Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18647944 | SEMICONDUCTOR DEVICE FABRICATION APPARATUS | April 2024 | August 2024 | Allow | 3 | 0 | 0 | Yes | No |
| 18527999 | SUBSTRATE PROCESSING APPARATUS | December 2023 | May 2024 | Allow | 5 | 1 | 0 | Yes | No |
| 18382062 | PLASMA PROCESSING APPARATUS | October 2023 | July 2025 | Abandon | 20 | 2 | 0 | Yes | No |
| 18373932 | GAS CONVEYING ASSEMBLY AND GAS-PHASE REACTION DEVICE | September 2023 | July 2025 | Allow | 22 | 2 | 0 | No | No |
| 18129735 | MICROWAVE PROVIDING APPARATUS, SYSTEM INCLUDING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | March 2023 | October 2025 | Allow | 30 | 1 | 1 | No | No |
| 18116840 | BATCH TYPE SUBSTRATE PROCESSING APPARATUS | March 2023 | January 2026 | Allow | 34 | 1 | 0 | No | No |
| 18175104 | LOW TEMPERATURE CHUCK FOR PLASMA PROCESSING SYSTEMS | February 2023 | February 2024 | Allow | 11 | 1 | 0 | No | No |
| 18162182 | SENSOR MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME | January 2023 | January 2026 | Allow | 36 | 1 | 1 | Yes | No |
| 17949925 | PLASMA PROCESSING APPARATUS | September 2022 | July 2023 | Allow | 10 | 0 | 0 | Yes | No |
| 17790716 | SUBSTRATE RECEIVING AREA FOR PROCESS CHAMBERS | July 2022 | December 2025 | Allow | 41 | 1 | 0 | Yes | No |
| 17846104 | APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE | June 2022 | August 2025 | Abandon | 38 | 2 | 0 | No | No |
| 17846734 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | June 2022 | January 2026 | Abandon | 43 | 2 | 1 | No | No |
| 17844721 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | June 2022 | October 2025 | Allow | 40 | 2 | 1 | Yes | No |
| 17832683 | ETCHING METHOD AND ETCHING APPARATUS | June 2022 | March 2026 | Abandon | 45 | 2 | 0 | Yes | No |
| 17746958 | SUBSTRATE SUPPORT, PLASMA PROCESSING APPARATUS, AND PLASMA PROCESSING METHOD | May 2022 | January 2026 | Abandon | 44 | 2 | 2 | Yes | No |
| 17775725 | CARRIER RING TO PEDESTAL KINEMATIC MOUNT FOR SUBSTRATE PROCESSING TOOLS | May 2022 | August 2025 | Abandon | 39 | 2 | 0 | Yes | Yes |
| 17723722 | REMOTE SURFACE WAVE PROPAGATION FOR SEMICONDUCTOR CHAMBERS | April 2022 | February 2026 | Allow | 46 | 1 | 1 | Yes | No |
| 17640017 | RPCVD Apparatus and Methods for Forming a Film | March 2022 | June 2025 | Allow | 39 | 1 | 1 | Yes | No |
| 17679900 | SUPPORT UNIT, AND APPARATUS FOR TREATING SUBSTRATE WITH THE SAME | February 2022 | July 2024 | Allow | 28 | 1 | 0 | No | No |
| 17586484 | ION BEAM ETCHING CHAMBER WITH ETCHING BY-PRODUCT REDISTRIBUTOR | January 2022 | March 2025 | Allow | 38 | 3 | 1 | Yes | No |
| 17584781 | PLASMA PROCESSING APPARATUS | January 2022 | October 2024 | Allow | 33 | 1 | 0 | Yes | No |
| 17560285 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | December 2021 | December 2025 | Abandon | 48 | 2 | 1 | No | No |
| 17596928 | APPARATUS FOR PHOTORESIST DRY DEPOSITION | December 2021 | April 2025 | Abandon | 40 | 3 | 0 | No | No |
| 17456967 | Growth Monitor System and Methods for Film Deposition | November 2021 | October 2023 | Allow | 22 | 1 | 1 | Yes | No |
| 17455333 | WAFER SUPPORT, WAFER PROCESSING DEVICE AND WAFER PROCESSING METHOD | November 2021 | October 2024 | Abandon | 34 | 2 | 0 | No | No |
| 17521777 | PLASMA PROCESSING APPARATUS AND METHOD OF ADJUSTING THE SAME | November 2021 | November 2025 | Allow | 48 | 2 | 0 | Yes | No |
| 17594968 | FILTER BOX FOR A SUBSTRATE PROCESSING SYSTEM | November 2021 | March 2025 | Allow | 40 | 1 | 0 | Yes | No |
| 17519451 | PLASMA CHAMBER WITH MULTIPHASE ROTATING INDEPENDENT GAS CROSS-FLOW WITH REDUCED VOLUME AND DUAL VHF | November 2021 | June 2025 | Allow | 43 | 2 | 0 | No | No |
| 17517068 | GAS SUPPLY BLOCK AND SUBSTRATE-PROCESSING APPARATUS INCLUDING THE SAME | November 2021 | November 2024 | Allow | 37 | 1 | 0 | Yes | No |
| 17508862 | DETACHING AND INSTALLING DEVICE FOR GAS DISTRIBUTION PLATE OF ETCHING MACHINE, AND ETCHING MACHINE | October 2021 | November 2024 | Allow | 37 | 1 | 0 | Yes | No |
| 17495908 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | October 2021 | September 2025 | Allow | 48 | 3 | 0 | Yes | No |
| 17600243 | PROCESS SYSTEM WITH VARIABLE FLOW VALVE | September 2021 | October 2025 | Abandon | 48 | 4 | 0 | Yes | No |
| 17476079 | VACUUM PROCESSING DEVICE | September 2021 | August 2024 | Allow | 35 | 1 | 0 | No | No |
| 17402398 | PLASMA PROCESSING APPARATUS | August 2021 | June 2023 | Allow | 22 | 1 | 0 | Yes | No |
| 17395860 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE SUPPORT UNIT | August 2021 | October 2024 | Allow | 39 | 1 | 1 | Yes | No |
| 17386663 | STAGE AND PLASMA PROCESSING APPARATUS | July 2021 | March 2025 | Allow | 43 | 3 | 0 | Yes | No |
| 17370766 | WAFER PROCESSING APPARATUS | July 2021 | April 2024 | Allow | 33 | 2 | 0 | Yes | No |
| 17356997 | SUBSTRATE PROCESSING APPARATUS | June 2021 | May 2025 | Allow | 47 | 3 | 1 | Yes | No |
| 17352165 | METHOD AND APPARATUS TO REDUCE FEATURE CHARGING IN PLASMA PROCESSING CHAMBER | June 2021 | December 2023 | Abandon | 30 | 1 | 0 | No | No |
| 17320353 | PLASMA PROCESSING APPARATUS | May 2021 | March 2024 | Allow | 34 | 1 | 0 | Yes | No |
| 17319013 | AUTOMATIC ELECTROSTATIC CHUCK BIAS COMPENSATION DURING PLASMA PROCESSING | May 2021 | December 2023 | Allow | 31 | 1 | 0 | Yes | No |
| 17236165 | SUBSTRATE SUPPORT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD | April 2021 | May 2024 | Abandon | 36 | 2 | 1 | No | No |
| 17283048 | LOWER PLASMA EXCLUSION ZONE RING FOR BEVEL ETCHER | April 2021 | April 2025 | Allow | 48 | 3 | 0 | Yes | No |
| 17282014 | PLASMA ENHANCED ATOMIC LAYER DEPOSITION (PEALD) APPARATUS | April 2021 | October 2024 | Abandon | 42 | 3 | 3 | No | No |
| 17207777 | ELECTROSTATIC CHUCK FOR A PLASMA PROCESSING APPARATUS | March 2021 | December 2023 | Abandon | 33 | 2 | 1 | No | No |
| 17205815 | Substrate Processing Apparatus and Reaction Tube | March 2021 | March 2024 | Abandon | 36 | 1 | 0 | No | No |
| 17274350 | ATOMIC LAYER TREATMENT PROCESS USING METASTABLE ACTIVATED RADICAL SPECIES | March 2021 | July 2025 | Allow | 52 | 4 | 1 | Yes | No |
| 17184792 | SUBSTRATE PROCESSING APPARATUS | February 2021 | June 2023 | Allow | 28 | 1 | 0 | No | No |
| 17165594 | PLASMA PROCESSING APPARATUS AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME | February 2021 | April 2025 | Allow | 50 | 3 | 1 | Yes | No |
| 17160414 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | January 2021 | February 2025 | Allow | 49 | 2 | 0 | Yes | No |
| 17155586 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | January 2021 | October 2025 | Allow | 57 | 3 | 1 | Yes | No |
| 17148963 | SUBSTRATE HOLDING MECHANISM AND SUBSTRATE PROCESSING APPARATUS | January 2021 | January 2023 | Allow | 24 | 1 | 0 | Yes | No |
| 17129868 | STAGE AND SUBSTRATE PROCESSING APPARATUS | December 2020 | March 2023 | Allow | 27 | 2 | 1 | Yes | No |
| 17122169 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | December 2020 | December 2024 | Abandon | 48 | 4 | 0 | Yes | No |
| 17113392 | SUSCEPTOR HAVING COOLING DEVICE | December 2020 | February 2024 | Allow | 38 | 2 | 0 | Yes | No |
| 17107678 | MOUNTING TABLE AND PLASMA PROCESSING APPARATUS | November 2020 | December 2024 | Allow | 49 | 3 | 0 | Yes | No |
| 17107029 | METHOD AND APPARATUS OF ACHIEVING HIGH INPUT IMPEDANCE WITHOUT USING FERRITE MATERIALS FOR RF FILTER APPLICATIONS IN PLASMA | November 2020 | November 2023 | Abandon | 36 | 1 | 0 | Yes | No |
| 17056558 | ELECTROSTATIC CHUCK | November 2020 | December 2024 | Abandon | 48 | 3 | 0 | Yes | No |
| 17085591 | PLACING TABLE AND PLASMA PROCESSING APPARATUS | October 2020 | April 2023 | Allow | 30 | 1 | 0 | Yes | No |
| 17078542 | BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE | October 2020 | March 2024 | Allow | 41 | 2 | 0 | No | No |
| 15733766 | EDGE EXCLUSION CONTROL | October 2020 | August 2025 | Allow | 58 | 3 | 1 | Yes | No |
| 15733687 | ELECTROSTATIC CHUCK WITH SEAL SURFACE | September 2020 | July 2024 | Allow | 45 | 3 | 0 | Yes | No |
| 17027311 | Substrate Processing Apparatus | September 2020 | February 2023 | Allow | 29 | 4 | 1 | Yes | No |
| 17014195 | SEMICONDUCTOR PROCESSING CHAMBERS FOR DEPOSITION AND ETCH | September 2020 | February 2023 | Allow | 29 | 1 | 0 | Yes | No |
| 17014177 | SEMICONDUCTOR PROCESSING CHAMBERS FOR DEPOSITION AND ETCH | September 2020 | September 2023 | Allow | 36 | 2 | 0 | No | No |
| 16978134 | PLASMA PROCESSING APPARATUS, PLASMA STATE DETECTION METHOD, AND PLASMA STATE DETECTION PROGRAM | September 2020 | November 2023 | Allow | 38 | 1 | 0 | Yes | No |
| 16999648 | EDGE RING, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF EDGE RING | August 2020 | September 2023 | Allow | 37 | 3 | 0 | Yes | No |
| 16986444 | SUBSTRATE SUPPORT UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | August 2020 | April 2023 | Allow | 32 | 3 | 0 | Yes | No |
| 16986438 | CHAMBER CONFIGURATIONS FOR CONTROLLED DEPOSITION | August 2020 | January 2024 | Abandon | 41 | 2 | 1 | Yes | No |
| 16945842 | System and method for in-situ plasma modification | August 2020 | December 2023 | Allow | 40 | 2 | 1 | No | No |
| 16966833 | ELECTROSTATIC CHUCK (ESC) PEDESTAL VOLTAGE ISOLATION | July 2020 | January 2024 | Allow | 41 | 2 | 0 | Yes | No |
| 16941976 | EDGE RING, SUBSTRATE SUPPORT, SUBSTRATE PROCESSING APPARATUS AND METHOD | July 2020 | January 2024 | Allow | 42 | 3 | 1 | Yes | No |
| 16940354 | Coating Apparatus and Coating Method | July 2020 | March 2023 | Allow | 31 | 1 | 1 | Yes | No |
| 16940339 | Coating Apparatus and Coating Method | July 2020 | November 2024 | Abandon | 52 | 4 | 1 | Yes | No |
| 16924519 | WAFER SUPPORT UNIT AND WAFER TREATMENT SYSTEM INCLUDING THE SAME | July 2020 | August 2023 | Abandon | 37 | 4 | 0 | No | No |
| 16770674 | FILM FORMING APPARATUS | June 2020 | December 2022 | Abandon | 30 | 3 | 0 | No | No |
| 16767480 | PROCESSING APPARATUS | May 2020 | November 2023 | Abandon | 42 | 4 | 0 | Yes | No |
| 16865493 | ELECTROSTATIC CHUCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | May 2020 | April 2022 | Allow | 23 | 1 | 0 | Yes | No |
| 16851550 | Extreme Edge Uniformity Control | April 2020 | November 2022 | Allow | 31 | 2 | 0 | Yes | No |
| 16825466 | SUBSTRATE SUPPORT ASSEMBLY WITH ARC RESISTANT COOLANT CONDUIT | March 2020 | January 2023 | Allow | 34 | 2 | 0 | Yes | No |
| 16649611 | ELECTROSTATIC CHUCK DEVICE | March 2020 | February 2023 | Allow | 35 | 3 | 0 | Yes | No |
| 16642542 | Mounting Stage, Substrate Processing Device, and Edge Ring | February 2020 | August 2022 | Allow | 30 | 2 | 0 | Yes | No |
| 16799069 | WAFER MOUNTING TABLE AND METHOD OF MANUFACTURING THE SAME | February 2020 | March 2022 | Allow | 25 | 1 | 1 | Yes | No |
| 16639449 | ELECTROSTATIC CHUCK FOR DAMAGE-FREE SUBSTRATE PROCESSING | February 2020 | November 2021 | Abandon | 22 | 1 | 0 | Yes | No |
| 16786400 | APPARATUS AND METHOD FOR ETCHING | February 2020 | February 2023 | Abandon | 36 | 4 | 1 | Yes | No |
| 16750317 | OPENING AND SHUTTING DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | January 2020 | March 2022 | Abandon | 26 | 1 | 0 | No | No |
| 16630793 | ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS | January 2020 | June 2022 | Abandon | 29 | 2 | 0 | Yes | No |
| 16730861 | PLASMA PROCESSING APPARATUS | December 2019 | May 2022 | Allow | 28 | 3 | 0 | No | No |
| 16728121 | MOUNTING TABLE, SUBSTRATE PROCESSING APPARATUS, AND CONTROL METHOD | December 2019 | October 2022 | Allow | 34 | 1 | 1 | Yes | No |
| 16624492 | PLACING TABLE STRUCTURE AND TREATMENT DEVICE | December 2019 | August 2022 | Abandon | 32 | 3 | 0 | No | No |
| 16720785 | ELECTROSTATIC-CHUCK HEATER | December 2019 | January 2023 | Allow | 37 | 2 | 0 | Yes | No |
| 16699289 | PLASMA PROCESSING APPARATUS AND ETCHING METHOD | November 2019 | September 2022 | Allow | 34 | 2 | 1 | Yes | No |
| 16686425 | ELECTROSTATIC CHUCK AND PLASMA PROCESSING DEVICE HAVING THE SAME | November 2019 | January 2022 | Abandon | 26 | 1 | 0 | No | No |
| 16683707 | CAPACITIVELY-COUPLED PLASMA SUBSTRATE PROCESSING APPARATUS INCLUDING A FOCUS RING AND A SUBSTRATE PROCESSING METHOD USING THE SAME | November 2019 | May 2022 | Allow | 30 | 2 | 0 | Yes | No |
| 16679323 | SEMICONDUCTOR PROCESSING CHAMBER | November 2019 | February 2022 | Abandon | 27 | 1 | 0 | No | No |
| 16673612 | SELECTIVE ION FILTERING IN A MULTIPURPOSE CHAMBER | November 2019 | November 2022 | Abandon | 36 | 3 | 0 | No | No |
| 16670573 | SUBSTRATE PROCESSING APPARATUS | October 2019 | May 2022 | Abandon | 31 | 2 | 0 | Yes | No |
| 16656987 | SEMICONDUCTOR CLEANING APPARATUS AND METHOD | October 2019 | February 2025 | Allow | 60 | 8 | 1 | Yes | No |
| 16600554 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING THEREOF | October 2019 | January 2022 | Abandon | 27 | 3 | 1 | Yes | No |
| 16591460 | HYRODGEN PARTIAL PRESSURE CONTROL IN A VACUUM PROCESS CHAMBER | October 2019 | September 2022 | Abandon | 36 | 3 | 1 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CHAN, LAUREEN.
With a 33.3% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 20.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner CHAN, LAUREEN works in Art Unit 1716 and has examined 218 patent applications in our dataset. With an allowance rate of 57.3%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 40 months.
Examiner CHAN, LAUREEN's allowance rate of 57.3% places them in the 18% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.
On average, applications examined by CHAN, LAUREEN receive 2.63 office actions before reaching final disposition. This places the examiner in the 77% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.
The median time to disposition (half-life) for applications examined by CHAN, LAUREEN is 40 months. This places the examiner in the 23% percentile for prosecution speed. Applications take longer to reach final disposition with this examiner compared to most others.
Conducting an examiner interview provides a +63.0% benefit to allowance rate for applications examined by CHAN, LAUREEN. This interview benefit is in the 97% percentile among all examiners. Recommendation: Interviews are highly effective with this examiner and should be strongly considered as a prosecution strategy. Per MPEP § 713.10, interviews are available at any time before the Notice of Allowance is mailed or jurisdiction transfers to the PTAB.
When applicants file an RCE with this examiner, 25.2% of applications are subsequently allowed. This success rate is in the 39% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 11.0% of cases where such amendments are filed. This entry rate is in the 11% percentile among all examiners. Strategic Recommendation: This examiner rarely enters after-final amendments compared to other examiners. You should generally plan to file an RCE or appeal rather than relying on after-final amendment entry. Per MPEP § 714.12, primary examiners have discretion in entering after-final amendments, and this examiner exercises that discretion conservatively.
When applicants request a pre-appeal conference (PAC) with this examiner, 0.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 2% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.
This examiner withdraws rejections or reopens prosecution in 40.0% of appeals filed. This is in the 7% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 77.8% are granted (fully or in part). This grant rate is in the 83% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 4% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 4% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.