USPTO Examiner KLUNK MARGARET D - Art Unit 1716

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18825717SYSTEM AND METHOD FOR CONTROLLING FILM THICKNESS, AND FILM DEPOSITION SYSTEM AND METHOD USING SAMESeptember 2024November 2025Allow1521NoNo
18631589CMP System and Method of UseApril 2024May 2025Allow1300YesNo
18526215HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENTDecember 2023September 2024Allow1000YesNo
18349666SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHODJuly 2023June 2025Abandon2311YesNo
18197455SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE TRANSFER APPARATUS AND METHODMay 2023July 2025Abandon2620YesNo
18193253SYSTEM AND METHOD FOR CONTROLLING FILM THICKNESS, AND FILM DEPOSITION SYSTEM AND METHOD USING SAMEMarch 2023September 2025Abandon3010NoNo
18174318SEMICONDUCTOR REACTION CHAMBER AND SEMICONDUCTOR PROCESSING APPARATUSFebruary 2023August 2025Allow3040YesNo
18161888SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODJanuary 2023October 2025Allow3211YesNo
17887101SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODAugust 2022January 2025Abandon2930NoNo
17799406STRUCTURE MANUFACTURING METHOD AND STRUCTURE MANUFACTURING APPARATUSAugust 2022October 2025Abandon3921NoNo
17811121WORKPIECE PLACEMENT APPARATUS AND PROCESSING APPARATUSJuly 2022November 2023Allow1620NoNo
17851638SYSTEM FOR UNIFORM TEMPERATURE CONTROL OF CLUSTER PLATFORMSJune 2022March 2025Abandon3301NoNo
17837241APPARATUS FOR TREATING SUBSTRATEJune 2022June 2025Allow3620NoNo
17741787ETCHING DEVICE AND ETCHING METHODMay 2022October 2024Abandon2921NoNo
17707316ETCHING METHOD AND ETCHING PROCESSING APPARATUSMarch 2022October 2025Abandon4321YesNo
17656315SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODMarch 2022April 2025Allow3731YesNo
17654640SUBSTRATE PROCESSING DEVICE AND ETCHING LIQUIDMarch 2022September 2024Allow3021YesNo
17653252Radiation of Substrates During Processing and Systems ThereofMarch 2022November 2025Abandon4441NoNo
17629362CERAMIC AIR INLET RADIO FREQUENCY CONNECTION TYPE CLEANING DEVICEJanuary 2022October 2025Allow4520YesNo
17562986PRESSURE ADJUSTMENT APPARATUS FOR CONTROLLING PRESSURE IN CHAMBER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAMEDecember 2021September 2025Allow4430NoNo
17554972CHUCK PIN ASSEMBLY, AND SUBSTRATE HOLDING APPARATUS AND LIQUID PROCESSING APPARATUS INCLUDING SAMEDecember 2021June 2025Allow4231NoNo
17456998ETCHING APPARATUS AND ETCHING METHODNovember 2021November 2024Abandon3621NoNo
17533507PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAMENovember 2021March 2026Abandon5141NoNo
17522660PROCESSING APPARATUS AND PROCESSING METHODNovember 2021September 2025Allow4631YesNo
17519785SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSNovember 2021March 2025Abandon4030YesNo
17513991SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODOctober 2021January 2025Abandon3931NoNo
17513986SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODOctober 2021December 2025Allow5041YesNo
17441850SEMICONDUCTOR DEPOSITION METHOD AND SEMICONDUCTOR DEPOSITION SYSTEMSeptember 2021April 2025Abandon4320NoNo
17465440ETCHING METHODSeptember 2021March 2025Abandon4241YesNo
17464007SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICESeptember 2021March 2024Allow3010YesNo
17446477SUBSTRATE PROCESSING SYSTEM AND STATE MONITORING METHODAugust 2021November 2025Allow5151NoNo
17433777LARGE AREA METROLOGY AND PROCESS CONTROL FOR ANISOTROPIC CHEMICAL ETCHINGAugust 2021November 2024Abandon3911NoNo
17393737ACTIVE WORKPIECE HEATING OR COOLING FOR AN ION IMPLANTATION SYSTEMAugust 2021December 2023Abandon2920NoNo
17386645PLASMA PROCESSING APPARATUSJuly 2021May 2023Allow2110YesNo
17443286SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSJuly 2021December 2023Allow2911YesNo
17424449SHOWERHEAD WITH CONFIGURABLE GAS OUTLETSJuly 2021February 2026Abandon5540NoNo
17377666SUPPORTING DEVICE AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING A SUPPORTING DEVICEJuly 2021October 2025Allow5170YesNo
17376446SUBSTRATE PROCESSING APPARATUS AND FURNACE OPENING CLOSERJuly 2021November 2024Allow4020YesNo
17367975SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSJuly 2021November 2025Allow5250YesNo
17366761SEMICONDUCTOR PROCESSING CHAMBER ADAPTERJuly 2021November 2025Allow5240YesNo
17361572PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODJune 2021February 2025Allow4431YesNo
17346410SUBSTRATE TREATING EQUIPMENTJune 2021March 2025Abandon4540NoNo
17413939SEMICONDUCTOR WAFER PHOTOELECTROCHEMICAL MECHANICAL POLISHING PROCESSING DEVICE AND PROCESSING METHODJune 2021September 2025Abandon5141NoNo
17326821SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODMay 2021March 2024Allow3321YesNo
17318019SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODMay 2021December 2023Allow3111YesNo
17315478HYDROGEN FLUORIDE VAPOR PHASE CORROSION APPARATUS AND METHODMay 2021May 2024Abandon3620NoNo
17243596ETCHING APPARATUS AND ETCHING METHODApril 2021February 2026Abandon5842YesNo
17241504SUBSTRATE PROCESSING APPARATUSApril 2021November 2024Allow4220YesNo
17223141SUBSTRATE PROCESSING APPARATUSApril 2021March 2023Allow2310YesNo
17219360PROCESS CHAMBER FOR CYCLIC AND SELECTIVE MATERIAL REMOVAL AND ETCHINGMarch 2021March 2023Allow2410YesNo
17213065SUBSTRATE PROCESSING APPARATUSMarch 2021May 2024Abandon3740YesNo
17204832SUBSTRATE POLISHING SIMULTANEOUSLY OVER MULTIPLE MINI PLATENSMarch 2021November 2023Abandon3220YesNo
17189858HOLDING METHOD OF EDGE RING, PLASMA PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEMMarch 2021January 2024Allow3421YesNo
17182535SUBSTRATE TREATING APPARATUSFebruary 2021September 2025Allow5440YesNo
17181571EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGSFebruary 2021February 2024Allow3620YesNo
17180394SUBSTRATE PROCESSING APPARATUS AND METHOD FOR FABRICATING CATALYST PROCESSING MEMBERFebruary 2021December 2022Abandon2211NoNo
17163248Method and Apparatus for Anisotropic Pattern Etching and TreatmentJanuary 2021September 2024Allow4440YesNo
17141670SUBSTRATE PROCESSING APPARATUSJanuary 2021November 2023Allow3411YesNo
17138427METHOD FOR LIFTING SUBSTRATE AND APPARATUS FOR TREATING SUBSTRATEDecember 2020May 2024Abandon4040YesNo
17110817GAS INJECTOR FOR SEMICONDUCTOR MANUFACTURING CHAMBERDecember 2020October 2023Abandon3420NoNo
17095954SUBSTRATE PROCESSING APPARATUSNovember 2020December 2022Allow2510NoNo
17084903APPARATUS AND METHOD FOR TREATING SUBSTRATEOctober 2020August 2023Abandon3420NoNo
17079439SUBSTRATE TREATMENT APPARATUSOctober 2020November 2023Abandon3620NoNo
17076315HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMSOctober 2020May 2025Allow5561YesNo
17027460EDGE RING, SUBSTRATE PROCESSING APPARATUS HAVING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE APPARATUSSeptember 2020July 2025Allow5740YesNo
16980995SUBSTRATE HOLDING APPARATUS AND METHOD OF MANUFACTURING A DRIVE RINGSeptember 2020October 2025Abandon6041YesYes
17016881SUBSTRATE PROCESSING APPARATUSSeptember 2020September 2022Allow2400YesNo
17013325PLASMA PROCESSING APPARATUSSeptember 2020September 2022Allow2420NoNo
16999836APPARATUS AND METHOD FOR TREATING SUBSTRATEAugust 2020August 2023Allow3530NoNo
16991168GAS FLOW CONTROL DURING SEMICONDUCTOR FABRICATIONAugust 2020September 2025Abandon6081YesNo
16930867SEMICONDUCTOR VAPOR ETCHING DEVICE WITH INTERMEDIATE CHAMBERJuly 2020November 2025Abandon6071YesNo
16924513SUBSTRATE SUPPORTING DEVICE AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAMEJuly 2020May 2024Abandon4640NoNo
16909228STAGE, SUBSTRATE PROCESSING APPARATUS AND STAGE ASSEMBLING METHODJune 2020March 2023Abandon3320YesNo
16871588HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMSMay 2020April 2025Allow5961YesNo
16761642OPTICAL ELEMENTS HOLDER DEVICE FOR A COATING STATIONMay 2020March 2023Allow3451YesNo
16851012HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMSApril 2020January 2026Allow6071YesNo
16842087SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE TRANSFER APPARATUS AND METHODApril 2020March 2023Allow3521YesNo
16835104PLASMA FOCUS RING OF SEMICONDUCTOR ETCHING APPARATUS AND MANUFACTURING METHOD THEREOFMarch 2020April 2022Abandon2531NoNo
16641456Inner Wall and substrate Processing ApparatusFebruary 2020March 2024Allow4940YesNo
16638688LINER, REACTION CHAMBER AND SEMICONDUCTOR PROCESSING EQUIPMENTFebruary 2020August 2024Allow5450YesNo
16722438WETTING PROCESSING APPARATUS AND OPERATION METHOD THEREOFDecember 2019August 2023Allow4421YesNo
16682338FOCUS RING HEIGHT ADJUSTING DEVICE AND WAFER ETCHING APPARATUS INCLUDING THE SAMENovember 2019April 2022Abandon2910NoNo
16666717SUBSTRATE PROCESSING APPARATUSOctober 2019December 2022Allow3820YesNo
16660736CONTAINER FOR STORING SLURRY HAVING FUMED SILICA PARTICLES AND CMP APPARATUS HAVING THE SAMEOctober 2019July 2023Abandon4540NoNo
16528757Substrate Processing Apparatus and Substrate Processing MethodAugust 2019March 2023Allow4321NoNo
16515938CMP System and Method of UseJuly 2019March 2021Allow2011NoNo
16457416WET BENCH AND CHEMICAL TREATMENT METHOD USING THE SAMEJune 2019August 2022Allow3841YesNo
16454289WAFER CUTTING DEVICE AND METHODJune 2019February 2022Abandon3231NoNo
16452364CONTINUOUS ANALYTE SENSORS AND METHODS OF MAKING SAMEJune 2019July 2022Abandon3740YesNo
16469171ETCHING DEVICEJune 2019September 2020Abandon1610NoNo
16423745APPARATUS AND METHOD FOR PROCESSING SUBSTRATEMay 2019March 2024Abandon5741NoNo
16418142CHEMICAL VAPOR DEPOSITION APPARATUS AND METHOD OF FORMING FILMMay 2019April 2024Abandon5951NoNo
16406921ELECTROSTATIC CHUCK FOR HIGH BIAS RADIO FREQUENCY (RF) POWER APPLICATION IN A PLASMA PROCESSING CHAMBERMay 2019January 2025Allow6061YesNo
16401871PROTECTION OF ALUMINUM PROCESS CHAMBER COMPONENTSMay 2019August 2023Allow5151YesNo
16400090PRECISION DYNAMIC LEVELING MECHANISM WITH LONG MOTION CAPABILITYMay 2019October 2022Allow4130YesNo
16400323WAFFER PEDESTAL WITH HEATING MECHANISM AND REACTION CHAMBER INCLUDING THE SAMEMay 2019December 2022Abandon4431NoNo
16396438System and Method for Performing Spin Dry EtchingApril 2019August 2023Allow5260YesNo
16394655SUBSTRATE PROCESSING APPARATUS AND PROGRAM FOR SUBSTRATE PROCESSING APPARATUSApril 2019January 2022Abandon3311NoNo
16394320SUBSTRATE PROCESSING APPARATUSApril 2019October 2021Allow3011NoNo
16391262SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITORApril 2019March 2024Allow5961YesNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner KLUNK, MARGARET D.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
14
Examiner Affirmed
11
(78.6%)
Examiner Reversed
3
(21.4%)
Reversal Percentile
34.4%
Lower than average

What This Means

With a 21.4% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.

Strategic Value of Filing an Appeal

Total Appeal Filings
40
Allowed After Appeal Filing
9
(22.5%)
Not Allowed After Appeal Filing
31
(77.5%)
Filing Benefit Percentile
30.3%
Lower than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 22.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.

Strategic Recommendations

Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.

Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.

Examiner KLUNK, MARGARET D - Prosecution Strategy Guide

Executive Summary

Examiner KLUNK, MARGARET D works in Art Unit 1716 and has examined 434 patent applications in our dataset. With an allowance rate of 43.1%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 43 months.

Allowance Patterns

Examiner KLUNK, MARGARET D's allowance rate of 43.1% places them in the 8% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.

Office Action Patterns

On average, applications examined by KLUNK, MARGARET D receive 3.15 office actions before reaching final disposition. This places the examiner in the 89% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by KLUNK, MARGARET D is 43 months. This places the examiner in the 16% percentile for prosecution speed. Applications take longer to reach final disposition with this examiner compared to most others.

Interview Effectiveness

Conducting an examiner interview provides a +32.4% benefit to allowance rate for applications examined by KLUNK, MARGARET D. This interview benefit is in the 80% percentile among all examiners. Recommendation: Interviews are highly effective with this examiner and should be strongly considered as a prosecution strategy. Per MPEP § 713.10, interviews are available at any time before the Notice of Allowance is mailed or jurisdiction transfers to the PTAB.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 12.3% of applications are subsequently allowed. This success rate is in the 7% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 19.3% of cases where such amendments are filed. This entry rate is in the 23% percentile among all examiners. Strategic Recommendation: This examiner rarely enters after-final amendments compared to other examiners. You should generally plan to file an RCE or appeal rather than relying on after-final amendment entry. Per MPEP § 714.12, primary examiners have discretion in entering after-final amendments, and this examiner exercises that discretion conservatively.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 40.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 36% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 57.6% of appeals filed. This is in the 31% percentile among all examiners. Of these withdrawals, 26.3% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.

Petition Practice

When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 46% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 4% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 4% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • Prepare for rigorous examination: With a below-average allowance rate, ensure your application has strong written description and enablement support. Consider filing a continuation if you need to add new matter.
  • Expect multiple rounds of prosecution: This examiner issues more office actions than average. Address potential issues proactively in your initial response and consider requesting an interview early in prosecution.
  • Prioritize examiner interviews: Interviews are highly effective with this examiner. Request an interview after the first office action to clarify issues and potentially expedite allowance.
  • Plan for RCE after final rejection: This examiner rarely enters after-final amendments. Budget for an RCE in your prosecution strategy if you receive a final rejection.
  • Plan for extended prosecution: Applications take longer than average with this examiner. Factor this into your continuation strategy and client communications.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.