USPTO Examiner FAN SU JYA - Art Unit 2818

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18674329POWER STORAGE PACK, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHODMay 2024August 2024Allow301NoNo
18582494PACKAGE STRUCTURE AND METHOD OF FORMING THE SAMEFebruary 2024May 2025Allow1501NoNo
18407264SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAMEJanuary 2024April 2025Allow1511YesNo
18404686METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICEJanuary 2024June 2025Allow1721NoNo
18521697ORGANIC LIGHT EMITTING DISPLAY DEVICENovember 2023May 2025Allow1821NoNo
18485735Antenna Package with Via Structure and Method of Formation ThereofOctober 2023January 2025Allow1510NoNo
18369684INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAMESeptember 2023March 2025Allow1811YesNo
18244556ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAMESeptember 2023December 2024Allow1601NoNo
18363763PACKAGE STRUCTURE AND METHOD OF FORMING THE SAMEAugust 2023February 2025Allow1810NoNo
18360484HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMSJuly 2023May 2025Allow2221NoNo
18210291ELECTRONIC COMPONENT PACKAGEJune 2023October 2024Allow1610NoNo
18204721Power Diode and Method of Manufacturing a Power DiodeJune 2023September 2024Allow1610NoNo
18201145SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAMEMay 2023January 2025Allow2021NoNo
18318729PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAMEMay 2023September 2024Allow1611NoNo
18301949SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGEApril 2023May 2024Allow1301NoNo
18296778SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAMEApril 2023June 2024Allow1510YesNo
18295176SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICEApril 2023August 2024Allow1611NoNo
18185909DISPLAY DEVICE AND DISPLAY SYSTEMMarch 2023June 2024Allow1501NoNo
18169327SEMICONDUCTOR DEVICE INCLUDING INSULATING LAYERS AND METHOD OF MANUFACTURING THE SAMEFebruary 2023February 2025Allow2421YesNo
18166985LIGHT EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAMEFebruary 2023June 2024Allow1610NoNo
18163966DISPLAY APPARATUSFebruary 2023November 2024Allow2220NoNo
18159576SEMICONDUCTOR DEVICEJanuary 2023February 2024Allow1210NoNo
18096313HEAT RADIATION MEMBER FOR FLEXIBLE DISPLAY AND ELECTRONIC DEVICE USING THE SAMEJanuary 2023May 2024Allow1611NoNo
17930991SEMICONDUCTOR DEVICESeptember 2022May 2024Allow2011NoNo
17892008Low Parasitic Inductance Power Module Featuring Staggered Interleaving Conductive MembersAugust 2022June 2025Allow3401NoNo
17883726SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTUREAugust 2022November 2024Allow2721YesNo
17883682FUSION MEMORY DEVICE AND METHOD OF FABRICATING THE SAMEAugust 2022May 2024Allow2111YesNo
17816501SEMICONDUCTOR MEMORY DEVICEAugust 2022June 2025Allow3501NoNo
17876468METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGEJuly 2022June 2024Allow2321NoNo
17875144SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF MANUFACTURING THE SAMEJuly 2022October 2024Allow2721NoNo
17868654Cobalt Fill for Gate StructuresJuly 2022January 2024Allow1820YesNo
17861217SEMICONDUCTOR MODULEJuly 2022March 2024Allow2011NoNo
17853813SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEJune 2022December 2024Allow2901NoNo
17839725METHOD FOR DEPOSITING A GROUP IV SEMICONDUCTOR AND RELATED SEMICONDUCTOR DEVICE STRUCTURESJune 2022March 2025Allow3321NoNo
17832721SEMICONDUCTOR PACKAGE WITH CONDUCTIVE ADHESIVE THAT OVERFLOWS FOR RETURN PATH REDUCTION AND ASSOCIATED METHODJune 2022February 2025Allow3200NoNo
17830363SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFJune 2022June 2025Allow3711NoNo
17830143SEMICONDUCTOR DEVICEJune 2022May 2025Allow3501NoNo
17748016METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBYMay 2022May 2025Allow3610NoNo
17772619DISPLAY PANELApril 2022March 2025Allow3410NoNo
17729452METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICEApril 2022February 2025Allow3301NoNo
17718101High Voltage Device and Manufacturing Method ThereofApril 2022September 2024Allow2900NoNo
17654240SEMICONDUCTOR CHIPLET DEVICEMarch 2022December 2024Allow3310NoNo
17690222SILICON CARBIDE SUBSTRATE, SILICON CARBIDE DEVICE, AND SUBSTRATE THINNING METHOD THEREOFMarch 2022January 2025Abandon3501NoNo
17685097SUBSTRATE PROCESSING APPARATUS INCLUDING SHOWER HEAD AND EDGE RING AND RELATED METHODS OF MANUFACTURING SEMICONDUCTOR DEVICESMarch 2022December 2024Allow3401NoNo
17753291POWER SEMICONDUCTOR MODULE, POWER CONVERSION APPARATUS, AND MOVING BODYFebruary 2022May 2025Allow3931YesNo
17674284FIN-BASED FIELD EFFECT TRANSISTORSFebruary 2022December 2023Allow2210NoNo
17672033INTEGRATED CIRCUIT DEVICEFebruary 2022November 2024Allow3311YesNo
17591144SEMICONDUCTOR PACKAGEFebruary 2022May 2025Allow3931YesNo
17632503SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEFebruary 2022February 2024Allow2400NoNo
17581227SEMICONDUCTOR PACKAGEJanuary 2022April 2024Allow2611YesNo
17573282SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOFJanuary 2022March 2025Allow3811NoNo
17565773MEMS MICROPHONEDecember 2021February 2025Allow3811NoNo
17562348VERTICAL LIGHT EMITTING DEVICES WITH NICKEL SILICIDE BONDING AND METHODS OF MANUFACTURINGDecember 2021August 2024Allow3131NoNo
17560725Display device with dual-layer voltage transmitting linesDecember 2021June 2025Allow4221NoNo
17548707SEMICONDUCTOR DEVICEDecember 2021January 2024Allow2511NoNo
17549810ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICESDecember 2021June 2024Allow3021NoNo
17643672ELECTRONIC COMPONENT MODULEDecember 2021January 2025Allow3721NoNo
17546359HIGH-DENSITY MICROBUMP AND PROBE PAD ARRANGEMENT FOR SEMICONDUCTOR COMPONENTSDecember 2021March 2024Allow2711YesNo
17643056INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED WAVEGUIDE LAUNCHERDecember 2021April 2024Allow2911NoNo
17542828SEMICONDUCTOR PACKAGEDecember 2021March 2024Allow2711YesNo
17453343SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOFNovember 2021March 2024Abandon2920YesNo
17462458CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOFAugust 2021March 2024Allow3031YesNo
17461693SEMICONDUCTOR APPARATUSAugust 2021April 2024Allow3211NoNo
17460053ELECTRONIC PACKAGEAugust 2021April 2025Allow4431NoNo
17409086GATE-ALL-AROUND (GAA) METHOD AND DEVICESAugust 2021March 2024Allow3120NoNo
17403835DISPLAY DEVICEAugust 2021June 2024Allow3421NoNo
17402239ELECTRONIC CARRIER AND METHOD OF MANUFACTURING THE SAMEAugust 2021January 2024Allow2921NoNo
17371110SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOFJuly 2021August 2024Allow3721YesNo
17370770SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOFJuly 2021February 2025Allow4431YesNo
17370594SEMICONDUCTOR PACKAGEJuly 2021August 2024Allow3831YesNo
17370591High Efficiency Heat Dissipation Using Discrete Thermal Interface Material FilmsJuly 2021January 2025Allow4241NoNo
17367995SEMICONDUCTOR PACKAGEJuly 2021March 2024Allow3221YesNo
17304569DISPLAY DEVICE AND SEMICONDUCTOR DEVICEJune 2021March 2025Abandon4521NoNo
17349784SEMICONDUTOR PACKAGE, WEARABLE DEVICE, AND TEMPERATURE DETECTION METHODJune 2021February 2025Allow4441NoNo
17303062METHOD OF FABRICATING SEMICONDUCTOR DEVICEMay 2021April 2024Allow3520YesNo
17245084DISPLAY DEVICE AND MANUFACTURING METHOD THEREOFApril 2021March 2024Allow3510NoNo
17288964DISPLAY PANEL AND DISPLAY DEVICEApril 2021September 2024Allow4121NoNo
17288680SEMICONDUCTOR DEVICEApril 2021October 2024Allow4221NoNo
17286530SEMICONDUCTOR DEVICEApril 2021May 2024Allow3720NoNo
17227837PACKAGE CORE ASSEMBLY AND FABRICATION METHODSApril 2021September 2024Allow4130YesNo
17222534SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAMEApril 2021October 2023Allow3011NoNo
17185116SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAMEFebruary 2021May 2024Allow3931YesNo
17266151DISPLAY PANEL AND DISPLAY DEVICEFebruary 2021February 2024Allow3610NoNo
17159925PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERMALLY CONDUCTIVE ADHESIVE LAYERSJanuary 2021November 2024Allow4531NoNo
17263871LIGHT-EMITTING DEVICE AND DISPLAY DEVICE COMPRISING SAMEJanuary 2021August 2024Allow4321NoNo
17263434MAGNETORESISTIVE STACK AND METHODS THEREFORJanuary 2021July 2024Allow4231YesNo
17262768FLEXIBLE SUBSTRATE, PREPARATION METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICEJanuary 2021June 2024Allow4121YesNo
17151883ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICEJanuary 2021March 2023Allow2611NoNo
17260563OLED Display Substrate and Display ApparatusJanuary 2021August 2024Allow4321NoNo
17121073Methods of Forming Epitaxial Source/Drain Features in Semiconductor DevicesDecember 2020June 2024Allow4231NoNo
17119864ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAMEDecember 2020January 2024Allow3731YesNo
17112567SEMICONDUCTOR PACKAGEDecember 2020April 2024Allow4031YesNo
17110755Semiconductor Die being Connected with a Clip and a Wire which is Partially Disposed Under the ClipDecember 2020April 2024Allow4031NoNo
17096595SPLIT SUBSTRATE INTERPOSER WITH INTEGRATED PASSIVE DEVICENovember 2020July 2024Allow4531NoNo
17051453DISPLAY PANEL AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICEOctober 2020January 2025Allow5121NoNo
16966094DISPLAY PANEL, ARRAY SUBSTRATE, AND METHOD OF MANUFACTURING THEREOFJuly 2020June 2024Allow4611NoNo
16962514DISPLAY PANEL AND ELECTRONIC DEVICE HAVING SAMEJuly 2020January 2024Allow4210NoNo
16886704PACKAGE CORE ASSEMBLY AND FABRICATION METHODSMay 2020May 2024Allow4731YesNo
16848635LEAD STABILIZATION IN SEMICONDUCTOR PACKAGESApril 2020September 2024Allow5351YesNo
16830853ELECTRONIC DEVICE AND CROSSTALK MITIGATING SUBSTRATEMarch 2020March 2024Allow4841NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner FAN, SU JYA.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
1
Examiner Affirmed
1
(100.0%)
Examiner Reversed
0
(0.0%)
Reversal Percentile
10.1%
Lower than average

What This Means

With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.

Strategic Value of Filing an Appeal

Total Appeal Filings
1
Allowed After Appeal Filing
0
(0.0%)
Not Allowed After Appeal Filing
1
(100.0%)
Filing Benefit Percentile
4.8%
Lower than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.

Strategic Recommendations

Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.

Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.

Examiner FAN, SU JYA - Prosecution Strategy Guide

Executive Summary

Examiner FAN, SU JYA works in Art Unit 2818 and has examined 153 patent applications in our dataset. With an allowance rate of 95.4%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 29 months.

Allowance Patterns

Examiner FAN, SU JYA's allowance rate of 95.4% places them in the 87% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.

Office Action Patterns

On average, applications examined by FAN, SU JYA receive 1.65 office actions before reaching final disposition. This places the examiner in the 45% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by FAN, SU JYA is 29 months. This places the examiner in the 47% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.

Interview Effectiveness

Conducting an examiner interview provides a -0.9% benefit to allowance rate for applications examined by FAN, SU JYA. This interview benefit is in the 8% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 36.7% of applications are subsequently allowed. This success rate is in the 80% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 38.7% of cases where such amendments are filed. This entry rate is in the 51% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 0.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 12% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 0.0% of appeals filed. This is in the 0% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.

Petition Practice

When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 61% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 15.0% of allowed cases (in the 98% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 4.1% of allowed cases (in the 76% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • RCEs are effective: This examiner has a high allowance rate after RCE compared to others. If you receive a final rejection and have substantive amendments or arguments, an RCE is likely to be successful.
  • Examiner cooperation: This examiner frequently makes examiner's amendments to place applications in condition for allowance. If you are close to allowance, the examiner may help finalize the claims.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.