Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18798708 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPLE METAL LAYERS | August 2024 | November 2025 | Allow | 16 | 1 | 0 | No | No |
| 18643628 | HIGH-VOLTAGE ELECTROSTATIC DISCHARGE DEVICE | April 2024 | May 2025 | Allow | 13 | 2 | 1 | Yes | No |
| 18444455 | STACKED STAGGERED ELECTRODE FOIL CAPACITOR STRUCTURES IN SEMICONDUCTOR DEVICES FOR SINGLE AND MULTI-VOLTAGE DOMAIN APPLICATIONS AND METHOD OF FABRICATION | February 2024 | October 2024 | Allow | 8 | 1 | 1 | Yes | No |
| 18542983 | METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPLE METAL LAYERS | December 2023 | May 2024 | Allow | 5 | 1 | 0 | No | No |
| 18569588 | VERTICALLY STACKED MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | December 2023 | February 2026 | Allow | 26 | 0 | 0 | No | No |
| 18527269 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS | December 2023 | August 2024 | Allow | 9 | 2 | 0 | No | No |
| 18389577 | METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPLE METAL LAYERS | November 2023 | July 2024 | Allow | 8 | 1 | 0 | No | No |
| 18503210 | SEMICONDUCTOR DEVICE INCLUDING A GATE TRENCH IN AN INTER-PAD REGION | November 2023 | December 2025 | Allow | 26 | 1 | 0 | No | No |
| 18473098 | INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE | September 2023 | December 2025 | Allow | 26 | 2 | 0 | No | No |
| 18465439 | METHOD OF MANUFACTURING METAL NITRIDE FILM USING OPERATIONS WITH A METAL ORGANIC LIGAND, A FIRST PURGING, A HALOGEN COMPOUND, A SECOND PURGING, AND A NITRIDANT, AND A METHOD OF MANUFACTURING AN ELECTRONIC DEVICE INCLUDING METAL NITRIDE FILM | September 2023 | September 2025 | Allow | 24 | 2 | 0 | Yes | No |
| 18464789 | MICROELECTRONIC WORKPIECE PROCESSING SYSTEMS AND ASSOCIATED METHODS OF COLOR CORRECTION | September 2023 | April 2025 | Abandon | 19 | 1 | 0 | No | No |
| 18459942 | SENSOR EMBEDDED DISPLAY PANEL AND ELECTRONIC DEVICE | September 2023 | March 2026 | Allow | 30 | 0 | 1 | No | No |
| 17762098 | DISPLAY PANEL HAVING LIGHT-TRANSMITTING HOLE AND UNDER-SCREEN CAMERA DISPLAY DEVICE | August 2023 | March 2026 | Allow | 48 | 1 | 0 | No | No |
| 18455980 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A NODE CAPPING PATTERN AND A GATE CAPPING PATTERN | August 2023 | May 2025 | Allow | 21 | 1 | 0 | Yes | No |
| 18454471 | SRAM CELL LAYOUT INCLUDING ARRANGEMENT OF MULTIPLE ACTIVE REGIONS AND MULTIPLE GATE REGIONS | August 2023 | November 2024 | Allow | 15 | 1 | 1 | Yes | No |
| 18447053 | METHODS OF MANUFACTURE OF SEMICONDUCTOR DEVICES | August 2023 | September 2025 | Allow | 25 | 4 | 1 | No | No |
| 18446873 | MIDDLE END OF LINE DECOUPLING CAPACITORS FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | August 2023 | October 2024 | Allow | 14 | 1 | 1 | Yes | No |
| 18230782 | DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR DIE PACKAGING AND METHODS OF FORMING THE SAME | August 2023 | October 2024 | Allow | 14 | 1 | 1 | Yes | No |
| 18361722 | INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE | July 2023 | March 2025 | Allow | 20 | 2 | 1 | No | No |
| 18359825 | METHOD OF FABRICATING A SEMICONDUCTOR CHIP HAVING STRENGTH ADJUSTMENT PATTERN IN BONDING LAYER | July 2023 | October 2024 | Allow | 14 | 1 | 0 | No | No |
| 18357220 | Method of Measuring Mask Overlay Using Test Patterns | July 2023 | December 2024 | Allow | 16 | 1 | 0 | No | No |
| 18224524 | METHOD OF MANUFACTURING A CERAMIC STRUCTURE WITH METAL TRACES | July 2023 | October 2024 | Allow | 15 | 2 | 0 | No | No |
| 18341793 | DEVICE STRUCTURE INCLUDING FIELD EFFECT TRANSISTORS AND FERROELECTRIC CAPACITORS | June 2023 | November 2024 | Allow | 16 | 1 | 0 | No | No |
| 18213396 | Asymmetric Semiconductor Memory Device Having Electrically Floating Body Transistor | June 2023 | September 2024 | Allow | 15 | 1 | 0 | No | No |
| 18331917 | SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-UP DEPOSITION | June 2023 | November 2024 | Allow | 18 | 2 | 1 | No | No |
| 18204619 | Semiconductor capacitor array layout capable of generating parasitic capacitance toward edge of layout | June 2023 | August 2024 | Allow | 14 | 1 | 0 | No | No |
| 18255383 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE BY REMOVING CARRIER AFTER FORMING RE-DISTRIBUTION LAYER | June 2023 | February 2026 | Allow | 33 | 1 | 0 | No | No |
| 18197550 | HIGHLY FLEXIBLE, ELECTRICAL DISTRIBUTION GRID EDGE ENERGY MANAGER AND ROUTER | May 2023 | October 2024 | Allow | 17 | 1 | 0 | No | No |
| 18315066 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS FOR CONTROLLING INTRODUCTION INTO INSULATING FILM | May 2023 | February 2026 | Allow | 34 | 1 | 1 | No | No |
| 18312332 | ULTRASONIC DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF CONTROLLING ULTRASONIC DEVICE | May 2023 | September 2025 | Allow | 28 | 0 | 1 | No | No |
| 18311167 | 3D MEMORY CELL STRUCTURES WITH FLOATING BODIES | May 2023 | December 2025 | Allow | 32 | 1 | 1 | Yes | No |
| 18308702 | DEEP TRENCH STRUCTURE FOR A CAPACITIVE DEVICE | April 2023 | May 2025 | Allow | 24 | 3 | 1 | Yes | No |
| 18136988 | HIGH ABSORPTION PHOTOVOLTAIC MATERIAL HAVING A GRADIENT REFRACTIVE INDEX PROFILE AND METHODS OF MAKING THE SAME | April 2023 | January 2026 | Allow | 33 | 1 | 0 | No | No |
| 18303378 | CERAMIC CARRIER AND BUILD UP CARRIER FOR LIGHT-EMITTING DIODE (LED) ARRAY | April 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18127751 | AN INTEGRATED CIRCUIT COMPRISING TRENCHES FORMED IN A SUBSTRATE | March 2023 | September 2024 | Allow | 18 | 2 | 0 | No | No |
| 18188592 | MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE HAVING HIGH-VOLTAGE ISOLATION CAPACITOR | March 2023 | March 2026 | Allow | 35 | 1 | 0 | No | No |
| 18123972 | MANUFACTURING METHOD OF CAPACITOR STRUCTURE INCLUDING PATTERNED CONDUCTIVE LAYER DISPOSED BETWEEN TWO ELECTRODES | March 2023 | August 2024 | Allow | 17 | 2 | 0 | No | No |
| 18182921 | METHOD AND DEVICE RELATED TO SEAMLESS METAL CONTACT | March 2023 | January 2026 | Allow | 35 | 1 | 1 | No | No |
| 18182527 | SEMICONDUCTOR STRUCTURE BODY AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE BODY WITH ALIGNMENT BETWEEN STORIES OF THE SAME | March 2023 | February 2026 | Allow | 35 | 1 | 1 | No | No |
| 18043669 | METAL OXIDE FILM AND SEMICONDUCTOR DEVICE | March 2023 | January 2026 | Allow | 34 | 1 | 1 | No | No |
| 18173313 | INTEGRATED CIRCUIT STRUCTURE IN POROUS SEMICONDUCTOR REGION AND METHOD TO FORM SAME | February 2023 | November 2025 | Allow | 32 | 2 | 1 | No | No |
| 18172077 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE WITH CAVITY TO FACILITATE SUBSTRATE CLEAVAGE | February 2023 | January 2025 | Abandon | 23 | 2 | 0 | Yes | No |
| 18171205 | A VERTICAL SEMICONDUCTOR DIODE OR TRANSISTOR DEVICE HAVING AT LEAST ONE COMPOUND SEMICONDUCTOR AND A THREE-DIMENSIONAL ELECTRONIC SEMICONDUCTOR DEVICE COMPRISING AT LEAST ONE VERTICAL COMPOUND STRUCTURE | February 2023 | August 2024 | Allow | 18 | 1 | 0 | No | No |
| 18110610 | SENSOR PACKAGE STRUCTURE HAVING SOLDER MASK FRAME | February 2023 | March 2024 | Allow | 13 | 1 | 0 | No | No |
| 18110666 | SENSOR PACKAGE STRUCTURE HAVING RING-SHAPED SOLDER MASK FRAME | February 2023 | March 2024 | Allow | 13 | 1 | 0 | No | No |
| 18110568 | METHOD OF FABRICATING AN ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP | February 2023 | April 2024 | Allow | 14 | 1 | 0 | No | No |
| 18110637 | SENSOR PACKAGE STRUCTURE HAVING SOLDER MASK FRAME | February 2023 | December 2024 | Allow | 22 | 3 | 0 | No | No |
| 18168332 | SEMICONDUCTOR DEVICES HAVING DIFFERENT NUMBERS OF STACKED CHANNELS IN DIFFERENT REGIONS | February 2023 | April 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18104650 | SEMICONDUCTOR PACKAGE INCLUDING A METAL PLATE AND PACKAGE-ON-PACKAGE HAVING THE SAME | February 2023 | October 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 18161985 | SEMICONDUCTOR STRUCTURE WITH BUFFER LAYER BETWEEN CONDUCTIVE CONTACT AND WORD LINE AND METHOD FOR FORMING THE SAME, AND MEMORY | January 2023 | February 2026 | Allow | 37 | 1 | 1 | No | No |
| 18161130 | SEMICONDUCTOR DEVICE INCLUDING ACTIVE PILLARS MADE OF THREE SEMICONDUCTOR LAYERS, METHOD FOR OPERATING SAME, AND SEMICONDUCTOR STRUCTURE | January 2023 | September 2025 | Allow | 31 | 2 | 1 | No | No |
| 18161463 | OXIDE SEMICONDUCTOR DEVICE AND OXIDE SEMICONDUCTOR MEMORY DEVICE | January 2023 | March 2026 | Allow | 37 | 1 | 1 | No | No |
| 18016738 | DISPLAY DEVICE WITH ORGANIC LAYER BETWEEN RESPECTIVE ELECTRODES | January 2023 | December 2025 | Allow | 35 | 1 | 1 | Yes | No |
| 18094719 | SEMICONDUCTOR MEMORY DEVICE HAVING STACKED WORD LINES INCLUDING SUB-GATE ELECTRODES | January 2023 | January 2026 | Allow | 36 | 1 | 1 | Yes | No |
| 18152054 | DISPLAY DEVICE HAVING A DISPLAY AREA INCLUDING A FIRST AREA, A SECOND AREA, AND A THIRD AREA | January 2023 | October 2025 | Allow | 33 | 1 | 0 | No | No |
| 18150372 | STACKED CMOS IMAGE SENSOR WITH STI-FREE PHOTODETECTOR ISOLATION AND METHOD FOR FORMING THE SAME | January 2023 | January 2026 | Allow | 36 | 1 | 1 | No | No |
| 18150184 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE INCLUDING CAPACITOR | January 2023 | February 2026 | Allow | 38 | 2 | 1 | No | No |
| 18066733 | SEMICONDUCTOR DEVICE WITH INCREASED UNITY DENSITY | December 2022 | January 2025 | Allow | 25 | 3 | 1 | No | No |
| 18065770 | SEMICONDUCTOR STRUCTURE WITH A BIT LINE IN A DIFFERENT CONFIGURATION THAN A LOCAL INTERCONNECT LINE | December 2022 | February 2024 | Allow | 14 | 1 | 0 | No | No |
| 18064777 | METHOD OF FORMING SEMICONDUCTOR DEVICE WITH INCREASED UNIT DENSITY | December 2022 | July 2024 | Allow | 20 | 2 | 1 | No | No |
| 18054994 | SEMICONDUCTOR STRUCTURE WITH A HIGH DEPTH-WIDTH RATIO CAPACITOR AND MANUFACTURING METHOD THEREOF | November 2022 | December 2025 | Allow | 37 | 1 | 0 | No | No |
| 17923595 | METHOD FOR OPTIMIZING PROTECTION CIRCUITS OF ELECTRONIC DEVICE CHIPS IN A WAFER | November 2022 | December 2025 | Abandon | 37 | 0 | 1 | No | No |
| 17978882 | DISPLAY DEVICE HAVING MULTI-WIDTH CONNECTION ELECTRODE | November 2022 | December 2025 | Allow | 37 | 1 | 1 | No | No |
| 17977487 | LIGHT EMITTING DISPLAY DEVICE HAVING BUMPY PATTERN ON RAMP | October 2022 | February 2026 | Allow | 40 | 2 | 0 | No | No |
| 18050600 | Systems, Articles, and Methods related to Multilayered Magnetic Memory Devices | October 2022 | November 2025 | Allow | 37 | 1 | 0 | No | No |
| 17972211 | SEMICONDUCTOR DEVICE HAVING A THREE-DIMENSIONAL STRUCTURE AND METHOD FOR FABRICATING THE SAME | October 2022 | October 2025 | Allow | 36 | 1 | 0 | No | No |
| 17970360 | SEMICONDUCTOR DEVICE INCLUDING CONTACT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | October 2022 | March 2024 | Allow | 16 | 1 | 0 | No | No |
| 17955067 | SEMICONDUCTOR DEVICE WITH CARBON-DENSITY-DECREASING REGION | September 2022 | January 2024 | Allow | 16 | 1 | 0 | No | No |
| 17954377 | DISPLAY PANEL AND DISPLAY DEVICE FOR IVL TESTING | September 2022 | February 2024 | Allow | 16 | 1 | 0 | No | No |
| 17934743 | SEMICONDUCTOR DEVICE INCLUDING ELECTRODES EACH HAVING A PAD PART AND ELECTRONIC SYSTEM INCLUDING THE SAME | September 2022 | November 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17932817 | SEMICONDUCTOR MEMORY DEVICE INCLUDING MULTI-LAYER ELECTRODE | September 2022 | October 2024 | Abandon | 25 | 2 | 0 | Yes | No |
| 17945671 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH AT LEAST TWO SINGLE-CRYSTAL LAYERS | September 2022 | March 2024 | Abandon | 18 | 2 | 0 | No | No |
| 17894645 | SEMICONDUCTOR DEVICE HAVING AN INSULATING SHEET AND A CONDUCTIVE FILM, AND METHOD OF MANUFACTURING THE SAME | August 2022 | May 2024 | Allow | 21 | 2 | 1 | Yes | No |
| 17892326 | CHIPS BONDING AUXILIARY STRUCTURE | August 2022 | February 2025 | Allow | 30 | 4 | 0 | No | No |
| 17889161 | ELECTRONIC SENSOR DEVICES AND METHODS OF MANUFACTURING ELECTRONIC SENSOR DEVICES | August 2022 | August 2024 | Allow | 24 | 3 | 0 | No | No |
| 17886161 | A SEMICONDUCTOR STRUCTURE HAVING A SEMICONDUCTOR SUBSTRATE AND AN ISOLATION COMPONENT | August 2022 | June 2024 | Allow | 22 | 3 | 1 | No | No |
| 17886200 | A SEMICONDUCTOR STRUCTURE HAVING A SEMICONDUCTOR SUBSTRATE AND AN ISOLATION COMPONENT | August 2022 | January 2025 | Allow | 30 | 4 | 1 | No | No |
| 17884790 | MEMORY DEVICE HAVING A FIRST LAYER DISPOSED BETWEEN A MEMORY ELEMENT AND A SWITCHING ELEMENT THEREOF | August 2022 | November 2025 | Allow | 39 | 2 | 1 | No | No |
| 17876067 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE WITH HIGH-DIELECTRIC-CONSTANT GATE INSULATOR | July 2022 | December 2025 | Abandon | 40 | 2 | 1 | No | No |
| 17870296 | Method of Manufacturing Semiconductor Devices with System on Chip Devices | July 2022 | July 2025 | Allow | 36 | 5 | 0 | No | No |
| 17758720 | ELECTRON-GAS THERMOELECTRIC SENSOR | July 2022 | November 2025 | Abandon | 40 | 1 | 0 | No | No |
| 17860325 | Vertical Transistors Having At Least 50% Grain Boundaries Offset Between Top And Bottom Source/Drain Regions And The Channel Region That Is Vertically Therebetween | July 2022 | August 2024 | Allow | 26 | 2 | 1 | No | No |
| 17834837 | DEVICE WITH DUMMY METALLIC TRACES | June 2022 | January 2024 | Allow | 20 | 2 | 1 | No | No |
| 17782979 | DISPLAY SUBSTRATE HAVING PLANARIZATION LAYER COVERING SPACING REGION BETWEEN SIGNAL LINES, MANUFACTURING METHOD THEREOF AND DISPLAY APPARATUS | June 2022 | September 2025 | Allow | 39 | 1 | 1 | No | No |
| 17833885 | SEMICONDUCTOR DEVICE INCLUDING III-V COMPOUND SEMICONDUCTOR LAYER AND MANUFACTURING METHOD THEREOF | June 2022 | June 2025 | Allow | 36 | 1 | 1 | No | No |
| 17782261 | SYSTEMS AND METHODS FOR FABRICATING FLUX TRAP MITIGATING SUPERCONDUCTING INTEGRATED CIRCUITS | June 2022 | April 2025 | Allow | 34 | 1 | 1 | No | No |
| 17830470 | DISPLAY DEVICE WITH STACKED WIRING AND DISPLAY DEVICE WITH TRANSLUCENT REGION | June 2022 | March 2025 | Allow | 34 | 1 | 1 | No | No |
| 17831143 | A SEMICONDUCTOR DEVICE INCLUDING A LEAD AND A SEALING RESIN | June 2022 | February 2025 | Allow | 32 | 1 | 0 | No | No |
| 17831108 | SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE | June 2022 | March 2024 | Allow | 21 | 2 | 1 | No | No |
| 17829781 | SEMICONDUCTOR DEVICES INCLUDING BUFFER LAYER STRUCTURE | June 2022 | February 2026 | Allow | 45 | 2 | 1 | Yes | No |
| 17804676 | SEMICONDUCTOR DEVICE WITH MULTILAYER SOURCE AND DRAIN REGIONS FORMED IN OPENINGS OF ELECTRON SUPPLY AND TRANSIT LAYERS | May 2022 | February 2026 | Allow | 45 | 2 | 1 | No | No |
| 17744253 | IMAGE SENSING DEVICE WITH MULTIPLE TRANSMISSION GATES FOR GLOBAL SHUTTER OPERATION | May 2022 | March 2025 | Allow | 34 | 1 | 1 | No | No |
| 17742372 | SEMICONDUCTOR MEMORY DEVICE HAVING BURIED WORD LINE WITH A NECK PROFILE PORTION | May 2022 | March 2025 | Allow | 34 | 1 | 1 | No | No |
| 17771824 | OLED DISPLAY PANEL HAVING MULTIPLE LIGHT-EMITTING LAYERS AND A PIXEL DEFINITION LAYER PROVIDED WITH OPENINGS, AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | April 2022 | March 2025 | Allow | 35 | 1 | 1 | No | No |
| 17728785 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF | April 2022 | November 2024 | Allow | 30 | 1 | 1 | No | No |
| 17771351 | LITHIUM NIOBATE SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | April 2022 | March 2025 | Allow | 35 | 1 | 1 | No | No |
| 17722682 | SEMICONDUCTOR POWER MODULE PACKAGE HAVING LEAD FRAME ANCHORED BARS | April 2022 | August 2025 | Allow | 40 | 2 | 1 | Yes | No |
| 17717875 | ELECTRONIC DEVICE WITH DIE PADS AND LEADS | April 2022 | February 2024 | Allow | 23 | 2 | 0 | Yes | No |
| 17657937 | LAYOUT STRUCTURE OF ANTI-FUSE ARRAY | April 2022 | January 2025 | Abandon | 33 | 1 | 1 | No | No |
| 17711381 | DISPLAY PANEL AND DISPLAY APPARATUS FOR UNIFORM DISPLAY OF A FIRST DISPLAY AREA AND A SECOND DISPLAY AREA | April 2022 | March 2025 | Allow | 35 | 1 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner NGUYEN, DUY T V.
With a 50.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 59.1% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner NGUYEN, DUY T V works in Art Unit 2818 and has examined 174 patent applications in our dataset. With an allowance rate of 97.7%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 31 months.
Examiner NGUYEN, DUY T V's allowance rate of 97.7% places them in the 89% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by NGUYEN, DUY T V receive 2.32 office actions before reaching final disposition. This places the examiner in the 66% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by NGUYEN, DUY T V is 31 months. This places the examiner in the 56% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +3.5% benefit to allowance rate for applications examined by NGUYEN, DUY T V. This interview benefit is in the 26% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 28.9% of applications are subsequently allowed. This success rate is in the 54% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 27.6% of cases where such amendments are filed. This entry rate is in the 39% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 133.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 86% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 90.9% of appeals filed. This is in the 83% percentile among all examiners. Of these withdrawals, 45.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 42.1% are granted (fully or in part). This grant rate is in the 34% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 9.2% of allowed cases (in the 92% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 1.2% of allowed cases (in the 62% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.