Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19207750 | Semiconductor Package with Integrated Capacitors | May 2025 | March 2026 | Allow | 10 | 2 | 0 | No | No |
| 19097611 | FIELD EFFECT TRANSISTOR INCLUDING TRANSITION METAL DICHALCOGENIDE COVERED WITH PROTECTIVE LAYER, AND METHOD OF MANUFACTURING THE SAME | April 2025 | May 2025 | Allow | 1 | 0 | 0 | No | No |
| 18773010 | Semiconductor Package with Integrated Capacitors | July 2024 | April 2025 | Allow | 9 | 1 | 0 | No | No |
| 18758992 | MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS | June 2024 | August 2025 | Allow | 14 | 1 | 0 | No | No |
| 18747337 | Manufacturing Method for a Power MOSFET with Gate-Source ESD Diode Structure | June 2024 | September 2024 | Allow | 3 | 1 | 0 | No | No |
| 18740523 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | June 2024 | January 2026 | Allow | 19 | 1 | 1 | No | No |
| 18735185 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | June 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18731407 | ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STRUCTURES AND METHODS OF FORMING THE SAME | June 2024 | March 2025 | Allow | 9 | 1 | 0 | No | No |
| 18679941 | SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE, AND GAS CONCENTRATION MEASURING DEVICE | May 2024 | January 2025 | Allow | 8 | 1 | 0 | No | No |
| 18668887 | SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18662916 | METHODS OF FABRICATING PACKAGE STRUCTURE | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18662075 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | May 2024 | February 2026 | Allow | 21 | 1 | 0 | No | No |
| 18652515 | APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS | May 2024 | January 2025 | Allow | 9 | 1 | 0 | No | No |
| 18624686 | PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS | April 2024 | September 2025 | Allow | 18 | 3 | 0 | No | No |
| 18616245 | ORGANIC ELECTROLUMINESCENT DEVICES | March 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18613089 | DISPLAY PANEL | March 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18599472 | ORGANIC ELECTROLUMINESCENT DEVICES | March 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18597684 | MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18590585 | REDISTRIBUTION STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | February 2024 | March 2025 | Allow | 13 | 1 | 0 | No | No |
| 18590718 | SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME | February 2024 | September 2025 | Abandon | 18 | 1 | 0 | No | No |
| 18412583 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE | January 2024 | December 2024 | Allow | 11 | 1 | 0 | No | No |
| 18399885 | SOURCE/DRAIN REGIONS IN INTEGRATED CIRCUIT STRUCTURES | December 2023 | April 2025 | Allow | 15 | 2 | 0 | Yes | No |
| 18390051 | Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation | December 2023 | December 2024 | Allow | 12 | 1 | 0 | No | No |
| 18539847 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | December 2023 | October 2024 | Allow | 10 | 1 | 0 | No | No |
| 18535375 | ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES | December 2023 | November 2024 | Allow | 12 | 1 | 0 | No | No |
| 18522537 | SEMICONDUCTOR DEVICE INCLUDING INSULATING ELEMENT AND METHOD OF MAKING | November 2023 | November 2025 | Allow | 23 | 1 | 1 | No | No |
| 18515264 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | November 2023 | September 2024 | Allow | 10 | 1 | 0 | No | No |
| 18507759 | Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF FORMING THE SAME | November 2023 | March 2025 | Allow | 16 | 1 | 0 | No | No |
| 18501065 | Quantum Dot Light-Emitting Device, Manufacturing Method and Display Device | November 2023 | August 2024 | Allow | 10 | 1 | 0 | No | No |
| 18386728 | MULTILAYER ELECTRICAL CONDUCTORS FOR TRANSFER PRINTING | November 2023 | December 2025 | Allow | 25 | 2 | 0 | No | No |
| 18473609 | METAL-ASSISTED DELAYED FLUORESCENT MATERIALS AS CO-HOST MATERIALS FOR FLUORESCENT OLEDS | September 2023 | September 2024 | Allow | 12 | 1 | 0 | No | No |
| 18244350 | INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | September 2023 | July 2024 | Allow | 10 | 1 | 0 | No | No |
| 18240026 | ORGANIC LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME | August 2023 | October 2025 | Allow | 26 | 0 | 0 | No | No |
| 18451727 | ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES | August 2023 | June 2024 | Allow | 10 | 1 | 0 | No | No |
| 18447443 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING | August 2023 | November 2024 | Allow | 15 | 1 | 0 | No | No |
| 18366779 | Magnetic Tunnel Junction Device and Method of Forming Same | August 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18230718 | COMPUTATIONAL ANALYSIS OF BIOLOGICAL DATA USING MANIFOLD AND A HYPERPLANE | August 2023 | June 2024 | Allow | 10 | 1 | 0 | No | No |
| 18228787 | LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COMMODITY PROGRAMMABLE LOGIC IC CHIP AND MEMORY IC CHIP | August 2023 | March 2025 | Allow | 60 | 0 | 0 | No | No |
| 18362973 | METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCTOR STRUCTURE | August 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18361933 | METALLIZATION STRUCTURE | July 2023 | November 2024 | Allow | 15 | 1 | 0 | No | No |
| 18361917 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | July 2023 | March 2024 | Allow | 7 | 0 | 0 | No | No |
| 18361332 | Package Structure and Method and Equipment for Forming the Same | July 2023 | February 2024 | Allow | 7 | 0 | 0 | No | No |
| 18227451 | SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSERS IN HETEROGENEOUSLY INTEGRATED SYSTEMS | July 2023 | February 2026 | Allow | 31 | 1 | 0 | No | No |
| 18359864 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | July 2023 | February 2025 | Allow | 18 | 2 | 0 | No | No |
| 18358400 | SEMICONDUCTOR DEVICE | July 2023 | November 2025 | Allow | 28 | 0 | 0 | No | No |
| 18357224 | INTEGRATED CIRCUIT FILLER AND METHOD THEREOF | July 2023 | August 2024 | Allow | 13 | 1 | 0 | No | No |
| 18216102 | MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS | June 2023 | May 2024 | Allow | 10 | 1 | 0 | No | No |
| 18343888 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | June 2023 | December 2024 | Allow | 17 | 2 | 0 | No | No |
| 18344182 | Semiconductor Device and Method of Forming Hybrid TIM Layers | June 2023 | July 2024 | Allow | 13 | 2 | 0 | No | No |
| 18342755 | SEMICONDUCTOR STRUCTURE HAVING PHOTONIC DIE AND ELECTRONIC DIE | June 2023 | May 2025 | Allow | 22 | 1 | 0 | No | No |
| 18340387 | Reinforcing Package Using Reinforcing Patches | June 2023 | May 2024 | Allow | 11 | 1 | 0 | No | No |
| 18340380 | WAFER LEVEL CHIP SCALE PACKAGE HAVING VARYING THICKNESSES | June 2023 | March 2025 | Allow | 20 | 1 | 1 | No | No |
| 18333951 | SEMICONDUCTOR DEVICE | June 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18332863 | SEMICONDUCTOR PACKAGE WITH TSV INDUCTOR | June 2023 | July 2024 | Allow | 13 | 1 | 0 | Yes | No |
| 18331249 | TRIM WALL PROTECTION METHOD FOR MULTI-WAFER STACKING | June 2023 | June 2024 | Allow | 13 | 1 | 0 | No | No |
| 18331589 | ELECTRONIC COMPONENT AND METHOD FOR FORMING RESIN LAYER ON ELECTRONIC COMPONENT | June 2023 | February 2026 | Allow | 32 | 1 | 0 | Yes | No |
| 18253945 | WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT | May 2023 | February 2026 | Allow | 33 | 1 | 0 | Yes | No |
| 18199824 | INTERCONNECTION STRUCTURE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING INTERCONNECTION STRUCTURE | May 2023 | January 2024 | Allow | 8 | 0 | 0 | No | No |
| 18315463 | SEMICONDUCTOR PACKAGES | May 2023 | January 2025 | Allow | 21 | 2 | 0 | No | No |
| 18313475 | SWITCHING LAYER SCHEME TO ENHANCE RRAM PERFORMANCE | May 2023 | April 2024 | Allow | 11 | 1 | 0 | No | No |
| 18312801 | APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS AND METHODS | May 2023 | January 2024 | Allow | 8 | 1 | 0 | No | No |
| 18311621 | SEMICONDUCTOR PACKAGE | May 2023 | September 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 18138948 | SEMICONDUCTOR DEVICE | April 2023 | September 2025 | Allow | 29 | 0 | 0 | No | No |
| 18303543 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | April 2023 | March 2024 | Allow | 11 | 1 | 0 | No | No |
| 18303240 | Metal Etching Stop Layer in Magnetic Tunnel Junction Memory Cells | April 2023 | February 2026 | Allow | 34 | 2 | 0 | No | No |
| 18302500 | Semiconductor Package and Method of Manufacture | April 2023 | August 2025 | Allow | 28 | 1 | 0 | No | No |
| 18301246 | INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | April 2023 | April 2024 | Allow | 12 | 1 | 1 | No | No |
| 18300372 | HIGH ELECTRON MOBILITY TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF | April 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18300175 | Semiconductor Device and Method of Manufacture | April 2023 | August 2024 | Allow | 16 | 2 | 0 | No | No |
| 18298379 | WAFER-LEVEL HETEROGENEOUS DIES INTEGRATION STRUCTURE AND METHOD | April 2023 | November 2023 | Allow | 7 | 0 | 0 | No | No |
| 18194381 | SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME | March 2023 | November 2023 | Allow | 8 | 0 | 0 | No | No |
| 18128952 | MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR | March 2023 | May 2024 | Allow | 14 | 0 | 0 | No | No |
| 18189834 | INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | March 2023 | July 2025 | Allow | 28 | 1 | 0 | Yes | No |
| 18122224 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | March 2023 | March 2026 | Allow | 36 | 1 | 1 | No | No |
| 18121189 | ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STRUCTURES AND METHODS OF FORMING THE SAME | March 2023 | March 2024 | Allow | 12 | 1 | 0 | No | No |
| 18183924 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | March 2023 | September 2023 | Allow | 6 | 0 | 0 | No | No |
| 18183062 | SEMICONDUCTOR PACKAGE | March 2023 | October 2024 | Allow | 19 | 1 | 0 | No | No |
| 18119396 | ORGANIC ELECTROLUMINESCENT DEVICES | March 2023 | January 2024 | Allow | 11 | 1 | 0 | No | No |
| 18180563 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | March 2023 | March 2026 | Allow | 36 | 1 | 0 | Yes | No |
| 18110994 | SEMICONDUCTOR PACKAGE | February 2023 | October 2025 | Allow | 32 | 0 | 0 | No | No |
| 18169303 | CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND METHOD FOR PACKAGING SEMICONDUCTOR STRUCTURE | February 2023 | July 2025 | Allow | 29 | 0 | 0 | No | No |
| 18107991 | DISPLAY PANEL, METHOD OF MANUFACTURING THE SAME AND DISPLAY DEVICE | February 2023 | February 2025 | Allow | 24 | 1 | 0 | No | No |
| 18165928 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE | February 2023 | February 2024 | Allow | 13 | 0 | 0 | No | No |
| 18165808 | DISPLAY DEVICE | February 2023 | September 2025 | Allow | 31 | 1 | 0 | No | No |
| 18106225 | SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE | February 2023 | January 2024 | Allow | 11 | 1 | 0 | No | No |
| 18105970 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | February 2023 | May 2024 | Allow | 15 | 0 | 0 | No | No |
| 18161707 | METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP | January 2023 | December 2025 | Abandon | 34 | 1 | 0 | No | No |
| 18099715 | METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK | January 2023 | August 2025 | Allow | 31 | 0 | 0 | No | No |
| 18098158 | SEMICONDUCTOR PACKAGE | January 2023 | November 2024 | Allow | 22 | 2 | 0 | Yes | No |
| 18152496 | TRANSIENT-SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREOF | January 2023 | December 2025 | Abandon | 35 | 1 | 0 | No | No |
| 18152615 | Package with Improved Heat Dissipation Efficiency and Method for Forming the Same | January 2023 | February 2026 | Allow | 37 | 0 | 1 | No | No |
| 18152453 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | January 2023 | February 2026 | Allow | 37 | 1 | 1 | No | No |
| 18093499 | DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME, AND TILED DISPLAY DEVICE INCLUDING THE SAME | January 2023 | August 2025 | Allow | 31 | 1 | 0 | No | No |
| 18149793 | Integrated Circuit Packages and Methods of Forming the Same | January 2023 | March 2026 | Allow | 38 | 1 | 1 | No | No |
| 18091072 | SEMICONDUCTOR PACKAGE WITH INTERPOSER INCLUDING RECESS | December 2022 | January 2026 | Allow | 36 | 1 | 0 | Yes | No |
| 18145047 | SEMICONDUCTOR PACKAGE INCLUDING ANTENNA AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | December 2022 | January 2026 | Allow | 37 | 1 | 1 | No | No |
| 18086545 | SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF | December 2022 | September 2024 | Allow | 21 | 1 | 1 | No | No |
| 18083809 | PLASMONIC OLEDs AND VERTICAL DIPOLE EMITTERS | December 2022 | December 2023 | Allow | 12 | 1 | 0 | No | No |
| 18067221 | SEMICONDUCTOR PACKAGE STRUCTURE HAVING ANTENNA ARRAY | December 2022 | January 2026 | Allow | 37 | 1 | 1 | No | No |
| 18067060 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | December 2022 | July 2025 | Allow | 31 | 0 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner TOBERGTE, NICHOLAS J.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 50.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner TOBERGTE, NICHOLAS J works in Art Unit 2817 and has examined 469 patent applications in our dataset. With an allowance rate of 97.9%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 18 months.
Examiner TOBERGTE, NICHOLAS J's allowance rate of 97.9% places them in the 90% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by TOBERGTE, NICHOLAS J receive 1.00 office actions before reaching final disposition. This places the examiner in the 10% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by TOBERGTE, NICHOLAS J is 18 months. This places the examiner in the 96% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a -1.8% benefit to allowance rate for applications examined by TOBERGTE, NICHOLAS J. This interview benefit is in the 9% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 35.7% of applications are subsequently allowed. This success rate is in the 80% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 70.0% of cases where such amendments are filed. This entry rate is in the 92% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 133.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 86% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 92% percentile among all examiners. Of these withdrawals, 100.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 13.6% are granted (fully or in part). This grant rate is in the 8% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 2.6% of allowed cases (in the 77% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 4.4% of allowed cases (in the 79% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.