Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18922186 | BACK-GATE EFFECT CONTROL VIA DOPING | October 2024 | June 2025 | Allow | 7 | 1 | 0 | Yes | No |
| 18786636 | MEMORY STRUCTURES AND METHODS OF FORMING THE SAME | July 2024 | March 2025 | Allow | 8 | 1 | 0 | No | No |
| 18763686 | SEMICONDUCTOR PACKAGE | July 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18739428 | CAP STRUCTURE COUPLED TO SOURCE TO REDUCE SATURATION CURRENT IN HEMT DEVICE | June 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18738161 | VIA STRUCTURE AND METHODS OF FORMING THE SAME | June 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18679002 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18673892 | DISPLAY DEVICE | May 2024 | March 2025 | Allow | 10 | 0 | 0 | No | No |
| 18669577 | SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING THE SAME | May 2024 | June 2025 | Allow | 13 | 1 | 1 | No | No |
| 18663423 | ALEFT-ISD-LTSEE{Advanced Low Electrostatic Field Transistor Using Implanted S/D and Low Temperature Selective Epitaxial Extension} | May 2024 | January 2025 | Allow | 9 | 3 | 0 | Yes | No |
| 18663878 | DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME | May 2024 | June 2025 | Allow | 14 | 1 | 1 | No | No |
| 18661750 | APPARATUS FOR FABRICATING A SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | May 2024 | April 2025 | Allow | 12 | 1 | 1 | No | No |
| 18659519 | DEPFET TRANSISTOR | May 2024 | May 2025 | Allow | 12 | 0 | 1 | No | No |
| 18658027 | METHODS OF EQUALIZING GATE HEIGHTS IN EMBEDDED NON-VOLATILE MEMORY ON HKMG TECHNOLOGY | May 2024 | October 2024 | Allow | 6 | 0 | 1 | No | No |
| 18655453 | RANDOM NUMBER GENERATORS INCLUDING MAGNETIC-TUNNEL-JUNCTION LAYER STACKS | May 2024 | November 2024 | Allow | 6 | 1 | 1 | No | No |
| 18654293 | VERTICAL DEVICE TRIGGERED SILICON CONTROL RECTIFIER | May 2024 | February 2025 | Allow | 10 | 1 | 1 | No | No |
| 18654247 | NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION | May 2024 | January 2025 | Allow | 9 | 0 | 0 | No | No |
| 18654186 | HIGH VOLTAGE AVALANCHE DIODE FOR ACTIVE CLAMP DRIVERS | May 2024 | April 2025 | Allow | 11 | 0 | 1 | No | No |
| 18654794 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | May 2024 | May 2025 | Allow | 12 | 0 | 1 | No | No |
| 18649247 | STRUCTURES INCLUDING A PHOTODETECTOR AND MULTIPLE CATHODE CONTACTS | April 2024 | March 2025 | Allow | 10 | 2 | 0 | Yes | No |
| 18649713 | SEMICONDUCTOR DEVICE | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18648466 | SEMICONDUCTOR PACKAGE | April 2024 | May 2025 | Allow | 12 | 0 | 1 | No | No |
| 18642052 | DEVICE WITH METAL FIELD PLATE EXTENSION | April 2024 | January 2025 | Allow | 9 | 1 | 1 | Yes | No |
| 18637915 | BUFFERED TOP THIN FILM RESISTOR, MIM CAPACITOR, AND METHOD OF FORMING THE SAME | April 2024 | March 2025 | Allow | 11 | 2 | 0 | Yes | No |
| 18637061 | SEMICONDUCTOR DEVICE | April 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18635399 | SEMICONDUCTOR DEVICE STRUCTURE | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18632960 | UNDER-SOURCE BODY CONTACT | April 2024 | March 2025 | Allow | 12 | 2 | 0 | Yes | No |
| 18633188 | DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRONIC APPARATUS | April 2024 | January 2025 | Allow | 9 | 0 | 0 | No | No |
| 18632506 | STRUCTURES FOR A LATERALLY-DIFFUSED METAL-OXIDE-SEMICONDUCTOR TRANSISTOR | April 2024 | August 2024 | Allow | 5 | 0 | 1 | No | No |
| 18632902 | STRUCTURE INCLUDING MULTI-LEVEL FIELD PLATE AND METHOD OF FORMING THE STRUCTURE | April 2024 | August 2024 | Allow | 4 | 1 | 1 | No | No |
| 18632532 | SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME | April 2024 | January 2025 | Allow | 10 | 0 | 0 | No | No |
| 18629606 | EPITAXIAL OXIDE TRANSISTOR | April 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18629555 | EPITAXIAL OXIDE TRANSISTOR | April 2024 | April 2025 | Allow | 12 | 0 | 0 | No | No |
| 18628275 | Laser Edge Shaping for Semiconductor Wafers | April 2024 | November 2024 | Allow | 7 | 1 | 0 | No | No |
| 18626720 | BIPOLAR TRANSISTOR | April 2024 | March 2025 | Allow | 11 | 1 | 1 | No | No |
| 18625604 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | April 2024 | June 2025 | Allow | 14 | 1 | 1 | Yes | No |
| 18619182 | METHOD OF MANUFACTURING MERGED PiN SCHOTTKY (MPS) DIODE | March 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18617971 | HEAT SINK FOR FACE BONDED SEMICONDUCTOR DEVICE | March 2024 | March 2025 | Allow | 11 | 1 | 1 | No | No |
| 18617795 | SURFACE DAMAGE CONTROL IN DIODES | March 2024 | March 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18617113 | SEMICONDUCTOR PACKAGE | March 2024 | January 2025 | Allow | 10 | 1 | 0 | Yes | No |
| 18616221 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | March 2024 | June 2025 | Allow | 15 | 0 | 1 | No | No |
| 18616427 | Fan-Out Package Having a Main Die and a Dummy Die | March 2024 | October 2024 | Allow | 6 | 0 | 0 | No | No |
| 18615573 | SEMICONDUCTOR DEVICE INCLUDING GATE CONTACT STRUCTURE FORMED FROM GATE STRUCTURE | March 2024 | November 2024 | Allow | 7 | 0 | 1 | No | No |
| 18615615 | MULTI-CHANNEL TRANSISTOR | March 2024 | September 2024 | Allow | 6 | 0 | 1 | No | No |
| 18613356 | METHOD FOR MAKING NANOSTRUCTURE TRANSISTORS WITH OFFSET SOURCE/DRAIN DOPANT BLOCKING STRUCTURES INCLUDING A SUPERLATTICE | March 2024 | July 2024 | Allow | 4 | 0 | 0 | No | No |
| 18613389 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES | March 2024 | September 2024 | Allow | 6 | 0 | 0 | No | No |
| 18614439 | SEMICONDUCTOR RECTIFIER AND MANUFACTURING METHOD OF THE SAME | March 2024 | August 2024 | Allow | 5 | 1 | 1 | No | No |
| 18611923 | TRANSISTOR STACKS HAVING INSULATING SPACERS, AND RELATED FABRICATION METHODS | March 2024 | March 2025 | Allow | 12 | 2 | 1 | Yes | No |
| 18611723 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | March 2024 | February 2025 | Allow | 11 | 2 | 0 | No | No |
| 18608957 | SEMICONDUCTOR STRUCTURE | March 2024 | February 2025 | Allow | 11 | 1 | 0 | No | No |
| 18604620 | METHOD FOR MAKING A RADIO FREQUENCY SILICON-ON-INSULATOR (RFSOI) WAFER INCLUDING A SUPERLATTICE | March 2024 | January 2025 | Allow | 11 | 2 | 0 | Yes | No |
| 18603932 | METHOD FOR PROCESSING MEMORY DEVICE | March 2024 | September 2024 | Allow | 6 | 1 | 0 | No | No |
| 18602704 | LIGHT EMITTING DIODE STRUCTURE HAVING RESONANT CAVITY AND METHOD FOR MANUFACTURING THE SAME | March 2024 | April 2025 | Allow | 13 | 1 | 0 | No | No |
| 18598870 | SEMICONDUCTOR DEVICE | March 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18598167 | SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME | March 2024 | December 2024 | Allow | 9 | 1 | 0 | No | No |
| 18592553 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | March 2024 | November 2024 | Allow | 9 | 1 | 0 | No | No |
| 18588986 | METHODS OF FORMING SEMICONDUCTOR PACKAGES | February 2024 | March 2025 | Allow | 13 | 1 | 0 | No | No |
| 18443357 | HIGH ELECTRON MOBILITY TRANSISTOR WITH DOPED SEMICONDUCTOR REGION IN GATE STRUCTURE | February 2024 | March 2025 | Allow | 13 | 1 | 0 | No | No |
| 18443143 | WIDE BAND GAP SEMICONDUCTOR ELECTRONIC DEVICE HAVING A JUNCTION-BARRIER SCHOTTKY DIODE | February 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18439652 | ULTRATHIN SOLID STATE DIES AND METHODS OF MANUFACTURING THE SAME | February 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18438338 | RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING CAPABILITY | February 2024 | September 2024 | Allow | 8 | 0 | 0 | Yes | No |
| 18437609 | MICROELECTRONIC DEVICES INCLUDING OXIDE MATERIAL BETWEEN DECKS THEREOF, AND RELATED MEMORY DEVICES | February 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18436942 | LIGHT EMITTING DEVICE WITH LED STACK FOR DISPLAY AND DISPLAY APPARATUS HAVING THE SAME | February 2024 | February 2025 | Allow | 12 | 0 | 1 | No | No |
| 18436325 | DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME | February 2024 | April 2025 | Allow | 14 | 2 | 0 | Yes | No |
| 18436812 | SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER | February 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18432923 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | February 2024 | December 2024 | Allow | 10 | 0 | 1 | No | No |
| 18430414 | SEMICONDUCTOR MODULE | February 2024 | May 2024 | Allow | 3 | 0 | 0 | No | No |
| 18430609 | METHOD OF MANUFACTURING WIDE-BAND GAP SEMICONDUCTOR DEVICE | February 2024 | October 2024 | Allow | 8 | 0 | 0 | No | No |
| 18428533 | VERTICAL POWER DEVICES FABRICATED USING IMPLANTED METHODS | January 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18423986 | EPITAXIAL OXIDE TRANSISTOR | January 2024 | February 2025 | Allow | 12 | 0 | 0 | No | No |
| 18424190 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18419015 | SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES | January 2024 | November 2024 | Allow | 10 | 0 | 1 | No | No |
| 18415549 | METHOD FOR FABRICATING A CHIP PACKAGE | January 2024 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18579130 | SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUBSTRATE AND BOND CONNECTING MEANS | January 2024 | June 2024 | Allow | 5 | 0 | 0 | No | No |
| 18406460 | COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS | January 2024 | September 2024 | Allow | 8 | 0 | 0 | No | No |
| 18405875 | BOND PAD CONNECTION LAYOUT | January 2024 | November 2024 | Allow | 11 | 1 | 0 | No | No |
| 18405099 | PASSIVATION LAYER FOR EPITAXIAL SEMICONDUCTOR PROCESS | January 2024 | March 2025 | Allow | 15 | 1 | 1 | Yes | No |
| 18405053 | SEGMENTED SCHOTTKY DIODE | January 2024 | January 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18402426 | SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18398204 | INTEGRATED CIRCUIT STRUCTURE | December 2023 | January 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18396987 | ELECTROSTATIC DISCHARGE (ESD) PROTECTION CIRCUIT WITH DISABLE FEATURE BASED ON HOT-PLUG CONDITION DETECTION | December 2023 | February 2025 | Allow | 14 | 1 | 0 | No | No |
| 18395785 | DISPLAY DEVICE | December 2023 | April 2025 | Allow | 15 | 2 | 0 | No | No |
| 18395649 | LAYOUT PATTERN FOR MAGNETORESISTIVE RANDOM ACCESS MEMORY | December 2023 | August 2024 | Allow | 8 | 1 | 0 | No | No |
| 18395249 | SELF-PASSIVATED NITROGEN-POLAR III-NITRIDE TRANSISTOR | December 2023 | October 2024 | Allow | 10 | 1 | 0 | No | No |
| 18391442 | ELECTRONIC DEVICES INCLUDING PILLARS IN ARRAY REGIONS AND NON-ARRAY REGIONS | December 2023 | November 2024 | Allow | 11 | 1 | 0 | No | No |
| 18389651 | SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME | December 2023 | July 2024 | Allow | 7 | 0 | 0 | No | No |
| 18545337 | Backside Gate Contact, Backside Gate Etch Stop Layer, and Methods of Forming Same | December 2023 | June 2024 | Allow | 6 | 0 | 1 | No | No |
| 18544100 | INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUCTIVITY | December 2023 | April 2024 | Allow | 4 | 0 | 1 | No | No |
| 18543111 | INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS OF FORMING THE SAME | December 2023 | May 2024 | Allow | 5 | 0 | 1 | No | No |
| 18541441 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | December 2023 | August 2024 | Allow | 8 | 1 | 1 | No | No |
| 18535829 | DISPLAY APPARATUS HAVING A SUBSTRATE HOLE | December 2023 | May 2025 | Allow | 17 | 2 | 0 | No | No |
| 18532847 | Display Device | December 2023 | April 2025 | Allow | 16 | 1 | 1 | No | No |
| 18530988 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS | December 2023 | November 2024 | Allow | 11 | 1 | 0 | No | No |
| 18528816 | LATERAL DIFFUSION METAL-OXIDE SEMICONDUCTOR DEVICE | December 2023 | January 2025 | Allow | 13 | 1 | 1 | No | No |
| 18528806 | LATERAL DIFFUSION METAL-OXIDE SEMICONDUCTOR DEVICE | December 2023 | March 2025 | Allow | 15 | 1 | 1 | No | No |
| 18529308 | SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS | December 2023 | September 2024 | Allow | 9 | 0 | 0 | No | No |
| 18564532 | CLAMPING ELEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE | November 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18519742 | DISPLAY APPARATUS | November 2023 | August 2024 | Allow | 9 | 0 | 0 | No | No |
| 18518579 | SEMICONDUCTOR STRUCTURE | November 2023 | January 2025 | Allow | 13 | 1 | 0 | No | No |
| 18517330 | BUFFER DESIGN FOR PACKAGE INTEGRATION | November 2023 | May 2025 | Allow | 18 | 2 | 0 | No | No |
| 18516971 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | November 2023 | July 2024 | Allow | 8 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2813.
With a 26.1% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 31.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Art Unit 2813 is part of Group 2810 in Technology Center 2800. This art unit has examined 19,046 patent applications in our dataset, with an overall allowance rate of 84.3%. Applications typically reach final disposition in approximately 23 months.
Art Unit 2813's allowance rate of 84.3% places it in the 77% percentile among all USPTO art units. This art unit has a significantly higher allowance rate than most art units at the USPTO.
Applications in Art Unit 2813 receive an average of 1.48 office actions before reaching final disposition (in the 23% percentile). The median prosecution time is 23 months (in the 85% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.