Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18929587 | BACK-ILLUMINATED SENSOR AND METHOD OF MAKING SAME | October 2024 | August 2025 | Allow | 10 | 0 | 1 | No | No |
| 18497947 | SYSTEM ON WAFER ASSEMBLY STRUCTURE AND ASSEMBLY METHOD THEREOF | October 2023 | July 2024 | Allow | 9 | 0 | 1 | No | No |
| 18446754 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | August 2023 | February 2026 | Allow | 30 | 0 | 0 | No | No |
| 18358924 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | July 2023 | March 2026 | Allow | 31 | 0 | 1 | No | No |
| 18355467 | ENHANCED TRENCH ISOLATION STRUCTURE | July 2023 | November 2025 | Allow | 28 | 1 | 0 | No | No |
| 18344794 | INTEGRATED CIRCUIT INCLUDING INTEGRATED STANDARD CELL STRUCTURE | June 2023 | April 2025 | Allow | 21 | 0 | 0 | No | No |
| 18332627 | SOLID SOURCE SUBLIMATOR | June 2023 | October 2025 | Allow | 29 | 1 | 0 | No | No |
| 18331011 | INTEGRATED CIRCUIT | June 2023 | October 2025 | Allow | 29 | 1 | 0 | No | No |
| 18329218 | SEMICONDUCTOR DEVICE | June 2023 | September 2025 | Allow | 27 | 1 | 0 | No | No |
| 18144779 | PHOTO-DETECTING APPARATUS WITH LOW DARK CURRENT | May 2023 | February 2026 | Allow | 33 | 1 | 1 | Yes | No |
| 18140115 | SEMICONDUCTOR DEVICE | April 2023 | December 2024 | Allow | 20 | 0 | 0 | No | No |
| 18302004 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | April 2023 | December 2024 | Allow | 20 | 0 | 0 | No | No |
| 18301714 | IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME | April 2023 | November 2024 | Allow | 19 | 0 | 0 | No | No |
| 18248870 | IMPEDANCE-MATCHING METHOD, IMPEDANCE-MATCHING DEVICE, AND SEMICONDUCTOR PROCESS APPARATUS | April 2023 | February 2025 | Allow | 22 | 0 | 1 | No | No |
| 18192712 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURINGTHE SAME | March 2023 | March 2025 | Allow | 24 | 1 | 0 | Yes | No |
| 17283901 | OPTICAL SEMICONDUCTOR ARRAY | March 2023 | August 2025 | Allow | 52 | 0 | 0 | No | No |
| 18181332 | SEMICONDUCTOR DEVICE, BATTERY PROTECTION CIRCUIT, AND POWER MANAGEMENT CIRCUIT | March 2023 | May 2024 | Abandon | 14 | 1 | 1 | No | No |
| 18180738 | PHOTOELECTRIC CONVERSION APPARATUS, SUBSTRATE, MANUFACTURING METHOD, AND EQUIPMENT | March 2023 | January 2026 | Allow | 34 | 0 | 1 | No | No |
| 18118264 | INTEGRATED PHOTOSENSITIVE MODULE, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND PREPARATION METHOD THEREFOR | March 2023 | February 2026 | Allow | 35 | 1 | 0 | No | No |
| 18174490 | LIGHT-EMITTING DEVICE | February 2023 | March 2025 | Allow | 25 | 1 | 0 | No | No |
| 18155096 | HIGH ASPECT RATIO BACK SIDE DEEP TRENCH ISOLATON STRUCTURE WITH SUBSTRATE-EMBEDDED METAL GRID AND NO PINCH OFF | January 2023 | March 2026 | Allow | 37 | 1 | 1 | No | No |
| 18093217 | METHODS FOR IMPROVING LIGHT SENSOR RESPONSE | January 2023 | September 2025 | Allow | 32 | 0 | 1 | No | No |
| 18149279 | INTEGRATED CIRCUIT STRUCTURE WITH MULTI-ROW CELL FOR ACCOMMODATING MIXED TRACK HEIGHT | January 2023 | October 2025 | Allow | 34 | 1 | 0 | No | No |
| 18090664 | ELECTRONIC COMPONENT PACKAGE | December 2022 | May 2025 | Allow | 28 | 1 | 1 | No | No |
| 18067393 | IMAGE SENSOR | December 2022 | February 2026 | Allow | 38 | 1 | 1 | No | No |
| 18081328 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | December 2022 | March 2025 | Allow | 27 | 0 | 1 | No | No |
| 18075676 | METHOD FOR FORMING PHOTOELECTRIC CONVERSION REGION OF IMAGE SENSING DEVICE | December 2022 | December 2025 | Abandon | 37 | 1 | 0 | No | No |
| 17972180 | SEMICONDUCTOR DEVICE | October 2022 | January 2026 | Allow | 39 | 1 | 1 | Yes | No |
| 17950556 | FIELD EFFECT TRANSISTORS HAVING A FIN | September 2022 | July 2024 | Allow | 21 | 0 | 0 | No | No |
| 17899071 | SEMICONDUCTOR TRIODE | August 2022 | October 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17883478 | METHOD AND SYSTEM FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE | August 2022 | September 2025 | Allow | 37 | 1 | 1 | No | No |
| 17879108 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | August 2022 | February 2025 | Allow | 31 | 2 | 0 | No | No |
| 17876878 | IMAGE SENSOR DEVICE | July 2022 | March 2025 | Allow | 32 | 2 | 0 | No | No |
| 17816000 | Image Sensors With Stress Adjusting Layers | July 2022 | June 2024 | Allow | 23 | 0 | 0 | No | No |
| 17876244 | EPITAXIAL GROWTH METHODS AND STRUCTURES THEREOF | July 2022 | March 2025 | Allow | 32 | 0 | 1 | No | No |
| 17874321 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | July 2022 | October 2024 | Allow | 26 | 0 | 1 | No | No |
| 17875257 | INTEGRATED CIRCUIT | July 2022 | January 2025 | Allow | 30 | 2 | 0 | No | No |
| 17873512 | IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME | July 2022 | September 2024 | Allow | 26 | 1 | 0 | No | No |
| 17868805 | SEMICONDUCTOR DEVICE | July 2022 | February 2026 | Allow | 43 | 1 | 1 | No | No |
| 17858688 | IMAGING DEVICE AND SIGNAL PROCESSING DEVICE | July 2022 | June 2024 | Allow | 24 | 0 | 0 | No | No |
| 17847971 | ETCHING ISOLATION FEATURES AND DENSE FEATURES WITHIN A SUBSTRATE | June 2022 | June 2024 | Allow | 24 | 0 | 0 | No | No |
| 17752994 | MANUFACTURING METHOD OF FILTER FOR SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD OF SOLID-STATE IMAGING ELEMENT | May 2022 | February 2026 | Allow | 44 | 1 | 1 | No | No |
| 17739613 | Multiply Spin-Coated Ultra-Thick Hybrid Hard Mask for Sub 60nm MRAM Devices | May 2022 | June 2024 | Allow | 25 | 0 | 0 | No | No |
| 17661729 | INTEGRATED CIRCUIT | May 2022 | February 2025 | Allow | 34 | 0 | 1 | No | No |
| 17731240 | MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE | April 2022 | January 2024 | Allow | 21 | 0 | 0 | No | No |
| 17770590 | BACK PLATE AND ANODE BACK PLATE FOR 3D PRINTING | April 2022 | July 2025 | Allow | 39 | 1 | 1 | No | No |
| 17719836 | IMAGE SENSOR | April 2022 | December 2025 | Allow | 44 | 2 | 1 | Yes | No |
| 17768405 | IMAGING DEVICE | April 2022 | November 2025 | Abandon | 44 | 2 | 0 | No | No |
| 17652300 | Component Carrier With a Photoimageable Dielectric Layer and a Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic Radiation | February 2022 | April 2025 | Allow | 37 | 1 | 1 | No | No |
| 17676864 | IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF | February 2022 | June 2025 | Abandon | 40 | 0 | 1 | No | No |
| 17675652 | METHOD OF MANUFACTURING A LIGHT EMITTING DEVICE | February 2022 | June 2024 | Allow | 28 | 2 | 0 | No | No |
| 17670626 | INTEGRATED CIRCUIT INCLUDING STANDARD CELLS, AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT | February 2022 | January 2026 | Allow | 47 | 2 | 1 | Yes | No |
| 17666770 | CMOS Image Sensors with Per-Pixel Micro-Lens Arrays | February 2022 | May 2025 | Allow | 40 | 4 | 0 | Yes | No |
| 17667286 | WIDEBAND DETECTOR STRUCTURES | February 2022 | March 2025 | Allow | 37 | 1 | 1 | No | No |
| 17590857 | TEMPERATURE CONTROL DEVICE FOR SEMICONDUCTOR WAFER AND TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR WAFER | February 2022 | June 2025 | Allow | 41 | 2 | 1 | No | No |
| 17572682 | HEAT DISSIPATION SHEET, MANUFACTURING METHOD OF HEAT DISSIPATION SHEET, AND ELECTRONIC APPARATUS | January 2022 | January 2024 | Allow | 24 | 1 | 0 | No | No |
| 17567753 | STACKED TRANSISTORS | January 2022 | April 2024 | Allow | 27 | 0 | 0 | No | No |
| 17564308 | IMAGE SENSORS AND METHODS OF FABRICATING THE SAME | December 2021 | February 2026 | Allow | 49 | 3 | 1 | Yes | No |
| 17562577 | PASSIVATION-ENHANCED IMAGE SENSOR AND SURFACE-PASSIVATION METHOD | December 2021 | October 2024 | Allow | 33 | 0 | 1 | No | No |
| 17547382 | SEMICONDUCTOR PACKAGE | December 2021 | January 2025 | Allow | 37 | 2 | 0 | Yes | No |
| 17518600 | BACKSIDE ILLUMINATED AVALANCHE PHOTODIODE AND MANUFACTURING METHOD THEREOF | November 2021 | July 2024 | Allow | 33 | 0 | 1 | No | No |
| 17510948 | PHOSPHOR CONVERTER STRUCTURES FOR THIN FILM PACKAGES AND METHOD OF MANUFACTURE | October 2021 | October 2024 | Abandon | 35 | 2 | 0 | No | No |
| 17606030 | TEST STRUCTURE AND MANUFACTURING METHOD THEREOF | October 2021 | November 2025 | Abandon | 49 | 2 | 1 | No | No |
| 17506947 | IMAGE SENSOR PIXEL WITH DEEP TRENCH ISOLATION STRUCTURE | October 2021 | January 2025 | Allow | 39 | 1 | 1 | No | No |
| 17507213 | PHOTODETECTORS WITH A DEEP TRENCH ISOLATION REGION THAT INCLUDES A BRAGG MIRROR | October 2021 | December 2024 | Allow | 38 | 1 | 1 | No | No |
| 17488616 | DETECTION PANEL, METHOD FOR MANUFACTURING THE SAME AND FLAT PANEL DETECTOR | September 2021 | September 2024 | Allow | 35 | 0 | 1 | No | No |
| 17479154 | SEMICONDUCTOR STRUCTURE | September 2021 | October 2024 | Allow | 36 | 1 | 1 | No | No |
| 17478556 | DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | September 2021 | June 2024 | Allow | 33 | 0 | 1 | No | No |
| 17476989 | Image Sensor Pixel with Deep Trench Isolation Structure | September 2021 | October 2024 | Allow | 37 | 1 | 1 | No | No |
| 17469702 | ELECTRONIC DEVICE COMPRISING A PHOTOSENSITIVE SEMICONDUCTOR REGION AND CORRESPONDING MANUFACTURING METHOD | September 2021 | March 2025 | Abandon | 42 | 2 | 1 | No | No |
| 17446954 | IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAY | September 2021 | June 2024 | Allow | 33 | 1 | 1 | No | No |
| 17463222 | IMAGE SENSOR WITH VARYING DEPTH DEEP TRENCH ISOLATION STRUCTURE FOR REDUCED CROSSTALK | August 2021 | January 2025 | Allow | 41 | 2 | 1 | Yes | No |
| 17462974 | INTEGRATED CIRCUIT DEVICE, METHOD AND SYSTEM | August 2021 | December 2024 | Allow | 40 | 2 | 1 | Yes | No |
| 17460961 | BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | August 2021 | April 2024 | Allow | 31 | 1 | 1 | No | No |
| 17461047 | BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | August 2021 | April 2024 | Allow | 32 | 0 | 1 | No | No |
| 17410025 | SINGLE-PHOTON AVALANCHE DIODES WITH DEEP TRENCH ISOLATION | August 2021 | September 2024 | Allow | 37 | 2 | 1 | Yes | No |
| 17408257 | SEMICONDUCTOR DEVICE CONTACT PAD AND METHOD OF CONTACT PAD FABRICATION | August 2021 | May 2024 | Allow | 33 | 2 | 1 | No | No |
| 17444923 | INTEGRATED CIRCUIT AND METHOD OF FORMING SAME | August 2021 | March 2025 | Allow | 43 | 2 | 1 | No | No |
| 17391302 | BOND PAD STRUCTURE WITH HIGH VIA DENSITY | August 2021 | October 2024 | Allow | 38 | 2 | 1 | Yes | No |
| 17385430 | METHOD FOR MANUFACTURING DEEP TRENCH ISOLATION GRID STRUCTURE | July 2021 | April 2024 | Allow | 33 | 1 | 1 | No | No |
| 17384956 | BACKSIDE STRUCTURE FOR IMAGE SENSOR | July 2021 | April 2024 | Allow | 32 | 1 | 1 | Yes | No |
| 17383376 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | July 2021 | March 2024 | Allow | 32 | 1 | 1 | No | No |
| 17383208 | CELL ARCHITECTURE FOR A SEMICONDUCTOR DEVICE | July 2021 | November 2025 | Allow | 51 | 5 | 1 | Yes | No |
| 17378472 | PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING THE PACKAGING STRUCTURE | July 2021 | April 2024 | Allow | 33 | 1 | 1 | No | No |
| 17378493 | SEMICONDUCTOR STRUCTURE | July 2021 | October 2024 | Allow | 39 | 2 | 1 | No | No |
| 17378365 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME | July 2021 | February 2025 | Allow | 43 | 2 | 1 | No | No |
| 17372888 | CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME | July 2021 | September 2024 | Allow | 39 | 2 | 1 | Yes | No |
| 17354469 | DEVICE MISMATCH MITIGATION FOR MEDIUM RANGE AND BEYOND DISTANCES | June 2021 | September 2024 | Allow | 39 | 2 | 1 | No | No |
| 17352919 | ISOLATION EPITAXIAL BI-LAYER FOR BACKSIDE DEEP TRENCH ISOLATION STRUCTURE IN AN IMAGE SENSOR | June 2021 | March 2024 | Allow | 33 | 1 | 1 | No | No |
| 17353003 | HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE | June 2021 | December 2024 | Allow | 41 | 2 | 1 | Yes | No |
| 17333969 | OPTICAL SENSOR COMPRISING A PHOTODIODE ARRAY | May 2021 | June 2024 | Allow | 37 | 2 | 1 | No | No |
| 17306058 | Substrate with Cut Semiconductor Pieces Having Measurement Test Structures for Semiconductor Metrology | May 2021 | January 2024 | Allow | 33 | 1 | 1 | No | No |
| 17220212 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR IMAGE SENSOR, AND METHOD OF MANUFACTURING THE SAME | April 2021 | November 2024 | Allow | 43 | 3 | 1 | No | No |
| 17207378 | IMAGE SENSOR WITH HIGH QUANTUM EFFICIENCY | March 2021 | October 2024 | Allow | 43 | 3 | 1 | Yes | No |
| 17197291 | DIELECTRIC STRUCTURE OVERLYING IMAGE SENSOR ELEMENT TO INCREASE QUANTUM EFFICIENCY | March 2021 | August 2024 | Allow | 41 | 2 | 2 | No | No |
| 17176959 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | February 2021 | March 2024 | Allow | 37 | 3 | 1 | No | No |
| 17096353 | PHOTOELECTRIC CONVERSION DEVICE AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE | November 2020 | January 2024 | Allow | 38 | 2 | 1 | No | No |
| 17046924 | BACK SURFACE INCIDENT TYPE SEMICONDUCTOR PHOTO DETECTION ELEMENT | October 2020 | February 2024 | Allow | 40 | 2 | 0 | No | No |
| 17042897 | DISPLAY DEVICE | September 2020 | March 2024 | Allow | 42 | 0 | 1 | No | No |
| 16994963 | EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR | August 2020 | February 2024 | Allow | 42 | 2 | 2 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner BELOUSOV, ALEXANDER.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 50.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner BELOUSOV, ALEXANDER works in Art Unit 2818 and has examined 150 patent applications in our dataset. With an allowance rate of 98.0%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 33 months.
Examiner BELOUSOV, ALEXANDER's allowance rate of 98.0% places them in the 90% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by BELOUSOV, ALEXANDER receive 1.61 office actions before reaching final disposition. This places the examiner in the 31% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by BELOUSOV, ALEXANDER is 33 months. This places the examiner in the 48% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +3.6% benefit to allowance rate for applications examined by BELOUSOV, ALEXANDER. This interview benefit is in the 26% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 33.1% of applications are subsequently allowed. This success rate is in the 71% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 26.7% of cases where such amendments are filed. This entry rate is in the 37% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 50.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 44% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 93% percentile among all examiners. Of these withdrawals, 50.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 0.0% are granted (fully or in part). This grant rate is in the 4% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 10.0% of allowed cases (in the 93% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 31% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.