Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18735408 | SEMICONDUCTOR PACKAGE | June 2024 | October 2025 | Allow | 16 | 1 | 1 | Yes | No |
| 18674329 | POWER STORAGE PACK, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | May 2024 | August 2024 | Allow | 3 | 0 | 1 | No | No |
| 18582494 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | February 2024 | May 2025 | Allow | 15 | 0 | 1 | No | No |
| 18407264 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | January 2024 | April 2025 | Allow | 15 | 1 | 1 | Yes | No |
| 18404686 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | January 2024 | June 2025 | Allow | 17 | 2 | 1 | No | No |
| 18521697 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | November 2023 | May 2025 | Allow | 18 | 2 | 1 | No | No |
| 18504473 | SEMICONDUCTOR DEVICE | November 2023 | August 2025 | Allow | 21 | 1 | 0 | No | No |
| 18485735 | Antenna Package with Via Structure and Method of Formation Thereof | October 2023 | January 2025 | Allow | 15 | 1 | 0 | No | No |
| 18369684 | INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | September 2023 | March 2025 | Allow | 18 | 1 | 1 | Yes | No |
| 18244556 | ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME | September 2023 | December 2024 | Allow | 16 | 0 | 1 | No | No |
| 18232520 | SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE | August 2023 | July 2025 | Allow | 23 | 2 | 1 | No | No |
| 18363763 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | August 2023 | February 2025 | Allow | 18 | 1 | 0 | No | No |
| 18362153 | Semiconductor Device and Method of Manufacturing | July 2023 | September 2025 | Allow | 26 | 2 | 0 | No | No |
| 18360484 | HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS | July 2023 | May 2025 | Allow | 22 | 2 | 1 | No | No |
| 18261547 | SEMICONDUCTOR PACKAGE | July 2023 | February 2026 | Allow | 32 | 0 | 1 | No | No |
| 18348770 | SEMICONDUCTOR MODULE | July 2023 | July 2025 | Allow | 25 | 2 | 0 | No | No |
| 18335291 | EXPOSED BONDING PAD OF CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | June 2023 | November 2025 | Allow | 29 | 0 | 0 | No | No |
| 18210291 | ELECTRONIC COMPONENT PACKAGE | June 2023 | October 2024 | Allow | 16 | 1 | 0 | No | No |
| 18204721 | Power Diode and Method of Manufacturing a Power Diode | June 2023 | September 2024 | Allow | 16 | 1 | 0 | No | No |
| 18201145 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | May 2023 | January 2025 | Allow | 20 | 2 | 1 | No | No |
| 18318729 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | May 2023 | September 2024 | Allow | 16 | 1 | 1 | No | No |
| 18196164 | Low Parasitic Inductance Power Module Featuring Staggered, interleaving Conductive Members | May 2023 | February 2026 | Allow | 33 | 0 | 1 | No | No |
| 18300306 | TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS | April 2023 | December 2025 | Allow | 32 | 3 | 1 | No | No |
| 18131998 | INTEGRATING INPUT AND OUTPUT CAPACITANCE WITH HIGH FREQUENCY SHUNT CAPACITANCE ON A SINGLE ADDITIVELY MANUFACTURED SUBSTRATE | April 2023 | January 2026 | Allow | 34 | 1 | 0 | No | No |
| 18296778 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME | April 2023 | June 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 18295176 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | April 2023 | August 2024 | Allow | 16 | 1 | 1 | No | No |
| 18185909 | DISPLAY DEVICE AND DISPLAY SYSTEM | March 2023 | June 2024 | Allow | 15 | 0 | 1 | No | No |
| 18179042 | Pad Design For Reliability Enhancement in Packages | March 2023 | November 2025 | Allow | 32 | 3 | 1 | No | No |
| 18169327 | SEMICONDUCTOR DEVICE INCLUDING INSULATING LAYERS AND METHOD OF MANUFACTURING THE SAME | February 2023 | February 2025 | Allow | 24 | 2 | 1 | Yes | No |
| 18166985 | LIGHT EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME | February 2023 | June 2024 | Allow | 16 | 1 | 0 | No | No |
| 18106405 | Low Parasitic Inductance Power Module Having Staggered, Interleaving Conductive Busbars | February 2023 | January 2026 | Allow | 35 | 0 | 1 | No | No |
| 18163966 | DISPLAY APPARATUS | February 2023 | November 2024 | Allow | 22 | 2 | 0 | No | No |
| 18159576 | SEMICONDUCTOR DEVICE | January 2023 | February 2024 | Allow | 12 | 1 | 0 | No | No |
| 18096313 | HEAT RADIATION MEMBER FOR FLEXIBLE DISPLAY AND ELECTRONIC DEVICE USING THE SAME | January 2023 | May 2024 | Allow | 16 | 1 | 1 | No | No |
| 18014723 | POWER MODULE | January 2023 | February 2026 | Allow | 37 | 1 | 1 | No | No |
| 18078925 | METHOD FOR MANUFACTURING A POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR MODULE | December 2022 | January 2026 | Allow | 37 | 0 | 1 | No | No |
| 17988846 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | November 2022 | December 2025 | Allow | 37 | 1 | 1 | No | No |
| 17955239 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | September 2022 | October 2025 | Allow | 37 | 3 | 1 | No | No |
| 17948195 | LEADFRAME PACKAGE WITH METAL INTERPOSER | September 2022 | March 2026 | Abandon | 41 | 1 | 1 | No | No |
| 17930991 | SEMICONDUCTOR DEVICE | September 2022 | May 2024 | Allow | 20 | 1 | 1 | No | No |
| 17896083 | INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE | August 2022 | December 2025 | Allow | 40 | 2 | 1 | Yes | No |
| 17896637 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | August 2022 | August 2025 | Allow | 35 | 0 | 1 | No | No |
| 17822049 | SEMICONDUCTOR DEVICE | August 2022 | August 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17892008 | Low Parasitic Inductance Power Module Featuring Staggered Interleaving Conductive Members | August 2022 | June 2025 | Allow | 34 | 0 | 1 | No | No |
| 17886896 | CHIP-ON-BOARD MODULE | August 2022 | November 2025 | Allow | 39 | 1 | 1 | No | No |
| 17883726 | SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE | August 2022 | November 2024 | Allow | 27 | 2 | 1 | Yes | No |
| 17883682 | FUSION MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | August 2022 | May 2024 | Allow | 21 | 1 | 1 | Yes | No |
| 17816501 | SEMICONDUCTOR MEMORY DEVICE | August 2022 | June 2025 | Allow | 35 | 0 | 1 | No | No |
| 17877795 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | July 2022 | November 2025 | Allow | 40 | 1 | 1 | No | No |
| 17876468 | METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE | July 2022 | June 2024 | Allow | 23 | 2 | 1 | No | No |
| 17875144 | SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF MANUFACTURING THE SAME | July 2022 | October 2024 | Allow | 27 | 2 | 1 | No | No |
| 17872303 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | July 2022 | January 2026 | Allow | 42 | 2 | 1 | No | No |
| 17868654 | Cobalt Fill for Gate Structures | July 2022 | January 2024 | Allow | 18 | 2 | 0 | Yes | No |
| 17862692 | SOLDERLESS AND PRESSURE CONTACT CONNECTION | July 2022 | September 2025 | Allow | 38 | 1 | 1 | No | No |
| 17861217 | SEMICONDUCTOR MODULE | July 2022 | March 2024 | Allow | 20 | 1 | 1 | No | No |
| 17857741 | HIGH-VOLTAGE FLIP-CHIP SEMICONDUCTOR LIGHT-EMITTING DEVICE | July 2022 | January 2026 | Allow | 43 | 2 | 1 | No | No |
| 17853813 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | June 2022 | December 2024 | Allow | 29 | 0 | 1 | No | No |
| 17844676 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | June 2022 | August 2025 | Allow | 38 | 1 | 1 | No | No |
| 17839725 | METHOD FOR DEPOSITING A GROUP IV SEMICONDUCTOR AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | June 2022 | March 2025 | Allow | 33 | 2 | 1 | No | No |
| 17832721 | SEMICONDUCTOR PACKAGE WITH CONDUCTIVE ADHESIVE THAT OVERFLOWS FOR RETURN PATH REDUCTION AND ASSOCIATED METHOD | June 2022 | February 2025 | Allow | 32 | 0 | 0 | No | No |
| 17830363 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | June 2022 | June 2025 | Allow | 37 | 1 | 1 | No | No |
| 17830143 | SEMICONDUCTOR DEVICE | June 2022 | May 2025 | Allow | 35 | 0 | 1 | No | No |
| 17829905 | FIELD PLATE STRUCTURES FOR GAN HIGH VOLTAGE TRANSISTORS | June 2022 | September 2025 | Allow | 40 | 2 | 1 | No | No |
| 17780549 | DISPLAY PANEL AND DISPLAY DEVICE | May 2022 | September 2025 | Allow | 40 | 1 | 1 | No | No |
| 17779813 | DISPLAY PANEL AND DISPLAY DEVICE | May 2022 | November 2025 | Allow | 42 | 2 | 1 | No | No |
| 17749665 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | May 2022 | July 2025 | Allow | 38 | 1 | 1 | No | No |
| 17748016 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY | May 2022 | May 2025 | Allow | 36 | 1 | 0 | No | No |
| 17747126 | Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells | May 2022 | January 2026 | Allow | 44 | 2 | 1 | No | No |
| 17742893 | 3D TRANSISTOR STACKING USING NON-EPITAXIAL COMPOUND SEMICONDUCTOR | May 2022 | January 2026 | Abandon | 44 | 2 | 1 | Yes | No |
| 17741870 | DISPLAY APPARATUS | May 2022 | September 2025 | Allow | 40 | 2 | 1 | Yes | No |
| 17662870 | BACKSIDE POWER PLANE | May 2022 | July 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17735755 | STACK TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | May 2022 | February 2026 | Abandon | 46 | 2 | 1 | No | No |
| 17772619 | DISPLAY PANEL | April 2022 | March 2025 | Allow | 34 | 1 | 0 | No | No |
| 17729452 | METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICE | April 2022 | February 2025 | Allow | 33 | 0 | 1 | No | No |
| 17718101 | High Voltage Device and Manufacturing Method Thereof | April 2022 | September 2024 | Allow | 29 | 0 | 0 | No | No |
| 17654240 | SEMICONDUCTOR CHIPLET DEVICE | March 2022 | December 2024 | Allow | 33 | 1 | 0 | No | No |
| 17690222 | SILICON CARBIDE SUBSTRATE, SILICON CARBIDE DEVICE, AND SUBSTRATE THINNING METHOD THEREOF | March 2022 | January 2025 | Abandon | 35 | 0 | 1 | No | No |
| 17685097 | SUBSTRATE PROCESSING APPARATUS INCLUDING SHOWER HEAD AND EDGE RING AND RELATED METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | March 2022 | December 2024 | Allow | 34 | 0 | 1 | No | No |
| 17653217 | COMPOSITION FOR DEPOSITING SILICON-CONTAINING THIN FILM AND METHOD FOR MANUFACTURING SILICON-CONTAINING THIN FILM USING THE SAME | March 2022 | November 2025 | Allow | 44 | 2 | 0 | Yes | No |
| 17682567 | DISPLAY DEVICE, AND METHOD FOR FABRICATING DISPLAY DEVICE | February 2022 | December 2025 | Allow | 45 | 3 | 1 | Yes | No |
| 17753291 | POWER SEMICONDUCTOR MODULE, POWER CONVERSION APPARATUS, AND MOVING BODY | February 2022 | May 2025 | Allow | 39 | 3 | 1 | Yes | No |
| 17679904 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | February 2022 | January 2026 | Allow | 47 | 2 | 1 | Yes | No |
| 17674284 | FIN-BASED FIELD EFFECT TRANSISTORS | February 2022 | December 2023 | Allow | 22 | 1 | 0 | No | No |
| 17672033 | INTEGRATED CIRCUIT DEVICE | February 2022 | November 2024 | Allow | 33 | 1 | 1 | Yes | No |
| 17591144 | SEMICONDUCTOR PACKAGE | February 2022 | May 2025 | Allow | 39 | 3 | 1 | Yes | No |
| 17632503 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | February 2022 | February 2024 | Allow | 24 | 0 | 0 | No | No |
| 17581227 | SEMICONDUCTOR PACKAGE | January 2022 | April 2024 | Allow | 26 | 1 | 1 | Yes | No |
| 17578981 | VERTICAL NAND FLASH MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | January 2022 | August 2025 | Allow | 42 | 2 | 1 | Yes | Yes |
| 17573282 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | January 2022 | March 2025 | Allow | 38 | 1 | 1 | No | No |
| 17565773 | MEMS MICROPHONE | December 2021 | February 2025 | Allow | 38 | 1 | 1 | No | No |
| 17562348 | VERTICAL LIGHT EMITTING DEVICES WITH NICKEL SILICIDE BONDING AND METHODS OF MANUFACTURING | December 2021 | August 2024 | Allow | 31 | 3 | 1 | No | No |
| 17562176 | MICRO-LED STRUCTURE AND MICRO-LED CHIP INCLUDING SAME | December 2021 | December 2025 | Allow | 48 | 2 | 1 | Yes | No |
| 17560725 | Display device with dual-layer voltage transmitting lines | December 2021 | June 2025 | Allow | 42 | 2 | 1 | No | No |
| 17549810 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | December 2021 | June 2024 | Allow | 30 | 2 | 1 | No | No |
| 17548707 | SEMICONDUCTOR DEVICE | December 2021 | January 2024 | Allow | 25 | 1 | 1 | No | No |
| 17643672 | ELECTRONIC COMPONENT MODULE | December 2021 | January 2025 | Allow | 37 | 2 | 1 | No | No |
| 17546359 | HIGH-DENSITY MICROBUMP AND PROBE PAD ARRANGEMENT FOR SEMICONDUCTOR COMPONENTS | December 2021 | March 2024 | Allow | 27 | 1 | 1 | Yes | No |
| 17643056 | INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED WAVEGUIDE LAUNCHER | December 2021 | April 2024 | Allow | 29 | 1 | 1 | No | No |
| 17542828 | SEMICONDUCTOR PACKAGE | December 2021 | March 2024 | Allow | 27 | 1 | 1 | Yes | No |
| 17453343 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | November 2021 | March 2024 | Abandon | 29 | 2 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner FAN, SU JYA.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner FAN, SU JYA works in Art Unit 2818 and has examined 111 patent applications in our dataset. With an allowance rate of 92.8%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 33 months.
Examiner FAN, SU JYA's allowance rate of 92.8% places them in the 79% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by FAN, SU JYA receive 2.01 office actions before reaching final disposition. This places the examiner in the 52% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by FAN, SU JYA is 33 months. This places the examiner in the 48% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +1.0% benefit to allowance rate for applications examined by FAN, SU JYA. This interview benefit is in the 19% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 35.0% of applications are subsequently allowed. This success rate is in the 78% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 37.0% of cases where such amendments are filed. This entry rate is in the 56% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 0.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 13% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.
This examiner withdraws rejections or reopens prosecution in 50.0% of appeals filed. This is in the 18% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 75.0% are granted (fully or in part). This grant rate is in the 81% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 20.7% of allowed cases (in the 98% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 3.9% of allowed cases (in the 77% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.