Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18763686 | SEMICONDUCTOR PACKAGE | July 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18758688 | SEMICONDUCTOR DEVICE | June 2024 | July 2025 | Allow | 13 | 2 | 0 | No | No |
| 18679002 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18675097 | SEMICONDUCTOR DEVICE | May 2024 | August 2025 | Allow | 15 | 1 | 1 | Yes | No |
| 18669577 | SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING THE SAME | May 2024 | June 2025 | Allow | 13 | 1 | 1 | No | No |
| 18663878 | DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME | May 2024 | June 2025 | Allow | 14 | 1 | 1 | No | No |
| 18654794 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | May 2024 | May 2025 | Allow | 12 | 0 | 1 | No | No |
| 18635399 | SEMICONDUCTOR DEVICE STRUCTURE | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18633188 | DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRONIC APPARATUS | April 2024 | January 2025 | Allow | 9 | 0 | 0 | No | No |
| 18628246 | Off Axis Laser-Based Surface Processing Operations for Semiconductor Wafers | April 2024 | April 2025 | Allow | 12 | 1 | 1 | Yes | No |
| 18628231 | Fill-In Planarization System and Method | April 2024 | March 2025 | Allow | 11 | 1 | 1 | Yes | No |
| 18616427 | Fan-Out Package Having a Main Die and a Dummy Die | March 2024 | October 2024 | Allow | 6 | 0 | 0 | No | No |
| 18616221 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | March 2024 | June 2025 | Allow | 15 | 0 | 1 | No | No |
| 18615573 | SEMICONDUCTOR DEVICE INCLUDING GATE CONTACT STRUCTURE FORMED FROM GATE STRUCTURE | March 2024 | November 2024 | Allow | 7 | 0 | 1 | No | No |
| 18598870 | SEMICONDUCTOR DEVICE | March 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18439652 | ULTRATHIN SOLID STATE DIES AND METHODS OF MANUFACTURING THE SAME | February 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18436812 | SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER | February 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18577518 | METHOD OF ALLOCATING WIDTHS FOR TARGET SIGNAL LINES, WIRING SUBSTRATE, LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE | January 2024 | March 2026 | Allow | 26 | 0 | 0 | No | No |
| 18402426 | SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18543111 | INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS OF FORMING THE SAME | December 2023 | May 2024 | Allow | 5 | 0 | 1 | No | No |
| 18519742 | DISPLAY APPARATUS | November 2023 | August 2024 | Allow | 9 | 0 | 0 | No | No |
| 18516971 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | November 2023 | July 2024 | Allow | 8 | 0 | 0 | No | No |
| 18506186 | MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION | November 2023 | September 2024 | Allow | 10 | 0 | 0 | No | No |
| 18506177 | EMBEDDED FERROELECTRIC MEMORY CELL | November 2023 | March 2025 | Allow | 16 | 0 | 1 | No | No |
| 18488561 | Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18474061 | MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED 3D NAND FLASH MEMORY DEVICES | September 2023 | May 2024 | Allow | 8 | 0 | 0 | No | No |
| 18281864 | LIGHT EMITTING DEVICE, DISPLAY DEVICE, AND ELECTRONIC DEVICE | September 2023 | December 2025 | Allow | 27 | 1 | 0 | No | No |
| 18465294 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | September 2023 | December 2025 | Allow | 27 | 0 | 0 | No | No |
| 18241067 | GLASS DIELECTRIC LAYER WITH PATTERNING | August 2023 | October 2025 | Abandon | 25 | 2 | 1 | No | No |
| 18455419 | Shielded Semiconductor Package with Open Terminal and Methods of Making | August 2023 | May 2025 | Allow | 21 | 2 | 1 | Yes | No |
| 18453817 | MANUFACTURING METHOD OF PATTERNIG SUBSTRATE, PATTERNED SUBSTRATE, AND INTERMEDIATE PATTERNED SUBSTRATE | August 2023 | January 2026 | Allow | 29 | 0 | 0 | No | No |
| 18446524 | SEMICONDUCTOR DEVICE | August 2023 | April 2024 | Allow | 9 | 0 | 0 | No | No |
| 18230284 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | August 2023 | December 2024 | Allow | 16 | 0 | 1 | No | No |
| 18229679 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | August 2023 | March 2025 | Allow | 20 | 1 | 1 | No | No |
| 18229612 | THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INTEGRATED PASSIVE DEVICE AND METHODS FOR MAKING THE SAME | August 2023 | December 2024 | Allow | 16 | 1 | 1 | No | No |
| 18229627 | SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING THE SAME | August 2023 | June 2024 | Allow | 10 | 0 | 1 | No | No |
| 18361953 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | July 2023 | December 2025 | Allow | 29 | 2 | 1 | Yes | No |
| 18360344 | MULTI-LAYER FILM DEVICE AND METHOD | July 2023 | July 2024 | Allow | 12 | 0 | 0 | No | No |
| 18360427 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | July 2023 | February 2025 | Allow | 19 | 0 | 1 | No | No |
| 18360166 | Semiconductor Devices Having Gate Dielectric Layers of Varying Thicknesses and Methods of Forming the Same | July 2023 | April 2024 | Allow | 8 | 0 | 0 | No | No |
| 18359578 | Stacked Semiconductor Device and Method | July 2023 | April 2024 | Allow | 8 | 0 | 0 | No | No |
| 18225134 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | July 2023 | April 2024 | Allow | 8 | 0 | 0 | No | No |
| 18354068 | SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE | July 2023 | March 2024 | Allow | 8 | 0 | 0 | No | No |
| 18353735 | SEMICONDUCTOR DEVICE | July 2023 | February 2026 | Allow | 31 | 0 | 1 | No | No |
| 18352273 | ELECTRONIC DEVICE | July 2023 | February 2025 | Allow | 19 | 1 | 1 | No | No |
| 18350573 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY SEPARATED SOURCE LINES AND METHOD OF MAKING THE SAME | July 2023 | September 2025 | Allow | 26 | 0 | 0 | Yes | No |
| 18216040 | MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING | June 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18343383 | MICROELECTRONIC DEVICES AND RELATED MEMORY DEVICES | June 2023 | August 2024 | Allow | 14 | 1 | 1 | No | No |
| 18342515 | LATERALLY UNCONFINED STRUCTURE | June 2023 | February 2024 | Allow | 8 | 0 | 0 | No | No |
| 18213470 | SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS | June 2023 | September 2025 | Allow | 27 | 0 | 0 | No | No |
| 18339567 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | June 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18213018 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | June 2023 | February 2026 | Allow | 32 | 0 | 1 | No | No |
| 18338596 | SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING THE SAME | June 2023 | February 2024 | Allow | 8 | 0 | 0 | No | No |
| 18335175 | BACKSIDE CONNECTION STRUCTURES FOR NANOSTRUCTURES AND METHODS OF FORMING THE SAME | June 2023 | May 2024 | Allow | 11 | 1 | 0 | No | No |
| 18335816 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | June 2023 | February 2024 | Allow | 8 | 0 | 0 | No | No |
| 18328848 | METHOD, APPARATUS, AND SYSTEM WITH INTEGRATED CIRCUIT MANUFACTURING | June 2023 | February 2026 | Allow | 32 | 0 | 1 | Yes | No |
| 18327252 | Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof | June 2023 | January 2026 | Allow | 32 | 3 | 1 | No | No |
| 18044839 | PEROVSKITE COMPOUND-BASED ELECTROLUMINESCENT LAYER AND LIGHT EMITTING DEVICE COMPRISING SAME | May 2023 | August 2025 | Allow | 29 | 0 | 0 | No | No |
| 18319823 | SEQUENTIAL COMPLIMENTARY FET INCORPORATING BACKSIDE POWER DISTRIBUTION NETWORK THROUGH WAFER BONDING PRIOR TO FORMATION OF ACTIVE DEVICES | May 2023 | February 2026 | Allow | 33 | 0 | 1 | No | No |
| 18197616 | NOISE REDUCTION IN SILICON-ON-INSULATOR DEVICES | May 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18196744 | DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRONIC APPARATUS | May 2023 | January 2024 | Allow | 8 | 0 | 0 | No | No |
| 18311834 | LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION | May 2023 | January 2024 | Allow | 9 | 0 | 0 | No | No |
| 18142044 | LIGHT PROJECTION CHIP FOR MICRO LED AND MANUFACTURING METHOD THEREOF | May 2023 | October 2025 | Allow | 30 | 0 | 1 | No | No |
| 18304261 | SEMICONDUCTOR DEVICE WITH SOURCE RESISTOR | April 2023 | November 2024 | Allow | 19 | 0 | 1 | No | No |
| 18303603 | IMAGING DEVICE | April 2023 | November 2025 | Allow | 31 | 1 | 0 | No | No |
| 18302228 | CHIP STRUCTURE WITH CONDUCTIVE PILLAR AND METHOD FOR FORMING THE SAME | April 2023 | May 2025 | Allow | 25 | 1 | 1 | No | No |
| 18302545 | Processes for Reducing Leakage and Improving Adhesion | April 2023 | February 2024 | Allow | 10 | 0 | 0 | No | No |
| 18134933 | POWER MODULE | April 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18133931 | NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION | April 2023 | July 2024 | Allow | 16 | 1 | 0 | No | No |
| 18133141 | SEMICONDUCTOR PACKAGE | April 2023 | October 2025 | Allow | 30 | 0 | 1 | No | No |
| 18132801 | MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING | April 2023 | May 2024 | Allow | 13 | 1 | 0 | No | No |
| 18126996 | SEMICONDUCTOR DEVICE | March 2023 | April 2024 | Allow | 13 | 1 | 0 | No | No |
| 18187628 | SEMICONDUCTOR DEVICE | March 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18186284 | PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME | March 2023 | October 2025 | Allow | 31 | 0 | 1 | No | No |
| 18184802 | SEMICONDUCTOR DEVICE | March 2023 | March 2026 | Allow | 36 | 1 | 1 | No | No |
| 18114419 | NON-VOLATILE MEMORY STRUCTURE WITH POSITIONED DOPING | February 2023 | December 2023 | Allow | 10 | 0 | 0 | No | No |
| 18174865 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | February 2023 | December 2025 | Allow | 34 | 0 | 1 | Yes | No |
| 18173837 | PASSIVATION LAYER FOR A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | February 2023 | June 2025 | Allow | 28 | 3 | 1 | Yes | No |
| 18042534 | TEMPERATURE SENSOR AND METHOD FOR PRODUCING A TEMPERATURE SENSOR OF THIS KIND | February 2023 | June 2025 | Allow | 27 | 0 | 0 | Yes | No |
| 18170292 | LIGHT EMITTING MODULE AND DISPLAY APPARATUS | February 2023 | January 2026 | Allow | 35 | 1 | 1 | No | No |
| 18107600 | COMMON MODE SUPPRESSION CIRCUIT | February 2023 | October 2025 | Allow | 33 | 0 | 1 | Yes | No |
| 18164642 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | February 2023 | December 2023 | Allow | 10 | 0 | 0 | No | No |
| 18164926 | MEMORY DEVICE AND MEMORY APPARATUS COMPRISING THE SAME | February 2023 | October 2025 | Allow | 33 | 1 | 1 | Yes | No |
| 18163486 | SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE AND VEHICLE | February 2023 | May 2025 | Allow | 27 | 0 | 0 | No | No |
| 18099290 | SEMICONDUCTOR PACKAGE INCLUDING A CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18155933 | TUNABLE STRUCTURE PROFILE | January 2023 | August 2025 | Allow | 31 | 0 | 1 | No | No |
| 18154046 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | January 2023 | January 2026 | Allow | 36 | 1 | 1 | No | No |
| 18096516 | Three Dimensional Application-Specific Integrated Circuit Architecture | January 2023 | February 2026 | Allow | 38 | 1 | 1 | Yes | No |
| 18095746 | DEVICE WITH ISOLATION STRUCTURES IN ACTIVE REGIONS | January 2023 | January 2026 | Allow | 37 | 1 | 1 | Yes | No |
| 18153334 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME | January 2023 | December 2025 | Allow | 35 | 0 | 1 | Yes | No |
| 18152187 | SEMICONDUCTOR DEVICE | January 2023 | October 2025 | Allow | 33 | 0 | 1 | Yes | No |
| 18151509 | LATERAL CAPACITORS OF SEMICONDUCTOR DEVICES | January 2023 | February 2026 | Allow | 37 | 1 | 1 | Yes | No |
| 18093900 | SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME | January 2023 | August 2025 | Allow | 31 | 1 | 1 | No | No |
| 18151008 | SEMICONDUCTOR DEVICE AND METHOD | January 2023 | December 2025 | Allow | 36 | 0 | 1 | Yes | No |
| 18004348 | Composition Comprising a Siloxane and an Alkane for Avoiding Pattern Collapse When Treating Patterned Materials with Line-Space Dimensions of 50 NM or Below | January 2023 | September 2025 | Allow | 32 | 1 | 0 | No | No |
| 18149330 | ELECTRONIC MODULE AND APPARATUS | January 2023 | August 2025 | Allow | 31 | 1 | 0 | No | No |
| 18092081 | CHIP PACKAGE STRUCTURES, MANUFACTURING METHODS THEREOF AND ELECTRONIC DEVICES | December 2022 | January 2026 | Allow | 36 | 1 | 1 | Yes | No |
| 18148810 | RESISTOR WITH DOPED REGIONS AND SEMICONDUCTOR DEVICES HAVING THE SAME | December 2022 | November 2023 | Allow | 10 | 0 | 0 | No | No |
| 18069957 | SEMICONDUCTOR PACKAGE | December 2022 | December 2025 | Allow | 35 | 1 | 1 | Yes | No |
| 18083561 | SEMICONDUCTOR DEVICE | December 2022 | November 2025 | Allow | 35 | 1 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner MENZ, LAURA MARY.
With a 38.5% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 51.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner MENZ, LAURA MARY works in Art Unit 2813 and has examined 1,806 patent applications in our dataset. With an allowance rate of 89.0%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 24 months.
Examiner MENZ, LAURA MARY's allowance rate of 89.0% places them in the 71% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by MENZ, LAURA MARY receive 1.15 office actions before reaching final disposition. This places the examiner in the 13% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by MENZ, LAURA MARY is 24 months. This places the examiner in the 83% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +2.4% benefit to allowance rate for applications examined by MENZ, LAURA MARY. This interview benefit is in the 23% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 37.1% of applications are subsequently allowed. This success rate is in the 84% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 28.5% of cases where such amendments are filed. This entry rate is in the 40% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 115.8% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 81% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 87.0% of appeals filed. This is in the 80% percentile among all examiners. Of these withdrawals, 52.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 36.1% are granted (fully or in part). This grant rate is in the 24% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 15.4% of allowed cases (in the 97% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 11.8% of allowed cases (in the 90% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.