Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19260203 | 2D MATERIAL-INTEGRATED HALIDE PEROVSKITE THIN-FILM SEMICONDUCTOR DEVICE AND ITS FABRICATION METHOD | July 2025 | September 2025 | Allow | 2 | 0 | 0 | No | No |
| 19232724 | INTERCONNECT SUBSTRATE AND METHOD OF MAKING | June 2025 | January 2026 | Allow | 8 | 1 | 0 | No | No |
| 19218116 | MOLDED BRIDGE WITH VERTICAL INTERCONNECTS AND METHOD OF MAKING THE SAME | May 2025 | November 2025 | Allow | 6 | 1 | 1 | No | No |
| 19207750 | Semiconductor Package with Integrated Capacitors | May 2025 | March 2026 | Allow | 10 | 2 | 0 | No | No |
| 19097611 | FIELD EFFECT TRANSISTOR INCLUDING TRANSITION METAL DICHALCOGENIDE COVERED WITH PROTECTIVE LAYER, AND METHOD OF MANUFACTURING THE SAME | April 2025 | May 2025 | Allow | 1 | 0 | 0 | No | No |
| 19094943 | Optical module and optical device | March 2025 | July 2025 | Allow | 4 | 0 | 0 | No | No |
| 18874035 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | March 2025 | June 2025 | Allow | 6 | 0 | 0 | No | No |
| 19076161 | METHOD OF MANUFACTURING OPTOELECTRONIC DEVICES | March 2025 | February 2026 | Allow | 11 | 2 | 0 | No | No |
| 19064511 | QUAD FLAT NO-LEAD (QFN) PACKAGE WITH TIE BARS AND DIRECT CONTACT INTERCONNECT BUILD-UP STRUCTURE AND METHOD FOR MAKING THE SAME | February 2025 | September 2025 | Allow | 6 | 2 | 0 | No | No |
| 19063390 | Anti-radiation Low-latency Chip for Neural Network Inference Acceleration | February 2025 | June 2025 | Allow | 4 | 0 | 0 | Yes | No |
| 19063218 | DEVICE FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS) BASED ON ARRAY WATER JET-BASED EJECTION | February 2025 | April 2025 | Allow | 2 | 0 | 0 | No | No |
| 19054743 | MECHANISMS FOR FABRICATING MICRO-LEDS | February 2025 | July 2025 | Allow | 5 | 1 | 0 | No | No |
| 19040693 | BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME | January 2025 | October 2025 | Allow | 9 | 0 | 0 | No | No |
| 19021887 | FABRICATION METHOD FOR PACKAGE STRUCTURE | January 2025 | March 2025 | Allow | 2 | 0 | 0 | No | No |
| 19001454 | METHOD FOR PREPARING PEROVSKITE SOLAR CELL BY IN-SITU INJECTION OF SELF-ASSEMBLED MOLECULE | December 2024 | March 2025 | Allow | 2 | 0 | 0 | No | No |
| 18989552 | OPTOELECTRONIC DEVICE MANUFACTURING METHOD | December 2024 | August 2025 | Allow | 8 | 1 | 0 | No | No |
| 18962722 | LIDAR System and Manufacturing Method Having Semiconductor-Based Optical Components Coupled Together with Solder | November 2024 | June 2025 | Allow | 7 | 1 | 0 | Yes | No |
| 18943851 | ORGANIC COMPOUND AND OLED HAVING SAME AND ORGANICA LIGHT-EMITTING APPARATUS | November 2024 | February 2025 | Allow | 3 | 0 | 0 | No | No |
| 18860313 | ORGANIC COMPOUND, COMPOSITION, ORGANIC ELECTROLUMINESCENT DEVICE, AND ELECTRONIC APPARATUS | October 2024 | February 2025 | Allow | 4 | 0 | 0 | No | No |
| 18898465 | Transistors, Method for Making the Same, Electrostatic Discharge Protection Circuit, and Electronic Device | September 2024 | January 2025 | Allow | 4 | 1 | 0 | No | No |
| 18822980 | DIFFUSION BARRIER FOR INTERCONNECTS | September 2024 | April 2025 | Allow | 7 | 1 | 0 | No | No |
| 18792957 | FUSED RING CARBAZOLE TETRADENTATE METAL PLATINUM (II) COMPLEX AND USE THEREOF | August 2024 | June 2025 | Allow | 10 | 0 | 0 | No | No |
| 18783087 | METHOD AND DEVICE FOR BOOSTING PERFORMANCE OF FINFETS VIA STRAINED SPACER | July 2024 | August 2025 | Allow | 12 | 0 | 0 | No | No |
| 18292714 | LIGHT EMITTING ELEMENT PACKAGE MANUFACTURING METHOD, DISPLAY APPARATUS, AND DISPLAY APPARATUS MANUFACTURING METHOD | July 2024 | August 2025 | Allow | 19 | 2 | 1 | Yes | No |
| 18778977 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATION LAYERS | July 2024 | October 2025 | Allow | 15 | 1 | 0 | Yes | No |
| 18778322 | Integrated circuit packages having stress-relieving features | July 2024 | November 2024 | Allow | 4 | 1 | 0 | No | No |
| 18774623 | ORGANIC ELECTROLUMINESCENCE ELEMENT AND ELECTRONIC DEVICE | July 2024 | December 2024 | Allow | 5 | 0 | 0 | No | No |
| 18773010 | Semiconductor Package with Integrated Capacitors | July 2024 | April 2025 | Allow | 9 | 1 | 0 | No | No |
| 18728862 | NITROGEN-CONTAINING COMPOUND, ELECTRONIC ELEMENT AND ELECTRONIC DEVICE | July 2024 | February 2025 | Allow | 7 | 0 | 0 | No | No |
| 18769413 | METHOD FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS) USING SLIDING-ON-MEMBRANE PIN EJECTION | July 2024 | March 2025 | Allow | 8 | 1 | 1 | No | No |
| 18769404 | DEVICE AND METHOD FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS) BASED ON ARRAY WATER JET-BASED EJECTION | July 2024 | November 2024 | Allow | 4 | 0 | 1 | No | No |
| 18768915 | DISPLAY DEVICE | July 2024 | October 2025 | Allow | 16 | 2 | 0 | No | No |
| 18769187 | HYBRID INTEGRATED CIRCUIT PACKAGES | July 2024 | March 2025 | Allow | 8 | 0 | 0 | No | No |
| 18767600 | INTEGRATED CIRCUIT PACKAGE AND METHOD | July 2024 | December 2025 | Allow | 17 | 1 | 1 | No | No |
| 18765292 | DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED | July 2024 | January 2026 | Allow | 19 | 2 | 0 | No | No |
| 18758926 | FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | June 2024 | April 2025 | Allow | 9 | 0 | 0 | No | No |
| 18758992 | MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS | June 2024 | August 2025 | Allow | 14 | 1 | 0 | No | No |
| 18756564 | HAND-WORN WORKWEAR UNIT FOR SCANNING BARCODES | June 2024 | August 2024 | Allow | 2 | 0 | 0 | No | No |
| 18751953 | SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTURE | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18751482 | DISPLAY DEVICE, DISPLAY MODULE, ELECTRONIC DEVICE, AND TELEVISION DEVICE | June 2024 | September 2025 | Allow | 14 | 1 | 0 | No | No |
| 18723335 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR | June 2024 | January 2025 | Allow | 7 | 0 | 1 | No | No |
| 18750424 | HYBRID HIGH-K DIELECTRIC MATERIAL FILM STACKS COMPRISING ZIRCONIUM OXIDE UTILIZED IN DISPLAY DEVICES | June 2024 | October 2025 | Abandon | 16 | 1 | 0 | Yes | No |
| 18747337 | Manufacturing Method for a Power MOSFET with Gate-Source ESD Diode Structure | June 2024 | September 2024 | Allow | 3 | 1 | 0 | No | No |
| 18744905 | SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR AND METHOD OF FABRICATING THE SAME | June 2024 | October 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18742056 | Interconnect Structure and Method of Forming Same | June 2024 | October 2025 | Allow | 16 | 2 | 0 | No | No |
| 18742009 | Semiconductor Device with Biofet and Biometric Sensors | June 2024 | July 2025 | Allow | 13 | 1 | 1 | Yes | No |
| 18740523 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | June 2024 | January 2026 | Allow | 19 | 1 | 1 | No | No |
| 18735185 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | June 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18733705 | SEMICONDUCTOR PACKAGE | June 2024 | April 2025 | Allow | 11 | 0 | 1 | No | No |
| 18731407 | ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STRUCTURES AND METHODS OF FORMING THE SAME | June 2024 | March 2025 | Allow | 9 | 1 | 0 | No | No |
| 18679941 | SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE, AND GAS CONCENTRATION MEASURING DEVICE | May 2024 | January 2025 | Allow | 8 | 1 | 0 | No | No |
| 18679252 | SYSTEMS AND METHODS FOR SYSTEMATIC PHYSICAL FAILURE ANALYSIS (PFA) FAULT LOCALIZATION | May 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18676102 | TOUCH DISPLAY DEVICE | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18674903 | PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18674669 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18671151 | SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC STRUCTURE EXTENDING INTO SECOND CAVITY OF SEMICONDUCTOR FIN | May 2024 | March 2026 | Allow | 22 | 2 | 0 | Yes | No |
| 18712686 | DISPLAY PIXEL COMPRISING LIGHT-EMITTING DIODES FOR A DISPLAY SCREEN | May 2024 | August 2025 | Allow | 14 | 1 | 1 | No | No |
| 18668609 | ORGANIC ELECTROLUMINESCENCE ELEMENT AND ELECTRONIC DEVICE | May 2024 | July 2024 | Allow | 2 | 0 | 0 | No | No |
| 18668344 | ORGANIC ELECTROLUMINESCENCE ELEMENT AND ELECTRONIC DEVICE | May 2024 | February 2026 | Allow | 21 | 0 | 0 | No | No |
| 18668974 | SEMICONDUCTOR PACKAGES | May 2024 | March 2025 | Allow | 10 | 0 | 0 | No | No |
| 18668887 | SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18667045 | PHOSPHOR-CONVERTED LIGHT-EMITTING DIODE WITH DIELECTRIC SPACER | May 2024 | December 2024 | Allow | 7 | 1 | 0 | No | No |
| 18666804 | CAPACITOR STRUCTURES AND METHODS OF FORMING THEREOF | May 2024 | January 2026 | Abandon | 20 | 3 | 0 | No | No |
| 18663051 | DISPLAY DEVICE | May 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18662916 | METHODS OF FABRICATING PACKAGE STRUCTURE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18662075 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | May 2024 | February 2026 | Allow | 21 | 1 | 0 | No | No |
| 18661056 | CIRCUIT BOARD ASSEMBLY HAVING CIRCUIT BOARD WITH ADJACENT CHIPS IMMERSED IN DIELECTRIC LIQUID AND METHOD OF MAKING THE SAME | May 2024 | July 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18657031 | DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, ELECTRONIC APPARATUS, AND LIGHTING DEVICE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18654780 | DEVICE HAVING SOLDER BUMP STRUCTURE FOR IMPROVED MECHANICAL, ELECTRICAL, AND/OR THERMAL PERFORMANCE | May 2024 | August 2025 | Allow | 15 | 1 | 0 | No | No |
| 18652515 | APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS | May 2024 | January 2025 | Allow | 9 | 1 | 0 | No | No |
| 18642254 | Display Device | April 2024 | July 2025 | Allow | 15 | 2 | 0 | No | No |
| 18641449 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | April 2024 | March 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18641442 | INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF | April 2024 | July 2025 | Allow | 15 | 2 | 0 | No | No |
| 18637486 | POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND METHODS FOR THE FABRICATION THEREOF | April 2024 | November 2025 | Allow | 19 | 1 | 0 | No | No |
| 18637664 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | April 2024 | February 2026 | Allow | 22 | 2 | 0 | No | No |
| 18638120 | Semiconductor Devices Having Funnel-Shaped Gate Structures | April 2024 | December 2024 | Allow | 8 | 0 | 0 | No | No |
| 18634014 | DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECOND STRUCTURE HAVING GATE LAYERS | April 2024 | August 2025 | Allow | 16 | 1 | 1 | Yes | No |
| 18632822 | ALLOY METAL PLATE AND DEPOSITION MASK INCLUDING ALLOY METAL PLATE | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18633330 | MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES | April 2024 | June 2025 | Allow | 15 | 2 | 0 | No | No |
| 18633267 | SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFERENT SEMICONDUCTOR DIES | April 2024 | June 2025 | Allow | 15 | 1 | 0 | No | No |
| 18630883 | METHODS OF FORMING MICROELECTRONIC DEVICES | April 2024 | November 2025 | Allow | 19 | 0 | 1 | No | No |
| 18629215 | Methods for Manufacturing a Semiconductor Package and a Semiconductor Module | April 2024 | September 2025 | Allow | 17 | 1 | 0 | No | No |
| 18629641 | ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNECT DIE | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18628525 | COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18626690 | Light-Emitting Element, Display Device, Electronic Device, and Lighting Device Each Having Thermally-Activated Delayed Fluorescent Organic Compound | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18626810 | SUBPIXEL LIGHT EMITTING DIODES FOR DIRECT VIEW DISPLAY AND METHODS OF MAKING THE SAME | April 2024 | June 2025 | Allow | 15 | 1 | 0 | Yes | No |
| 18624967 | NON-VOLATILE MEMORY DEVICE | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18624525 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18624284 | INTEGRATION OF MULTIPLE FIN STUCTURES ON A SINGLE SUBSTRATE | April 2024 | March 2025 | Allow | 11 | 0 | 1 | No | No |
| 18624686 | PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS | April 2024 | September 2025 | Allow | 18 | 3 | 0 | No | No |
| 18624954 | WAFER BONDING METHOD | April 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18623707 | Controlling Detection Time in Photodetectors | April 2024 | July 2025 | Allow | 15 | 1 | 0 | No | No |
| 18622981 | ARRAY SUBSTRATE AND DISPLAY PANEL | March 2024 | February 2025 | Allow | 46 | 1 | 0 | No | No |
| 18622867 | MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH OXIDE BONDING | March 2024 | January 2025 | Abandon | 10 | 2 | 0 | No | No |
| 18697320 | DISPLAY DEVICE | March 2024 | March 2025 | Allow | 11 | 1 | 1 | No | No |
| 18619340 | FLEXIBLE DISPLAY PANEL, DISPLAY DEVICE AND FORMING METHOD | March 2024 | April 2025 | Allow | 12 | 1 | 0 | No | No |
| 18616195 | SEMICONDUCTOR STRUCTURE WITH VIA EXTENDING ACROSS ADJACENT CONDUCTIVE LINES | March 2024 | September 2025 | Allow | 17 | 1 | 1 | Yes | No |
| 18616275 | CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT | March 2024 | October 2025 | Allow | 19 | 1 | 0 | No | No |
| 18617645 | DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE | March 2024 | July 2025 | Allow | 16 | 1 | 0 | No | No |
| 18616212 | METHOD OF FORMING PACKAGE STRUCTURE INCLUDING ANTENNAS | March 2024 | October 2025 | Allow | 19 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2817.
With a 29.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 41.2% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Art Unit 2817 is part of Group 2810 in Technology Center 2800. This art unit has examined 25,539 patent applications in our dataset, with an overall allowance rate of 89.8%. Applications typically reach final disposition in approximately 22 months.
Art Unit 2817's allowance rate of 89.8% places it in the 90% percentile among all USPTO art units. This art unit has a significantly higher allowance rate than most art units at the USPTO.
Applications in Art Unit 2817 receive an average of 1.29 office actions before reaching final disposition (in the 11% percentile). The median prosecution time is 22 months (in the 91% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.