USPTO Art Unit 1716 Prosecution Statistics

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
19082602RESEARCH WET ETCHING FULLY AUTOMATIC SYSTEM AND MACHINEMarch 2025October 2025Allow710YesNo
19055567DEVICE AND METHOD FOR PRODUCING THIN-FILM CATALYSTFebruary 2025April 2025Allow200YesNo
18980720ROTATABLE ELECTROCHEMICAL ETCHING CELLDecember 2024July 2025Allow711YesNo
18943037SLOT-DIE TYPE GAS DISTRIBUTION DEVICE FOR PHOTOVOLTAIC MANUFACTURINGNovember 2024November 2025Allow1221NoNo
18850990INTEGRATION OF DRY DEVELOPMENT AND ETCH PROCESSES FOR EUV PATTERNING IN A SINGLE PROCESS CHAMBERSeptember 2024April 2025Allow600NoNo
18826224PROCESSING AND RECYCLING METHOD AND PRODUCT OF ULTRATHIN LITHIUM FOILSeptember 2024November 2024Allow200NoNo
18825717SYSTEM AND METHOD FOR CONTROLLING FILM THICKNESS, AND FILM DEPOSITION SYSTEM AND METHOD USING SAMESeptember 2024November 2025Allow1521NoNo
18825040ETCHING DEVICE AND ETCHING METHOD THEREOFSeptember 2024March 2026Allow1810YesNo
18805861SUBSTRATE STRUCTURING METHODAugust 2024October 2024Allow200NoNo
18804455METHOD FOR FORMING PATTERNS ON A SUBSTRATEAugust 2024December 2024Allow400YesNo
18730489SEMICONDUCTOR PROCESS DEVICE AND PROCESS CHAMBER THEREOFJuly 2024November 2025Allow1600NoNo
18771782PLATEN ROTATION DEVICEJuly 2024December 2025Allow1710NoNo
18728824COATING CHAMBER WITH DISTANCE DETECTION FOR THE SUBSTRATESJuly 2024February 2026Allow1911NoNo
18768190METHODS AND SYSTEMS FOR COOLING PLASMA TREATMENT COMPONENTSJuly 2024February 2026Allow1921YesNo
18762402CMP COMPOSITION INCLUDING ANIONIC AND CATIONIC INHIBITORSJuly 2024July 2025Allow1310NoNo
18750473METHOD OF PERFORMING MAINTENANCE ON SUBSTRATE PROCESSING APPARATUSJune 2024February 2025Allow710NoNo
18744079CLEANING ASSEMBLIES FOR SUBSTRATE PROCESSING CHAMBERSJune 2024November 2025Allow1710YesNo
18740531GAS TUBE, GAS SUPPLY SYSTEM AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAMEJune 2024April 2025Allow1010NoNo
18740411SOLIDS VAPORIZERJune 2024March 2025Allow910NoNo
18679784APPARATUS FOR AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEMay 2024March 2025Allow900YesNo
18679771INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL AND PRECURSOR GAS TO A DOWNSTREAM CHAMBER TO ENABLE REMOTE PLASMA FILM DEPOSITIONMay 2024January 2025Allow800YesNo
18676513ETCHING DEVICEMay 2024October 2025Allow1730NoNo
18673409CHEMICAL LIQUID AND CHEMICAL LIQUID STORAGE BODYMay 2024July 2025Allow1310NoNo
18713532DISTRIBUTION BODY FOR DISTRIBUTING A PROCESS GAS FOR TREATING A SUBSTRATE BY MEANS OF THE PROCESS GASMay 2024January 2026Allow2011NoNo
18670879POLISHING COMPOSITIONS AND METHODS OF USING THE SAMEMay 2024February 2025Allow900NoNo
18671779SURFACE TREATMENT OF A SULFIDE GLASS SOLID ELECTROLYTE LAYERMay 2024April 2025Allow1110NoNo
18671508SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEMay 2024March 2025Abandon910NoNo
18670641ION BEAM ETCHING WITH SIDEWALL CLEANINGMay 2024January 2025Allow800NoNo
18667069SHOWER HEAD, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHODMay 2024December 2025Allow1901YesNo
18664004WAFER TREATMENT DEVICEMay 2024June 2025Allow1310NoNo
17924293METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR GROWTH DEVICEMay 2024July 2025Abandon3220NoNo
18647944SEMICONDUCTOR DEVICE FABRICATION APPARATUSApril 2024August 2024Allow300YesNo
18632509SEMICONDUCTOR PROCESSING TOOL PLATFORM CONFIGURATION WITH REDUCED FOOTPRINTApril 2024March 2026Allow2340YesNo
18631589CMP System and Method of UseApril 2024May 2025Allow1300YesNo
18632060APPARATUS AND METHOD FOR PLASMA ETCHINGApril 2024November 2024Allow800YesNo
18630603SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEADApril 2024December 2024Allow820YesNo
18630683SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEADApril 2024November 2024Allow820YesNo
18630726SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEADApril 2024December 2025Allow2010YesNo
18699313VAPOR DEPOSITION DEVICE CAPABLE OF RECIPROCATING ROTATION AND LIFTINGApril 2024November 2024Allow710NoNo
18626719SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEMApril 2024February 2025Allow1000NoNo
18626047SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAMEApril 2024January 2026Allow2200NoNo
18616493SELECTIVE IN-SITU CARBON-BASED MASK PROTECTIONMarch 2024February 2026Allow2200NoNo
18612807TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RANDOM ACCESS MEMORY (SRAM) AND DENSE LOGICMarch 2024February 2025Allow1100NoNo
18693438METHOD FOR MANUFACTURING A MOULD FOR NANOPRINTING AND ASSOCIATED MOULDMarch 2024October 2024Allow701NoNo
18693298BALANCING GAS FLOW TO MULTIPLE STATIONS USING HEATERS UPSTREAM OF FLOW RESTRICTORSMarch 2024March 2026Abandon2411NoNo
18604167WET ANISOTROPIC ETCHING OF SILICONMarch 2024March 2026Allow2420NoNo
18604257CAPACITIVE SENSOR FOR MONITORING GAS CONCENTRATIONMarch 2024October 2024Allow700YesNo
18599767Processing Chamber With Multiple Plasma UnitsMarch 2024October 2024Allow700NoNo
18689767GAS INJECTION DEVICE OF SEMICONDUCTOR THERMAL PROCESSING EQUIPMENT AND SEMICONDUCTOR THERMAL PROCESSING EQUIPMENTMarch 2024November 2025Allow2111NoNo
18593286PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICSMarch 2024January 2026Allow2320NoNo
18592994PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICSMarch 2024October 2025Allow2010NoNo
18589252SHOWERHEAD DEVICE FOR SEMICONDUCTOR PROCESSING SYSTEMFebruary 2024October 2024Allow800YesNo
18582163SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUSFebruary 2024July 2025Abandon1721YesNo
18582329SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUSFebruary 2024January 2025Allow1111YesNo
18442865APPARATUS AND ASSOCIATED ACCESSORIES, METHODS AND USES FOR VISUALISING A PRINT ON AN OBJECTFebruary 2024May 2025Allow1510NoNo
18439532PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION REACTORS AND ASSOCIATED METHODSFebruary 2024January 2026Allow2411YesNo
18438148MONOLITHIC PLATENFebruary 2024January 2025Allow1210NoNo
18435545PECVD APPARATUSFebruary 2024July 2024Allow610NoNo
18431669PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICSFebruary 2024January 2026Allow2320YesNo
18429110SYMMETRIC SEMICONDUCTOR PROCESSING CHAMBERJanuary 2024October 2025Abandon2020YesNo
18427348SPATIALLY TUNABLE DEPOSITION TO COMPENSATE WITHIN WAFER DIFFERENTIAL BOWJanuary 2024April 2025Allow1410YesNo
18419890SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUMJanuary 2024September 2024Allow800YesNo
18419389MONOLITHIC MODULAR MICROWAVE SOURCE WITH INTEGRATED PROCESS GAS DISTRIBUTIONJanuary 2024September 2024Allow800YesNo
18417567REMOTE LASER-BASED SAMPLE HEATER WITH SAMPLE EXCHANGE TURRETJanuary 2024June 2025Allow1731YesNo
18412399METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION DURING WORK PIECE POLISHINGJanuary 2024April 2025Allow1510NoNo
18409601Functionalized Carbon Particle CMP SlurryJanuary 2024March 2026Allow2610NoNo
18400180PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUMDecember 2023February 2025Allow1310NoNo
18400396SYSTEM AND METHOD FOR MANUFACTURING PLURALITY OF INTEGRATED CIRCUITSDecember 2023September 2025Abandon2120NoNo
18397941PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODDecember 2023April 2025Allow1611YesNo
18392294PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODDecember 2023November 2024Allow1011NoNo
18392987Microneedle Fabrication and Device ImplantationDecember 2023September 2024Allow900NoNo
18389827PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUSDecember 2023October 2025Abandon2221NoNo
18545322SELECTIVE THERMAL DRY ETCH OF MEMORY DEVICES USING PHOSPHORIC ACID DERIVATIVESDecember 2023January 2026Allow2500NoNo
18544315PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODDecember 2023September 2025Abandon2120YesNo
18540311TUNABLE HARDWARE TO CONTROL RADIAL FLOW DISTRIBUTION IN A PROCESSING CHAMBERDecember 2023March 2026Allow2711NoNo
18538165PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODDecember 2023January 2026Allow2521NoNo
18537574METHOD FOR CMP TEMPERATURE CONTROLDecember 2023September 2024Allow920YesNo
18569325COATING PLANT FOR COATING A PLANAR OBJECT AND A METHOD FOR COATING A PLANAR OBJECTDecember 2023July 2025Allow2011YesNo
18534327WAFER TOTAL THICKNESS VARIATION USING MASKLESS IMPLANTDecember 2023November 2025Allow2301NoNo
18534182MULTI-PLATE ELECTROSTATIC CHUCKS WITH CERAMIC BASEPLATESDecember 2023June 2025Allow1811YesNo
18532669CROSS FLOW GAS DELIVERY FOR PARTICLE REDUCTIONDecember 2023March 2026Allow2700NoNo
18567025DEVICE AND METHOD FOR PRODUCING THIN-FILM CATALYSTDecember 2023June 2025Abandon1821YesNo
18529465POLISHING METHOD AND POLISHING COMPOSITIONDecember 2023June 2024Allow610NoNo
18529763POLISHING COMPOSITIONDecember 2023September 2024Allow920YesNo
18529576Showerhead Faceplate Having Flow Apertures Configured for Hollow Cathode Discharge SuppressionDecember 2023November 2025Abandon2330NoNo
18527999SUBSTRATE PROCESSING APPARATUSDecember 2023May 2024Allow510YesNo
18526215HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENTDecember 2023September 2024Allow1000YesNo
18526472SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUMDecember 2023March 2025Allow1600YesNo
18526411SYSTEMS AND METHODS FOR PULSE WIDTH MODULATED DOSE CONTROLDecember 2023September 2024Allow1000YesNo
18525473Semiconductor Device and MethodNovember 2023February 2025Allow1410NoNo
18525005MASK DEVICE AND EVAPORATION DEVICENovember 2023March 2025Allow1511YesNo
18524974MASK DEVICE AND EVAPORATION DEVICENovember 2023January 2026Allow2531YesNo
18525636FORMULATIONS TO SELECTIVELY ETCH SILICON-GERMANIUM RELATIVE TO SILICONNovember 2023January 2025Allow1410NoNo
18522090CAPACITANCE MEASUREMENT WITHOUT DISCONNECTING FROM HIGH POWER CIRCUITNovember 2023April 2025Allow1700NoNo
18517341SUBSTRATE PROCESSING METHODNovember 2023December 2024Allow1310NoNo
18516991SHOWER HEAD STRUCTURE AND PLASMA PROCESSING APPARATUS USING THE SAMENovember 2023September 2024Allow1000YesNo
18516087PRECURSOR CONTAINERNovember 2023September 2024Allow1000YesNo
18514719METHODS OF PROCESSING WORKPIECES USING ORGANIC RADICALSNovember 2023January 2026Allow2601NoNo
18514911MASK AND DEPOSITION APPARATUS INCLUDING THE SAMENovember 2023March 2026Allow2800NoNo
18514494SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICENovember 2023September 2024Allow1000YesNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 1716.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
441
Examiner Affirmed
271
(61.5%)
Examiner Reversed
170
(38.5%)
Reversal Percentile
76.2%
Higher than average

What This Means

With a 38.5% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.

Strategic Value of Filing an Appeal

Total Appeal Filings
1091
Allowed After Appeal Filing
346
(31.7%)
Not Allowed After Appeal Filing
745
(68.3%)
Filing Benefit Percentile
47.7%
Lower than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 31.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.

Strategic Recommendations

Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.

Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.

Art Unit 1716 - Prosecution Statistics Summary

Executive Summary

Art Unit 1716 is part of Group 1710 in Technology Center 1700. This art unit has examined 10,679 patent applications in our dataset, with an overall allowance rate of 57.2%. Applications typically reach final disposition in approximately 40 months.

Comparative Analysis

Art Unit 1716's allowance rate of 57.2% places it in the 12% percentile among all USPTO art units. This art unit has a significantly lower allowance rate than most art units at the USPTO.

Prosecution Patterns

Applications in Art Unit 1716 receive an average of 2.51 office actions before reaching final disposition (in the 87% percentile). The median prosecution time is 40 months (in the 13% percentile).

Strategic Considerations

When prosecuting applications in this art unit, consider the following:

  • The art unit's allowance rate suggests a more challenging examination environment compared to the USPTO average.
  • With more office actions than average, plan for multiple rounds of prosecution.
  • The median prosecution time is longer than average and should be factored into your continuation and client communication strategies.
  • Review individual examiner statistics within this art unit to identify examiners with particularly favorable or challenging prosecution patterns.

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.