USPTO Examiner BELOUSOV ALEXANDER - Art Unit 2818

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18929587BACK-ILLUMINATED SENSOR AND METHOD OF MAKING SAMEOctober 2024August 2025Allow1001NoNo
18497947SYSTEM ON WAFER ASSEMBLY STRUCTURE AND ASSEMBLY METHOD THEREOFOctober 2023July 2024Allow901NoNo
18446754IMAGE SENSOR AND MANUFACTURING METHOD THEREOFAugust 2023February 2026Allow3000NoNo
18358924IMAGE SENSOR AND MANUFACTURING METHOD THEREOFJuly 2023March 2026Allow3101NoNo
18355467ENHANCED TRENCH ISOLATION STRUCTUREJuly 2023November 2025Allow2810NoNo
18344794INTEGRATED CIRCUIT INCLUDING INTEGRATED STANDARD CELL STRUCTUREJune 2023April 2025Allow2100NoNo
18332627SOLID SOURCE SUBLIMATORJune 2023October 2025Allow2910NoNo
18331011INTEGRATED CIRCUITJune 2023October 2025Allow2910NoNo
18329218SEMICONDUCTOR DEVICEJune 2023September 2025Allow2710NoNo
18144779PHOTO-DETECTING APPARATUS WITH LOW DARK CURRENTMay 2023February 2026Allow3311YesNo
18140115SEMICONDUCTOR DEVICEApril 2023December 2024Allow2000NoNo
18302004IMAGE SENSOR AND MANUFACTURING METHOD THEREOFApril 2023December 2024Allow2000NoNo
18301714IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAMEApril 2023November 2024Allow1900NoNo
18248870IMPEDANCE-MATCHING METHOD, IMPEDANCE-MATCHING DEVICE, AND SEMICONDUCTOR PROCESS APPARATUSApril 2023February 2025Allow2201NoNo
18192712SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURINGTHE SAMEMarch 2023March 2025Allow2410YesNo
17283901OPTICAL SEMICONDUCTOR ARRAYMarch 2023August 2025Allow5200NoNo
18181332SEMICONDUCTOR DEVICE, BATTERY PROTECTION CIRCUIT, AND POWER MANAGEMENT CIRCUITMarch 2023May 2024Abandon1411NoNo
18180738PHOTOELECTRIC CONVERSION APPARATUS, SUBSTRATE, MANUFACTURING METHOD, AND EQUIPMENTMarch 2023January 2026Allow3401NoNo
18118264INTEGRATED PHOTOSENSITIVE MODULE, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND PREPARATION METHOD THEREFORMarch 2023February 2026Allow3510NoNo
18174490LIGHT-EMITTING DEVICEFebruary 2023March 2025Allow2510NoNo
18155096HIGH ASPECT RATIO BACK SIDE DEEP TRENCH ISOLATON STRUCTURE WITH SUBSTRATE-EMBEDDED METAL GRID AND NO PINCH OFFJanuary 2023March 2026Allow3711NoNo
18093217METHODS FOR IMPROVING LIGHT SENSOR RESPONSEJanuary 2023September 2025Allow3201NoNo
18149279INTEGRATED CIRCUIT STRUCTURE WITH MULTI-ROW CELL FOR ACCOMMODATING MIXED TRACK HEIGHTJanuary 2023October 2025Allow3410NoNo
18090664ELECTRONIC COMPONENT PACKAGEDecember 2022May 2025Allow2811NoNo
18067393IMAGE SENSORDecember 2022February 2026Allow3811NoNo
18081328METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUMDecember 2022March 2025Allow2701NoNo
18075676METHOD FOR FORMING PHOTOELECTRIC CONVERSION REGION OF IMAGE SENSING DEVICEDecember 2022December 2025Abandon3710NoNo
17972180SEMICONDUCTOR DEVICEOctober 2022January 2026Allow3911YesNo
17950556FIELD EFFECT TRANSISTORS HAVING A FINSeptember 2022July 2024Allow2100NoNo
17899071SEMICONDUCTOR TRIODEAugust 2022October 2025Allow3811YesNo
17883478METHOD AND SYSTEM FOR MANUFACTURING INTEGRATED CIRCUIT DEVICEAugust 2022September 2025Allow3711NoNo
17879108METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEAugust 2022February 2025Allow3120NoNo
17876878IMAGE SENSOR DEVICEJuly 2022March 2025Allow3220NoNo
17816000Image Sensors With Stress Adjusting LayersJuly 2022June 2024Allow2300NoNo
17876244EPITAXIAL GROWTH METHODS AND STRUCTURES THEREOFJuly 2022March 2025Allow3201NoNo
17874321IMAGE SENSOR AND MANUFACTURING METHOD THEREOFJuly 2022October 2024Allow2601NoNo
17875257INTEGRATED CIRCUITJuly 2022January 2025Allow3020NoNo
17873512IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAMEJuly 2022September 2024Allow2610NoNo
17868805SEMICONDUCTOR DEVICEJuly 2022February 2026Allow4311NoNo
17858688IMAGING DEVICE AND SIGNAL PROCESSING DEVICEJuly 2022June 2024Allow2400NoNo
17847971ETCHING ISOLATION FEATURES AND DENSE FEATURES WITHIN A SUBSTRATEJune 2022June 2024Allow2400NoNo
17752994MANUFACTURING METHOD OF FILTER FOR SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD OF SOLID-STATE IMAGING ELEMENTMay 2022February 2026Allow4411NoNo
17739613Multiply Spin-Coated Ultra-Thick Hybrid Hard Mask for Sub 60nm MRAM DevicesMay 2022June 2024Allow2500NoNo
17661729INTEGRATED CIRCUITMay 2022February 2025Allow3401NoNo
17731240MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTUREApril 2022January 2024Allow2100NoNo
17770590BACK PLATE AND ANODE BACK PLATE FOR 3D PRINTINGApril 2022July 2025Allow3911NoNo
17719836IMAGE SENSORApril 2022December 2025Allow4421YesNo
17768405IMAGING DEVICEApril 2022November 2025Abandon4420NoNo
17652300Component Carrier With a Photoimageable Dielectric Layer and a Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic RadiationFebruary 2022April 2025Allow3711NoNo
17676864IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOFFebruary 2022June 2025Abandon4001NoNo
17675652METHOD OF MANUFACTURING A LIGHT EMITTING DEVICEFebruary 2022June 2024Allow2820NoNo
17670626INTEGRATED CIRCUIT INCLUDING STANDARD CELLS, AND METHOD OF DESIGNING THE INTEGRATED CIRCUITFebruary 2022January 2026Allow4721YesNo
17666770CMOS Image Sensors with Per-Pixel Micro-Lens ArraysFebruary 2022May 2025Allow4040YesNo
17667286WIDEBAND DETECTOR STRUCTURESFebruary 2022March 2025Allow3711NoNo
17590857TEMPERATURE CONTROL DEVICE FOR SEMICONDUCTOR WAFER AND TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR WAFERFebruary 2022June 2025Allow4121NoNo
17572682HEAT DISSIPATION SHEET, MANUFACTURING METHOD OF HEAT DISSIPATION SHEET, AND ELECTRONIC APPARATUSJanuary 2022January 2024Allow2410NoNo
17567753STACKED TRANSISTORSJanuary 2022April 2024Allow2700NoNo
17564308IMAGE SENSORS AND METHODS OF FABRICATING THE SAMEDecember 2021February 2026Allow4931YesNo
17562577PASSIVATION-ENHANCED IMAGE SENSOR AND SURFACE-PASSIVATION METHODDecember 2021October 2024Allow3301NoNo
17547382SEMICONDUCTOR PACKAGEDecember 2021January 2025Allow3720YesNo
17518600BACKSIDE ILLUMINATED AVALANCHE PHOTODIODE AND MANUFACTURING METHOD THEREOFNovember 2021July 2024Allow3301NoNo
17510948PHOSPHOR CONVERTER STRUCTURES FOR THIN FILM PACKAGES AND METHOD OF MANUFACTUREOctober 2021October 2024Abandon3520NoNo
17606030TEST STRUCTURE AND MANUFACTURING METHOD THEREOFOctober 2021November 2025Abandon4921NoNo
17506947IMAGE SENSOR PIXEL WITH DEEP TRENCH ISOLATION STRUCTUREOctober 2021January 2025Allow3911NoNo
17507213PHOTODETECTORS WITH A DEEP TRENCH ISOLATION REGION THAT INCLUDES A BRAGG MIRROROctober 2021December 2024Allow3811NoNo
17488616DETECTION PANEL, METHOD FOR MANUFACTURING THE SAME AND FLAT PANEL DETECTORSeptember 2021September 2024Allow3501NoNo
17479154SEMICONDUCTOR STRUCTURESeptember 2021October 2024Allow3611NoNo
17478556DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSORSeptember 2021June 2024Allow3301NoNo
17476989Image Sensor Pixel with Deep Trench Isolation StructureSeptember 2021October 2024Allow3711NoNo
17469702ELECTRONIC DEVICE COMPRISING A PHOTOSENSITIVE SEMICONDUCTOR REGION AND CORRESPONDING MANUFACTURING METHODSeptember 2021March 2025Abandon4221NoNo
17446954IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAYSeptember 2021June 2024Allow3311NoNo
17463222IMAGE SENSOR WITH VARYING DEPTH DEEP TRENCH ISOLATION STRUCTURE FOR REDUCED CROSSTALKAugust 2021January 2025Allow4121YesNo
17462974INTEGRATED CIRCUIT DEVICE, METHOD AND SYSTEMAugust 2021December 2024Allow4021YesNo
17460961BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAMEAugust 2021April 2024Allow3111NoNo
17461047BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAMEAugust 2021April 2024Allow3201NoNo
17410025SINGLE-PHOTON AVALANCHE DIODES WITH DEEP TRENCH ISOLATIONAugust 2021September 2024Allow3721YesNo
17408257SEMICONDUCTOR DEVICE CONTACT PAD AND METHOD OF CONTACT PAD FABRICATIONAugust 2021May 2024Allow3321NoNo
17444923INTEGRATED CIRCUIT AND METHOD OF FORMING SAMEAugust 2021March 2025Allow4321NoNo
17391302BOND PAD STRUCTURE WITH HIGH VIA DENSITYAugust 2021October 2024Allow3821YesNo
17385430METHOD FOR MANUFACTURING DEEP TRENCH ISOLATION GRID STRUCTUREJuly 2021April 2024Allow3311NoNo
17384956BACKSIDE STRUCTURE FOR IMAGE SENSORJuly 2021April 2024Allow3211YesNo
17383376PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFJuly 2021March 2024Allow3211NoNo
17383208CELL ARCHITECTURE FOR A SEMICONDUCTOR DEVICEJuly 2021November 2025Allow5151YesNo
17378472PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING THE PACKAGING STRUCTUREJuly 2021April 2024Allow3311NoNo
17378493SEMICONDUCTOR STRUCTUREJuly 2021October 2024Allow3921NoNo
17378365SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAMEJuly 2021February 2025Allow4321NoNo
17372888CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAMEJuly 2021September 2024Allow3921YesNo
17354469DEVICE MISMATCH MITIGATION FOR MEDIUM RANGE AND BEYOND DISTANCESJune 2021September 2024Allow3921NoNo
17352919ISOLATION EPITAXIAL BI-LAYER FOR BACKSIDE DEEP TRENCH ISOLATION STRUCTURE IN AN IMAGE SENSORJune 2021March 2024Allow3311NoNo
17353003HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCEJune 2021December 2024Allow4121YesNo
17333969OPTICAL SENSOR COMPRISING A PHOTODIODE ARRAYMay 2021June 2024Allow3721NoNo
17306058Substrate with Cut Semiconductor Pieces Having Measurement Test Structures for Semiconductor MetrologyMay 2021January 2024Allow3311NoNo
17220212SEMICONDUCTOR DEVICE, SEMICONDUCTOR IMAGE SENSOR, AND METHOD OF MANUFACTURING THE SAMEApril 2021November 2024Allow4331NoNo
17207378IMAGE SENSOR WITH HIGH QUANTUM EFFICIENCYMarch 2021October 2024Allow4331YesNo
17197291DIELECTRIC STRUCTURE OVERLYING IMAGE SENSOR ELEMENT TO INCREASE QUANTUM EFFICIENCYMarch 2021August 2024Allow4122NoNo
17176959SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEFebruary 2021March 2024Allow3731NoNo
17096353PHOTOELECTRIC CONVERSION DEVICE AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICENovember 2020January 2024Allow3821NoNo
17046924BACK SURFACE INCIDENT TYPE SEMICONDUCTOR PHOTO DETECTION ELEMENTOctober 2020February 2024Allow4020NoNo
17042897DISPLAY DEVICESeptember 2020March 2024Allow4201NoNo
16994963EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSORAugust 2020February 2024Allow4222YesNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner BELOUSOV, ALEXANDER.

Strategic Value of Filing an Appeal

Total Appeal Filings
4
Allowed After Appeal Filing
2
(50.0%)
Not Allowed After Appeal Filing
2
(50.0%)
Filing Benefit Percentile
80.2%
Higher than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 50.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.

Strategic Recommendations

Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.

Examiner BELOUSOV, ALEXANDER - Prosecution Strategy Guide

Executive Summary

Examiner BELOUSOV, ALEXANDER works in Art Unit 2818 and has examined 150 patent applications in our dataset. With an allowance rate of 98.0%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 33 months.

Allowance Patterns

Examiner BELOUSOV, ALEXANDER's allowance rate of 98.0% places them in the 90% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.

Office Action Patterns

On average, applications examined by BELOUSOV, ALEXANDER receive 1.61 office actions before reaching final disposition. This places the examiner in the 31% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by BELOUSOV, ALEXANDER is 33 months. This places the examiner in the 48% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.

Interview Effectiveness

Conducting an examiner interview provides a +3.6% benefit to allowance rate for applications examined by BELOUSOV, ALEXANDER. This interview benefit is in the 26% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 33.1% of applications are subsequently allowed. This success rate is in the 71% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 26.7% of cases where such amendments are filed. This entry rate is in the 37% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 50.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 44% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 93% percentile among all examiners. Of these withdrawals, 50.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.

Petition Practice

When applicants file petitions regarding this examiner's actions, 0.0% are granted (fully or in part). This grant rate is in the 4% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 10.0% of allowed cases (in the 93% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 31% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • Appeal filing as negotiation tool: This examiner frequently reconsiders rejections during the appeal process. Filing a Notice of Appeal may prompt favorable reconsideration during the mandatory appeal conference.
  • Examiner cooperation: This examiner frequently makes examiner's amendments to place applications in condition for allowance. If you are close to allowance, the examiner may help finalize the claims.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.