Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18624967 | NON-VOLATILE MEMORY DEVICE | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18410199 | POWER SWITCH FOR BACKSIDE POWER DISTRIBUTION | January 2024 | November 2024 | Allow | 10 | 1 | 0 | No | No |
| 18361454 | POWER SWITCH FOR BACKSIDE POWER DISTRIBUTION | July 2023 | November 2024 | Allow | 15 | 1 | 0 | No | No |
| 18304137 | METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE | April 2023 | November 2024 | Allow | 19 | 1 | 0 | No | No |
| 18161814 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | January 2023 | January 2025 | Allow | 23 | 1 | 1 | Yes | No |
| 18149206 | MEMORY DEVICES HAVING CELL OVER PERIPHERY STRUCTURE, MEMORY PACKAGES INCLUDING THE SAME, AND METHODS OF MANUFACTURING THE SAME | January 2023 | July 2024 | Allow | 19 | 1 | 1 | No | No |
| 18088419 | METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES | December 2022 | November 2024 | Allow | 23 | 1 | 0 | Yes | No |
| 18077191 | STRUCTURE OF SEMICONDUCTOR DEVICE | December 2022 | September 2024 | Allow | 21 | 1 | 0 | No | No |
| 17985902 | METHOD OF MANUFACTURING ELECTRONIC DEVICE | November 2022 | April 2025 | Abandon | 29 | 2 | 0 | No | No |
| 18053766 | METHODS RELATED TO FORMING SEMICONDUCTOR DEVICES | November 2022 | December 2024 | Allow | 25 | 1 | 0 | No | No |
| 17931444 | METHODS FOR ADJUSTING SURFACE TOPOGRAPHY OF A SUBSTRATE SUPPORT APPARATUS | September 2022 | August 2024 | Allow | 23 | 2 | 0 | No | No |
| 17881960 | DUMMY POLY LAYOUT FOR HIGH DENSITY DEVICES | August 2022 | September 2024 | Allow | 25 | 1 | 0 | No | No |
| 17882177 | Doping Techniques | August 2022 | January 2025 | Allow | 30 | 1 | 0 | No | No |
| 17814766 | Die Stacking Structure and Method Forming Same | July 2022 | January 2024 | Allow | 18 | 1 | 0 | No | No |
| 17872809 | Extended Seal Ring Structure on Wafer-Stacking | July 2022 | December 2024 | Allow | 29 | 1 | 0 | No | No |
| 17871005 | POWER SWITCH FOR BACKSIDE POWER DISTRIBUTION | July 2022 | September 2023 | Allow | 14 | 0 | 0 | No | No |
| 17871239 | INTEGRATED CIRCUIT HAVING FINS CROSSING CELL BOUNDARY | July 2022 | March 2025 | Allow | 32 | 2 | 0 | No | No |
| 17855825 | THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF | July 2022 | October 2024 | Allow | 27 | 1 | 1 | Yes | No |
| 17851962 | STACK TYPE SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE STACK TYPE SEMICONDUCTOR DEVICE | June 2022 | March 2025 | Allow | 33 | 1 | 1 | Yes | No |
| 17850549 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | June 2022 | January 2025 | Allow | 31 | 4 | 0 | No | No |
| 17808716 | SUBSTRATE ALIGNMENT SYSTEMS AND RELATED METHODS | June 2022 | February 2025 | Allow | 31 | 2 | 0 | No | No |
| 17749390 | RECESSED BLOCKING STRUCTURE FOR BLC PIXELS | May 2022 | March 2025 | Allow | 34 | 1 | 1 | No | No |
| 17747739 | VERTICAL INSULATED GATE POWER SWITCH WITH ISOLATED BASE CONTACT REGIONS | May 2022 | November 2024 | Allow | 30 | 1 | 0 | No | No |
| 17746492 | SEMICONDUCTOR DEVICE | May 2022 | August 2024 | Allow | 27 | 0 | 0 | No | No |
| 17755888 | LAYERED STRUCTURE, MAGNETORESISTIVE DEVICE USING THE SAME, AND METHOD OF FABRICATING LAYERED STRUCTURE | May 2022 | June 2025 | Allow | 37 | 2 | 1 | Yes | No |
| 17742154 | Integrated Circuitry, Array Of Cross-Point Memory Cells, Method Used In Forming Integrated Circuitry | May 2022 | February 2025 | Allow | 34 | 2 | 1 | No | No |
| 17661827 | TRANSISTOR WITH DIELECTRIC SPACERS AND METHOD OF FABRICATION THEREFOR | May 2022 | December 2024 | Allow | 32 | 1 | 1 | No | No |
| 17773595 | ARRAY SUBSTRATE AND DISPLAY DEVICE | April 2022 | March 2025 | Allow | 35 | 0 | 0 | No | No |
| 17772943 | POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICE | April 2022 | December 2024 | Allow | 32 | 1 | 1 | Yes | No |
| 17661136 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | April 2022 | April 2025 | Allow | 35 | 1 | 1 | Yes | No |
| 17772590 | SPLICING DISPLAY DEVICE | April 2022 | February 2025 | Allow | 33 | 1 | 0 | No | No |
| 17728295 | Metal Oxide Composite As Etch Stop Layer | April 2022 | August 2024 | Allow | 27 | 3 | 0 | Yes | No |
| 17771338 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | April 2022 | September 2024 | Allow | 28 | 0 | 0 | No | No |
| 17770220 | LIGHT-EMITTING THIN FILM, PREPARATION METHOD THEREFOR, LIGHT-EMITTING DEVICE AND DISPLAY SUBSTRATE | April 2022 | February 2025 | Allow | 34 | 1 | 1 | No | No |
| 17722872 | DISPLAY PANELS AND DISPLAY DEVICES | April 2022 | January 2025 | Allow | 33 | 1 | 0 | No | No |
| 17659030 | DUAL MEMBRANE PIEZOELECTRIC MICROELECTROMECHANICAL SYSTEM MICROPHONE | April 2022 | March 2025 | Allow | 35 | 2 | 0 | No | No |
| 17688497 | Buffer Layer(s) on a Stacked Structure Having a Via | March 2022 | February 2024 | Allow | 23 | 1 | 0 | No | No |
| 17676213 | MAGNETIC MEMORY DEVICE AND METHOD FOR FORMING THE SAME | February 2022 | January 2025 | Allow | 35 | 1 | 1 | No | No |
| 17584507 | SRAM BIT CELLS WITH THREE-DIMENSIONAL INTEGRATION | January 2022 | March 2024 | Allow | 25 | 2 | 1 | No | No |
| 17647736 | SEMICONDUCTOR BASE PLATE AND TEST METHOD THEREOF | January 2022 | July 2023 | Allow | 18 | 1 | 1 | No | No |
| 17553950 | Partial Self-Aligned Contact for MOL | December 2021 | November 2023 | Allow | 23 | 1 | 0 | Yes | No |
| 17553789 | MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME | December 2021 | August 2024 | Allow | 32 | 2 | 1 | Yes | No |
| 17550741 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | December 2021 | September 2024 | Allow | 33 | 2 | 1 | No | No |
| 17548186 | STACKED SEMICONDUCTOR DEVICE | December 2021 | January 2025 | Allow | 37 | 3 | 0 | Yes | No |
| 17516699 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE WITH AIR GAP | November 2021 | August 2023 | Allow | 21 | 0 | 0 | No | No |
| 17515354 | INTERWAFER CONNECTION STRUCTURE FOR COUPLING WAFERS IN A WAFER STACK | October 2021 | September 2023 | Allow | 23 | 1 | 0 | Yes | No |
| 17481838 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | September 2021 | April 2025 | Allow | 43 | 3 | 1 | No | No |
| 17400653 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | August 2021 | June 2024 | Abandon | 34 | 2 | 1 | No | No |
| 17378743 | Integrated Structures | July 2021 | August 2024 | Allow | 37 | 1 | 0 | No | No |
| 17348858 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING | June 2021 | February 2024 | Allow | 32 | 1 | 1 | No | No |
| 17241299 | SYSTEMS AND METHODS OF TESTING MEMORY DEVICES | April 2021 | June 2024 | Allow | 38 | 1 | 1 | No | No |
| 17215320 | ETCHING METHOD AND PLATING SOLUTION | March 2021 | August 2024 | Abandon | 41 | 2 | 0 | No | No |
| 17210743 | SEMICONDUCTOR DEVICE | March 2021 | June 2024 | Allow | 38 | 1 | 0 | No | No |
| 17207894 | Solid Body and Multi-Component Arrangement | March 2021 | September 2024 | Allow | 42 | 3 | 0 | No | No |
| 17199119 | TEST STRUCTURE AND TESTING METHOD THEREOF | March 2021 | February 2024 | Allow | 35 | 1 | 0 | No | No |
| 17199374 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | March 2021 | October 2022 | Allow | 19 | 1 | 1 | Yes | No |
| 17275165 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | March 2021 | July 2024 | Allow | 41 | 2 | 1 | Yes | No |
| 17194636 | ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-WAFER BONDING | March 2021 | August 2022 | Allow | 18 | 1 | 1 | No | No |
| 17189234 | SEMICONDUCTOR STORAGE DEVICE | March 2021 | January 2024 | Allow | 35 | 1 | 0 | No | No |
| 17182175 | BONDED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME | February 2021 | January 2024 | Allow | 35 | 1 | 0 | No | No |
| 17270081 | DISPLAY DEVICE, DISPLAY MODULE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | February 2021 | September 2023 | Allow | 31 | 3 | 1 | No | No |
| 17175914 | SEMICONDUCTOR PACKAGE INCLUDING A WIRE AND A METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE | February 2021 | August 2022 | Allow | 18 | 1 | 1 | No | No |
| 17174671 | INACTIVE STRUCTURE ON SOIC | February 2021 | March 2023 | Allow | 25 | 1 | 1 | No | No |
| 17174690 | WAFER STRUCTURE, DIE FABRICATION METHOD AND CHIP | February 2021 | June 2024 | Abandon | 40 | 1 | 1 | No | No |
| 17165799 | STACKED SEMICONDUCTOR DEVICE WITH REMOVABLE PROBE PADS | February 2021 | April 2024 | Allow | 38 | 3 | 1 | Yes | No |
| 17152557 | SOLID STATE TRANSDUCERS WITH STATE DETECTION, AND ASSOCIATED SYSTEMS AND METHODS | January 2021 | October 2024 | Allow | 45 | 2 | 0 | No | No |
| 17150871 | EXTENDED SEAL RING STRUCTURE ON WAFER-STACKING | January 2021 | September 2023 | Allow | 32 | 3 | 1 | Yes | No |
| 17147567 | SEMICONDUCTOR DEVICES HAVING STANDARD CELLS THEREIN WITH IMPROVED INTEGRATION AND RELIABILITY | January 2021 | June 2023 | Allow | 29 | 1 | 0 | No | No |
| 17143134 | DEFECT MEASUREMENT METHOD | January 2021 | September 2024 | Allow | 44 | 3 | 0 | No | No |
| 17136264 | INTEGRATED CIRCUIT APPARATUS AND POWER DISTRIBUTION NETWORK THEREOF | December 2020 | September 2023 | Allow | 32 | 2 | 0 | No | No |
| 17128915 | NON-VOLATILE MEMORY DEVICE | December 2020 | December 2023 | Allow | 36 | 1 | 0 | No | No |
| 17125704 | Devices and Methods of Local Interconnect Stitches and Power Grids | December 2020 | July 2024 | Allow | 43 | 5 | 1 | No | No |
| 17120918 | Package Structure and Method of Forming the Same | December 2020 | January 2024 | Allow | 37 | 1 | 1 | No | No |
| 17113455 | SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP, AND DICING METHOD | December 2020 | August 2022 | Allow | 21 | 1 | 1 | No | No |
| 17106525 | SEMICONDUCTOR STRUCTURE, MEMORY DEVICE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | November 2020 | November 2021 | Allow | 11 | 1 | 1 | No | No |
| 16953745 | SEMICONDUCTOR PACKAGE | November 2020 | March 2023 | Allow | 28 | 1 | 0 | Yes | No |
| 17097579 | Semiconductor Package and Method of Manufacturing the Same | November 2020 | November 2023 | Allow | 36 | 4 | 1 | Yes | No |
| 17093991 | METHODS OF MANUFACTURING SEMICONDUCTOR CHIP | November 2020 | December 2023 | Allow | 37 | 1 | 0 | Yes | No |
| 17082629 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING METAL SILICIDE SOURCE REGIONS AND METHODS FOR FORMING THE SAME | October 2020 | May 2022 | Allow | 18 | 1 | 1 | No | No |
| 17080625 | SEMICONDUCTOR STRUCTURE AND TESTING METHOD THEREOF | October 2020 | November 2023 | Allow | 37 | 0 | 0 | No | No |
| 17074107 | MULTI-LEVEL STACKING OF WAFERS AND CHIPS | October 2020 | March 2023 | Allow | 29 | 1 | 0 | No | No |
| 17068233 | Die-Beam Alignment for Laser-Assisted Bonding | October 2020 | November 2023 | Allow | 38 | 3 | 1 | No | No |
| 17063251 | Advanced INFO POP and Method of Forming Thereof | October 2020 | November 2023 | Allow | 38 | 1 | 0 | No | No |
| 17026637 | MEMORY DEVICES HAVING CELL OVER PERIPHERY STRUCTURE, MEMORY PACKAGES INCLUDING THE SAME, AND METHODS OF MANUFACTURING THE SAME | September 2020 | September 2022 | Allow | 24 | 0 | 0 | No | No |
| 17010196 | SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING THE SAME | September 2020 | August 2022 | Allow | 24 | 1 | 1 | Yes | No |
| 17007764 | ORGANIC THIN FILM TRANSISTORS AND THE USE THEREOF IN SENSING APPLICATIONS | August 2020 | June 2024 | Allow | 45 | 2 | 0 | No | No |
| 17007968 | PROJECTED-CAPACITIVE (PCAP) TOUCHSCREEN | August 2020 | May 2023 | Allow | 33 | 0 | 0 | No | No |
| 16984601 | STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD FOR BONDING TWO SUBSTRATES | August 2020 | October 2022 | Allow | 27 | 3 | 1 | No | No |
| 16961927 | METHOD AND STRUCTURE FOR DETERMINING BLOCKING ABILITY OF COPPER DIFFUSION BLOCKING LAYER | July 2020 | February 2024 | Allow | 44 | 1 | 0 | No | No |
| 16925032 | Die Stacking Structure and Method Forming Same | July 2020 | August 2022 | Allow | 25 | 1 | 1 | No | No |
| 16919073 | SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME | July 2020 | March 2023 | Allow | 33 | 2 | 1 | No | No |
| 16913649 | METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES | June 2020 | September 2022 | Allow | 27 | 1 | 0 | Yes | No |
| 16908269 | Structure of S/D Contact and Method of Making Same | June 2020 | January 2023 | Allow | 31 | 1 | 0 | No | No |
| 16902636 | DUMMY POLY LAYOUT FOR HIGH DENSITY DEVICES | June 2020 | September 2023 | Allow | 39 | 3 | 1 | Yes | No |
| 16894449 | PIXELATED LED ARRAY WITH OPTICAL ELEMENTS | June 2020 | March 2024 | Allow | 46 | 4 | 0 | No | No |
| 16889467 | SEMICONDUCTOR DEVICE WITH METAL INTERCONNECTION | June 2020 | February 2023 | Allow | 33 | 2 | 0 | Yes | No |
| 16883610 | SEMICONDUCTOR DEVICES AND METHODS RELATED THERETO | May 2020 | July 2022 | Allow | 26 | 0 | 1 | No | No |
| 16877256 | POWER SWITCH FOR BACKSIDE POWER DISTRIBUTION | May 2020 | April 2023 | Allow | 35 | 2 | 1 | No | No |
| 16865909 | SEMICONDUCTOR PACKAGE WITH AIR GAP AND MANUFACTURING METHOD THEREOF | May 2020 | January 2022 | Allow | 20 | 1 | 1 | No | No |
| 16862298 | METHODS FOR MULTI-WAFER STACKING AND DICING | April 2020 | March 2023 | Allow | 34 | 2 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner GOODWIN, DAVID J.
With a 13.3% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 12.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner GOODWIN, DAVID J works in Art Unit 2817 and has examined 575 patent applications in our dataset. With an allowance rate of 78.6%, this examiner has a below-average tendency to allow applications. Applications typically reach final disposition in approximately 30 months.
Examiner GOODWIN, DAVID J's allowance rate of 78.6% places them in the 39% percentile among all USPTO examiners. This examiner has a below-average tendency to allow applications.
On average, applications examined by GOODWIN, DAVID J receive 2.54 office actions before reaching final disposition. This places the examiner in the 86% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.
The median time to disposition (half-life) for applications examined by GOODWIN, DAVID J is 30 months. This places the examiner in the 42% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +4.1% benefit to allowance rate for applications examined by GOODWIN, DAVID J. This interview benefit is in the 26% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 18.4% of applications are subsequently allowed. This success rate is in the 10% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.
This examiner enters after-final amendments leading to allowance in 27.8% of cases where such amendments are filed. This entry rate is in the 31% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 66.7% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 53% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 61.5% of appeals filed. This is in the 34% percentile among all examiners. Of these withdrawals, 37.5% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 43.8% are granted (fully or in part). This grant rate is in the 47% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.7% of allowed cases (in the 64% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 9.3% of allowed cases (in the 87% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.