USPTO Examiner CHAN LAUREEN - Art Unit 1716

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18647944SEMICONDUCTOR DEVICE FABRICATION APPARATUSApril 2024August 2024Allow300YesNo
18527999SUBSTRATE PROCESSING APPARATUSDecember 2023May 2024Allow510YesNo
18382062PLASMA PROCESSING APPARATUSOctober 2023July 2025Abandon2020YesNo
18373932GAS CONVEYING ASSEMBLY AND GAS-PHASE REACTION DEVICESeptember 2023July 2025Allow2220NoNo
18129735MICROWAVE PROVIDING APPARATUS, SYSTEM INCLUDING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEMarch 2023October 2025Allow3011NoNo
18116840BATCH TYPE SUBSTRATE PROCESSING APPARATUSMarch 2023January 2026Allow3410NoNo
18175104LOW TEMPERATURE CHUCK FOR PLASMA PROCESSING SYSTEMSFebruary 2023February 2024Allow1110NoNo
18162182SENSOR MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAMEJanuary 2023January 2026Allow3611YesNo
17949925PLASMA PROCESSING APPARATUSSeptember 2022July 2023Allow1000YesNo
17790716SUBSTRATE RECEIVING AREA FOR PROCESS CHAMBERSJuly 2022December 2025Allow4110YesNo
17846104APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATEJune 2022August 2025Abandon3820NoNo
17846734PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUSJune 2022January 2026Abandon4321NoNo
17844721PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODJune 2022October 2025Allow4021YesNo
17832683ETCHING METHOD AND ETCHING APPARATUSJune 2022March 2026Abandon4520YesNo
17746958SUBSTRATE SUPPORT, PLASMA PROCESSING APPARATUS, AND PLASMA PROCESSING METHODMay 2022January 2026Abandon4422YesNo
17775725CARRIER RING TO PEDESTAL KINEMATIC MOUNT FOR SUBSTRATE PROCESSING TOOLSMay 2022August 2025Abandon3920YesYes
17723722REMOTE SURFACE WAVE PROPAGATION FOR SEMICONDUCTOR CHAMBERSApril 2022February 2026Allow4611YesNo
17640017RPCVD Apparatus and Methods for Forming a FilmMarch 2022June 2025Allow3911YesNo
17679900SUPPORT UNIT, AND APPARATUS FOR TREATING SUBSTRATE WITH THE SAMEFebruary 2022July 2024Allow2810NoNo
17586484ION BEAM ETCHING CHAMBER WITH ETCHING BY-PRODUCT REDISTRIBUTORJanuary 2022March 2025Allow3831YesNo
17584781PLASMA PROCESSING APPARATUSJanuary 2022October 2024Allow3310YesNo
17560285PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODDecember 2021December 2025Abandon4821NoNo
17596928APPARATUS FOR PHOTORESIST DRY DEPOSITIONDecember 2021April 2025Abandon4030NoNo
17456967Growth Monitor System and Methods for Film DepositionNovember 2021October 2023Allow2211YesNo
17455333WAFER SUPPORT, WAFER PROCESSING DEVICE AND WAFER PROCESSING METHODNovember 2021October 2024Abandon3420NoNo
17521777PLASMA PROCESSING APPARATUS AND METHOD OF ADJUSTING THE SAMENovember 2021November 2025Allow4820YesNo
17594968FILTER BOX FOR A SUBSTRATE PROCESSING SYSTEMNovember 2021March 2025Allow4010YesNo
17519451PLASMA CHAMBER WITH MULTIPHASE ROTATING INDEPENDENT GAS CROSS-FLOW WITH REDUCED VOLUME AND DUAL VHFNovember 2021June 2025Allow4320NoNo
17517068GAS SUPPLY BLOCK AND SUBSTRATE-PROCESSING APPARATUS INCLUDING THE SAMENovember 2021November 2024Allow3710YesNo
17508862DETACHING AND INSTALLING DEVICE FOR GAS DISTRIBUTION PLATE OF ETCHING MACHINE, AND ETCHING MACHINEOctober 2021November 2024Allow3710YesNo
17495908PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUSOctober 2021September 2025Allow4830YesNo
17600243PROCESS SYSTEM WITH VARIABLE FLOW VALVESeptember 2021October 2025Abandon4840YesNo
17476079VACUUM PROCESSING DEVICESeptember 2021August 2024Allow3510NoNo
17402398PLASMA PROCESSING APPARATUSAugust 2021June 2023Allow2210YesNo
17395860SUBSTRATE TREATING APPARATUS AND SUBSTRATE SUPPORT UNITAugust 2021October 2024Allow3911YesNo
17386663STAGE AND PLASMA PROCESSING APPARATUSJuly 2021March 2025Allow4330YesNo
17370766WAFER PROCESSING APPARATUSJuly 2021April 2024Allow3320YesNo
17356997SUBSTRATE PROCESSING APPARATUSJune 2021May 2025Allow4731YesNo
17352165METHOD AND APPARATUS TO REDUCE FEATURE CHARGING IN PLASMA PROCESSING CHAMBERJune 2021December 2023Abandon3010NoNo
17320353PLASMA PROCESSING APPARATUSMay 2021March 2024Allow3410YesNo
17319013AUTOMATIC ELECTROSTATIC CHUCK BIAS COMPENSATION DURING PLASMA PROCESSINGMay 2021December 2023Allow3110YesNo
17236165SUBSTRATE SUPPORT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHODApril 2021May 2024Abandon3621NoNo
17283048LOWER PLASMA EXCLUSION ZONE RING FOR BEVEL ETCHERApril 2021April 2025Allow4830YesNo
17282014PLASMA ENHANCED ATOMIC LAYER DEPOSITION (PEALD) APPARATUSApril 2021October 2024Abandon4233NoNo
17207777ELECTROSTATIC CHUCK FOR A PLASMA PROCESSING APPARATUSMarch 2021December 2023Abandon3321NoNo
17205815Substrate Processing Apparatus and Reaction TubeMarch 2021March 2024Abandon3610NoNo
17274350ATOMIC LAYER TREATMENT PROCESS USING METASTABLE ACTIVATED RADICAL SPECIESMarch 2021July 2025Allow5241YesNo
17184792SUBSTRATE PROCESSING APPARATUSFebruary 2021June 2023Allow2810NoNo
17165594PLASMA PROCESSING APPARATUS AND SEMICONDUCTOR FABRICATION METHOD USING THE SAMEFebruary 2021April 2025Allow5031YesNo
17160414PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODJanuary 2021February 2025Allow4920YesNo
17155586SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODJanuary 2021October 2025Allow5731YesNo
17148963SUBSTRATE HOLDING MECHANISM AND SUBSTRATE PROCESSING APPARATUSJanuary 2021January 2023Allow2410YesNo
17129868STAGE AND SUBSTRATE PROCESSING APPARATUSDecember 2020March 2023Allow2721YesNo
17122169PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODDecember 2020December 2024Abandon4840YesNo
17113392SUSCEPTOR HAVING COOLING DEVICEDecember 2020February 2024Allow3820YesNo
17107678MOUNTING TABLE AND PLASMA PROCESSING APPARATUSNovember 2020December 2024Allow4930YesNo
17107029METHOD AND APPARATUS OF ACHIEVING HIGH INPUT IMPEDANCE WITHOUT USING FERRITE MATERIALS FOR RF FILTER APPLICATIONS IN PLASMANovember 2020November 2023Abandon3610YesNo
17056558ELECTROSTATIC CHUCKNovember 2020December 2024Abandon4830YesNo
17085591PLACING TABLE AND PLASMA PROCESSING APPARATUSOctober 2020April 2023Allow3010YesNo
17078542BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGEOctober 2020March 2024Allow4120NoNo
15733766EDGE EXCLUSION CONTROLOctober 2020August 2025Allow5831YesNo
15733687ELECTROSTATIC CHUCK WITH SEAL SURFACESeptember 2020July 2024Allow4530YesNo
17027311Substrate Processing ApparatusSeptember 2020February 2023Allow2941YesNo
17014195SEMICONDUCTOR PROCESSING CHAMBERS FOR DEPOSITION AND ETCHSeptember 2020February 2023Allow2910YesNo
17014177SEMICONDUCTOR PROCESSING CHAMBERS FOR DEPOSITION AND ETCHSeptember 2020September 2023Allow3620NoNo
16978134PLASMA PROCESSING APPARATUS, PLASMA STATE DETECTION METHOD, AND PLASMA STATE DETECTION PROGRAMSeptember 2020November 2023Allow3810YesNo
16999648EDGE RING, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF EDGE RINGAugust 2020September 2023Allow3730YesNo
16986444SUBSTRATE SUPPORT UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAMEAugust 2020April 2023Allow3230YesNo
16986438CHAMBER CONFIGURATIONS FOR CONTROLLED DEPOSITIONAugust 2020January 2024Abandon4121YesNo
16945842System and method for in-situ plasma modificationAugust 2020December 2023Allow4021NoNo
16966833ELECTROSTATIC CHUCK (ESC) PEDESTAL VOLTAGE ISOLATIONJuly 2020January 2024Allow4120YesNo
16941976EDGE RING, SUBSTRATE SUPPORT, SUBSTRATE PROCESSING APPARATUS AND METHODJuly 2020January 2024Allow4231YesNo
16940354Coating Apparatus and Coating MethodJuly 2020March 2023Allow3111YesNo
16940339Coating Apparatus and Coating MethodJuly 2020November 2024Abandon5241YesNo
16924519WAFER SUPPORT UNIT AND WAFER TREATMENT SYSTEM INCLUDING THE SAMEJuly 2020August 2023Abandon3740NoNo
16770674FILM FORMING APPARATUSJune 2020December 2022Abandon3030NoNo
16767480PROCESSING APPARATUSMay 2020November 2023Abandon4240YesNo
16865493ELECTROSTATIC CHUCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAMEMay 2020April 2022Allow2310YesNo
16851550Extreme Edge Uniformity ControlApril 2020November 2022Allow3120YesNo
16825466SUBSTRATE SUPPORT ASSEMBLY WITH ARC RESISTANT COOLANT CONDUITMarch 2020January 2023Allow3420YesNo
16649611ELECTROSTATIC CHUCK DEVICEMarch 2020February 2023Allow3530YesNo
16642542Mounting Stage, Substrate Processing Device, and Edge RingFebruary 2020August 2022Allow3020YesNo
16799069WAFER MOUNTING TABLE AND METHOD OF MANUFACTURING THE SAMEFebruary 2020March 2022Allow2511YesNo
16639449ELECTROSTATIC CHUCK FOR DAMAGE-FREE SUBSTRATE PROCESSINGFebruary 2020November 2021Abandon2210YesNo
16786400APPARATUS AND METHOD FOR ETCHINGFebruary 2020February 2023Abandon3641YesNo
16750317OPENING AND SHUTTING DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAMEJanuary 2020March 2022Abandon2610NoNo
16630793ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUSJanuary 2020June 2022Abandon2920YesNo
16730861PLASMA PROCESSING APPARATUSDecember 2019May 2022Allow2830NoNo
16728121MOUNTING TABLE, SUBSTRATE PROCESSING APPARATUS, AND CONTROL METHODDecember 2019October 2022Allow3411YesNo
16624492PLACING TABLE STRUCTURE AND TREATMENT DEVICEDecember 2019August 2022Abandon3230NoNo
16720785ELECTROSTATIC-CHUCK HEATERDecember 2019January 2023Allow3720YesNo
16699289PLASMA PROCESSING APPARATUS AND ETCHING METHODNovember 2019September 2022Allow3421YesNo
16686425ELECTROSTATIC CHUCK AND PLASMA PROCESSING DEVICE HAVING THE SAMENovember 2019January 2022Abandon2610NoNo
16683707CAPACITIVELY-COUPLED PLASMA SUBSTRATE PROCESSING APPARATUS INCLUDING A FOCUS RING AND A SUBSTRATE PROCESSING METHOD USING THE SAMENovember 2019May 2022Allow3020YesNo
16679323SEMICONDUCTOR PROCESSING CHAMBERNovember 2019February 2022Abandon2710NoNo
16673612SELECTIVE ION FILTERING IN A MULTIPURPOSE CHAMBERNovember 2019November 2022Abandon3630NoNo
16670573SUBSTRATE PROCESSING APPARATUSOctober 2019May 2022Abandon3120YesNo
16656987SEMICONDUCTOR CLEANING APPARATUS AND METHODOctober 2019February 2025Allow6081YesNo
16600554SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING THEREOFOctober 2019January 2022Abandon2731YesNo
16591460HYRODGEN PARTIAL PRESSURE CONTROL IN A VACUUM PROCESS CHAMBEROctober 2019September 2022Abandon3631YesNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CHAN, LAUREEN.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
3
Examiner Affirmed
2
(66.7%)
Examiner Reversed
1
(33.3%)
Reversal Percentile
49.6%
Lower than average

What This Means

With a 33.3% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.

Strategic Value of Filing an Appeal

Total Appeal Filings
5
Allowed After Appeal Filing
1
(20.0%)
Not Allowed After Appeal Filing
4
(80.0%)
Filing Benefit Percentile
24.5%
Lower than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 20.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.

Strategic Recommendations

Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.

Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.

Examiner CHAN, LAUREEN - Prosecution Strategy Guide

Executive Summary

Examiner CHAN, LAUREEN works in Art Unit 1716 and has examined 218 patent applications in our dataset. With an allowance rate of 57.3%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 40 months.

Allowance Patterns

Examiner CHAN, LAUREEN's allowance rate of 57.3% places them in the 18% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.

Office Action Patterns

On average, applications examined by CHAN, LAUREEN receive 2.63 office actions before reaching final disposition. This places the examiner in the 77% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by CHAN, LAUREEN is 40 months. This places the examiner in the 23% percentile for prosecution speed. Applications take longer to reach final disposition with this examiner compared to most others.

Interview Effectiveness

Conducting an examiner interview provides a +63.0% benefit to allowance rate for applications examined by CHAN, LAUREEN. This interview benefit is in the 97% percentile among all examiners. Recommendation: Interviews are highly effective with this examiner and should be strongly considered as a prosecution strategy. Per MPEP § 713.10, interviews are available at any time before the Notice of Allowance is mailed or jurisdiction transfers to the PTAB.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 25.2% of applications are subsequently allowed. This success rate is in the 39% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 11.0% of cases where such amendments are filed. This entry rate is in the 11% percentile among all examiners. Strategic Recommendation: This examiner rarely enters after-final amendments compared to other examiners. You should generally plan to file an RCE or appeal rather than relying on after-final amendment entry. Per MPEP § 714.12, primary examiners have discretion in entering after-final amendments, and this examiner exercises that discretion conservatively.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 0.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 2% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 40.0% of appeals filed. This is in the 7% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.

Petition Practice

When applicants file petitions regarding this examiner's actions, 77.8% are granted (fully or in part). This grant rate is in the 83% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 4% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 4% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • Prepare for rigorous examination: With a below-average allowance rate, ensure your application has strong written description and enablement support. Consider filing a continuation if you need to add new matter.
  • Expect multiple rounds of prosecution: This examiner issues more office actions than average. Address potential issues proactively in your initial response and consider requesting an interview early in prosecution.
  • Prioritize examiner interviews: Interviews are highly effective with this examiner. Request an interview after the first office action to clarify issues and potentially expedite allowance.
  • Plan for RCE after final rejection: This examiner rarely enters after-final amendments. Budget for an RCE in your prosecution strategy if you receive a final rejection.
  • Plan for extended prosecution: Applications take longer than average with this examiner. Factor this into your continuation strategy and client communications.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.