Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18822980 | DIFFUSION BARRIER FOR INTERCONNECTS | September 2024 | April 2025 | Allow | 7 | 1 | 0 | No | No |
| 18633267 | SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFERENT SEMICONDUCTOR DIES | April 2024 | June 2025 | Allow | 15 | 1 | 0 | No | No |
| 18630883 | METHODS OF FORMING MICROELECTRONIC DEVICES | April 2024 | November 2025 | Allow | 19 | 0 | 1 | No | No |
| 18628525 | COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18624954 | WAFER BONDING METHOD | April 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18623707 | Controlling Detection Time in Photodetectors | April 2024 | July 2025 | Allow | 15 | 1 | 0 | No | No |
| 18616403 | SEMICONDUCTOR DEVICE COMPRISING DRIVER CIRCUIT | March 2024 | December 2024 | Allow | 8 | 0 | 0 | No | No |
| 18593467 | VERTICAL MEMORY DEVICES | March 2024 | May 2025 | Allow | 14 | 1 | 1 | No | No |
| 18435272 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | February 2024 | March 2025 | Allow | 13 | 1 | 0 | No | No |
| 18429311 | MEMORY DEVICES AND RELATED ELECTRONIC SYSTEMS | January 2024 | March 2025 | Allow | 13 | 0 | 0 | No | No |
| 18415558 | SEMICONDUCTOR PACKAGE AND METHOD OF BONDING WORKPIECES | January 2024 | May 2025 | Allow | 16 | 1 | 1 | No | No |
| 18411038 | SEMICONDUCTOR PACKAGE, METHOD OF BONDING WORKPIECES AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | January 2024 | March 2025 | Allow | 15 | 0 | 0 | No | No |
| 18400296 | ORGANIC LIGHT-EMITTING DEVICE | December 2023 | July 2024 | Allow | 7 | 0 | 0 | No | No |
| 18535623 | INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES | December 2023 | December 2024 | Allow | 12 | 1 | 0 | No | No |
| 18522461 | METHOD FOR FABRICATING A STRAINED STRUCTURE AND STRUCTURE FORMED | November 2023 | February 2025 | Allow | 15 | 2 | 0 | No | No |
| 18520467 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | November 2023 | February 2026 | Allow | 26 | 4 | 0 | Yes | No |
| 18564451 | DISPLAY PANEL | November 2023 | March 2026 | Allow | 27 | 0 | 0 | Yes | No |
| 18512648 | HIGH-K CAPACITOR DIELECTRIC HAVING A METAL OXIDE AREA COMPRISING BORON, ELECTRICAL DEVICE AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME | November 2023 | March 2025 | Allow | 16 | 0 | 0 | No | No |
| 18501314 | SEMICONDUCTOR PACKAGES INCLUDING PASSIVE DEVICES AND METHODS OF FORMING SAME | November 2023 | September 2024 | Allow | 11 | 1 | 0 | No | No |
| 18384008 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | October 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18491813 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | October 2023 | February 2025 | Allow | 16 | 2 | 0 | No | No |
| 18382956 | ELECTROLUMINESCENCE DISPLAY DEVICE HAVING A THROUGH-HOLE IN DISPLAY AREA | October 2023 | September 2024 | Allow | 11 | 1 | 0 | No | No |
| 18378166 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | October 2023 | December 2024 | Allow | 14 | 0 | 1 | No | No |
| 18483604 | STANDARD CELLS WITH MULTI-WELL SIZE PLACEMENTS | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18478821 | MICROELECTRONIC DEVICES, AND METHODS OF FORMING MICROELECTRONIC DEVICES | September 2023 | February 2025 | Allow | 16 | 0 | 1 | No | No |
| 18371805 | INTEGRATED CIRCUIT PRODUCT AND CHIP FLOORPLAN ARRANGEMENT THEREOF | September 2023 | August 2024 | Allow | 10 | 1 | 0 | No | No |
| 18469349 | ECO BASE CELL STRUCTURE, LAYOUT METHOD, AND SYSTEM | September 2023 | January 2026 | Allow | 28 | 0 | 0 | No | No |
| 18465244 | SEMICONDUCTOR MEMORY DEVICE | September 2023 | March 2026 | Allow | 30 | 0 | 0 | No | No |
| 18235995 | SEMICONDUCTOR DEVICE | August 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18236000 | SEMICONDUCTOR DEVICE | August 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18366686 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | August 2023 | March 2026 | Allow | 31 | 1 | 0 | No | No |
| 18231192 | THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTERPOSERS CARRYING A SUBSET OF THE EXTERNAL CONTACTS OF THE ASSEMBLY, AND METHODS OF MAKING THE SAME | August 2023 | August 2024 | Allow | 13 | 1 | 0 | No | No |
| 18365362 | INTEGRATED CIRCUIT PACKAGE AND METHOD | August 2023 | May 2025 | Allow | 22 | 1 | 1 | No | No |
| 18364310 | Bonding to Alignment Marks with Dummy Alignment Marks | August 2023 | October 2024 | Allow | 14 | 2 | 0 | No | No |
| 18361568 | SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE | July 2023 | April 2025 | Allow | 21 | 2 | 1 | No | No |
| 18359254 | METHODS OF FORMING EPITAXIAL STRUCTURES IN FIN-LIKE FIELD EFFECT TRANSISTORS | July 2023 | April 2024 | Allow | 9 | 0 | 0 | No | No |
| 18356538 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF | July 2023 | December 2025 | Allow | 29 | 1 | 0 | No | No |
| 18353621 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A MID-STACK SOURCE LAYER AND METHODS FOR FORMING THE SAME | July 2023 | November 2025 | Allow | 28 | 0 | 0 | No | No |
| 18349527 | THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION TRENCH DEPTH AND METHODS OF FORMING THE SAME | July 2023 | December 2025 | Allow | 29 | 0 | 0 | No | No |
| 18349017 | NONVOLATILE MEMORY DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF FABRICATING THE SAME | July 2023 | May 2024 | Allow | 10 | 0 | 0 | No | No |
| 18346692 | SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS BETWEEN SEMICONDUCTOR DIES AND METHODS OF FORMING THE SAME | July 2023 | April 2025 | Allow | 21 | 2 | 1 | No | No |
| 18340278 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | June 2023 | September 2025 | Allow | 27 | 0 | 0 | No | No |
| 18340086 | THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | June 2023 | February 2026 | Allow | 31 | 2 | 0 | No | No |
| 18336775 | DYNAMIC RANDOM-ACCESS MEMORY (DRAM) ON HOT COMPUTE LOGIC FOR LAST-LEVEL-CACHE APPLICATIONS | June 2023 | September 2025 | Allow | 27 | 0 | 0 | No | No |
| 18336097 | DRAM MEMORY DEVICE WITH XTACKING ARCHITECTURE | June 2023 | July 2024 | Allow | 13 | 1 | 0 | No | No |
| 18335923 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE HAVING VIAS AND PADS FORMED BY LASER | June 2023 | May 2025 | Allow | 23 | 1 | 1 | Yes | No |
| 18256933 | SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREFOR | June 2023 | October 2025 | Allow | 28 | 0 | 0 | No | No |
| 18206539 | METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THEREBY | June 2023 | July 2024 | Allow | 13 | 1 | 0 | No | No |
| 18328359 | MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND METHOD OF MANUFACTURING THE MEMORY DEVICE | June 2023 | March 2025 | Allow | 21 | 1 | 1 | No | No |
| 18202057 | CHIP PACKAGE STRUCTURE AND METHOD FOR PREVENTING WARPAGE OF CHIP PACKAGE STRUCTURE | May 2023 | January 2026 | Allow | 32 | 1 | 0 | No | No |
| 18323440 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME | May 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18199513 | ELECTRICAL PLANARIZATION OF CARBON NANOTUBE THIN FILMS FOR ELECTRONIC DEVICE APPLICATIONS | May 2023 | March 2026 | Allow | 34 | 1 | 0 | No | No |
| 18318240 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | May 2023 | February 2026 | Allow | 33 | 1 | 0 | No | No |
| 18197998 | SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE | May 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18196247 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | May 2023 | February 2026 | Allow | 33 | 1 | 0 | No | No |
| 18313786 | METHODS OF FORMING BONDING STRUCTURES | May 2023 | December 2025 | Allow | 32 | 1 | 0 | No | No |
| 18313783 | METHOD FOR FINFET FABRICATION AND STRUCTURE THEREOF | May 2023 | October 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 18143932 | SEMICONDUCTOR PACKAGE | May 2023 | June 2024 | Allow | 13 | 1 | 0 | Yes | No |
| 18142801 | ON CHIP INDUCTORS | May 2023 | February 2026 | Allow | 33 | 1 | 1 | No | No |
| 18141274 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | April 2023 | February 2026 | Allow | 33 | 1 | 0 | No | No |
| 18302112 | Heterogeneous Fan-Out Structure and Method of Manufacture | April 2023 | June 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18135766 | SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | April 2023 | December 2023 | Allow | 8 | 0 | 0 | No | No |
| 18301597 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC TRANSISTOR | April 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18132865 | COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME | April 2023 | February 2024 | Allow | 10 | 1 | 0 | No | No |
| 18297829 | DIFFUSION BARRIER COLLAR FOR INTERCONNECTS | April 2023 | August 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18129975 | DISPLAY DEVICE INCLUDING TRANSISTOR AND MANUFACTURING METHOD THEREOF | April 2023 | December 2023 | Allow | 9 | 0 | 0 | No | No |
| 18246391 | FILM FORMATION METHOD | March 2023 | October 2025 | Allow | 30 | 1 | 0 | No | No |
| 18027807 | ADVANCED LIFT METHOD AND APPARATUS FOR TRANSFERRING OPTICAL DEVICES USING LASER EMISSION AND PHOTOMASK TECHNIQUES | March 2023 | February 2026 | Allow | 34 | 0 | 0 | No | No |
| 18123582 | ORGANIC LIGHT-EMITTING DIODE DISPLAY SUBSTRATE AND DISPLAY DEVICE | March 2023 | January 2024 | Allow | 10 | 1 | 0 | No | No |
| 18122895 | Embedded Package with Shielding Pad | March 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18118821 | SEMICONDUCTOR DEVICE | March 2023 | February 2024 | Allow | 11 | 2 | 0 | No | No |
| 18117851 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | March 2023 | October 2025 | Allow | 31 | 1 | 0 | No | No |
| 18177279 | WIRING STRUCTURE OF ELECTRONIC DEVICE | March 2023 | September 2025 | Allow | 31 | 1 | 0 | No | No |
| 18042621 | METHOD FOR PRODUCING A RADIATION-EMITTING SEMICONDUCTOR CHIP, AND RADIATION-EMITTING SEMICONDUCTOR CHIP | February 2023 | September 2025 | Allow | 31 | 1 | 0 | No | No |
| 18172592 | DISPLAY PANEL AND DISPLAY DEVICE | February 2023 | October 2025 | Allow | 32 | 0 | 0 | No | No |
| 18167882 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | February 2023 | March 2026 | Allow | 37 | 1 | 1 | Yes | No |
| 18166465 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRACATING THE SAME | February 2023 | January 2026 | Allow | 36 | 1 | 1 | No | No |
| 18163416 | STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS | February 2023 | March 2026 | Allow | 37 | 1 | 1 | No | No |
| 18159508 | Controlling Detection Time in Photodetectors | January 2023 | December 2023 | Allow | 11 | 0 | 0 | No | No |
| 18099038 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | January 2023 | December 2025 | Allow | 35 | 1 | 1 | Yes | No |
| 18154471 | ORGANIC LIGHT-EMITTING DEVICE | January 2023 | September 2023 | Allow | 8 | 0 | 0 | No | No |
| 18151412 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | January 2023 | June 2024 | Allow | 17 | 1 | 0 | No | No |
| 18147342 | MICROELECTRONIC DEVICES INCLUDING CONTROL LOGIC REGIONS | December 2022 | April 2024 | Allow | 15 | 0 | 0 | No | No |
| 18145979 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | December 2022 | March 2024 | Allow | 15 | 1 | 0 | No | No |
| 18088474 | INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES | December 2022 | September 2023 | Allow | 9 | 0 | 0 | No | No |
| 18069257 | METHODS OF FORMING SEMICONDUCTOR PACKAGES WITH BACK SIDE METAL | December 2022 | March 2024 | Allow | 15 | 1 | 0 | No | No |
| 18076688 | ACTIVE PHASED ARRAY ANTENNA COMPRISING A PSEUDO WAFER INCLUDING MULTIPLE FEEDERS | December 2022 | July 2025 | Allow | 31 | 0 | 0 | No | No |
| 17985328 | SEMICONDUCTOR DEVICE INCLUDING STACK REGION AND PAD REGION HAVING DIFFERENT THICKNESS | November 2022 | February 2026 | Allow | 39 | 0 | 1 | No | No |
| 17983569 | SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR FABRICATING THE SAME | November 2022 | May 2025 | Allow | 30 | 0 | 0 | No | No |
| 18052689 | SEMICONDUCTOR MEMORY DEVICE | November 2022 | March 2026 | Allow | 40 | 1 | 0 | No | No |
| 17977689 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | October 2022 | April 2025 | Allow | 29 | 0 | 0 | No | No |
| 17975812 | DISPLAY DEVICE | October 2022 | March 2026 | Allow | 41 | 1 | 1 | No | No |
| 18048606 | MEMORY DEVICE | October 2022 | October 2025 | Allow | 36 | 1 | 1 | Yes | No |
| 17968775 | STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES | October 2022 | February 2025 | Allow | 28 | 3 | 0 | No | No |
| 17966205 | A STACKED SEMICONDUCTOR ASSEMBLY FOR DIRECT MOUNTING TO A PRINTED CIRCUIT BOARD | October 2022 | February 2026 | Allow | 40 | 0 | 1 | No | No |
| 17963959 | SEMICONDUCTOR DEVICE PACKAGE | October 2022 | January 2025 | Allow | 28 | 2 | 0 | No | No |
| 17798966 | DISPLAY DEVICE AND MOBILE TERMINAL | August 2022 | April 2025 | Allow | 33 | 0 | 0 | No | No |
| 17798326 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS | August 2022 | October 2025 | Allow | 38 | 1 | 1 | No | No |
| 17884499 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | August 2022 | April 2024 | Allow | 20 | 1 | 0 | No | No |
| 17881998 | SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFERENT SEMICONDUCTOR DIES | August 2022 | December 2023 | Allow | 16 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner TRAN, THANH Y.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 66.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner TRAN, THANH Y works in Art Unit 2817 and has examined 659 patent applications in our dataset. With an allowance rate of 95.1%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 19 months.
Examiner TRAN, THANH Y's allowance rate of 95.1% places them in the 84% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by TRAN, THANH Y receive 1.27 office actions before reaching final disposition. This places the examiner in the 17% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by TRAN, THANH Y is 19 months. This places the examiner in the 95% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +1.5% benefit to allowance rate for applications examined by TRAN, THANH Y. This interview benefit is in the 20% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 38.1% of applications are subsequently allowed. This success rate is in the 87% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 51.0% of cases where such amendments are filed. This entry rate is in the 77% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 133.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 86% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 71.4% of appeals filed. This is in the 59% percentile among all examiners. Of these withdrawals, 60.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 45.0% are granted (fully or in part). This grant rate is in the 38% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.3% of allowed cases (in the 56% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 22.3% of allowed cases (in the 94% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.