Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18673892 | DISPLAY DEVICE | May 2024 | March 2025 | Allow | 10 | 0 | 0 | No | No |
| 18648466 | SEMICONDUCTOR PACKAGE | April 2024 | May 2025 | Allow | 12 | 0 | 1 | No | No |
| 18564532 | CLAMPING ELEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE | November 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18506889 | Memory Cell And Method Used In Forming A Memory Cells | November 2023 | July 2024 | Allow | 8 | 0 | 0 | No | No |
| 18503233 | SEMICONDUCTOR MEMORY DEVICE THAT INCLUDES A SEMICONDUCTOR COLUMN THAT PENETRATES A PLURALITY OF CONDUCTIVE LAYERS | November 2023 | October 2024 | Allow | 11 | 0 | 1 | No | No |
| 18384799 | POWER SEMICONDUCTOR MODULE HAVING A PRESSURE DEVICE ACTING ON A SWITCHING DEVICE | October 2023 | June 2024 | Allow | 8 | 1 | 0 | No | No |
| 18491470 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES BY ETCHING ACTIVE FINS USING ETCHING MASKS AND FORMING SOURCE/DRAIN LAYERS ON THE ACTIVE FINS | October 2023 | October 2024 | Allow | 12 | 1 | 0 | Yes | No |
| 18357776 | MIM EFUSE MEMORY DEVICES AND MEMORY ARRAY USING A METAL-BASED LAYER BETWEEN STRUCTURES | July 2023 | March 2025 | Allow | 19 | 2 | 1 | No | No |
| 18215854 | Circuit Carrier Arrangement And Method For Producing Such A Circuit Carrier Arrangement | June 2023 | January 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18307286 | RESISTANCE TUNABLE FUSE STRUCTURE FORMED BY EMBEDDED THIN METAL LAYERS | April 2023 | April 2024 | Allow | 12 | 0 | 0 | No | No |
| 18137506 | SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS | April 2023 | March 2025 | Allow | 23 | 2 | 0 | Yes | No |
| 18101834 | IMAGING DEVICE | January 2023 | April 2024 | Allow | 14 | 0 | 0 | No | No |
| 18154051 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER | January 2023 | March 2025 | Allow | 26 | 3 | 1 | Yes | No |
| 18070051 | LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING A SEMICONDUCTOR DEVICE | November 2022 | July 2024 | Allow | 19 | 1 | 1 | No | No |
| 17984724 | E-FUSE WITH METAL FILL | November 2022 | May 2025 | Allow | 30 | 1 | 1 | Yes | No |
| 18050431 | DEVICES INCLUDING A STAIR STEP STRUCTURE ADJACENT A SUBSTANTIALLY PLANAR, VERTICALLY EXTENDING SURFACE OF A STACK STRUCTURE | October 2022 | February 2025 | Allow | 27 | 2 | 1 | No | No |
| 17930410 | ELECTRONIC FUSE DEVICES WITH FUSE LINKS HAVING INDENTATIONS AND INTEGRATION METHODS | September 2022 | June 2025 | Abandon | 33 | 2 | 1 | No | No |
| 17875042 | A SEMICONDUCTOR STRUCTURE HAVBING AN ENHANCED E-FUSE AND A METHOD MAKING THE SAME | July 2022 | October 2024 | Allow | 27 | 1 | 0 | No | No |
| 17850504 | SEMICONDUCTOR PACKAGE INCLUDING COMPOSITE MOLDING STRUCTURE | June 2022 | October 2023 | Allow | 15 | 0 | 1 | No | No |
| 17843725 | Dummy Structure of Stacked and Bonded Semiconductor Device | June 2022 | October 2024 | Allow | 28 | 2 | 1 | No | No |
| 17841203 | SEMICONDUCTOR DEVICE | June 2022 | October 2023 | Allow | 17 | 1 | 0 | No | No |
| 17839796 | SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE | June 2022 | November 2024 | Allow | 29 | 1 | 0 | No | No |
| 17664242 | SEMICONDUCTOR STRUCTURE WITH SILICON-GERMANIUM COMPOUND AND MANUFACTURING METHOD THEREOF | May 2022 | June 2025 | Allow | 37 | 1 | 1 | No | No |
| 17741956 | METHOD FOR MANUFACTURING MEMORY DEVICE USING SEMICONDUCTOR ELEMENT | May 2022 | February 2025 | Allow | 34 | 0 | 0 | No | No |
| 17735747 | DEVICE TRANSFER SUBSTRATE RECEIVING A LIGHT EMITTING DEVICE, DEVICE TRANSFER STRUCTURE, AND DISPLAY APPARATUS | May 2022 | March 2025 | Allow | 35 | 1 | 1 | Yes | No |
| 17732688 | ELEMENT FORMING WAFER AND METHOD FOR MANUFACTURING THE SAME | April 2022 | March 2025 | Allow | 35 | 0 | 1 | No | No |
| 17661130 | FORMING A DUMMY GATE STRUCTURE | April 2022 | October 2024 | Allow | 30 | 1 | 0 | Yes | No |
| 17715331 | MONOLITHIC COMPLEMENTARY FIELD-EFFECT TRANSISTORS HAVING CARBON-DOPED RELEASE LAYERS | April 2022 | February 2025 | Allow | 34 | 1 | 1 | No | No |
| 17698487 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES BY ETCHING ACTIVE FINS USING ETCHING MASKS | March 2022 | September 2023 | Allow | 18 | 0 | 1 | No | No |
| 17647741 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | January 2022 | May 2025 | Abandon | 40 | 1 | 1 | No | No |
| 17560164 | METHOD FOR PREPARING A MEMS MICRO MIRROR WITH ELCTRODES ON BOTH SIDES | December 2021 | October 2024 | Allow | 34 | 1 | 0 | No | No |
| 17548002 | ION IMPLANTATION PROCESS TO FORM PUNCH THROUGH STOPPER | December 2021 | March 2025 | Allow | 39 | 2 | 0 | Yes | No |
| 17545260 | Electronic Fuse with Passive Two-Terminal Phase Change Material and Method of Fabrication | December 2021 | March 2024 | Allow | 28 | 3 | 1 | Yes | No |
| 17536964 | LIGHT EMITTING DISPLAY DEVICE INCLUDING CONDUCTIVITY IMPROVEMENT LAYER | November 2021 | October 2023 | Allow | 22 | 1 | 0 | No | No |
| 17525926 | CMOS IMAGE SENSOR STRUCTURE WITH MICROSTRUCTURES ON BACKSIDE SURFACE OF SEMICONDUCTOR LAYER | November 2021 | January 2024 | Allow | 26 | 1 | 1 | No | No |
| 17508770 | METHOD FOR PREPARING VERTICAL ELECTRICAL FUSE DEVICE | October 2021 | August 2023 | Allow | 22 | 1 | 0 | No | No |
| 17507250 | SEMICONDUCTOR DEVICE | October 2021 | December 2024 | Abandon | 37 | 1 | 0 | No | No |
| 17505633 | TRANSFERRING APPARATUS AND METHOD FOR TRANSFERRING ELECTRONIC COMPONENT | October 2021 | June 2025 | Abandon | 43 | 2 | 1 | No | No |
| 17504636 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE | October 2021 | August 2024 | Allow | 34 | 0 | 1 | No | No |
| 17501014 | DISPLAY DEVICE | October 2021 | February 2024 | Allow | 28 | 2 | 0 | No | No |
| 17499911 | BENCHMARK DEVICE ON A SEMICONDUCTOR WAFER WITH FUSE ELEMENT | October 2021 | February 2025 | Allow | 40 | 2 | 0 | No | No |
| 17481842 | SEMICONDUCTOR DEVICE IDENTIFICATION USING PREFORMED RESISTIVE MEMORY | September 2021 | February 2025 | Allow | 41 | 2 | 1 | Yes | No |
| 17477040 | A Vertical Three-Dimensional Stack NOR Flash Memory | September 2021 | August 2024 | Allow | 35 | 1 | 1 | No | No |
| 17477238 | ELECTRONIC PACKAGE INCLUDING A PROTECTION LAYER | September 2021 | September 2024 | Allow | 36 | 2 | 1 | No | No |
| 17474705 | METHOD AND APPARATUS FOR SELECTIVE FILM FORMATION IN SEMICONDUCTOR SUBSTRATE PROCESSING | September 2021 | October 2024 | Allow | 37 | 1 | 1 | No | No |
| 17474257 | MIM EFUSE MEMORY DEVICES AND MEMORY ARRAY | September 2021 | October 2024 | Allow | 37 | 2 | 1 | No | No |
| 17467987 | ELECTRONIC DEVICE | September 2021 | November 2023 | Allow | 26 | 1 | 0 | Yes | No |
| 17461920 | SEMICONDUCTOR PACKAGE COMPRISING HEAT DISSIPATION PLATES | August 2021 | January 2024 | Allow | 29 | 1 | 1 | Yes | No |
| 17461601 | LIGHT EMITTING SEMICONDUCTOR DEVICE FOR ENHANCING LIGHT EXTRACTION EFFICIENCY | August 2021 | December 2023 | Allow | 28 | 1 | 0 | No | No |
| 17461818 | PACKAGE STRUCTURE HAVING LID WITH PROTRUSION AND MANUFACTURING METHOD THEREOF | August 2021 | May 2024 | Allow | 33 | 2 | 1 | Yes | No |
| 17458581 | SEMICONDUCTOR DEVICE, MEMORY CELL INCLUDING CONNECTING STRUCTURE HAVING BASE PORTION AND PILLAR PORTION, AND METHOD OF FORMING THE SAME | August 2021 | June 2024 | Allow | 34 | 1 | 1 | No | No |
| 17459493 | FLEXIBLE DISPLAY DEVICE HAVING REDUCED STRAIN DURING BENDING OR ROLLING | August 2021 | February 2024 | Allow | 30 | 2 | 0 | No | No |
| 17410508 | SEMICONDUCTOR DEVICE WITH GROOVED DIE PAD | August 2021 | October 2024 | Allow | 37 | 3 | 1 | No | No |
| 17409822 | SEMICONDUCTOR MODULE WITH REINFORCED SEALING RESIN | August 2021 | September 2023 | Allow | 25 | 2 | 0 | No | No |
| 17399437 | ELECTRONIC DEVICE INCLUDING PROTON CONDUCTIVE LAYER AND RESISTANCE CHANGE CHANNEL LAYER CAPABLE OF RECEIVING HYDROGEN | August 2021 | September 2024 | Allow | 37 | 2 | 1 | No | No |
| 17395915 | SEMICONDUCTOR STRUCTURE WITH TWO-DIMENSIONAL CONDUCTIVE STRUCTURES | August 2021 | April 2024 | Allow | 32 | 1 | 1 | Yes | No |
| 17428058 | METHODS FOR MANUFACTURING SEMICONDUCTOR STRUCTURES INCLUDING ISOLATION LAYER AND SEMICONDUCTOR STRUCTURES INCLUDING ISOLATION LAYER | August 2021 | June 2024 | Allow | 35 | 2 | 0 | No | No |
| 17392301 | Circuit Carrier Arrangement And Method For Producing Such A Circuit Carrier Arrangement | August 2021 | June 2023 | Allow | 22 | 0 | 1 | No | No |
| 17391377 | MEMORY CELL HAVING PROGRAMMABLE MATERIAL COMPRISING AT LEAST TWO REGIONS COMPRISING SiNx | August 2021 | August 2023 | Allow | 25 | 1 | 0 | No | No |
| 17388842 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | July 2021 | November 2022 | Allow | 16 | 0 | 0 | No | No |
| 17386446 | HETEROSTRUCTURE AND LIGHT-EMITTING DEVICE EMPLOYING THE SAME | July 2021 | August 2023 | Allow | 24 | 1 | 0 | No | No |
| 17379569 | Semiconductor Device Having a Shaped Epitaxial Region with Shaping Section | July 2021 | July 2024 | Allow | 36 | 2 | 1 | Yes | No |
| 17371301 | SEMICONDUCTOR DEVICE | July 2021 | February 2023 | Allow | 19 | 0 | 0 | No | No |
| 17362088 | POWER SEMICONDUCTOR MODULE HAVING PROTRUSIONS AS FIXING STRUCTURES | June 2021 | January 2024 | Allow | 30 | 2 | 1 | Yes | No |
| 17358752 | SEMICONDUCTOR DEVICE HAVING A GRAPHENE FILM AND METHOD FOR FABRICATING THEREOF | June 2021 | April 2024 | Allow | 34 | 2 | 1 | Yes | No |
| 17358244 | BACKSIDE WAFER DOPANT ACTIVATION | June 2021 | April 2024 | Allow | 34 | 3 | 0 | Yes | No |
| 17418359 | METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT, AND SUBSTRATE | June 2021 | April 2024 | Allow | 34 | 0 | 1 | No | No |
| 17344168 | RESIDUE REMOVAL DURING SEMICONDUCTOR DEVICE FORMATION | June 2021 | June 2023 | Allow | 24 | 1 | 0 | Yes | No |
| 17340273 | PIXEL HAVING TWO SEMICONDUCTOR LAYERS, IMAGE SENSOR INCLUDING THE PIXEL, AND IMAGE PROCESSING SYSTEM INCLUDING THE IMAGE SENSOR | June 2021 | August 2023 | Allow | 26 | 1 | 0 | Yes | No |
| 17317082 | Semiconductor Device and Method of Forming Multi-Layer Shielding Structure With Layers of Ferromagnetic Material, Protective Material, Laminate Material or Conductive Material Over the Semiconductor Device | May 2021 | March 2025 | Allow | 46 | 5 | 1 | No | Yes |
| 17315170 | STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEATURES | May 2021 | December 2023 | Allow | 31 | 1 | 1 | No | No |
| 17288927 | ORGANIC LIGHT EMITTING DIODE DISPLAY SUBSTRATE, PREPARATION METHOD AND REPAIR METHOD THEREFOR AND ORGANIC LIGHT EMITTING DIODE DISPLAY APPARATUS | April 2021 | July 2024 | Allow | 38 | 1 | 1 | No | No |
| 17233311 | INTEGRATED CIRCUIT E-FUSE HAVING AN E-FUSE ELEMENT PROVIDING A DIFFUSION BARRIER FOR UNDERLYING E-FUSE TERMINALS | April 2021 | January 2023 | Allow | 22 | 2 | 1 | Yes | No |
| 17228111 | INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE | April 2021 | January 2024 | Allow | 33 | 1 | 1 | Yes | No |
| 17224153 | MRAM STRUCTURE WITH SOURCE LINES HAVING ALTERNATING BRANCHES AT OPPOSITE SIDES AND STORAGE UNITS IN STAGGERED ARRANGEMENT | April 2021 | April 2023 | Allow | 25 | 1 | 0 | No | No |
| 17282736 | MICROMECHANICAL COMPONENT FOR A CAPACITIVE PRESSURE SENSOR DEVICE | April 2021 | January 2024 | Allow | 34 | 0 | 1 | No | No |
| 17209242 | SEMICONDUCTOR DEVICE CONTAINING AN OXYGEN CONCENTRATION DISTRIBUTION | March 2021 | March 2023 | Allow | 24 | 2 | 1 | No | No |
| 17192233 | METHOD FOR FORMING CONTACT SURFACE ON TOP OF MESA STRUCTURE FORMED ON SEMICONDUCTOR SUBSTRATE | March 2021 | February 2025 | Abandon | 47 | 1 | 0 | No | No |
| 17181027 | SEMICONDUCTOR MEMORY DEVICE THAT INCLUDES A SEMICONDUCTOR COLUMN THAT PENETRATES A PLURALITY OF CONDUCTIVE LAYERS | February 2021 | August 2023 | Allow | 30 | 1 | 1 | No | No |
| 17179825 | DISPLAY DEVICE STRUCTURE FOR REDUCING DEFECTS | February 2021 | November 2022 | Allow | 21 | 1 | 0 | No | No |
| 17169644 | LIGHT EMITTING DEVICE | February 2021 | November 2022 | Allow | 21 | 0 | 0 | No | No |
| 17165954 | STACKED VIA STRUCTURE | February 2021 | December 2023 | Allow | 35 | 3 | 1 | Yes | No |
| 17166252 | RESISTANCE TUNABLE FUSE STRUCTURE FORMED BY EMBEDDED THIN METAL LAYERS | February 2021 | February 2023 | Allow | 24 | 1 | 1 | No | No |
| 17159257 | Power Semiconductor Module with Baseplate and Heat Dissipating Element | January 2021 | April 2024 | Allow | 38 | 3 | 1 | Yes | No |
| 17126125 | HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING A HOUSING WITH A SEMICONDUCTOR BODY | December 2020 | January 2023 | Abandon | 25 | 1 | 1 | No | No |
| 17252582 | SEMICONDUCTOR ELEMENT WITH ELECTRODE HAVING FIRST SECTION AND SECOND SECTIONS IN CONTACT WITH THE FIRST SECTION, AND SEMICONDUCTOR DEVICE | December 2020 | January 2023 | Allow | 26 | 1 | 1 | No | No |
| 17112668 | PHYSICAL UNCLONABLE FUNCTIONS WITH SILICON-RICH DIELECTRIC DEVICES | December 2020 | December 2023 | Allow | 37 | 2 | 0 | Yes | No |
| 15734477 | SEMICONDUCTOR DEVICE INCLUDING GROOVE IN TERMINATION REGION | December 2020 | May 2024 | Allow | 42 | 3 | 0 | Yes | Yes |
| 16952288 | Layout Structure of eFuse Unit | November 2020 | March 2024 | Allow | 40 | 3 | 0 | Yes | No |
| 17095710 | HIGH-EFFICIENCY PACKAGED CHIP STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME | November 2020 | January 2023 | Allow | 26 | 1 | 1 | No | No |
| 17092923 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING IMPROVED DEEP SHIELD CONNECTION PATTERNS | November 2020 | April 2023 | Allow | 30 | 2 | 1 | Yes | No |
| 17088621 | SEMICONDUCTOR SYSTEM AND METHOD OF FORMING SEMICONDUCTOR SYSTEM | November 2020 | December 2023 | Abandon | 37 | 2 | 1 | No | No |
| 17078410 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE WITH IMPROVED HEAT DISSIPATION | October 2020 | March 2024 | Allow | 41 | 2 | 1 | Yes | No |
| 17077013 | IMAGING DEVICE | October 2020 | November 2022 | Allow | 25 | 0 | 0 | No | No |
| 17038429 | POWER MODULE INCLUDING LEAD FRAME UNIT CONNECTING FIRST SUBSTRATE AND SECOND SUBSTRATE | September 2020 | April 2023 | Allow | 31 | 1 | 0 | No | No |
| 17033444 | MEMORY STRUCTURE FOR SELF-ERASING SECRET STORAGE | September 2020 | January 2024 | Allow | 39 | 3 | 1 | Yes | No |
| 17027772 | POWER SEMICONDUCTOR MODULE WITH CLAMPING DEVICE | September 2020 | June 2024 | Abandon | 44 | 2 | 1 | No | No |
| 17023267 | SEMICONDUCTOR PACKAGE STRUCTURE HAVING A LEAD FRAME AND A PASSIVE COMPONENT | September 2020 | March 2024 | Allow | 41 | 4 | 1 | No | No |
| 17019662 | SEMICONDUCTOR DEVICE FOR IMPROVING PERFORMANCE OF A BLOCK INSULATOR AND METHOD OF MANUFACTURING THE SAME | September 2020 | April 2023 | Allow | 31 | 2 | 1 | Yes | No |
| 17016115 | SEMICONDUCTOR PACKAGE INCLUDING COMPOSITE MOLDING STRUCTURE | September 2020 | February 2022 | Allow | 17 | 0 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CHAN, CANDICE.
With a 25.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 17.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner CHAN, CANDICE works in Art Unit 2813 and has examined 603 patent applications in our dataset. With an allowance rate of 74.1%, this examiner has a below-average tendency to allow applications. Applications typically reach final disposition in approximately 32 months.
Examiner CHAN, CANDICE's allowance rate of 74.1% places them in the 31% percentile among all USPTO examiners. This examiner has a below-average tendency to allow applications.
On average, applications examined by CHAN, CANDICE receive 2.11 office actions before reaching final disposition. This places the examiner in the 70% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by CHAN, CANDICE is 32 months. This places the examiner in the 32% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +16.9% benefit to allowance rate for applications examined by CHAN, CANDICE. This interview benefit is in the 62% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 25.6% of applications are subsequently allowed. This success rate is in the 31% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 33.0% of cases where such amendments are filed. This entry rate is in the 41% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 100.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 71% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 55.6% of appeals filed. This is in the 22% percentile among all examiners. Of these withdrawals, 40.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 49.2% are granted (fully or in part). This grant rate is in the 58% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 1.8% of allowed cases (in the 76% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 8.5% of allowed cases (in the 86% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.