Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19082602 | RESEARCH WET ETCHING FULLY AUTOMATIC SYSTEM AND MACHINE | March 2025 | October 2025 | Allow | 7 | 1 | 0 | Yes | No |
| 19055567 | DEVICE AND METHOD FOR PRODUCING THIN-FILM CATALYST | February 2025 | April 2025 | Allow | 2 | 0 | 0 | Yes | No |
| 18980720 | ROTATABLE ELECTROCHEMICAL ETCHING CELL | December 2024 | July 2025 | Allow | 7 | 1 | 1 | Yes | No |
| 18943037 | SLOT-DIE TYPE GAS DISTRIBUTION DEVICE FOR PHOTOVOLTAIC MANUFACTURING | November 2024 | November 2025 | Allow | 12 | 2 | 1 | No | No |
| 18850990 | INTEGRATION OF DRY DEVELOPMENT AND ETCH PROCESSES FOR EUV PATTERNING IN A SINGLE PROCESS CHAMBER | September 2024 | April 2025 | Allow | 6 | 0 | 0 | No | No |
| 18826224 | PROCESSING AND RECYCLING METHOD AND PRODUCT OF ULTRATHIN LITHIUM FOIL | September 2024 | November 2024 | Allow | 2 | 0 | 0 | No | No |
| 18825717 | SYSTEM AND METHOD FOR CONTROLLING FILM THICKNESS, AND FILM DEPOSITION SYSTEM AND METHOD USING SAME | September 2024 | November 2025 | Allow | 15 | 2 | 1 | No | No |
| 18825040 | ETCHING DEVICE AND ETCHING METHOD THEREOF | September 2024 | March 2026 | Allow | 18 | 1 | 0 | Yes | No |
| 18805861 | SUBSTRATE STRUCTURING METHOD | August 2024 | October 2024 | Allow | 2 | 0 | 0 | No | No |
| 18804455 | METHOD FOR FORMING PATTERNS ON A SUBSTRATE | August 2024 | December 2024 | Allow | 4 | 0 | 0 | Yes | No |
| 18730489 | SEMICONDUCTOR PROCESS DEVICE AND PROCESS CHAMBER THEREOF | July 2024 | November 2025 | Allow | 16 | 0 | 0 | No | No |
| 18771782 | PLATEN ROTATION DEVICE | July 2024 | December 2025 | Allow | 17 | 1 | 0 | No | No |
| 18728824 | COATING CHAMBER WITH DISTANCE DETECTION FOR THE SUBSTRATES | July 2024 | February 2026 | Allow | 19 | 1 | 1 | No | No |
| 18768190 | METHODS AND SYSTEMS FOR COOLING PLASMA TREATMENT COMPONENTS | July 2024 | February 2026 | Allow | 19 | 2 | 1 | Yes | No |
| 18762402 | CMP COMPOSITION INCLUDING ANIONIC AND CATIONIC INHIBITORS | July 2024 | July 2025 | Allow | 13 | 1 | 0 | No | No |
| 18750473 | METHOD OF PERFORMING MAINTENANCE ON SUBSTRATE PROCESSING APPARATUS | June 2024 | February 2025 | Allow | 7 | 1 | 0 | No | No |
| 18744079 | CLEANING ASSEMBLIES FOR SUBSTRATE PROCESSING CHAMBERS | June 2024 | November 2025 | Allow | 17 | 1 | 0 | Yes | No |
| 18740531 | GAS TUBE, GAS SUPPLY SYSTEM AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME | June 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18740411 | SOLIDS VAPORIZER | June 2024 | March 2025 | Allow | 9 | 1 | 0 | No | No |
| 18679784 | APPARATUS FOR AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | May 2024 | March 2025 | Allow | 9 | 0 | 0 | Yes | No |
| 18679771 | INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL AND PRECURSOR GAS TO A DOWNSTREAM CHAMBER TO ENABLE REMOTE PLASMA FILM DEPOSITION | May 2024 | January 2025 | Allow | 8 | 0 | 0 | Yes | No |
| 18676513 | ETCHING DEVICE | May 2024 | October 2025 | Allow | 17 | 3 | 0 | No | No |
| 18673409 | CHEMICAL LIQUID AND CHEMICAL LIQUID STORAGE BODY | May 2024 | July 2025 | Allow | 13 | 1 | 0 | No | No |
| 18713532 | DISTRIBUTION BODY FOR DISTRIBUTING A PROCESS GAS FOR TREATING A SUBSTRATE BY MEANS OF THE PROCESS GAS | May 2024 | January 2026 | Allow | 20 | 1 | 1 | No | No |
| 18670879 | POLISHING COMPOSITIONS AND METHODS OF USING THE SAME | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18671779 | SURFACE TREATMENT OF A SULFIDE GLASS SOLID ELECTROLYTE LAYER | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18671508 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | May 2024 | March 2025 | Abandon | 9 | 1 | 0 | No | No |
| 18670641 | ION BEAM ETCHING WITH SIDEWALL CLEANING | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18667069 | SHOWER HEAD, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD | May 2024 | December 2025 | Allow | 19 | 0 | 1 | Yes | No |
| 18664004 | WAFER TREATMENT DEVICE | May 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 17924293 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR GROWTH DEVICE | May 2024 | July 2025 | Abandon | 32 | 2 | 0 | No | No |
| 18647944 | SEMICONDUCTOR DEVICE FABRICATION APPARATUS | April 2024 | August 2024 | Allow | 3 | 0 | 0 | Yes | No |
| 18632509 | SEMICONDUCTOR PROCESSING TOOL PLATFORM CONFIGURATION WITH REDUCED FOOTPRINT | April 2024 | March 2026 | Allow | 23 | 4 | 0 | Yes | No |
| 18631589 | CMP System and Method of Use | April 2024 | May 2025 | Allow | 13 | 0 | 0 | Yes | No |
| 18632060 | APPARATUS AND METHOD FOR PLASMA ETCHING | April 2024 | November 2024 | Allow | 8 | 0 | 0 | Yes | No |
| 18630603 | SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEAD | April 2024 | December 2024 | Allow | 8 | 2 | 0 | Yes | No |
| 18630683 | SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEAD | April 2024 | November 2024 | Allow | 8 | 2 | 0 | Yes | No |
| 18630726 | SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEAD | April 2024 | December 2025 | Allow | 20 | 1 | 0 | Yes | No |
| 18699313 | VAPOR DEPOSITION DEVICE CAPABLE OF RECIPROCATING ROTATION AND LIFTING | April 2024 | November 2024 | Allow | 7 | 1 | 0 | No | No |
| 18626719 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM | April 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18626047 | SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAME | April 2024 | January 2026 | Allow | 22 | 0 | 0 | No | No |
| 18616493 | SELECTIVE IN-SITU CARBON-BASED MASK PROTECTION | March 2024 | February 2026 | Allow | 22 | 0 | 0 | No | No |
| 18612807 | TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RANDOM ACCESS MEMORY (SRAM) AND DENSE LOGIC | March 2024 | February 2025 | Allow | 11 | 0 | 0 | No | No |
| 18693438 | METHOD FOR MANUFACTURING A MOULD FOR NANOPRINTING AND ASSOCIATED MOULD | March 2024 | October 2024 | Allow | 7 | 0 | 1 | No | No |
| 18693298 | BALANCING GAS FLOW TO MULTIPLE STATIONS USING HEATERS UPSTREAM OF FLOW RESTRICTORS | March 2024 | March 2026 | Abandon | 24 | 1 | 1 | No | No |
| 18604167 | WET ANISOTROPIC ETCHING OF SILICON | March 2024 | March 2026 | Allow | 24 | 2 | 0 | No | No |
| 18604257 | CAPACITIVE SENSOR FOR MONITORING GAS CONCENTRATION | March 2024 | October 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18599767 | Processing Chamber With Multiple Plasma Units | March 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18689767 | GAS INJECTION DEVICE OF SEMICONDUCTOR THERMAL PROCESSING EQUIPMENT AND SEMICONDUCTOR THERMAL PROCESSING EQUIPMENT | March 2024 | November 2025 | Allow | 21 | 1 | 1 | No | No |
| 18593286 | PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS | March 2024 | January 2026 | Allow | 23 | 2 | 0 | No | No |
| 18592994 | PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS | March 2024 | October 2025 | Allow | 20 | 1 | 0 | No | No |
| 18589252 | SHOWERHEAD DEVICE FOR SEMICONDUCTOR PROCESSING SYSTEM | February 2024 | October 2024 | Allow | 8 | 0 | 0 | Yes | No |
| 18582163 | SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS | February 2024 | July 2025 | Abandon | 17 | 2 | 1 | Yes | No |
| 18582329 | SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS | February 2024 | January 2025 | Allow | 11 | 1 | 1 | Yes | No |
| 18442865 | APPARATUS AND ASSOCIATED ACCESSORIES, METHODS AND USES FOR VISUALISING A PRINT ON AN OBJECT | February 2024 | May 2025 | Allow | 15 | 1 | 0 | No | No |
| 18439532 | PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION REACTORS AND ASSOCIATED METHODS | February 2024 | January 2026 | Allow | 24 | 1 | 1 | Yes | No |
| 18438148 | MONOLITHIC PLATEN | February 2024 | January 2025 | Allow | 12 | 1 | 0 | No | No |
| 18435545 | PECVD APPARATUS | February 2024 | July 2024 | Allow | 6 | 1 | 0 | No | No |
| 18431669 | PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS | February 2024 | January 2026 | Allow | 23 | 2 | 0 | Yes | No |
| 18429110 | SYMMETRIC SEMICONDUCTOR PROCESSING CHAMBER | January 2024 | October 2025 | Abandon | 20 | 2 | 0 | Yes | No |
| 18427348 | SPATIALLY TUNABLE DEPOSITION TO COMPENSATE WITHIN WAFER DIFFERENTIAL BOW | January 2024 | April 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18419890 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | January 2024 | September 2024 | Allow | 8 | 0 | 0 | Yes | No |
| 18419389 | MONOLITHIC MODULAR MICROWAVE SOURCE WITH INTEGRATED PROCESS GAS DISTRIBUTION | January 2024 | September 2024 | Allow | 8 | 0 | 0 | Yes | No |
| 18417567 | REMOTE LASER-BASED SAMPLE HEATER WITH SAMPLE EXCHANGE TURRET | January 2024 | June 2025 | Allow | 17 | 3 | 1 | Yes | No |
| 18412399 | METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION DURING WORK PIECE POLISHING | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18409601 | Functionalized Carbon Particle CMP Slurry | January 2024 | March 2026 | Allow | 26 | 1 | 0 | No | No |
| 18400180 | PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM | December 2023 | February 2025 | Allow | 13 | 1 | 0 | No | No |
| 18400396 | SYSTEM AND METHOD FOR MANUFACTURING PLURALITY OF INTEGRATED CIRCUITS | December 2023 | September 2025 | Abandon | 21 | 2 | 0 | No | No |
| 18397941 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | December 2023 | April 2025 | Allow | 16 | 1 | 1 | Yes | No |
| 18392294 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | December 2023 | November 2024 | Allow | 10 | 1 | 1 | No | No |
| 18392987 | Microneedle Fabrication and Device Implantation | December 2023 | September 2024 | Allow | 9 | 0 | 0 | No | No |
| 18389827 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | December 2023 | October 2025 | Abandon | 22 | 2 | 1 | No | No |
| 18545322 | SELECTIVE THERMAL DRY ETCH OF MEMORY DEVICES USING PHOSPHORIC ACID DERIVATIVES | December 2023 | January 2026 | Allow | 25 | 0 | 0 | No | No |
| 18544315 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | December 2023 | September 2025 | Abandon | 21 | 2 | 0 | Yes | No |
| 18540311 | TUNABLE HARDWARE TO CONTROL RADIAL FLOW DISTRIBUTION IN A PROCESSING CHAMBER | December 2023 | March 2026 | Allow | 27 | 1 | 1 | No | No |
| 18538165 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | December 2023 | January 2026 | Allow | 25 | 2 | 1 | No | No |
| 18537574 | METHOD FOR CMP TEMPERATURE CONTROL | December 2023 | September 2024 | Allow | 9 | 2 | 0 | Yes | No |
| 18569325 | COATING PLANT FOR COATING A PLANAR OBJECT AND A METHOD FOR COATING A PLANAR OBJECT | December 2023 | July 2025 | Allow | 20 | 1 | 1 | Yes | No |
| 18534327 | WAFER TOTAL THICKNESS VARIATION USING MASKLESS IMPLANT | December 2023 | November 2025 | Allow | 23 | 0 | 1 | No | No |
| 18534182 | MULTI-PLATE ELECTROSTATIC CHUCKS WITH CERAMIC BASEPLATES | December 2023 | June 2025 | Allow | 18 | 1 | 1 | Yes | No |
| 18532669 | CROSS FLOW GAS DELIVERY FOR PARTICLE REDUCTION | December 2023 | March 2026 | Allow | 27 | 0 | 0 | No | No |
| 18567025 | DEVICE AND METHOD FOR PRODUCING THIN-FILM CATALYST | December 2023 | June 2025 | Abandon | 18 | 2 | 1 | Yes | No |
| 18529465 | POLISHING METHOD AND POLISHING COMPOSITION | December 2023 | June 2024 | Allow | 6 | 1 | 0 | No | No |
| 18529763 | POLISHING COMPOSITION | December 2023 | September 2024 | Allow | 9 | 2 | 0 | Yes | No |
| 18529576 | Showerhead Faceplate Having Flow Apertures Configured for Hollow Cathode Discharge Suppression | December 2023 | November 2025 | Abandon | 23 | 3 | 0 | No | No |
| 18527999 | SUBSTRATE PROCESSING APPARATUS | December 2023 | May 2024 | Allow | 5 | 1 | 0 | Yes | No |
| 18526215 | HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENT | December 2023 | September 2024 | Allow | 10 | 0 | 0 | Yes | No |
| 18526472 | SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | December 2023 | March 2025 | Allow | 16 | 0 | 0 | Yes | No |
| 18526411 | SYSTEMS AND METHODS FOR PULSE WIDTH MODULATED DOSE CONTROL | December 2023 | September 2024 | Allow | 10 | 0 | 0 | Yes | No |
| 18525473 | Semiconductor Device and Method | November 2023 | February 2025 | Allow | 14 | 1 | 0 | No | No |
| 18525005 | MASK DEVICE AND EVAPORATION DEVICE | November 2023 | March 2025 | Allow | 15 | 1 | 1 | Yes | No |
| 18524974 | MASK DEVICE AND EVAPORATION DEVICE | November 2023 | January 2026 | Allow | 25 | 3 | 1 | Yes | No |
| 18525636 | FORMULATIONS TO SELECTIVELY ETCH SILICON-GERMANIUM RELATIVE TO SILICON | November 2023 | January 2025 | Allow | 14 | 1 | 0 | No | No |
| 18522090 | CAPACITANCE MEASUREMENT WITHOUT DISCONNECTING FROM HIGH POWER CIRCUIT | November 2023 | April 2025 | Allow | 17 | 0 | 0 | No | No |
| 18517341 | SUBSTRATE PROCESSING METHOD | November 2023 | December 2024 | Allow | 13 | 1 | 0 | No | No |
| 18516991 | SHOWER HEAD STRUCTURE AND PLASMA PROCESSING APPARATUS USING THE SAME | November 2023 | September 2024 | Allow | 10 | 0 | 0 | Yes | No |
| 18516087 | PRECURSOR CONTAINER | November 2023 | September 2024 | Allow | 10 | 0 | 0 | Yes | No |
| 18514719 | METHODS OF PROCESSING WORKPIECES USING ORGANIC RADICALS | November 2023 | January 2026 | Allow | 26 | 0 | 1 | No | No |
| 18514911 | MASK AND DEPOSITION APPARATUS INCLUDING THE SAME | November 2023 | March 2026 | Allow | 28 | 0 | 0 | No | No |
| 18514494 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | November 2023 | September 2024 | Allow | 10 | 0 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 1716.
With a 38.5% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 31.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Art Unit 1716 is part of Group 1710 in Technology Center 1700. This art unit has examined 10,679 patent applications in our dataset, with an overall allowance rate of 57.2%. Applications typically reach final disposition in approximately 40 months.
Art Unit 1716's allowance rate of 57.2% places it in the 12% percentile among all USPTO art units. This art unit has a significantly lower allowance rate than most art units at the USPTO.
Applications in Art Unit 1716 receive an average of 2.51 office actions before reaching final disposition (in the 87% percentile). The median prosecution time is 40 months (in the 13% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.