Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18923311 | SEMICONDUCTOR DEVICE | October 2024 | September 2025 | Allow | 11 | 2 | 0 | Yes | No |
| 18762679 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | July 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18755281 | MULTI-GATE DEVICE AND RELATED METHODS | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18750379 | Gate Isolation Feature and Manufacturing Method Thereof | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18746944 | THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE INTERCONNECT STRUCTURES | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18740752 | DISPLAY SUBSTRATE AND DISPLAY PANEL | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18673746 | NANO-SHEET-BASED COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICES WITH ASYMMETRIC INNER SPACERS | May 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18670223 | FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18665199 | Dipole-Engineered High-K Gate Dielectric and Method Forming Same | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18659388 | METHOD TO EMBED PLANAR FETS WITH FINFETS | May 2024 | April 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18656574 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | May 2024 | April 2025 | Allow | 12 | 2 | 0 | No | No |
| 18645434 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18645415 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18640616 | DEVICES RELATED TO SWITCH BODY CONNECTIONS TO ACHIEVE SOFT BREAKDOWN | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18617517 | ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES | March 2024 | November 2024 | Allow | 8 | 0 | 0 | No | No |
| 18614735 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | March 2024 | October 2024 | Allow | 6 | 0 | 0 | No | No |
| 18613142 | OPTICAL SENSING SYSTEM | March 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18606052 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | March 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18595256 | INTEGRATED CIRCUIT DEVICE | March 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18593544 | SEMICONDUCTOR DEVICE WITH CONDUCTIVE ELEMENTS FORMED OVER DIELECTRIC LAYERS AND METHOD OF FABRICATION THEREFOR | March 2024 | April 2025 | Allow | 13 | 2 | 0 | No | No |
| 18586731 | EDGE SEALS FOR SEMICONDUCTOR PACKAGES | February 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18444208 | QUANTUM ANNEALING DEBUGGING SYSTEMS AND METHODS | February 2024 | November 2024 | Allow | 9 | 0 | 0 | No | No |
| 18422006 | PHOTOMASK, DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18411667 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18408149 | ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD | January 2024 | December 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18397457 | Semiconductor Device Having a Layer Stack, Semiconductor Arrangement and Method for Producing the Same | December 2023 | July 2024 | Allow | 14 | 0 | 0 | No | No |
| 18540635 | STRUCTURE FOR MONITORING HYBRID BONDS IN A SEMICONDUCTOR CHIP PACKAGE | December 2023 | March 2026 | Allow | 27 | 0 | 0 | No | No |
| 18538795 | HIGH VOLTAGE THREE-DIMENSIONAL DEVICES HAVING DIELECTRIC LINERS | December 2023 | July 2024 | Allow | 7 | 0 | 0 | No | No |
| 18531359 | ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES | December 2023 | July 2024 | Allow | 7 | 0 | 0 | No | No |
| 18527457 | SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER THE IC | December 2023 | October 2024 | Allow | 11 | 1 | 0 | No | No |
| 18516311 | POLYSILICON RESISTOR STRUCTURES | November 2023 | December 2024 | Allow | 13 | 1 | 0 | No | No |
| 18514589 | TANDEM VISION WINDOW AND MEDIA DISPLAY | November 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18387921 | Integrated Assemblies Comprising Hydrogen Diffused Within Two or More Different Semiconductor Materials, and Methods of Forming Integrated Assemblies | November 2023 | May 2024 | Allow | 6 | 0 | 0 | No | No |
| 18494035 | SILICON CARBIDE SEMICONDUCTOR DEVICE | October 2023 | March 2026 | Allow | 28 | 0 | 0 | No | No |
| 18493067 | CONTROLLERS FOR OPTICALLY-SWITCHABLE DEVICES | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18381969 | SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA | October 2023 | August 2024 | Allow | 10 | 0 | 0 | No | No |
| 18489652 | METHOD OF MAKING SEMICONDUCTOR DEVICE ELECTROSTATIC DISCHARGE DIODE | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18487217 | INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18484452 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | October 2023 | July 2024 | Allow | 9 | 1 | 0 | No | No |
| 18375761 | DOUBLE-SIDED COOLING TYPE POWER MODULE AND MANUFACTURING METHOD THEREFOR | October 2023 | April 2024 | Allow | 7 | 0 | 0 | No | No |
| 18470844 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE | September 2023 | April 2024 | Allow | 7 | 0 | 0 | No | No |
| 18232413 | CAPACITOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | August 2023 | March 2024 | Allow | 7 | 0 | 0 | No | No |
| 18447200 | S-Contact for SOI | August 2023 | March 2024 | Allow | 7 | 0 | 0 | No | No |
| 18365424 | METHOD TO EMBED PLANAR FETS WITH FINFETS | August 2023 | February 2024 | Allow | 6 | 0 | 0 | No | No |
| 18361556 | Gate Isolation Feature and Manufacturing Method Thereof | July 2023 | February 2024 | Allow | 7 | 0 | 0 | No | No |
| 18226783 | FLOW FIELD IDENTIFICATION METHOD OF ARTIFICIAL INTELLIGENCE FISH SIMULATION SYSTEM | July 2023 | January 2025 | Abandon | 18 | 2 | 0 | No | No |
| 18226961 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | July 2023 | January 2026 | Allow | 30 | 0 | 1 | No | No |
| 18227059 | METHODS AND DEVICES FOR VERTICAL CONNECTION WITH INTERNAL EPITAXIAL STRUCTURE | July 2023 | November 2025 | Allow | 27 | 0 | 0 | No | No |
| 18356860 | Dipole-Engineered High-K Gate Dielectric and Method Forming Same | July 2023 | February 2024 | Allow | 7 | 0 | 0 | No | No |
| 18224582 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | July 2023 | March 2026 | Allow | 32 | 1 | 0 | No | No |
| 18355253 | REDUCING PARASITIC CAPACITANCE FOR GATE-ALL-AROUND DEVICE BY FORMING EXTRA INNER SPACERS | July 2023 | August 2024 | Allow | 13 | 2 | 0 | Yes | No |
| 18220980 | Lead Frame, Packaging Structure and Packaging Method | July 2023 | March 2026 | Allow | 32 | 1 | 0 | No | No |
| 18218322 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | July 2023 | March 2026 | Allow | 32 | 1 | 0 | Yes | No |
| 18345248 | HEAT DISSIPATION IN SEMICONDUCTOR DEVICES | June 2023 | March 2026 | Allow | 33 | 1 | 0 | No | No |
| 18212935 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT | June 2023 | February 2024 | Allow | 7 | 0 | 0 | No | No |
| 18338453 | HEAT RADIATION STRUCTURE AND ELECTRONIC APPARATUS | June 2023 | October 2025 | Allow | 28 | 0 | 0 | No | No |
| 18211911 | SEMICONDUCTOR PACKAGE ENCAPSULANT WITH METAL ACTIVATED INORGANIC FILLER PARTICLES | June 2023 | February 2026 | Allow | 32 | 1 | 0 | No | No |
| 18208034 | DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME | June 2023 | February 2026 | Allow | 32 | 1 | 0 | Yes | No |
| 18325001 | LIGHT-EMITTING ELEMENT ENCAPSULATION STRUCTURE, DISPLAY PANEL, DISPLAY DEVICE, AND MANUFACTURING METHODS | May 2023 | November 2025 | Allow | 30 | 1 | 0 | No | No |
| 18202128 | SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME | May 2023 | January 2026 | Allow | 32 | 1 | 0 | Yes | No |
| 18201731 | OPTICAL SENSING SYSTEM | May 2023 | December 2023 | Allow | 7 | 0 | 0 | No | No |
| 18198497 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | May 2023 | January 2026 | Allow | 32 | 1 | 0 | No | No |
| 18318827 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | May 2023 | February 2026 | Allow | 33 | 1 | 0 | Yes | No |
| 18318208 | SEMICONDUCTOR STRUCTURE | May 2023 | December 2023 | Allow | 7 | 0 | 0 | No | No |
| 18196441 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | May 2023 | January 2026 | Allow | 32 | 1 | 0 | No | No |
| 18314566 | PHOTORESIST AND FORMATION METHOD THEREOF | May 2023 | December 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 18144822 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | May 2023 | December 2023 | Allow | 8 | 0 | 0 | No | No |
| 18144811 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | May 2023 | February 2024 | Allow | 9 | 1 | 0 | No | No |
| 18143082 | METHODS RELATED TO SWITCH BODY CONNECTIONS TO ACHIEVE SOFT BREAKDOWN | May 2023 | December 2023 | Allow | 7 | 0 | 0 | No | No |
| 18312372 | SEMICONDUCTOR DEVICE | May 2023 | April 2024 | Allow | 11 | 1 | 0 | No | No |
| 18251678 | SEMICONDUCTOR DEVICE | May 2023 | February 2026 | Allow | 33 | 1 | 0 | No | No |
| 18305959 | EDGE SEALS FOR SEMICONDUCTOR PACKAGES | April 2023 | November 2023 | Allow | 7 | 0 | 0 | No | No |
| 18137271 | QUANTUM ANNEALING DEBUGGING SYSTEMS AND METHODS | April 2023 | December 2023 | Allow | 8 | 0 | 0 | No | No |
| 18128871 | SEMICONDUCTOR PACKAGE | March 2023 | January 2026 | Allow | 34 | 1 | 0 | Yes | No |
| 18180140 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | March 2023 | January 2024 | Allow | 10 | 1 | 0 | No | No |
| 18179570 | ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF | March 2023 | March 2026 | Allow | 36 | 2 | 0 | No | No |
| 18178973 | SEMICONDUCTOR DEVICE | March 2023 | August 2025 | Allow | 30 | 0 | 0 | No | No |
| 18179072 | SINTERING FILM FRAMES AND RELATED METHODS | March 2023 | February 2026 | Allow | 35 | 1 | 0 | No | No |
| 18176451 | METHOD FOR MANUFACTURING COLOR MICRO LED DISPLAY CHIP MODULE | February 2023 | November 2025 | Allow | 33 | 1 | 0 | No | No |
| 18175805 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | February 2023 | December 2025 | Allow | 34 | 1 | 0 | No | No |
| 18175718 | ELECTRICAL CHARACTERIZATION OF MISALIGNMENT IN INTEGRATED CIRCUIT MANUFACTURING | February 2023 | January 2026 | Allow | 34 | 1 | 0 | No | No |
| 18042894 | PASTE COMPOSITION AND SEMICONDUCTOR DEVICE | February 2023 | December 2025 | Allow | 34 | 1 | 0 | No | No |
| 18112483 | RESISTIVE RANDOM ACCESS MEMORY DEVICE AND FABRICATION METHOD THEREOF | February 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18111313 | HIGH VOLTAGE THREE-DIMENSIONAL DEVICES HAVING DIELECTRIC LINERS | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18021778 | THIN FILM TRANSISTOR, DISPLAY SUBSTRATE AND DISPLAY DEVICE | February 2023 | July 2025 | Allow | 29 | 0 | 0 | No | No |
| 18169518 | Metal Nitride Core-Shell Particle Die-Attach Material | February 2023 | December 2025 | Allow | 34 | 1 | 0 | No | No |
| 18168753 | SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION AND METHODS OF FORMING THE SAME | February 2023 | June 2023 | Allow | 4 | 0 | 0 | No | No |
| 18168795 | SEMICONDUCTOR PACKAGE | February 2023 | July 2025 | Allow | 29 | 0 | 0 | No | No |
| 18104471 | ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME | February 2023 | January 2026 | Allow | 35 | 2 | 0 | Yes | No |
| 18161701 | SEMICONDUCTOR DEVICE | January 2023 | September 2023 | Allow | 7 | 1 | 0 | No | No |
| 18102147 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | January 2023 | October 2025 | Allow | 32 | 1 | 0 | No | No |
| 18154847 | SEMICONDUCTOR STRUCTURE WITH TESTING PADS AND METHOD OF MANUFACTURING THEREOF | January 2023 | September 2025 | Allow | 32 | 1 | 0 | No | No |
| 18097057 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | January 2023 | October 2023 | Allow | 9 | 1 | 0 | No | No |
| 18152776 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME | January 2023 | September 2025 | Allow | 32 | 1 | 0 | No | No |
| 18093959 | LIGHT EMITTING ELEMENT, METHOD FOR FABRICATING THE SAME AND DISPLAY DEVICE | January 2023 | February 2026 | Allow | 37 | 2 | 0 | No | No |
| 18146712 | LOW-STRESS THERMAL INTERFACE | December 2022 | October 2025 | Allow | 33 | 1 | 0 | No | No |
| 18146964 | LIGHT EMITTING DISPLAY APPARATUS | December 2022 | October 2025 | Allow | 33 | 1 | 0 | No | No |
| 18073398 | Display Device and Method of Manufacturing the Same | December 2022 | July 2025 | Allow | 31 | 0 | 1 | No | No |
| 17928445 | CHEMICAL SENSOR AND METHOD OF FORMING THE SAME | November 2022 | September 2025 | Allow | 33 | 1 | 0 | No | No |
| 17927564 | LIGHT-EMITTING DEVICE AND DISPLAY DEVICE | November 2022 | January 2026 | Abandon | 38 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner INOUSSA, MOULOUCOULAY.
With a 25.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 56.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner INOUSSA, MOULOUCOULAY works in Art Unit 2818 and has examined 699 patent applications in our dataset. With an allowance rate of 84.4%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 27 months.
Examiner INOUSSA, MOULOUCOULAY's allowance rate of 84.4% places them in the 60% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by INOUSSA, MOULOUCOULAY receive 1.89 office actions before reaching final disposition. This places the examiner in the 45% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by INOUSSA, MOULOUCOULAY is 27 months. This places the examiner in the 73% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +5.4% benefit to allowance rate for applications examined by INOUSSA, MOULOUCOULAY. This interview benefit is in the 31% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 35.4% of applications are subsequently allowed. This success rate is in the 79% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 21.2% of cases where such amendments are filed. This entry rate is in the 27% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 88.9% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 67% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 87.5% of appeals filed. This is in the 81% percentile among all examiners. Of these withdrawals, 42.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 85.7% are granted (fully or in part). This grant rate is in the 87% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 0.4% of allowed cases (in the 59% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 4.1% of allowed cases (in the 77% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.