Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18732662 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | June 2024 | April 2025 | Allow | 10 | 1 | 1 | No | No |
| 18632631 | ELECTRONIC DEVICE | April 2024 | April 2025 | Allow | 12 | 1 | 0 | No | No |
| 18596678 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | March 2024 | February 2025 | Allow | 11 | 1 | 0 | No | No |
| 18581415 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | February 2024 | April 2025 | Allow | 14 | 0 | 1 | No | No |
| 18510723 | FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS FOR FORMING THE SAME | November 2023 | June 2025 | Allow | 19 | 1 | 0 | No | No |
| 18473420 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | September 2023 | December 2024 | Allow | 15 | 1 | 0 | No | No |
| 18367866 | SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS AND SYSTEMS | September 2023 | June 2025 | Allow | 21 | 2 | 0 | No | No |
| 18450143 | SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER | August 2023 | April 2024 | Allow | 8 | 0 | 0 | No | No |
| 18360749 | HIGH CONNECTIVITY DEVICE STACKING | July 2023 | April 2025 | Allow | 21 | 1 | 1 | Yes | No |
| 18360734 | FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS FOR FORMING THE SAME | July 2023 | September 2024 | Allow | 14 | 0 | 0 | No | No |
| 18358261 | MICROELECTRONIC ASSEMBLIES | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18355895 | Integrated Circuit Structure and Method with Hybrid Orientation for FinFET | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18216445 | SEMICONDUCTOR PACKAGE | June 2023 | August 2024 | Allow | 13 | 1 | 0 | No | No |
| 18308610 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | April 2023 | March 2025 | Allow | 22 | 1 | 1 | No | No |
| 18304106 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | April 2023 | February 2024 | Allow | 9 | 0 | 0 | No | No |
| 18112715 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE | February 2023 | January 2024 | Allow | 11 | 0 | 0 | No | No |
| 18108503 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE INCLUDING THE SAME | February 2023 | February 2024 | Allow | 13 | 1 | 0 | No | No |
| 18103315 | MULTI-HEIGHT INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS | January 2023 | January 2025 | Allow | 24 | 4 | 0 | No | No |
| 18155684 | CHARGED PARTICLE SOURCE MODULE | January 2023 | December 2024 | Allow | 23 | 1 | 0 | No | No |
| 18155554 | Semiconductor FinFET Device and Method | January 2023 | February 2025 | Allow | 25 | 2 | 1 | No | No |
| 18095891 | MANUFACTURABLE DEVICES FORMED ON GALLIUM AND NITROGEN MATERIAL | January 2023 | May 2024 | Allow | 16 | 1 | 0 | No | No |
| 18068041 | Low-Resistance Contact Plugs and Method Forming Same | December 2022 | April 2024 | Allow | 16 | 1 | 0 | No | No |
| 17875656 | INTEGRATED CIRCUIT PACKAGE AND METHOD | July 2022 | January 2024 | Allow | 17 | 1 | 1 | No | No |
| 17874283 | SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND METHOD OF FORMING THE SAME | July 2022 | April 2024 | Allow | 20 | 1 | 0 | No | No |
| 17874038 | MONOLITHIC LED ARRAY STRUCTURE | July 2022 | December 2024 | Abandon | 28 | 2 | 0 | No | No |
| 17869797 | INTEGRATED CIRCUIT, METHOD FOR FORMING A LAYOUT OF INTEGRATED CIRCUIT USING STANDARD CELLS | July 2022 | May 2025 | Allow | 34 | 0 | 1 | No | No |
| 17867833 | Facilitating Alignment of Stacked Chiplets | July 2022 | August 2024 | Allow | 25 | 3 | 0 | No | No |
| 17868770 | INTEGRATED CIRCUIT LAYOUT INCLUDING STANDARD CELLS AND METHOD TO FORM THE SAME | July 2022 | June 2025 | Allow | 35 | 0 | 1 | No | No |
| 17860328 | FAN-OUT PACKAGING STRUCTURE | July 2022 | June 2024 | Abandon | 23 | 2 | 0 | No | No |
| 17857186 | SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME | July 2022 | June 2025 | Allow | 35 | 2 | 0 | No | No |
| 17854584 | THIN FILM TRANSISTOR, METHOD FOR FABRICATING THE THIN FILM TRANSISTOR, THIN FILM TRANSISTOR ARRAY SUBSTRATE, AND METHOD FOR FABRICATING THE THIN FILM TRANSISTOR ARRAY SUBSTRATE | June 2022 | February 2025 | Allow | 31 | 0 | 1 | No | No |
| 17851289 | SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR AND A METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE | June 2022 | November 2024 | Allow | 28 | 0 | 0 | No | No |
| 17789170 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | June 2022 | March 2025 | Allow | 33 | 1 | 0 | No | No |
| 17848162 | DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH RUTHENIUM LINER | June 2022 | January 2024 | Allow | 19 | 2 | 1 | Yes | No |
| 17807476 | BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE | June 2022 | November 2024 | Allow | 29 | 0 | 1 | No | No |
| 17805702 | INTEGRATED CIRCUIT DEVICE | June 2022 | January 2025 | Allow | 32 | 0 | 1 | No | No |
| 17832949 | Semiconductor Package and Method | June 2022 | February 2024 | Allow | 20 | 2 | 0 | No | No |
| 17752293 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | May 2022 | February 2024 | Allow | 21 | 2 | 1 | No | No |
| 17732286 | DIVIDER AND CONTACT FORMATION FOR MEMORY CELLS | April 2022 | March 2025 | Allow | 34 | 1 | 1 | No | No |
| 17771767 | LENS MODULE | April 2022 | January 2025 | Allow | 33 | 1 | 0 | No | No |
| 17718217 | SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE BONDS AND ASSOCIATED SYSTEMS AND METHODS | April 2022 | July 2024 | Allow | 27 | 0 | 1 | No | No |
| 17716213 | METHOD FOR MANUFACTURING SWITCHING DEVICE | April 2022 | November 2024 | Allow | 32 | 1 | 0 | Yes | No |
| 17715974 | LAYOUT OF INTEGRATED CIRCUIT | April 2022 | March 2024 | Allow | 23 | 0 | 0 | No | No |
| 17714822 | LOW PROFILE SENSOR PACKAGES | April 2022 | October 2024 | Allow | 31 | 1 | 1 | No | No |
| 17699426 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE | March 2022 | April 2025 | Allow | 36 | 1 | 1 | No | No |
| 17762142 | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME | March 2022 | January 2025 | Allow | 34 | 1 | 0 | No | No |
| 17697835 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | March 2022 | April 2025 | Allow | 37 | 1 | 1 | No | No |
| 17682952 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | February 2022 | October 2024 | Allow | 31 | 1 | 1 | No | No |
| 17677578 | SEMICONDUCTOR DEVICE | February 2022 | March 2025 | Allow | 37 | 3 | 1 | No | No |
| 17675949 | HYBRID MOLD CHASE SURFACE FOR SEMICONDUCTOR BONDING AND RELATED SYSTEMS AND METHODS | February 2022 | September 2024 | Allow | 30 | 1 | 1 | No | No |
| 17592065 | THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS | February 2022 | July 2024 | Allow | 29 | 1 | 1 | No | No |
| 17590428 | LIGHT-EMITTING ELEMENT | February 2022 | May 2024 | Allow | 28 | 0 | 0 | No | No |
| 17649614 | Semiconductor Device With Unbalanced Die Stackup | February 2022 | May 2024 | Allow | 27 | 0 | 1 | No | No |
| 17587805 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | January 2022 | April 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17566661 | Chip Package and Method of Forming Chip Packages | December 2021 | June 2025 | Allow | 41 | 3 | 1 | No | No |
| 17562168 | MICRO-LED STRUCTURE AND MICRO-LED CHIP INCLUDING SAME | December 2021 | July 2024 | Allow | 30 | 1 | 0 | No | No |
| 17562272 | MICRO-LED STRUCTURE AND MICRO-LED CHIP INCLUDING SAME | December 2021 | July 2024 | Allow | 31 | 1 | 0 | No | No |
| 17555709 | METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR DIE, AND METHOD OF PRODUCING A SEMICONDUCTOR MODULE | December 2021 | September 2024 | Allow | 33 | 2 | 1 | No | No |
| 17552336 | FIELD PROGRAMMABLE PLATFORM ARRAY | December 2021 | June 2025 | Allow | 42 | 4 | 1 | No | No |
| 17617941 | DISPLAY DEVICE AND TOUCH CONTROLLER | December 2021 | January 2025 | Allow | 37 | 1 | 1 | No | No |
| 17617913 | NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | December 2021 | September 2024 | Allow | 34 | 1 | 0 | No | No |
| 17542419 | MEMORY DEVICE AND PREPARATION METHOD THEREOF | December 2021 | October 2024 | Allow | 34 | 2 | 1 | No | No |
| 17542416 | Method for Forming Chip Packages and a Chip Package | December 2021 | January 2025 | Allow | 37 | 3 | 1 | Yes | No |
| 17541986 | Electroluminescence Display Apparatus | December 2021 | May 2024 | Allow | 30 | 0 | 1 | No | No |
| 17457350 | Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device | December 2021 | March 2024 | Allow | 28 | 2 | 1 | Yes | No |
| 17536538 | SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME | November 2021 | August 2024 | Allow | 32 | 2 | 1 | No | No |
| 17535987 | Method of Forming Chip Package Having Stacked Chips | November 2021 | May 2024 | Allow | 30 | 1 | 1 | No | No |
| 17535985 | Chip Package and Method of Forming Chip Packages | November 2021 | May 2025 | Allow | 41 | 3 | 1 | No | No |
| 17610968 | EMBEDDED PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR, AND TERMINAL | November 2021 | February 2025 | Abandon | 39 | 2 | 0 | No | No |
| 17517941 | SEMICONDUCTOR DEVICE | November 2021 | April 2024 | Allow | 29 | 0 | 1 | No | No |
| 17517642 | LAYOUT OF INTEGRATED CIRCUIT | November 2021 | February 2025 | Allow | 40 | 3 | 1 | No | No |
| 17501952 | ELECTRONIC PACKAGE STRUCTURE | October 2021 | August 2024 | Allow | 34 | 2 | 1 | No | No |
| 17600385 | DISPLAY PANEL, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | September 2021 | May 2025 | Abandon | 43 | 2 | 0 | No | No |
| 17599688 | THIN FILM TRANSISTOR, DISPLAY APPARATUS, AND METHOD OF FABRICATING THIN FILM TRANSISTOR | September 2021 | July 2024 | Allow | 33 | 1 | 0 | No | No |
| 17488890 | LIGHT-EMITTING DIODE, MANUFACTURING METHOD THEREOF AND DISPLAY | September 2021 | August 2024 | Abandon | 35 | 0 | 1 | No | No |
| 17439402 | SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR | September 2021 | April 2024 | Allow | 31 | 2 | 0 | No | No |
| 17438831 | FILM DEPOSITION METHODS IN FURNACE TUBE, AND SEMICONDUCTOR DEVICES | September 2021 | July 2024 | Abandon | 34 | 1 | 0 | No | No |
| 17469127 | DISPLAY PANELS, DISPLAY APPARATUSES AND PREPARATION METHODS OF DISPLAY PANEL | September 2021 | October 2024 | Allow | 37 | 2 | 1 | No | No |
| 17465246 | Method of Manufacturing Bipolar Complementary-Metal-Oxide-Semiconductor (BiCMOS) Devices Using Nickel Silicide | September 2021 | February 2025 | Allow | 42 | 4 | 0 | No | No |
| 17446437 | MASK AND MASK ASSEMBLY | August 2021 | April 2024 | Allow | 32 | 1 | 1 | No | No |
| 17460898 | SELECTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE | August 2021 | July 2024 | Allow | 34 | 1 | 0 | Yes | No |
| 17458607 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | August 2021 | January 2024 | Allow | 29 | 2 | 2 | Yes | No |
| 17433649 | METHOD AND ASSEMBLY FOR BOARD TO BOARD CONNECTION OF ACTIVE DEVICES | August 2021 | June 2024 | Allow | 34 | 2 | 1 | No | No |
| 17428402 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | August 2021 | April 2024 | Allow | 32 | 1 | 0 | No | No |
| 17368381 | DISPLAY DEVICE AND METHOD FOR MAKING THE SAME | July 2021 | January 2024 | Allow | 30 | 3 | 1 | Yes | No |
| 17417651 | SYSTEM AND METHOD OF FABRICATING DISPLAY STRUCTURES | June 2021 | May 2024 | Abandon | 35 | 1 | 1 | No | No |
| 17330607 | DISPLAY SUBSTRATE WITH FRAME AREA, DISPLAY DEVICE WITH THE DISPLAY SUBSTRATE, METHOD OF FORMING THE DISPLAY SUBSTRATE, AND METHOD OF FORMING THE DISPLAY DEVICE | May 2021 | April 2024 | Allow | 34 | 1 | 1 | No | No |
| 17331133 | CHIP MOLDING STRUCTURE, WAFER LEVEL CHIP SCALE PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | May 2021 | July 2024 | Abandon | 38 | 2 | 1 | No | No |
| 17327737 | DEVICE OF DIELECTRIC LAYER | May 2021 | March 2024 | Allow | 33 | 1 | 1 | No | No |
| 17211736 | SPIN ORBIT TORQUE DEVICE WITH TOPOLOGICAL INSULATOR AND HEAVY METAL INSERT | March 2021 | May 2025 | Abandon | 50 | 2 | 1 | No | No |
| 17200063 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | March 2021 | January 2024 | Allow | 35 | 3 | 0 | No | No |
| 17273288 | LIGHT-EMITTING DEVICE | March 2021 | June 2025 | Allow | 52 | 5 | 0 | No | No |
| 17271645 | COMPONENT AND METHOD FOR PRODUCING A COMPONENT | February 2021 | March 2024 | Allow | 36 | 1 | 1 | No | No |
| 17270732 | Printed Circuit Board and Method of Manufacturing a Printed Circuit Board with at Least One Optoelectronic Component Integrated into the Printed Circuit Board | February 2021 | May 2024 | Abandon | 38 | 1 | 0 | No | No |
| 17179030 | THERMALLY CONDUCTIVE ELECTRONIC PACKAGING | February 2021 | June 2024 | Abandon | 40 | 1 | 1 | No | No |
| 17265815 | Display Substrate and Display Device | February 2021 | December 2023 | Allow | 34 | 1 | 0 | No | No |
| 17133603 | HIGH SPEED MEMORY SYSTEM INTEGRATION | December 2020 | June 2025 | Abandon | 54 | 2 | 1 | No | No |
| 17250270 | CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | December 2020 | June 2024 | Abandon | 42 | 1 | 1 | No | No |
| 17252274 | SENSOR MODULE, METHOD FOR MANUFACTURING SAME, AND DISPLAY PANEL | December 2020 | May 2024 | Allow | 41 | 1 | 1 | No | No |
| 17115085 | Fabrication Method of Flexible Cyclo-Olefin Polymer (COP) Substrate for IC Packaging of Communication Devices and Biocompatible Sensors Devices | December 2020 | May 2025 | Abandon | 53 | 6 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner KARIMY, TIMOR.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 55.6% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner KARIMY, TIMOR works in Art Unit 2818 and has examined 265 patent applications in our dataset. With an allowance rate of 94.0%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 25 months.
Examiner KARIMY, TIMOR's allowance rate of 94.0% places them in the 82% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by KARIMY, TIMOR receive 1.47 office actions before reaching final disposition. This places the examiner in the 35% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by KARIMY, TIMOR is 25 months. This places the examiner in the 67% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +6.8% benefit to allowance rate for applications examined by KARIMY, TIMOR. This interview benefit is in the 36% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 29.9% of applications are subsequently allowed. This success rate is in the 49% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 44.6% of cases where such amendments are filed. This entry rate is in the 62% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 150.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 89% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 75.0% of appeals filed. This is in the 61% percentile among all examiners. Of these withdrawals, 100.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 6.2% are granted (fully or in part). This grant rate is in the 6% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 4.5% of allowed cases (in the 88% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.8% of allowed cases (in the 54% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.