Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19232724 | INTERCONNECT SUBSTRATE AND METHOD OF MAKING | June 2025 | January 2026 | Allow | 8 | 1 | 0 | No | No |
| 19218116 | MOLDED BRIDGE WITH VERTICAL INTERCONNECTS AND METHOD OF MAKING THE SAME | May 2025 | November 2025 | Allow | 6 | 1 | 1 | No | No |
| 18674903 | PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18657031 | DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, ELECTRONIC APPARATUS, AND LIGHTING DEVICE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18641449 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | April 2024 | March 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18641442 | INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF | April 2024 | July 2025 | Allow | 15 | 2 | 0 | No | No |
| 18602718 | Package-On-Package Device | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18599304 | Semiconductor Device and Method of Forming Vertical Interconnect Structure for POP Module | March 2024 | October 2025 | Allow | 19 | 3 | 0 | No | No |
| 18434703 | OPTOELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | February 2024 | December 2024 | Allow | 11 | 1 | 0 | No | No |
| 18430066 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | February 2024 | December 2025 | Allow | 22 | 0 | 0 | No | No |
| 18428934 | Arrangement of Power-Grounds in Package Structures | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18415460 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE | January 2024 | August 2025 | Allow | 19 | 1 | 0 | Yes | No |
| 18413154 | DISPLAY PANEL | January 2024 | December 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18406636 | MANAGEMENT OF HEAT ON A SEMICONDUCTOR DEVICE AND METHODS FOR PRODUCING THE SAME | January 2024 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18403583 | METHODS OF MANUFACTURING A FAN-OUT PANEL LEVEL SEMICONDUCTOR PACKAGE | January 2024 | February 2025 | Allow | 13 | 1 | 0 | Yes | No |
| 18401928 | THREE-DIMENSIONAL (3D) PACKAGE | January 2024 | May 2025 | Allow | 16 | 2 | 0 | No | No |
| 18526016 | MEMORY PACKAGES AND METHODS OF FORMING SAME | December 2023 | October 2025 | Allow | 22 | 3 | 0 | Yes | No |
| 18519200 | METHOD FOR FORMING CAPACITOR, SEMICONDUCTOR DEVICE, MODULE, AND ELECTRONIC DEVICE | November 2023 | June 2025 | Allow | 19 | 2 | 0 | No | No |
| 18515156 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | November 2023 | March 2026 | Allow | 28 | 1 | 0 | No | No |
| 18508165 | METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM | November 2023 | September 2024 | Allow | 11 | 0 | 1 | No | No |
| 18506111 | PACKAGE STRUCTURE | November 2023 | September 2024 | Allow | 11 | 1 | 0 | No | No |
| 18502086 | METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE | November 2023 | September 2025 | Allow | 23 | 3 | 0 | No | No |
| 18487830 | DISPLAY APPARATUS | October 2023 | February 2025 | Allow | 16 | 1 | 0 | No | No |
| 18238082 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSOR, AND ELECTRONIC EQUIPMENT | August 2023 | March 2025 | Allow | 18 | 2 | 0 | No | No |
| 18447535 | SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME | August 2023 | August 2024 | Allow | 12 | 1 | 0 | Yes | No |
| 18366282 | Antenna Apparatus and Method | August 2023 | September 2024 | Allow | 13 | 0 | 0 | No | No |
| 18365915 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | August 2023 | August 2024 | Allow | 12 | 1 | 0 | Yes | No |
| 18364314 | FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV) VERTICAL INTERCONNECTS | August 2023 | June 2025 | Allow | 22 | 2 | 0 | No | No |
| 18362599 | Semiconductor Package and Method | July 2023 | March 2024 | Allow | 8 | 0 | 0 | No | No |
| 18361480 | METHOD FOR FORMING CHIP PACKAGE STRUCTURE | July 2023 | November 2024 | Allow | 16 | 2 | 0 | No | No |
| 18359807 | METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER | July 2023 | August 2024 | Allow | 13 | 1 | 0 | No | No |
| 18359273 | Integrated Circuit Structure and Method | July 2023 | August 2024 | Allow | 13 | 1 | 0 | No | No |
| 18357704 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | July 2023 | October 2025 | Allow | 27 | 2 | 0 | No | No |
| 18348351 | INTEGRATED FAN-OUT PACKAGE HAVING STRESS RELEASE STRUCTURE | July 2023 | August 2025 | Allow | 25 | 4 | 0 | No | No |
| 18217739 | METHODS FOR FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | July 2023 | August 2024 | Allow | 13 | 1 | 0 | No | No |
| 18344920 | Semiconductor Device and Method of Forming Inverted EWLB Package with Vertical E-Bar Structure | June 2023 | January 2026 | Allow | 31 | 1 | 1 | No | No |
| 18216041 | SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN HAVING SIDEWALLS WITH CONVEX AND CONCAVE PORTIONS | June 2023 | September 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 18343606 | Semiconductor Device and Method of Forming Discrete Antenna Modules | June 2023 | December 2024 | Allow | 17 | 2 | 0 | No | No |
| 18258190 | MEMORY DEVICE AND MEMORY DEVICE MODULE | June 2023 | February 2024 | Allow | 8 | 1 | 0 | No | No |
| 18324686 | Semiconductor Device | May 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18196542 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE HAVING INTERCONNECTIONS BETWEEN DIES | May 2023 | February 2025 | Allow | 21 | 1 | 0 | No | No |
| 18141838 | SEMICONDUCTOR PACKAGE DEVICE | May 2023 | April 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18306702 | PACKAGED INTERCONNECT STRUCTURES | April 2023 | February 2026 | Allow | 33 | 1 | 1 | Yes | No |
| 18303929 | DISPLAY WITH EMBEDDED PIXEL DRIVER CHIPS | April 2023 | November 2024 | Allow | 19 | 1 | 0 | No | No |
| 18136921 | LIGHT-EMITTING DEVICE | April 2023 | August 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18133656 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | April 2023 | September 2024 | Allow | 17 | 2 | 0 | Yes | No |
| 18296843 | HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS | April 2023 | February 2026 | Allow | 34 | 1 | 1 | No | No |
| 18128077 | INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES | March 2023 | January 2025 | Allow | 22 | 2 | 0 | No | No |
| 18125989 | SEMICONDUCTOR PACKAGE INCLUDING ANTENNA | March 2023 | July 2024 | Allow | 16 | 2 | 0 | Yes | No |
| 18189622 | SUBSTRATE, PACKAGED STRUCTURE, AND ELECTRONIC DEVICE | March 2023 | March 2026 | Allow | 36 | 1 | 0 | No | No |
| 18125170 | SEMICONDUCTOR PACKAGE DEVICE | March 2023 | May 2024 | Allow | 13 | 2 | 0 | No | No |
| 18026083 | WIRING SUBSTRATE AND ELECTRONIC DEVICE | March 2023 | January 2026 | Allow | 34 | 0 | 0 | No | No |
| 18043582 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT DEVICE | March 2023 | January 2026 | Allow | 34 | 1 | 1 | Yes | No |
| 18172326 | INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF | February 2023 | January 2024 | Allow | 11 | 1 | 0 | No | No |
| 18158078 | PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME | January 2023 | March 2026 | Allow | 37 | 1 | 1 | No | No |
| 18152153 | CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME | January 2023 | January 2026 | Allow | 36 | 1 | 1 | No | No |
| 18078111 | METHOD OF FABRICATING PACKAGE STRUCTURE | December 2022 | May 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 18078135 | METHOD FOR SEPARATING A SOLID BODY | December 2022 | January 2024 | Allow | 13 | 2 | 0 | No | No |
| 18060853 | Semiconductor Package with Multiple Redistribution Substrates | December 2022 | February 2024 | Allow | 14 | 2 | 0 | Yes | No |
| 17989224 | THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING METHOD THEREOF, AND WIRELESS HEADSET | November 2022 | January 2026 | Allow | 38 | 1 | 1 | No | No |
| 17919280 | FAN-OUT PACKAGE STRUCTURE | October 2022 | September 2025 | Allow | 35 | 1 | 0 | No | No |
| 18046028 | Semiconductor Device and Method of Forming Graphene Core Shell Embedded Within Shielding Layer | October 2022 | October 2025 | Allow | 36 | 1 | 1 | No | No |
| 17964381 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | October 2022 | July 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 17956153 | SEMICONDUCTOR PACKAGE INCLUDING PHOTO IMAGEABLE DIELECTRIC | September 2022 | March 2025 | Allow | 29 | 2 | 0 | Yes | No |
| 17936132 | SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR | September 2022 | December 2025 | Allow | 39 | 1 | 1 | Yes | No |
| 17951722 | SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD | September 2022 | October 2025 | Allow | 36 | 1 | 1 | No | No |
| 17897523 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | August 2022 | June 2025 | Allow | 34 | 1 | 0 | No | No |
| 17821725 | SIGNAL-HEAT SEPARATED TMV PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | August 2022 | January 2026 | Allow | 40 | 1 | 1 | No | No |
| 17820957 | Semiconductor Device and Method for Partial EMI Shielding | August 2022 | July 2025 | Allow | 35 | 1 | 1 | No | No |
| 17820502 | Semiconductor Device and Method of Forming Module-in-Package Structure Using Redistribution Layer | August 2022 | November 2025 | Allow | 39 | 3 | 0 | No | No |
| 17889358 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | August 2022 | November 2025 | Allow | 39 | 2 | 1 | No | No |
| 17818797 | Semiconductor Devices and Methods of Manufacture | August 2022 | June 2024 | Allow | 22 | 2 | 0 | No | No |
| 17815638 | SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR | July 2022 | April 2025 | Allow | 32 | 0 | 1 | No | No |
| 17872473 | CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF CHIP PACKAGE ASSEMBLY | July 2022 | April 2025 | Allow | 33 | 1 | 0 | No | No |
| 17873073 | METHOD OF FABRICATING PACKAGE STRUCTURE | July 2022 | May 2024 | Allow | 21 | 1 | 0 | Yes | No |
| 17873135 | SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING A SEMICONDUCTOR PACKAGE | July 2022 | June 2025 | Allow | 35 | 1 | 1 | No | No |
| 17814121 | Semiconductor Device and Method of Forming Conductive Structure for EMI Shielding and Heat Dissipation | July 2022 | July 2025 | Allow | 36 | 2 | 0 | No | No |
| 17870104 | Semiconductor Devices and Methods of Manufacture | July 2022 | October 2024 | Allow | 27 | 1 | 0 | No | No |
| 17793722 | LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | July 2022 | August 2025 | Allow | 37 | 2 | 0 | No | No |
| 17864470 | SEMICONDUCTOR PACKAGE STRUCTURE HAVING INTERCONNECTIONS BETWEEN DIES AND MANUFACTURING METHOD THEREOF | July 2022 | February 2025 | Allow | 31 | 1 | 0 | No | No |
| 17864953 | POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF | July 2022 | August 2025 | Allow | 37 | 1 | 0 | No | No |
| 17860491 | LOW COST WAFER LEVEL PACKAGES AND SILICON | July 2022 | August 2025 | Allow | 37 | 1 | 1 | No | No |
| 17857066 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | July 2022 | March 2024 | Allow | 21 | 0 | 0 | No | No |
| 17810028 | A Method of Forming An Embedded Magnetic Shielding Device | June 2022 | August 2025 | Allow | 37 | 1 | 1 | Yes | No |
| 17851870 | WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREPARATION METHOD | June 2022 | August 2025 | Allow | 38 | 1 | 1 | No | No |
| 17789390 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | June 2022 | April 2025 | Allow | 33 | 1 | 0 | No | No |
| 17846596 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | June 2022 | February 2024 | Allow | 20 | 1 | 0 | No | No |
| 17842411 | THREE-DIMENSIONAL TYPE NAND MEMORY DEVICE | June 2022 | July 2025 | Allow | 37 | 1 | 1 | No | No |
| 17840435 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | June 2022 | July 2024 | Allow | 25 | 3 | 0 | No | No |
| 17806660 | 3D Embedded Redistribution Layers for IC Substrate Packaging | June 2022 | August 2025 | Allow | 38 | 2 | 0 | Yes | No |
| 17837039 | 3D SEMICONDUCTOR PACKAGES | June 2022 | October 2024 | Allow | 28 | 3 | 0 | Yes | No |
| 17783969 | DISPLAY DEVICE | June 2022 | December 2024 | Allow | 30 | 0 | 0 | No | No |
| 17834977 | A NON-VOLATILE MEMORY DEVICE | June 2022 | January 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 17833395 | Dielectric Layers Having Nitrogen-Containing Crusted Surfaces | June 2022 | October 2025 | Allow | 41 | 1 | 1 | No | No |
| 17832306 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES HAVING METAL GATE STRUCTURE AND SEMICONDUCTOR DEVICES | June 2022 | September 2025 | Allow | 39 | 2 | 0 | Yes | No |
| 17827006 | NANO THROUGH SUBSTRATE VIAS FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS | May 2022 | August 2025 | Allow | 39 | 2 | 1 | No | No |
| 17824923 | METHOD FOR MANUFACTURING SILICON PHOTONIC DEVICE AND SILICON PHOTONIC DEVICE THEREOF | May 2022 | May 2025 | Allow | 35 | 1 | 1 | Yes | No |
| 17779402 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS | May 2022 | March 2025 | Allow | 34 | 1 | 0 | No | No |
| 17664801 | DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE | May 2022 | April 2024 | Allow | 23 | 1 | 0 | No | No |
| 17664809 | DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE | May 2022 | July 2024 | Allow | 26 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner SYLVIA, CHRISTINA A.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner SYLVIA, CHRISTINA A works in Art Unit 2817 and has examined 81 patent applications in our dataset. With an allowance rate of 96.3%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 28 months.
Examiner SYLVIA, CHRISTINA A's allowance rate of 96.3% places them in the 86% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by SYLVIA, CHRISTINA A receive 1.95 office actions before reaching final disposition. This places the examiner in the 48% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by SYLVIA, CHRISTINA A is 28 months. This places the examiner in the 69% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +4.5% benefit to allowance rate for applications examined by SYLVIA, CHRISTINA A. This interview benefit is in the 29% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 26.9% of applications are subsequently allowed. This success rate is in the 45% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 45.0% of cases where such amendments are filed. This entry rate is in the 68% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 200.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 95% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 92% percentile among all examiners. Of these withdrawals, 100.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 40.0% are granted (fully or in part). This grant rate is in the 30% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 24% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 5.1% of allowed cases (in the 81% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.