Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19040693 | BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME | January 2025 | October 2025 | Allow | 9 | 0 | 0 | No | No |
| 18962722 | LIDAR System and Manufacturing Method Having Semiconductor-Based Optical Components Coupled Together with Solder | November 2024 | June 2025 | Allow | 7 | 1 | 0 | Yes | No |
| 18778977 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATION LAYERS | July 2024 | October 2025 | Allow | 15 | 1 | 0 | Yes | No |
| 18679252 | SYSTEMS AND METHODS FOR SYSTEMATIC PHYSICAL FAILURE ANALYSIS (PFA) FAULT LOCALIZATION | May 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18629641 | ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNECT DIE | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18622867 | MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH OXIDE BONDING | March 2024 | January 2025 | Abandon | 10 | 2 | 0 | No | No |
| 18604923 | ELECTRONIC APPARATUS WITH POLARIZATION PLATE AND MANUFACTURING METHOD THEREOF | March 2024 | May 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18432387 | MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CURRENT | February 2024 | June 2025 | Allow | 16 | 1 | 0 | No | No |
| 18402991 | INTEGRATED ALIGNED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS | January 2024 | August 2024 | Allow | 8 | 0 | 0 | No | No |
| 18401212 | SOLID STATE TRANSDUCER DIES HAVING REFLECTIVE FEATURES OVER CONTACTS AND ASSOCIATED SYSTEMS AND METHODS | December 2023 | December 2024 | Allow | 11 | 1 | 0 | No | No |
| 18534433 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNECTIVE PATH | December 2023 | May 2024 | Allow | 5 | 1 | 0 | No | No |
| 18515837 | SEMICONDUCTOR DEVICE INCLUDING LEAD WITH VARYING THICKNESS | November 2023 | December 2024 | Allow | 13 | 1 | 0 | No | No |
| 18510855 | SEMICONDUCTOR MEMORY STRUCTURE WITH L-SHAPED CHANNEL AND METHOD FOR MANUFACTURING THE SAME | November 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18388848 | MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH OXIDE BONDING | November 2023 | March 2024 | Allow | 4 | 1 | 0 | No | No |
| 18501354 | SEMICONDUCTOR DEVICE WITH ACTIVE PORTIONS OF VARIED WIDTHS INSIDE ACTIVE PATTERN | November 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18501396 | METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE LAYERS AND METHODS OF FORMING THE SAME | November 2023 | July 2024 | Allow | 8 | 0 | 0 | No | No |
| 18484348 | EMBEDDED HIGH-Z MARKER MATERIAL AND PROCESS FOR ALIGNMENT OF MULTILEVEL EBEAM LITHOGRAPHY | October 2023 | January 2025 | Allow | 15 | 1 | 0 | No | No |
| 18370916 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH IMPURITY DOPED OXIDE SEMICONDUCTOR LAYER | September 2023 | November 2024 | Allow | 14 | 1 | 0 | No | No |
| 18368355 | METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER | September 2023 | March 2026 | Allow | 30 | 2 | 0 | No | No |
| 18452772 | PROCESSING METHOD OF WAFER REMOVING PERIPHERAL PORTION OF WAFER | August 2023 | January 2026 | Allow | 29 | 1 | 0 | Yes | No |
| 18452069 | ORGANIC COMPOUND, LIGHT ABSORPTION SENSOR, SENSOR-EMBEDDED DISPLAY PANEL, AND ELECTRONIC DEVICE | August 2023 | October 2025 | Allow | 26 | 0 | 0 | No | No |
| 18451354 | SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A CORE LAYER AND AN ADJACENT INSULATION LAYER(S) WITH AN EMBEDDED METAL STRUCTURE(S) POSITIONED FROM THE CORE LAYER | August 2023 | February 2026 | Allow | 30 | 1 | 0 | No | No |
| 18233357 | SEMICONDUCTOR MEMORY DEVICE INCLUDING LOWER CONTACT PLUG PROTRUDING FROM SIDEWALL SPACERS | August 2023 | January 2026 | Allow | 29 | 1 | 0 | Yes | No |
| 18447332 | DISPLAY DEVICE WITH PERIPHERAL WIRING SUROUNDING SENSOR AREA | August 2023 | March 2026 | Allow | 31 | 1 | 0 | No | No |
| 18275020 | DISPLAY PANEL AND DISPLAY DEVICE WITH REDUCED CROSS-VOLTAGE BETWEEN SOURCE AND DRAIN | July 2023 | March 2026 | Allow | 32 | 1 | 0 | No | No |
| 18361758 | GATED METAL-INSULATOR-SEMICONDUCTOR (MIS) TUNNEL DIODE HAVING NEGATIVE TRANSCONDUCTANCE | July 2023 | July 2024 | Allow | 11 | 0 | 0 | No | No |
| 18359383 | GRAPHENE BARRIER LAYER FOR REDUCED CONTACT RESISTANCE | July 2023 | January 2025 | Allow | 18 | 2 | 0 | No | No |
| 18222377 | METHOD FOR MANUFACTURING MONOCRYSTALLINE SILICON WAFER CONTAINING ARCED SIDE, METHOD FOR MANUFACTURING MONOCRYSTALLINE SILICON CELL, AND PHOTOVOLTAIC MODULE | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18218212 | SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE AND MANUFACTURING METHOD THEREOF | July 2023 | May 2025 | Allow | 23 | 2 | 0 | No | No |
| 18344057 | GATE ALL AROUND STRUCTURE WITH ADDITIONAL SILICON LAYER AND METHOD FOR FORMING THE SAME | June 2023 | June 2024 | Allow | 11 | 0 | 0 | No | No |
| 18207357 | CIRCUIT BOARD ASSEMBLY WITH PHOTOSENSITIVE ELEMENT MOUNTED TO BACK SIDE OF CIRCUIT BOARD | June 2023 | July 2024 | Allow | 13 | 0 | 0 | No | No |
| 18197505 | MEMORY DEVICE HAVING AN ARRAY OF VERTICAL TRANSISTORS WITH ASSOCIATED LINES AND METHOD FOR FORMING THE SAME | May 2023 | February 2026 | Allow | 33 | 1 | 0 | Yes | No |
| 18195512 | SEMICONDUCTOR DEVICE WITH VANADIUM-CONTAINING SPACERS AND METHOD FOR FABRICATING THE SAME | May 2023 | February 2025 | Allow | 21 | 2 | 0 | No | No |
| 18314126 | SEMICONDUCTOR STRUCTURE INCLUDING INTERCONNECTION TO PROBE PAD WITH PROBE MARK | May 2023 | September 2024 | Allow | 17 | 1 | 0 | No | No |
| 18139414 | LASER LIGHT SOURCE AND A LASER CRYSTALLIZATION APPARATUS INCLUDING THE SAME | April 2023 | June 2024 | Allow | 14 | 0 | 0 | No | No |
| 18139275 | MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE OF INTERCONNECT BRIDGE OVER GLASS LAYER AND METHOD OF MAKING | April 2023 | July 2024 | Allow | 15 | 0 | 0 | No | No |
| 18135618 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING STATIONARY LASER MODULE | April 2023 | March 2025 | Allow | 23 | 3 | 0 | Yes | No |
| 18299683 | SEMICONDUCTOR MEMORY DEVICE WITH BARRIER LAYERS BETWEEN GAP-FILL PATTERNS AND METHOD OF MANUFACTURING THE SAME | April 2023 | February 2026 | Allow | 34 | 2 | 0 | No | No |
| 18297946 | WAFER EDGE TRIMMING PROCESS INCLUDING WATER JET AND WEDGE SEPARATION AND METHODS THEREOF | April 2023 | October 2025 | Allow | 30 | 0 | 0 | No | No |
| 18031084 | SUBSTRATE HOLDER WITH CENTRAL ELEVATION AND SUPPORT ELEVATIONS AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR BONDING THEREOF | April 2023 | February 2026 | Allow | 34 | 1 | 0 | No | No |
| 18030841 | PROCESS OF MAKING MONOLITHIC RGB MICRO LED DISPLAY USING DOWN CONVERTING MACROMOLECULES | April 2023 | February 2026 | Allow | 34 | 1 | 0 | No | No |
| 18296389 | DATA STORAGE NODE VOLTAGE MONITOR CIRCUIT AND METHODS FOR FORMING THE SAME | April 2023 | October 2025 | Allow | 30 | 0 | 0 | No | No |
| 18129928 | HIGH ELECTRON MOBILITY TRANSISTOR STRUCTURE INCLUDING PASSIVATION CAPPING LAYER AND METHOD OF MANUFACTURING THE SAME | April 2023 | October 2025 | Allow | 30 | 0 | 0 | No | No |
| 18295225 | ADJACENT CELL ROUTING RESOURCE CONNECTIVITY | April 2023 | February 2026 | Allow | 34 | 1 | 0 | No | No |
| 18194642 | SEMICONDUCTOR MEMORY DEVICES INCLUDING STEPWISE PROFILES AND METHODS OF FABRICATING THE SAME | April 2023 | January 2026 | Allow | 34 | 1 | 0 | Yes | No |
| 18193719 | DISPLAY DEVICE INCLUDING ORGANIC SENSOR LAYER WITH COLORANT | March 2023 | February 2026 | Allow | 34 | 1 | 0 | No | No |
| 18128327 | LIGHT-EMITTING DEVICE WITH CAVITY BETWEEN TOP ELECTRODE PAD AND PROTECTIVE LAYER | March 2023 | October 2025 | Allow | 30 | 0 | 0 | No | No |
| 18182456 | SEMICONDUCTOR MEMORY STRUCTURE WITH BUTTED CONTACT AND METHOD FOR MANUFACTURING SAME | March 2023 | November 2025 | Allow | 33 | 1 | 1 | No | No |
| 18175557 | METHOD AND DEVICE FOR PROVIDING THROUGH-OPENINGS IN A SUBSTRATE AND A SUBSTRATE PRODUCED IN SAID MANNER | February 2023 | May 2025 | Allow | 26 | 1 | 0 | No | No |
| 18163821 | SYSTEMS AND METHODS FOR SYSTEMATIC PHYSICAL FAILURE ANALYSIS (PFA) FAULT LOCALIZATION | February 2023 | February 2024 | Allow | 12 | 1 | 0 | No | No |
| 18159590 | OPTICAL HEATING DEVICE WITH ANGLED LIGHT HOLDING SUBSTRATE AND METHOD OF HEATING TREATMENT THEREOF | January 2023 | February 2026 | Allow | 37 | 1 | 1 | No | No |
| 18155878 | Molded Laser Package with Electromagnetic Interference Shield and Method of Making | January 2023 | February 2025 | Allow | 25 | 2 | 0 | No | No |
| 18068064 | ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNECT DIE | December 2022 | January 2024 | Allow | 13 | 1 | 0 | No | No |
| 18081207 | 3D MULTIPLE LOCATION COMPRESSING BONDED ARM FOR ADVANCED INTEGRATION | December 2022 | April 2025 | Allow | 28 | 1 | 0 | No | No |
| 18080678 | INTERACTIVE ENVIRONMENT WITH VIRTUAL ENVIRONMENT SPACE SCANNING | December 2022 | August 2023 | Allow | 9 | 2 | 0 | No | No |
| 17927504 | Chip Fabrication Process for Improving LED Chip Light Extraction Efficiency with Isolation Groove and LED Chip Thereof | November 2022 | September 2025 | Allow | 34 | 1 | 0 | No | No |
| 17999492 | TRENCHED GATE DOUBLE DIFFUSED SEMICONDUCTOR DEVICE WITH CHANNEL IMPURITY CONCENTRATION ADJUSTMENT REGION | November 2022 | May 2025 | Allow | 30 | 1 | 0 | No | No |
| 18054871 | INVERSION LAYER AVALANCHE PHOTODIODE WITH VERTICAL ELECTRIC FIELD | November 2022 | January 2025 | Allow | 26 | 0 | 0 | No | No |
| 17995171 | BONDED SUBSTRATE PERIPHERAL LASER PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS THEREOF | September 2022 | April 2025 | Allow | 30 | 0 | 0 | No | No |
| 17885097 | WAFER SHAPE CONTROL FOR W2W BONDING | August 2022 | March 2025 | Allow | 31 | 0 | 0 | No | No |
| 17818123 | SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT-END PROCESSED WAFER GLOBAL GEOMETRY METRICS | August 2022 | April 2025 | Allow | 33 | 0 | 0 | No | No |
| 17880685 | METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS | August 2022 | January 2025 | Allow | 29 | 1 | 0 | No | No |
| 17863493 | SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE | July 2022 | March 2025 | Allow | 33 | 2 | 0 | No | No |
| 17855952 | SEMICONDUCTOR DEVICE WITH VANADIUM-CONTAINING SPACERS AND METHOD FOR FABRICATING THE SAME | July 2022 | February 2025 | Allow | 31 | 1 | 0 | No | No |
| 17852424 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING UNDERLAYER FOR REDUCING DEFECT IN ARRAY REGION | June 2022 | November 2025 | Allow | 41 | 1 | 0 | No | No |
| 17851170 | SEMICONDUCTOR CHIP WITH FUSE STRUCTURE IN SCRIBE LANE AND METHOD OF FABRICATING THE SAME | June 2022 | February 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 17788776 | SUBSTRATE LASER PROCESSING METHOD AND SUBSTRATE LASER PROCESSING APPARATUS | June 2022 | January 2025 | Allow | 31 | 1 | 0 | No | No |
| 17827876 | OPTICAL HEATING APPARATUS WITH ANGLED LIGHT HOLDING SUBSTRATE AND HEATING TREATMENT METHOD THEREOF | May 2022 | January 2025 | Allow | 32 | 2 | 0 | No | No |
| 17826805 | SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING TEMPERATURE SENSOR INSIDE GAS PIPE AND TEMPERATURE CONTROL METHOD THEREOF | May 2022 | August 2025 | Allow | 38 | 1 | 0 | No | No |
| 17750452 | SEMICONDUCTOR DEVICE WITH LIGHT TRANSMITTANCE ADJUSTMENT PLATE AND PROCESSING METHOD THEREFOR, AND METHOD FOR MEASURING TEMPERATURE | May 2022 | June 2025 | Allow | 37 | 0 | 0 | Yes | No |
| 17778476 | APPARATUS WITH DEFORMABLE HEATER AND METHOD FOR HEATING A SUBSTRATE THEREOF | May 2022 | October 2025 | Allow | 41 | 1 | 0 | No | No |
| 17663488 | REINFORCEMENT PORTION PROCESSING APPARATUS | May 2022 | August 2025 | Allow | 39 | 1 | 0 | No | No |
| 17742447 | NON-CONTACT PROCESSING DEVICE AND PROCESSING METHOD INCLUDING MODIFICATION ENERGY AND SEPARATION ENERGY | May 2022 | January 2026 | Allow | 44 | 1 | 0 | No | No |
| 17661377 | FLOORING EDGE TOOLS | April 2022 | May 2025 | Allow | 36 | 0 | 1 | Yes | No |
| 17772166 | MANUFACTURING METHOD OF CHIP-ATTACHED SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS | April 2022 | October 2025 | Allow | 41 | 1 | 0 | No | No |
| 17720282 | WAFER PROCESSING APPARATUS INCLUDING ROTATABLE ELEMENT CONNECTED TO PRESSURE APPLYING ELEMENT | April 2022 | October 2025 | Allow | 42 | 1 | 0 | No | No |
| 17708579 | COOKTOP APPLIANCE AND DUAL WIRE SENSOR ASSEMBLY | March 2022 | June 2025 | Allow | 39 | 0 | 0 | No | No |
| 17754354 | PLASMA DEVICE ACTIVATION WITHIN A PREDETERMINED DISTANCE | March 2022 | August 2025 | Allow | 41 | 1 | 0 | No | No |
| 17708281 | SEMICONDUCTOR STRUCTURE WITH INTERCONNECTS AND METHOD FOR PREPARING SAME | March 2022 | March 2025 | Allow | 35 | 2 | 0 | No | No |
| 17763454 | REFLOW SOLDERING MACHINE FOR CONTINUOUSLY SOLDERING OF SOLDERING GOODS | March 2022 | July 2025 | Allow | 39 | 0 | 0 | No | No |
| 17703419 | ELECTRODE-EMBEDDED MEMBER WITH PIN-SHAPED PROJECTIONS OF VARYING HEIGHTS, SUBSTRATE HOLDING MEMBER, CERAMIC HEATER, AND ELECTROSTATIC CHUCK | March 2022 | January 2026 | Allow | 46 | 2 | 0 | No | No |
| 17701088 | THIN WAFER PROCESS FOR IMPROVED CRYSTAL UTILIZATION OF WIDE BANDGAP DEVICES | March 2022 | March 2025 | Allow | 36 | 0 | 0 | No | No |
| 17651858 | Transistors with Stacked Semiconductor Layers as Channels | February 2022 | April 2025 | Allow | 38 | 0 | 0 | No | No |
| 17675398 | POWDER SUPPLY ASSEMBLY INCLUDING MULTIPLE CONTAINER REGIONS AND FLOW CONTROL IN AN ADDITIVE MANUFACTURING SYSTEM | February 2022 | March 2026 | Allow | 49 | 1 | 0 | No | No |
| 17636266 | WAFER OPTICAL PROCESSING DEVICE AND SINTERING FURNACE | February 2022 | April 2025 | Allow | 38 | 1 | 0 | No | No |
| 17634801 | INTERMEDIATE HEATING STATION WITH SUPPORT PROJECTIONS ON LOWER MASK | February 2022 | June 2025 | Allow | 40 | 1 | 0 | No | No |
| 17591926 | COOKING APPLIANCE WITH RESIDUAL HEAT INDICATOR ASSEMBLY | February 2022 | July 2025 | Allow | 41 | 0 | 0 | No | No |
| 17570675 | BURIED NEAR-GATE LOCAL INTERCONNECTS AND METHODS OF THEIR MANUFACTURE | January 2022 | February 2026 | Allow | 50 | 1 | 1 | No | No |
| 17569892 | INDUCTION HEATING APPARATUS AND METHOD FOR CONTROLLING THE SAME | January 2022 | March 2025 | Allow | 38 | 0 | 0 | No | No |
| 17567136 | HEAT SHIELD WITH COIL RECESS FOR INDUCTION WELDING | January 2022 | December 2024 | Allow | 35 | 0 | 0 | No | No |
| 17564421 | TOWEL WARMING ASSEMBLY INCLUDING FRAGRANCE DOOR | December 2021 | June 2025 | Allow | 42 | 1 | 0 | No | No |
| 17621079 | LASER WELDING CONTROL FEEDBACK METHOD, APPARATUS AND SYSTEM, AND ELECTRONIC DEVICE | December 2021 | April 2025 | Allow | 40 | 1 | 0 | No | No |
| 17620211 | FLUX-CORED WIRE AND WELDING METHOD | December 2021 | January 2025 | Allow | 37 | 0 | 0 | No | No |
| 17552680 | DEVICE WITH DIELECTRIC METAL OXIDE LAYERS AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME | December 2021 | May 2025 | Allow | 41 | 2 | 0 | Yes | No |
| 17643073 | SEMICONDUCTOR MANUFACTURING METHOD AND MANUFACTURING DEVICE OF EDGE LASER REMOVAL OF COMBINED SUBSTRATE | December 2021 | March 2024 | Allow | 27 | 1 | 0 | No | No |
| 17596163 | Welding Work Measurement System | December 2021 | May 2025 | Allow | 42 | 1 | 0 | No | No |
| 17541166 | LASER WELDING DEVICE WITH CHANGING FOCAL POSITION AND LASER WELDING METHOD USING SAME | December 2021 | January 2025 | Allow | 37 | 1 | 0 | No | No |
| 17595764 | LASER PROCESSING SYSTEM USING BESSEL BEAM AND METHOD FOR PROCESSING WORKPIECE USING BESSEL BEAM | November 2021 | March 2025 | Allow | 40 | 1 | 0 | No | No |
| 17532719 | CONNECTOR AND LASER ENGRAVING LABEL FORMING METHOD THEREOF | November 2021 | February 2025 | Allow | 38 | 1 | 0 | No | No |
| 17530729 | TOUCH-START WELDING METHOD BETWEEN COILS OF DIFFERENT HEIGHT AND DEVICE THEREOF | November 2021 | March 2025 | Allow | 40 | 1 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner DULKA, JOHN P.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 25.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner DULKA, JOHN P works in Art Unit 2817 and has examined 149 patent applications in our dataset. With an allowance rate of 99.3%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 38 months.
Examiner DULKA, JOHN P's allowance rate of 99.3% places them in the 93% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by DULKA, JOHN P receive 1.95 office actions before reaching final disposition. This places the examiner in the 48% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by DULKA, JOHN P is 38 months. This places the examiner in the 30% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +0.9% benefit to allowance rate for applications examined by DULKA, JOHN P. This interview benefit is in the 19% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 35.0% of applications are subsequently allowed. This success rate is in the 78% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 49.2% of cases where such amendments are filed. This entry rate is in the 74% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 0.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 13% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.
This examiner withdraws rejections or reopens prosecution in 80.0% of appeals filed. This is in the 72% percentile among all examiners. Of these withdrawals, 75.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 83.3% are granted (fully or in part). This grant rate is in the 86% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 8.7% of allowed cases (in the 92% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 30% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.