Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18763686 | SEMICONDUCTOR PACKAGE | July 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18679002 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18669577 | SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING THE SAME | May 2024 | June 2025 | Allow | 13 | 1 | 1 | No | No |
| 18663878 | DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME | May 2024 | June 2025 | Allow | 14 | 1 | 1 | No | No |
| 18654794 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | May 2024 | May 2025 | Allow | 12 | 0 | 1 | No | No |
| 18635399 | SEMICONDUCTOR DEVICE STRUCTURE | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18633188 | DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRONIC APPARATUS | April 2024 | January 2025 | Allow | 9 | 0 | 0 | No | No |
| 18616221 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | March 2024 | June 2025 | Allow | 15 | 0 | 1 | No | No |
| 18616427 | Fan-Out Package Having a Main Die and a Dummy Die | March 2024 | October 2024 | Allow | 6 | 0 | 0 | No | No |
| 18615573 | SEMICONDUCTOR DEVICE INCLUDING GATE CONTACT STRUCTURE FORMED FROM GATE STRUCTURE | March 2024 | November 2024 | Allow | 7 | 0 | 1 | No | No |
| 18598870 | SEMICONDUCTOR DEVICE | March 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18439652 | ULTRATHIN SOLID STATE DIES AND METHODS OF MANUFACTURING THE SAME | February 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18436812 | SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER | February 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18402426 | SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18543111 | INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS OF FORMING THE SAME | December 2023 | May 2024 | Allow | 5 | 0 | 1 | No | No |
| 18519742 | DISPLAY APPARATUS | November 2023 | August 2024 | Allow | 9 | 0 | 0 | No | No |
| 18516971 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | November 2023 | July 2024 | Allow | 8 | 0 | 0 | No | No |
| 18506186 | MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION | November 2023 | September 2024 | Allow | 10 | 0 | 0 | No | No |
| 18506177 | EMBEDDED FERROELECTRIC MEMORY CELL | November 2023 | March 2025 | Allow | 16 | 0 | 1 | No | No |
| 18488561 | Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18474061 | MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED 3D NAND FLASH MEMORY DEVICES | September 2023 | May 2024 | Allow | 8 | 0 | 0 | No | No |
| 18455419 | Shielded Semiconductor Package with Open Terminal and Methods of Making | August 2023 | May 2025 | Allow | 21 | 2 | 1 | Yes | No |
| 18446524 | SEMICONDUCTOR DEVICE | August 2023 | April 2024 | Allow | 9 | 0 | 0 | No | No |
| 18230284 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | August 2023 | December 2024 | Allow | 16 | 0 | 1 | No | No |
| 18229679 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | August 2023 | March 2025 | Allow | 20 | 1 | 1 | No | No |
| 18229627 | SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING THE SAME | August 2023 | June 2024 | Allow | 10 | 0 | 1 | No | No |
| 18229612 | THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INTEGRATED PASSIVE DEVICE AND METHODS FOR MAKING THE SAME | August 2023 | December 2024 | Allow | 16 | 1 | 1 | No | No |
| 18360427 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | July 2023 | February 2025 | Allow | 19 | 0 | 1 | No | No |
| 18360344 | MULTI-LAYER FILM DEVICE AND METHOD | July 2023 | July 2024 | Allow | 12 | 0 | 0 | No | No |
| 18360166 | Semiconductor Devices Having Gate Dielectric Layers of Varying Thicknesses and Methods of Forming the Same | July 2023 | April 2024 | Allow | 8 | 0 | 0 | No | No |
| 18359578 | Stacked Semiconductor Device and Method | July 2023 | April 2024 | Allow | 8 | 0 | 0 | No | No |
| 18225134 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | July 2023 | April 2024 | Allow | 8 | 0 | 0 | No | No |
| 18354068 | SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE | July 2023 | March 2024 | Allow | 8 | 0 | 0 | No | No |
| 18352273 | ELECTRONIC DEVICE | July 2023 | February 2025 | Allow | 19 | 1 | 1 | No | No |
| 18216040 | MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING | June 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18343383 | MICROELECTRONIC DEVICES AND RELATED MEMORY DEVICES | June 2023 | August 2024 | Allow | 14 | 1 | 1 | No | No |
| 18342515 | LATERALLY UNCONFINED STRUCTURE | June 2023 | February 2024 | Allow | 8 | 0 | 0 | No | No |
| 18338596 | SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING THE SAME | June 2023 | February 2024 | Allow | 8 | 0 | 0 | No | No |
| 18335175 | BACKSIDE CONNECTION STRUCTURES FOR NANOSTRUCTURES AND METHODS OF FORMING THE SAME | June 2023 | May 2024 | Allow | 11 | 1 | 0 | No | No |
| 18335816 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | June 2023 | February 2024 | Allow | 8 | 0 | 0 | No | No |
| 18196744 | DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRONIC APPARATUS | May 2023 | January 2024 | Allow | 8 | 0 | 0 | No | No |
| 18311834 | LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION | May 2023 | January 2024 | Allow | 9 | 0 | 0 | No | No |
| 18304261 | SEMICONDUCTOR DEVICE WITH SOURCE RESISTOR | April 2023 | November 2024 | Allow | 19 | 0 | 1 | No | No |
| 18302228 | CHIP STRUCTURE WITH CONDUCTIVE PILLAR AND METHOD FOR FORMING THE SAME | April 2023 | May 2025 | Allow | 25 | 1 | 1 | No | No |
| 18302545 | Processes for Reducing Leakage and Improving Adhesion | April 2023 | February 2024 | Allow | 10 | 0 | 0 | No | No |
| 18133931 | NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION | April 2023 | July 2024 | Allow | 16 | 1 | 0 | No | No |
| 18132801 | MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING | April 2023 | May 2024 | Allow | 13 | 1 | 0 | No | No |
| 18126996 | SEMICONDUCTOR DEVICE | March 2023 | April 2024 | Allow | 13 | 1 | 0 | No | No |
| 18187628 | SEMICONDUCTOR DEVICE | March 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18114419 | NON-VOLATILE MEMORY STRUCTURE WITH POSITIONED DOPING | February 2023 | December 2023 | Allow | 10 | 0 | 0 | No | No |
| 18173837 | PASSIVATION LAYER FOR A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | February 2023 | June 2025 | Allow | 28 | 3 | 1 | Yes | No |
| 18042534 | TEMPERATURE SENSOR AND METHOD FOR PRODUCING A TEMPERATURE SENSOR OF THIS KIND | February 2023 | June 2025 | Allow | 27 | 0 | 0 | Yes | No |
| 18164642 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | February 2023 | December 2023 | Allow | 10 | 0 | 0 | No | No |
| 18163486 | SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE AND VEHICLE | February 2023 | May 2025 | Allow | 27 | 0 | 0 | No | No |
| 18099290 | SEMICONDUCTOR PACKAGE INCLUDING A CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18148810 | RESISTOR WITH DOPED REGIONS AND SEMICONDUCTOR DEVICES HAVING THE SAME | December 2022 | November 2023 | Allow | 10 | 0 | 0 | No | No |
| 18077495 | SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE STACKED SEMICONDUCTOR STRUCTURES | December 2022 | May 2025 | Allow | 29 | 0 | 0 | No | No |
| 18059646 | SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE | November 2022 | May 2025 | Allow | 29 | 1 | 0 | Yes | No |
| 17999954 | OPTICAL SENSOR PACKAGE STRUCTURE AND ELECTRONIC DEVICE | November 2022 | April 2025 | Allow | 29 | 0 | 0 | Yes | No |
| 18057885 | SEMICONDUCTOR STRUCTURE | November 2022 | February 2024 | Allow | 15 | 1 | 0 | No | No |
| 17977875 | Type III-V Semiconductor Substrate with Monolithically Integrated Capacitor | October 2022 | October 2023 | Allow | 12 | 0 | 0 | No | No |
| 17977031 | SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER | October 2022 | November 2023 | Allow | 12 | 0 | 0 | No | No |
| 17974894 | SEMICONDUCTOR DEVICE | October 2022 | January 2025 | Allow | 27 | 0 | 0 | No | No |
| 17972331 | VOLUMETRIC BUDGET BASED IRRIGATION CONTROL | October 2022 | April 2024 | Allow | 18 | 1 | 0 | No | No |
| 17920554 | SEMICONDUCTOR DEVICE | October 2022 | April 2025 | Allow | 30 | 0 | 0 | Yes | No |
| 17970111 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | October 2022 | April 2025 | Allow | 30 | 0 | 1 | No | No |
| 18047146 | SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE | October 2022 | April 2025 | Allow | 29 | 0 | 0 | No | No |
| 18045331 | ULTRATHIN SOLID STATE DIES AND METHODS OF MANUFACTURING THE SAME | October 2022 | September 2023 | Allow | 11 | 0 | 0 | No | No |
| 17952080 | SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHITECTURES | September 2022 | November 2023 | Allow | 14 | 0 | 0 | No | No |
| 17944793 | INTEGRATED CIRCUIT INCLUDING STANDARD CELLS AND AT LEAST ONE CAPACITIVE FILLING STRUCTURE | September 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17901189 | Thermal Extraction of Single Layer Transfer Integrated Circuits | September 2022 | June 2024 | Allow | 22 | 0 | 1 | No | No |
| 17897065 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE | August 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17895223 | SEMICONDUCTOR PACKAGE | August 2022 | March 2025 | Allow | 31 | 0 | 1 | No | No |
| 17821042 | ISOLATION STRUCTURES IN SEMICONDUCTOR DEVICES | August 2022 | May 2025 | Allow | 33 | 0 | 1 | Yes | No |
| 17904361 | GRAPHENE INTEGRATION | August 2022 | March 2025 | Allow | 31 | 0 | 0 | No | No |
| 17820020 | BACK END OF LINE STRUCTURE FOR IMPROVED CURRENT DENSITY IN HR DEVICES | August 2022 | March 2025 | Allow | 31 | 0 | 1 | No | No |
| 17819245 | SEMICONDUCTOR DEVICE WITH SHORT-RESISTANT CAPACITOR PLATE | August 2022 | June 2025 | Allow | 34 | 2 | 1 | No | No |
| 17818537 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | August 2022 | February 2025 | Allow | 30 | 0 | 0 | No | No |
| 17880787 | MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION | August 2022 | August 2023 | Allow | 12 | 0 | 0 | No | No |
| 17874945 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | July 2022 | February 2025 | Allow | 31 | 0 | 0 | No | No |
| 17872255 | POWER SEMICONDUCTOR MODULE ARRANGEMENT | July 2022 | January 2024 | Allow | 17 | 1 | 0 | No | No |
| 17868104 | P-GaN HIGH-ELECTRON-MOBILITY TRANSISTOR | July 2022 | December 2024 | Allow | 29 | 0 | 0 | No | No |
| 17866946 | EMBEDDED FERROELECTRIC MEMORY CELL | July 2022 | August 2023 | Allow | 13 | 0 | 0 | No | No |
| 17866782 | SEMICONDUCTOR DEVICE | July 2022 | May 2023 | Allow | 10 | 0 | 0 | No | No |
| 17858150 | PATTERN FORMATION METHOD AND SEMICONDUCTOR DEVICE FABRICATION METHOD USING THE SAME | July 2022 | May 2025 | Allow | 35 | 1 | 1 | Yes | No |
| 17849995 | Multi-Layer Film Device and Method | June 2022 | May 2023 | Allow | 11 | 0 | 0 | No | No |
| 17809224 | SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS | June 2022 | August 2023 | Allow | 14 | 0 | 0 | No | No |
| 17846319 | METHOD FOR MANUFACTURING MEMORY DEVICE USING SEMICONDUCTOR ELEMENT | June 2022 | September 2024 | Allow | 27 | 0 | 0 | No | No |
| 17845871 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | June 2022 | January 2025 | Allow | 31 | 1 | 1 | No | No |
| 17844961 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | June 2022 | April 2025 | Allow | 34 | 1 | 1 | No | No |
| 17841213 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | June 2022 | June 2023 | Allow | 12 | 0 | 0 | No | No |
| 17839828 | CONDUCTIVE FEATURE WITH NON-UNIFORM CRITICAL DIMENSION AND METHOD OF MANUFACTURING THE SAME | June 2022 | January 2024 | Allow | 19 | 0 | 0 | No | No |
| 17806730 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | June 2022 | January 2025 | Allow | 31 | 0 | 0 | No | No |
| 17806390 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CONTACT VIA STRUCTURES FOR MULTI-LEVEL STEPPED SURFACES AND METHODS FOR FORMING THE SAME | June 2022 | September 2024 | Allow | 27 | 0 | 0 | No | No |
| 17836612 | SPLIT VALVE AIR CURTAIN | June 2022 | May 2025 | Allow | 35 | 0 | 1 | Yes | No |
| 17834204 | SIDEWALL SPACER STRUCTURE ENCLOSING CONDUCTIVE WIRE SIDEWALLS TO INCREASE RELIABILITY | June 2022 | September 2023 | Allow | 15 | 0 | 0 | No | No |
| 17833063 | APPARATUS AND METHOD FOR BGA COPLANARITY AND WARPAGE CONTROL | June 2022 | January 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 17825360 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF | May 2022 | March 2025 | Allow | 33 | 0 | 1 | No | No |
| 17751953 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH PROTECTION LAYERS | May 2022 | May 2023 | Allow | 12 | 0 | 0 | No | No |
| 17751988 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH TEST PAD | May 2022 | June 2023 | Allow | 13 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner MENZ, LAURA MARY.
With a 38.5% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 51.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner MENZ, LAURA MARY works in Art Unit 2813 and has examined 1,871 patent applications in our dataset. With an allowance rate of 90.0%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 24 months.
Examiner MENZ, LAURA MARY's allowance rate of 90.0% places them in the 70% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by MENZ, LAURA MARY receive 1.09 office actions before reaching final disposition. This places the examiner in the 16% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by MENZ, LAURA MARY is 24 months. This places the examiner in the 72% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +2.0% benefit to allowance rate for applications examined by MENZ, LAURA MARY. This interview benefit is in the 19% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 36.9% of applications are subsequently allowed. This success rate is in the 80% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 28.5% of cases where such amendments are filed. This entry rate is in the 32% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 113.5% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 79% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 86.9% of appeals filed. This is in the 78% percentile among all examiners. Of these withdrawals, 52.3% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 36.4% are granted (fully or in part). This grant rate is in the 32% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 13.1% of allowed cases (in the 97% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 11.8% of allowed cases (in the 89% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.