Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18632902 | STRUCTURE INCLUDING MULTI-LEVEL FIELD PLATE AND METHOD OF FORMING THE STRUCTURE | April 2024 | August 2024 | Allow | 4 | 1 | 1 | No | No |
| 18632532 | SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME | April 2024 | January 2025 | Allow | 10 | 0 | 0 | No | No |
| 18598167 | SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME | March 2024 | December 2024 | Allow | 9 | 1 | 0 | No | No |
| 18398204 | INTEGRATED CIRCUIT STRUCTURE | December 2023 | January 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18529308 | SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS | December 2023 | September 2024 | Allow | 9 | 0 | 0 | No | No |
| 18355799 | Passivation Structure with Planar Top Surfaces | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18216989 | SIZE AND EFFICIENCY OF DIES | June 2023 | May 2024 | Allow | 11 | 0 | 0 | No | No |
| 18325829 | MODULE CONFIGURATIONS FOR INTEGRATED III-NITRIDE DEVICES | May 2023 | March 2024 | Allow | 10 | 0 | 0 | No | No |
| 18202136 | SIZE AND EFFICIENCY OF DIES | May 2023 | April 2024 | Allow | 10 | 0 | 0 | No | No |
| 18141621 | INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE | May 2023 | September 2024 | Allow | 16 | 1 | 0 | No | No |
| 18133959 | SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME | April 2023 | March 2024 | Allow | 11 | 0 | 0 | No | No |
| 18193977 | THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS | March 2023 | September 2024 | Allow | 17 | 1 | 0 | No | No |
| 18189647 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME | March 2023 | March 2024 | Allow | 11 | 0 | 0 | No | No |
| 18165339 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | February 2023 | October 2024 | Allow | 20 | 1 | 0 | Yes | No |
| 18095900 | SEMICONDUCTOR PACKAGE | January 2023 | May 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18089213 | LOCALIZED HIGH DENSITY SUBSTRATE ROUTING | December 2022 | January 2024 | Allow | 13 | 0 | 0 | No | No |
| 18079054 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | December 2022 | May 2024 | Allow | 17 | 1 | 0 | No | No |
| 18074134 | SEMICONDUCTOR DEVICE | December 2022 | January 2024 | Allow | 13 | 0 | 0 | No | No |
| 17993235 | METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE POLYMER LINER | November 2022 | February 2024 | Allow | 15 | 1 | 0 | No | No |
| 17972340 | LOCALIZED HIGH DENSITY SUBSTRATE ROUTING | October 2022 | May 2024 | Allow | 19 | 1 | 0 | Yes | No |
| 17964010 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | October 2022 | April 2024 | Allow | 18 | 1 | 0 | No | No |
| 17890835 | SEMICONDUCTOR PACKAGE | August 2022 | December 2023 | Allow | 16 | 0 | 0 | No | No |
| 17851324 | METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT | June 2022 | January 2025 | Allow | 30 | 0 | 0 | No | No |
| 17848422 | MULTI-LEVEL GATE DRIVER APPLIED TO SIC MOSFET | June 2022 | November 2024 | Allow | 29 | 0 | 0 | No | No |
| 17842086 | SEMICONDUCTOR DEVICE | June 2022 | January 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 17830442 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS | June 2022 | August 2024 | Allow | 26 | 0 | 0 | No | No |
| 17780519 | POWER MODULE AND POWER CONVERSION DEVICE | May 2022 | July 2024 | Allow | 25 | 1 | 0 | No | No |
| 17664603 | DISPLAY APPARATUS | May 2022 | May 2024 | Abandon | 24 | 1 | 0 | No | No |
| 17746069 | SEMICONDUCTOR DEVICE | May 2022 | February 2024 | Allow | 21 | 0 | 0 | No | No |
| 17662380 | GATE ALL AROUND DEVICE AND METHOD OF FORMING THE SAME | May 2022 | September 2024 | Allow | 28 | 0 | 0 | No | No |
| 17732324 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND WAFER STACKING METHOD | April 2022 | August 2024 | Allow | 28 | 2 | 0 | No | No |
| 17659885 | SEMICONDUCTOR PACKAGE AND RELATED METHODS | April 2022 | February 2024 | Allow | 22 | 1 | 0 | No | No |
| 17714978 | Display Assembly Apparatus And Methods For Information Handling Systems | April 2022 | June 2024 | Allow | 26 | 2 | 0 | No | No |
| 17712306 | Dielectric Film for Semiconductor Fabrication | April 2022 | September 2023 | Allow | 18 | 1 | 0 | Yes | No |
| 17698545 | SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME | March 2022 | March 2024 | Allow | 24 | 0 | 1 | No | No |
| 17687072 | SEMICONDUCTOR PACKAGE | March 2022 | September 2023 | Allow | 19 | 1 | 0 | Yes | No |
| 17683002 | POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS | February 2022 | September 2023 | Allow | 19 | 0 | 0 | No | No |
| 17678619 | Composite Wafer, Semiconductor Device and Electronic Component | February 2022 | August 2023 | Allow | 17 | 1 | 0 | No | No |
| 17678392 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | February 2022 | September 2023 | Allow | 19 | 0 | 0 | No | No |
| 17650796 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | February 2022 | March 2024 | Allow | 25 | 1 | 0 | No | No |
| 17665749 | INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM | February 2022 | December 2023 | Allow | 22 | 0 | 0 | No | No |
| 17590289 | SEMICONDUCTOR DEVICE | February 2022 | June 2024 | Allow | 29 | 0 | 0 | No | No |
| 17583946 | ELECTRONIC PACKAGE, HEAT DISSIPATION STRUCTURE AND MANUFACTURING METHOD THEREOF | January 2022 | June 2024 | Allow | 29 | 2 | 0 | Yes | No |
| 17648309 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | January 2022 | February 2024 | Allow | 25 | 1 | 0 | No | No |
| 17577091 | SEMICONDUCTOR DEVICE | January 2022 | July 2023 | Allow | 18 | 0 | 0 | No | No |
| 17574485 | DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE | January 2022 | September 2023 | Allow | 20 | 1 | 0 | No | No |
| 17572033 | SEMICONDUCTOR DEVICE INCLUDING RE-DISTRIBUTION PADS DISPOSED AT DIFFERENT LEVELS AND A METHOD OF MANUFACTURING THE SAME | January 2022 | January 2025 | Allow | 36 | 1 | 0 | No | No |
| 17565020 | METHOD OF MANUFACTURING A LIGHT EMITTING DEVICE | December 2021 | January 2024 | Allow | 24 | 2 | 0 | No | No |
| 17622229 | DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE | December 2021 | November 2024 | Allow | 35 | 2 | 1 | No | No |
| 17555213 | SIZE AND EFFICIENCY OF DIES | December 2021 | March 2023 | Allow | 15 | 0 | 0 | No | No |
| 17644716 | SEMICONDUCTOR DEVICE | December 2021 | April 2024 | Allow | 27 | 0 | 0 | No | No |
| 17549236 | STORAGE DEVICE | December 2021 | June 2024 | Allow | 31 | 0 | 0 | No | No |
| 17524928 | SEMICONDUCTOR PACKAGE WITH AIR GAP | November 2021 | September 2023 | Allow | 23 | 2 | 0 | No | No |
| 17524375 | CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR STRUCTURES | November 2021 | September 2023 | Allow | 22 | 1 | 1 | No | No |
| 17609906 | SEMICONDUCTOR APPARATUS AND ELECTRONIC APPARATUS | November 2021 | November 2023 | Allow | 24 | 1 | 0 | No | No |
| 17522602 | SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS | November 2021 | December 2024 | Allow | 37 | 1 | 1 | No | No |
| 17521786 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | November 2021 | December 2023 | Allow | 25 | 2 | 0 | No | No |
| 17511884 | DISPLAY DRIVER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | October 2021 | December 2024 | Allow | 37 | 1 | 0 | No | No |
| 17506286 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE USING SAME | October 2021 | April 2023 | Allow | 17 | 0 | 0 | No | No |
| 17489064 | POWER MODULE | September 2021 | April 2023 | Allow | 18 | 0 | 0 | No | No |
| 17479403 | INTEGRATED STRUCTURE WITH BIFUNCTIONAL ROUTING AND ASSEMBLY COMPRISING SUCH A STRUCTURE | September 2021 | November 2024 | Allow | 37 | 4 | 0 | Yes | No |
| 17477996 | BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME | September 2021 | February 2023 | Allow | 17 | 0 | 0 | No | No |
| 17478247 | SEMICONDUCTOR PACKAGE | September 2021 | August 2023 | Allow | 23 | 0 | 0 | No | No |
| 17447997 | TRENCH STRUCTURE FOR REDUCED WAFER CRACKING | September 2021 | September 2024 | Allow | 36 | 2 | 0 | Yes | No |
| 17464113 | HIGH DENSITY AND DURABLE SEMICONDUCTOR DEVICE INTERCONNECT | September 2021 | March 2023 | Allow | 19 | 0 | 0 | No | No |
| 17462504 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR | August 2021 | January 2025 | Allow | 41 | 1 | 1 | Yes | No |
| 17459849 | CONTACT PAD FABRICATION PROCESS FOR A SEMICONDUCTOR PRODUCT | August 2021 | August 2024 | Allow | 35 | 1 | 0 | No | No |
| 17402618 | SEMICONDUCTOR PACKAGE | August 2021 | October 2023 | Abandon | 26 | 2 | 0 | No | No |
| 17391164 | SEMICONDUCTOR DEVICE | August 2021 | May 2023 | Allow | 21 | 0 | 0 | No | No |
| 17391036 | ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME | August 2021 | December 2023 | Allow | 29 | 0 | 0 | No | No |
| 17389610 | WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESIGN AND METHOD OF FORMING THE SAME | July 2021 | October 2024 | Allow | 39 | 1 | 1 | Yes | No |
| 17379529 | Semiconductor Package with Low Parasitic Connection to Passive Device | July 2021 | December 2023 | Allow | 29 | 0 | 1 | No | No |
| 17370317 | BONDED ASSEMBLY INCLUDING AN AIRGAP CONTAINING BONDING-LEVEL DIELECTRIC LAYER AND METHODS OF FORMING THE SAME | July 2021 | November 2023 | Allow | 29 | 1 | 0 | Yes | No |
| 17368303 | BOND FOOT SEALING FOR CHIP FRONTSIDE METALLIZATION | July 2021 | June 2024 | Abandon | 35 | 2 | 0 | No | No |
| 17356772 | DRIVING BACKPLANE AND DISPLAY APPARATUS | June 2021 | September 2022 | Allow | 15 | 0 | 0 | No | No |
| 17356387 | TEMPORARY BONDING STRUCTURES FOR DIE-TO-DIE AND WAFER-TO-WAFER BONDING | June 2021 | April 2024 | Allow | 34 | 5 | 1 | No | No |
| 17349211 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | June 2021 | February 2023 | Allow | 20 | 1 | 0 | No | No |
| 17333754 | Substrate and Package Structure | May 2021 | September 2023 | Allow | 28 | 2 | 0 | Yes | No |
| 17329856 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | May 2021 | March 2023 | Allow | 21 | 1 | 0 | No | No |
| 17328666 | PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A BRIDGE | May 2021 | August 2024 | Abandon | 39 | 2 | 1 | No | No |
| 17325384 | SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES | May 2021 | March 2023 | Allow | 22 | 1 | 0 | No | No |
| 17324836 | Passivation Structure with Planar Top Surfaces | May 2021 | June 2023 | Allow | 25 | 2 | 0 | Yes | No |
| 17316716 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | May 2021 | May 2024 | Allow | 36 | 2 | 1 | Yes | No |
| 17316157 | SEMICONDUCTOR DEVICE | May 2021 | March 2023 | Allow | 22 | 1 | 0 | No | No |
| 17315102 | NANOPARTICLE BACKSIDE DIE ADHESION LAYER | May 2021 | February 2023 | Allow | 21 | 1 | 0 | No | No |
| 17308366 | MODULE CONFIGURATIONS FOR INTEGRATED III-NITRIDE DEVICES | May 2021 | February 2023 | Allow | 22 | 0 | 0 | No | No |
| 17243056 | SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS AND RELATED METHODS OF MANUFACTURING | April 2021 | July 2023 | Allow | 40 | 0 | 1 | No | No |
| 17230509 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2021 | October 2022 | Allow | 19 | 0 | 0 | No | No |
| 17219123 | PACKAGE FOR POWER SEMICONDUCTOR DEVICES | March 2021 | February 2023 | Allow | 23 | 0 | 0 | No | No |
| 17206725 | DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES | March 2021 | January 2024 | Allow | 33 | 1 | 1 | No | No |
| 17206295 | SEMICONDUCTOR DEVICE | March 2021 | January 2023 | Allow | 22 | 1 | 0 | Yes | No |
| 17202542 | SEMICONDUCTOR DEVICE | March 2021 | February 2023 | Allow | 23 | 1 | 0 | No | No |
| 17201929 | SEMICONDUCTOR DEVICE PACKAGE | March 2021 | September 2023 | Allow | 30 | 2 | 0 | Yes | No |
| 17272843 | ELECTRONIC POWER MODULE | March 2021 | September 2023 | Allow | 31 | 1 | 1 | No | No |
| 17184659 | CONTACT PAD STRUCTURES AND METHODS FOR FABRICATING CONTACT PAD STRUCTURES | February 2021 | January 2023 | Allow | 23 | 1 | 0 | No | No |
| 17181720 | Buffer Design for Package Integration | February 2021 | August 2023 | Allow | 30 | 2 | 0 | Yes | No |
| 17176095 | Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects | February 2021 | February 2023 | Allow | 24 | 1 | 0 | No | No |
| 17169054 | OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME | February 2021 | June 2023 | Allow | 29 | 2 | 0 | Yes | No |
| 17163645 | INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE | February 2021 | March 2023 | Allow | 26 | 2 | 1 | Yes | No |
| 17160400 | INTEGRATED CIRCUIT STRUCTURE AND FABRICATION METHOD THEREOF | January 2021 | September 2023 | Allow | 32 | 3 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner TRINH, HOA B.
With a 50.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 31.6% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner TRINH, HOA B works in Art Unit 2813 and has examined 317 patent applications in our dataset. With an allowance rate of 89.6%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 24 months.
Examiner TRINH, HOA B's allowance rate of 89.6% places them in the 69% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by TRINH, HOA B receive 1.88 office actions before reaching final disposition. This places the examiner in the 59% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by TRINH, HOA B is 24 months. This places the examiner in the 72% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a -1.9% benefit to allowance rate for applications examined by TRINH, HOA B. This interview benefit is in the 7% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 24.8% of applications are subsequently allowed. This success rate is in the 28% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 36.3% of cases where such amendments are filed. This entry rate is in the 47% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 80.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 61% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 76.5% of appeals filed. This is in the 64% percentile among all examiners. Of these withdrawals, 38.5% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 40.0% are granted (fully or in part). This grant rate is in the 39% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.9% of allowed cases (in the 68% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 28% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.