Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18413020 | Method of Forming Packages of Stacked Chips | January 2024 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18543992 | Double-Sided Partial Molded SiP Module | December 2023 | June 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18389264 | EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | November 2023 | October 2024 | Allow | 11 | 1 | 0 | No | No |
| 18379368 | FIELD STOP IGBT WITH GROWN INJECTION REGION | October 2023 | February 2025 | Allow | 16 | 1 | 1 | Yes | No |
| 18367285 | INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES | September 2023 | January 2025 | Allow | 16 | 1 | 1 | Yes | No |
| 18464409 | CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND ENCAPSULATION BACK-END ASSEMBLY PROCESSES | September 2023 | June 2025 | Allow | 21 | 1 | 1 | Yes | No |
| 18462414 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | September 2023 | April 2025 | Allow | 19 | 1 | 1 | Yes | No |
| 18237115 | CARRIER FILM DISPOSED ON A MOTHER SUBSTRATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE | August 2023 | October 2024 | Allow | 14 | 1 | 1 | Yes | No |
| 18447428 | Semiconductor Package and Method of Forming Thereof | August 2023 | June 2025 | Allow | 22 | 2 | 0 | No | No |
| 18361300 | PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT | July 2023 | June 2025 | Allow | 22 | 2 | 0 | No | No |
| 18333460 | CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELECTRIC MATERIAL BONDING | June 2023 | February 2025 | Allow | 20 | 2 | 0 | No | No |
| 18333449 | CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELECTRIC MATERIAL BONDING | June 2023 | September 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 18141568 | SEMICONDUCTOR PACKAGE AND ANTENNA MODULE COMPRISING THE SAME | May 2023 | July 2024 | Allow | 14 | 1 | 0 | No | No |
| 18121145 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING APPARATUS AND SEMICONDUCTOR DEVICE | March 2023 | June 2024 | Allow | 15 | 1 | 0 | No | No |
| 18121569 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | March 2023 | July 2024 | Allow | 16 | 1 | 0 | No | No |
| 18114119 | CONTACTS FOR SOLAR CELLS | February 2023 | October 2024 | Allow | 20 | 2 | 0 | No | No |
| 18104817 | METAL OXIDE AND FIELD-EFFECT TRANSISTOR | February 2023 | March 2025 | Allow | 25 | 3 | 0 | No | No |
| 18080640 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | December 2022 | July 2024 | Allow | 19 | 1 | 0 | No | No |
| 18063466 | SYSTEMS AND METHODS FOR QUANTUM BASED OPTIMIZATION OF A PERSONALIZED PORTFOLIO | December 2022 | November 2024 | Allow | 23 | 1 | 0 | Yes | No |
| 18063449 | SYSTEMS AND METHODS FOR QUANTUM BASED OPTIMIZATION OF A PERSONALIZED PORTFOLIO | December 2022 | October 2024 | Allow | 22 | 1 | 0 | Yes | No |
| 17981939 | NOISE REDUCED CIRCUITS FOR SUPERCONDUCTING QUANTUM COMPUTERS | November 2022 | May 2024 | Allow | 18 | 1 | 0 | Yes | No |
| 17973864 | Semiconductor Package with Lead Tip Inspection Feature | October 2022 | December 2024 | Abandon | 26 | 2 | 0 | No | No |
| 17884037 | Semiconductor Package and Method of Manufacturing The Same | August 2022 | November 2024 | Allow | 27 | 2 | 0 | No | No |
| 17818625 | Semiconductor Device and Method | August 2022 | July 2024 | Allow | 24 | 1 | 1 | No | No |
| 17882239 | Semiconductor Device and Method of Manufacture | August 2022 | September 2024 | Allow | 25 | 2 | 0 | No | No |
| 17881274 | TECHNIQUES FOR FORMING SELF-ALIGNED MEMORY STRUCTURES | August 2022 | October 2024 | Allow | 26 | 2 | 0 | Yes | No |
| 17817481 | Antenna in Embedded Wafer-Level Ball-Grid Array Package | August 2022 | June 2024 | Allow | 22 | 4 | 1 | No | No |
| 17874782 | Integrated Circuit Package and Method | July 2022 | May 2025 | Allow | 33 | 2 | 1 | Yes | No |
| 17813906 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | July 2022 | May 2024 | Allow | 22 | 1 | 0 | No | No |
| 17859834 | Method of Forming Semiconductor Device | July 2022 | July 2024 | Allow | 24 | 2 | 0 | No | No |
| 17853953 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | June 2022 | June 2024 | Allow | 24 | 1 | 1 | Yes | No |
| 17849138 | SEMICONDUCTOR PACKAGE | June 2022 | April 2024 | Allow | 21 | 1 | 0 | Yes | No |
| 17829119 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | May 2022 | March 2024 | Allow | 22 | 1 | 0 | No | No |
| 17735471 | METHODS OF FABRICATING SEMICONDUCTOR PACKAGE | May 2022 | March 2024 | Allow | 23 | 3 | 0 | Yes | No |
| 17717153 | THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORMING THE SAME | April 2022 | October 2024 | Allow | 30 | 2 | 1 | Yes | No |
| 17682994 | SEMICONDUCTOR DEVICE | February 2022 | January 2025 | Allow | 35 | 1 | 1 | No | No |
| 17583038 | GRINDABLE HEAT SINK FOR MULTIPLE DIE PACKAGING | January 2022 | January 2025 | Allow | 36 | 1 | 1 | No | No |
| 17574192 | FIDELITY ESTIMATION FOR QUANTUM COMPUTING SYSTEMS | January 2022 | August 2024 | Allow | 31 | 2 | 0 | No | No |
| 17566573 | ELECTRONIC PACKAGE | December 2021 | July 2024 | Allow | 31 | 1 | 0 | No | No |
| 17623278 | DISPLAY PANEL | December 2021 | July 2024 | Allow | 31 | 1 | 0 | No | No |
| 17623301 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | December 2021 | November 2024 | Allow | 34 | 1 | 1 | Yes | No |
| 17622859 | DISPLAY PANEL, METHOD FOR MANUFACTURING SAME, AND DISPLAY TERMINAL | December 2021 | March 2025 | Allow | 38 | 2 | 0 | Yes | No |
| 17559443 | DISPLAY DEVICE | December 2021 | February 2025 | Allow | 37 | 2 | 1 | Yes | No |
| 17559363 | DIRECTED SELF-ASSEMBLY ENABLED SUBTRACTIVE METAL PATTERNING | December 2021 | January 2025 | Allow | 37 | 2 | 1 | No | No |
| 17559482 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | December 2021 | April 2025 | Allow | 40 | 2 | 1 | Yes | No |
| 17551185 | MICRO LIGHT EMITTING DIODE DISPLAY DEVICE | December 2021 | June 2024 | Allow | 30 | 1 | 0 | No | No |
| 17550689 | TRANSPARENT DISPLAY DEVICE | December 2021 | September 2024 | Allow | 33 | 2 | 0 | Yes | No |
| 17536280 | SEMICONDUCTOR DEVICE WITH BUFFER LAYER AND METHOD OF FORMING | November 2021 | September 2024 | Allow | 33 | 2 | 0 | No | No |
| 17535984 | Chip Package Including Stacked Chips and Chip Couplers | November 2021 | December 2023 | Allow | 25 | 2 | 1 | Yes | No |
| 17613691 | DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE | November 2021 | May 2025 | Allow | 42 | 3 | 0 | No | No |
| 17532030 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTURES LATERALLY SURROUNDING BACKSIDE METAL STRUCTURES | November 2021 | January 2024 | Allow | 26 | 3 | 0 | Yes | No |
| 17612316 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, AND ELECTRONIC COMPONENT DEVICE | November 2021 | October 2024 | Allow | 35 | 1 | 1 | No | No |
| 17454742 | FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | November 2021 | September 2024 | Allow | 34 | 2 | 1 | No | No |
| 17492493 | SEMICONDUCTOR PACKAGE SHIELDING STRUCTURE | October 2021 | January 2024 | Allow | 28 | 1 | 0 | Yes | No |
| 17490038 | CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT | September 2021 | March 2024 | Allow | 29 | 2 | 1 | Yes | No |
| 17471249 | Semiconductor Package, Semiconductor Module and Methods for Manufacturing a Semiconductor Package and a Semiconductor Module | September 2021 | December 2023 | Allow | 28 | 1 | 1 | No | No |
| 17468527 | INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD | September 2021 | September 2024 | Abandon | 36 | 2 | 1 | No | No |
| 17435630 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE | September 2021 | February 2025 | Allow | 41 | 2 | 0 | No | No |
| 17463140 | LEADFRAME-LESS LASER DIRECT STRUCTURING (LDS) PACKAGE | August 2021 | April 2024 | Allow | 32 | 2 | 1 | Yes | No |
| 17460346 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | August 2021 | November 2024 | Allow | 39 | 4 | 1 | Yes | No |
| 17460301 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | August 2021 | July 2024 | Allow | 35 | 3 | 1 | Yes | No |
| 17412604 | APPARATUS INCLUDING DIRECT-CONTACT HEAT PATHS AND METHODS OF MANUFACTURING THE SAME | August 2021 | March 2025 | Allow | 43 | 5 | 1 | Yes | No |
| 17377507 | PACKAGED SEMICONDUCTOR DEVICES AND METHODS THEREFOR | July 2021 | April 2024 | Allow | 33 | 3 | 1 | Yes | No |
| 17324833 | SPUTTERING TARGET INCLUDING CARBON-DOPED GST AND METHOD FOR FABRICATING ELECTRONIC DEVICE USING THE SAME | May 2021 | January 2024 | Allow | 32 | 1 | 1 | Yes | No |
| 17170666 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | February 2021 | November 2024 | Allow | 45 | 2 | 1 | Yes | No |
| 17164402 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | February 2021 | August 2024 | Allow | 43 | 3 | 1 | Yes | No |
| 17154011 | IMAGING DEVICE | January 2021 | April 2025 | Allow | 50 | 1 | 1 | No | No |
| 17255987 | DISPLAY DEVICE | December 2020 | January 2024 | Allow | 36 | 1 | 0 | Yes | No |
| 17255979 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | December 2020 | December 2023 | Allow | 36 | 1 | 0 | No | No |
| 16909575 | Die Package and Method of Manufacturing a Die Package | June 2020 | March 2024 | Allow | 44 | 2 | 1 | Yes | Yes |
| 16453895 | INTEGRATED CIRCUIT PACKAGE ASSEMBLIES WITH HIGH-ASPECT RATIO METALLIZATION FEATURES | June 2019 | July 2024 | Abandon | 60 | 2 | 1 | Yes | No |
| 15815605 | PARASITIC CAPACITANCE REDUCING CONTACT STRUCTURE IN A FINFET | November 2017 | April 2019 | Allow | 17 | 1 | 0 | Yes | No |
| 15815626 | PARASITIC CAPACITANCE REDUCING CONTACT STRUCTURE IN A FINFET | November 2017 | April 2019 | Allow | 17 | 1 | 0 | No | No |
| 15815616 | PARASITIC CAPACITANCE REDUCING CONTACT STRUCTURE IN A FINFET | November 2017 | April 2019 | Allow | 17 | 1 | 0 | No | No |
| 15610894 | SILICON-BASED PHOTODETECTORS WITH EXPANDED BANDWIDTH | June 2017 | April 2019 | Allow | 23 | 2 | 1 | No | No |
| 15604719 | SELF-FORMING SPACERS USING OXIDATION | May 2017 | April 2018 | Allow | 11 | 1 | 0 | No | No |
| 15452999 | COMPOUND SEMICONDUCTOR DEVICE | March 2017 | June 2018 | Allow | 15 | 1 | 1 | No | No |
| 15507962 | DISPLAY MODULE AND ELECTRONIC DEVICE HAVING SAID DISPLAY MODULE | March 2017 | August 2018 | Allow | 17 | 2 | 0 | No | No |
| 15231061 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | August 2016 | September 2017 | Allow | 14 | 1 | 0 | No | No |
| 15230871 | PARASITIC CAPACITANCE REDUCING CONTACT STRUCTURE IN A FINFET | August 2016 | March 2018 | Allow | 19 | 2 | 0 | No | No |
| 15065874 | METHOD OF MANUFACTURING PIXEL STRUCTURE | March 2016 | October 2018 | Allow | 31 | 2 | 0 | No | No |
| 14980540 | MICRO ELECTRO MECHANICAL SYSTEM (MEMS) BASED WIDE-BAND POLYMER PHOTO-DETECTOR | December 2015 | August 2017 | Allow | 20 | 1 | 1 | Yes | No |
| 14882737 | Method and Apparatus For Reduction of Solar Cell LID | October 2015 | June 2017 | Allow | 20 | 1 | 1 | Yes | No |
| 14883045 | METHODS OF FORMING TRANSISTOR STRUCTURES INCLUDING FORMING CHANNEL MATERIAL AFTER FORMATION PROCESSES TO PREVENT DAMAGE TO THE CHANNEL MATERIAL | October 2015 | October 2016 | Allow | 12 | 1 | 1 | No | No |
| 14882441 | METHOD FOR FABRICATING THE LIQUID CRYSTAL DISPLAY PANELS INCLUDING POURING LIQUID CRYSTAL INTO DUMMY AND PANEL GROUP REGIONS TO RESIST PRESSURE DIFFERENCES | October 2015 | July 2017 | Allow | 21 | 3 | 0 | No | No |
| 14492123 | SELF-FORMING SPACERS USING OXIDATION | September 2014 | March 2017 | Allow | 30 | 3 | 1 | Yes | No |
| 14491470 | METHOD OF ELECTRODEPOSITING GOLD ON A COPPER SEED LAYER TO FORM A GOLD METALLIZATION STRUCTURE | September 2014 | April 2016 | Allow | 19 | 1 | 1 | No | No |
| 14139222 | PLASMA DENSIFICATION OF DIELECTRICS FOR IMPROVED DIELECTRIC LOSS TANGENT | December 2013 | October 2015 | Allow | 21 | 2 | 0 | Yes | No |
| 14139186 | METAL ORGANIC CHEMICAL VAPOR DEPOSITION OF EMBEDDED RESISTORS FOR RERAM CELLS | December 2013 | August 2015 | Allow | 19 | 1 | 1 | Yes | No |
| 14096243 | METHOD OF EPITAXIALLY FORMING CONTACT STRUCTURES FOR SEMICONDUCTOR TRANSISTORS | December 2013 | January 2015 | Allow | 13 | 1 | 1 | No | No |
| 14094245 | Light Emitting And Lasing Semiconductor Methods And Devices | December 2013 | November 2015 | Allow | 23 | 2 | 0 | No | No |
| 13838546 | III-NITRIDE TRANSISTOR WITH ENGINEERED SUBSTRATE | March 2013 | March 2017 | Allow | 48 | 8 | 1 | No | No |
| 13774682 | DRAM WITH A NANOWIRE ACCESS TRANSISTOR | February 2013 | October 2013 | Allow | 8 | 1 | 0 | No | No |
| 13640481 | SEMICONDUCTOR DEVICE COMPRISING A BREAKDOWN WITHSTANDING SECTION | December 2012 | June 2014 | Allow | 20 | 1 | 1 | Yes | No |
| 13643652 | CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING FIRST AND SECOND CHANNEL LAYERS MADE OF DIFFERENT SEMICONDUCTOR MATERIALS | December 2012 | April 2015 | Allow | 30 | 3 | 0 | No | No |
| 13687883 | METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE WITH A SINGLE-CRYSTAL SUBSTRATE | November 2012 | January 2014 | Allow | 14 | 0 | 0 | No | No |
| 13490759 | DRAM WITH A NANOWIRE ACCESS TRANSISTOR | June 2012 | December 2014 | Allow | 30 | 4 | 0 | No | No |
| 13428185 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE CONTAINING A MATERIAL HAVING AN OXYGEN DISSOCIATION CATALYTIC ACTION | March 2012 | August 2014 | Allow | 28 | 2 | 1 | Yes | No |
| 13427628 | PERFORMING ENHANCED CLEANING IN THE FORMATION OF MOS DEVICES | March 2012 | February 2015 | Allow | 35 | 3 | 0 | No | No |
| 13382335 | Method for Forming MEMS Variable Capacitors | March 2012 | November 2013 | Allow | 22 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CHANG, JAY C.
With a 100.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 100.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner CHANG, JAY C works in Art Unit 2817 and has examined 105 patent applications in our dataset. With an allowance rate of 97.1%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 25 months.
Examiner CHANG, JAY C's allowance rate of 97.1% places them in the 91% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by CHANG, JAY C receive 1.79 office actions before reaching final disposition. This places the examiner in the 54% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by CHANG, JAY C is 25 months. This places the examiner in the 67% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +1.2% benefit to allowance rate for applications examined by CHANG, JAY C. This interview benefit is in the 16% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 35.5% of applications are subsequently allowed. This success rate is in the 75% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 44.2% of cases where such amendments are filed. This entry rate is in the 61% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 0.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 12% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.
This examiner withdraws rejections or reopens prosecution in 50.0% of appeals filed. This is in the 13% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 60% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 22% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 28% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.