | 11 | 0 | 0 | No | No |
| 18090273 | DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE COMPONENTS | December 2022 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18003364 | WAFER LEVEL INTEGRATION OF TRANSUCER ELEMENTS, TECHNIQUES AND IMPLEMENTATIONS | December 2022 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18088478 | ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS | December 2022 | February 2024 | Allow | 14 | 0 | 1 | No | No |
| 18060216 | IMAGING UNIT, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | November 2022 | September 2024 | Allow | 21 | 1 | 0 | No | No |
| 17989196 | MANUFACTURING A MODULE WITH SOLDER BODY HAVING ELEVATED EDGE | November 2022 | November 2023 | Allow | 12 | 0 | 0 | No | No |
| 18055763 | METHOD OF PRODUCING HYBRID SEMICONDUCTOR WAFER | November 2022 | April 2025 | Allow | 29 | 0 | 0 | No | No |
| 18055139 | PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES | November 2022 | March 2024 | Allow | 16 | 0 | 0 | No | No |
| 17986831 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | November 2022 | January 2023 | Allow | 2 | 0 | 0 | No | No |
| 17984259 | PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER | November 2022 | February 2024 | Allow | 15 | 0 | 1 | No | No |
| 17980656 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | November 2022 | January 2024 | Allow | 14 | 0 | 1 | No | No |
| 17978225 | INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF PACKAGE STRUCTURE | November 2022 | June 2024 | Allow | 20 | 1 | 0 | No | No |
| 17973731 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM | October 2022 | April 2025 | Allow | 30 | 0 | 0 | No | No |
| 17970237 | Integrated Circuit Package For High Bandwidth Memory | October 2022 | January 2024 | Allow | 15 | 0 | 1 | No | No |
| 17938665 | PACKAGE SUBSTRATES AND SEMICONDUCTOR PACKAGES HAVING THE SAME | October 2022 | April 2025 | Allow | 31 | 0 | 0 | No | No |
| 17956766 | GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION | September 2022 | September 2023 | Allow | 11 | 0 | 0 | No | No |
| 17936640 | PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | September 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17935886 | AMINE-BASED CURING AGENTS, AND COMPOSITIONS, SEMICONDUCTOR PACKAGES, AND ELECTRONIC DEVICES INCLUDING THE SAME | September 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17952249 | Field Programmable Multichip Package Based on Field-Programmable-Gate-Array (FPGA) Integrated-Circuit (IC) Chip | September 2022 | April 2025 | Allow | 31 | 0 | 0 | No | No |
| 17934676 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METHOD OF MAKING THE SAME | September 2022 | May 2025 | Allow | 32 | 0 | 1 | No | No |
| 17951841 | SEMICONDUCTOR MEMORY DEVICE | September 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17940125 | SEMICONDUCTOR CHIP PACKAGE AND METHOD OF ASSEMBLY | September 2022 | December 2023 | Allow | 15 | 0 | 0 | No | No |
| 17940939 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | September 2022 | April 2025 | Allow | 31 | 0 | 0 | No | No |
| 17902641 | THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME | September 2022 | September 2023 | Allow | 13 | 0 | 0 | No | No |
| 17901448 | SEMICONDUCTOR DEVICE, WAFER, AND WAFER MANUFACTURING METHOD | September 2022 | June 2025 | Allow | 33 | 0 | 1 | No | No |
| 17898883 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | August 2022 | June 2025 | Allow | 34 | 0 | 1 | No | No |
| 17822844 | POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES | August 2022 | August 2023 | Allow | 11 | 0 | 0 | No | No |
| 17893033 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | August 2022 | October 2023 | Allow | 13 | 0 | 0 | No | No |
| 17799807 | STRETCHABLE DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | August 2022 | February 2025 | Allow | 30 | 0 | 0 | No | No |
| 17882607 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | August 2022 | October 2022 | Allow | 2 | 0 | 0 | No | No |
| 17874308 | SEMICONDUCTOR PACKAGE | July 2022 | September 2023 | Allow | 14 | 0 | 0 | No | No |
| 17874030 | PACKAGE STRUCTURE | July 2022 | November 2023 | Allow | 16 | 0 | 0 | No | No |
| 17865272 | METHOD OF FORMING SEMICONDUCTOR DEVICE HAVING MORE SIMILAR CELL DENSITIES IN ALTERNATING ROWS | July 2022 | June 2023 | Allow | 11 | 0 | 0 | No | No |
| 17863127 | SEMICONDUCTOR DEVICES | July 2022 | June 2023 | Allow | 11 | 0 | 0 | No | No |
| 17848815 | 3D IC COMPRISING SEMICONDUCTOR SUBSTRATES WITH DIFFERENT BANDGAPS | June 2022 | April 2025 | Allow | 33 | 1 | 0 | No | No |
| 17848378 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | June 2022 | June 2023 | Allow | 11 | 0 | 0 | No | No |
| 17846720 | MODULES WITH INTEGRATED CIRCUITS AND DEVICES | June 2022 | September 2023 | Allow | 15 | 0 | 0 | No | No |
| 17806895 | BASE STRUCTURES FOR MICROELECTRONIC DEVICES | June 2022 | October 2023 | Allow | 16 | 1 | 0 | No | No |
| 17804110 | SEMICONDUCTOR PACKAGE | May 2022 | June 2023 | Allow | 12 | 0 | 0 | No | No |
| 17824620 | METHODS OF MANUFACTURING LIGHT-EMITTING DEVICES WITH METAL INLAYS AND BOTTOM CONTACTS | May 2022 | March 2024 | Allow | 22 | 1 | 0 | No | No |
| 17750338 | A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS | May 2022 | August 2022 | Allow | 2 | 0 | 0 | No | No |
| 17749282 | SINGLE CRYSTALLINE SILICON STACK FORMATION AND BONDING TO A CMOS WAFER | May 2022 | August 2023 | Allow | 15 | 0 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner LE, THAO P.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 88.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner LE, THAO P works in Art Unit 2818 and has examined 2,115 patent applications in our dataset. With an allowance rate of 95.0%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 16 months.
Examiner LE, THAO P's allowance rate of 95.0% places them in the 85% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by LE, THAO P receive 0.73 office actions before reaching final disposition. This places the examiner in the 6% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by LE, THAO P is 16 months. This places the examiner in the 98% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +1.8% benefit to allowance rate for applications examined by LE, THAO P. This interview benefit is in the 18% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 36.8% of applications are subsequently allowed. This success rate is in the 80% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 64.5% of cases where such amendments are filed. This entry rate is in the 86% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 133.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 85% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 91% percentile among all examiners. Of these withdrawals, 33.3% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 40.6% are granted (fully or in part). This grant rate is in the 41% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 10.2% of allowed cases (in the 96% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 9.5% of allowed cases (in the 87% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.