USPTO Examiner LUND JEFFRIE ROBERT - Art Unit 1716

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18750473METHOD OF PERFORMING MAINTENANCE ON SUBSTRATE PROCESSING APPARATUSJune 2024February 2025Allow710NoNo
18740411SOLIDS VAPORIZERJune 2024March 2025Allow910NoNo
18630603SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEADApril 2024December 2024Allow820YesNo
18630683SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEADApril 2024November 2024Allow820YesNo
18442865APPARATUS AND ASSOCIATED ACCESSORIES, METHODS AND USES FOR VISUALISING A PRINT ON AN OBJECTFebruary 2024May 2025Allow1510NoNo
18526472SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUMDecember 2023March 2025Allow1600YesNo
18475355ATOMIC LAYER DEPOSITION APPARATUSSeptember 2023November 2023Allow200NoNo
18368285DIFFERENTIAL CAPACITIVE SENSOR FOR IN-SITU FILM THICKNESS AND DIELECTRIC CONSTANT MEASUREMENTSeptember 2023September 2024Allow1200NoNo
18452918SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUSAugust 2023January 2025Allow1710YesNo
18355224METHOD FOR USING SHIELD PLATE IN A CVD REACTORJuly 2023May 2024Allow1000YesNo
18217696SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEADJuly 2023September 2024Allow1410YesNo
18323769PLASMA PROCESSING APPARATUS AND METHODMay 2023June 2025Allow2501NoNo
18115738SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHODFebruary 2023June 2025Allow2801NoNo
18106857SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHODFebruary 2023June 2025Allow2801NoNo
18097559SEQUENTIAL INFILTRATION SYNTHESIS APPARATUSJanuary 2023December 2023Allow1110NoNo
18077607SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEDecember 2022December 2023Allow1210NoNo
18074872APPARATUS AND METHODS TO REDUCE PARTICLES IN A FILM DEPOSITION CHAMBERDecember 2022November 2024Abandon2320NoNo
17921871SHOWERHEAD DESIGNS FOR CONTROLLING DEPOSITION ON WAFER BEVEL/EDGEOctober 2022June 2025Allow3100NoNo
17958282ASYMMETRIC INJECTION FOR BETTER WAFER UNIFORMITYSeptember 2022December 2023Allow1410NoNo
17943843SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUMSeptember 2022August 2023Allow1100YesNo
17901521SUBSTRATE PROCESSING APPARATUSSeptember 2022June 2025Allow3410NoNo
17871826SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERSJuly 2022August 2024Allow2420NoNo
17871607PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITYJuly 2022December 2024Allow2932YesNo
17814007MECHANISMS FOR SUPPLYING PROCESS GAS INTO WAFER PROCESS APPARATUSJuly 2022March 2025Allow3200YesNo
17867589APPARATUS AND METHOD FOR CONTROLLING A FLOW PROCESS MATERIAL TO A DEPOSITION CHAMBERJuly 2022June 2025Allow3510NoNo
17863173PAD RAISING MECHANISM IN WAFER POSITIONING PEDESTAL FOR SEMICONDUCTOR PROCESSINGJuly 2022December 2023Allow1710NoNo
17857984METAL COMPONENT AND MANUFACTURING METHOD THEREOF AND PROCESS CHAMBER HAVING THE METAL COMPONENTJuly 2022January 2024Abandon1810NoNo
17856613METHOD FOR CONTROLLING A PROCESSING SYSTEMJuly 2022July 2024Allow2420YesNo
17832775FILM THICKNESS UNIFORMITY IMPROVEMENT USING EDGE RING AND BIAS ELECTRODE GEOMETRYJune 2022November 2024Allow3030YesNo
17756681PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODMay 2022March 2025Allow3411NoNo
17804128APPARATUS FOR PERFORMING FILM FORMING PROCESS ON SUBSTRATE AND METHOD OF USING VACUUM CHUCK MECHANISM PROVIDED IN THE APPARATUSMay 2022November 2024Allow3000NoNo
17744852RING CARRIER AND SUBSTRATE TREATING SYSTEMMay 2022February 2025Allow3310NoNo
17742637TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATIONMay 2022February 2025Allow3311NoNo
17722874SHADOW MASK APPARATUS AND METHODS FOR VARIABLE ETCH DEPTHSApril 2022May 2025Allow3710NoNo
17656009GAS SUPPLY APPARATUS, GAS SUPPLY METHOD, AND SUBSTRATE PROCESSING APPARATUSMarch 2022January 2024Allow2111YesNo
17689565VAPORIZER, SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEMarch 2022January 2024Allow2210NoNo
17682457MULTI-CHAMBER SEMICONDUCTOR MANUFACTURING SYSTEMFebruary 2022February 2025Allow3510NoNo
17681186SOLIDS VAPORIZERFebruary 2022March 2024Allow2521YesNo
17590681GAS HUB FOR PLASMA REACTORFebruary 2022March 2023Allow1400YesNo
17582188Graphite PlateJanuary 2022October 2024Abandon3320YesNo
17648436PLASMA PROCESSING APPARATUSJanuary 2022March 2024Allow2600NoNo
17576216SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUMJanuary 2022October 2024Allow3311YesNo
17575049SYSTEMS AND METHODS FOR STORAGE AND SUPPLY OF F3NO-FREE FNO GASES AND F3NO-FREE FNO GAS MIXTURES FOR SEMICONDUCTOR PROCESSESJanuary 2022May 2024Allow2830NoNo
17565808SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND RECORDING MEDIUMDecember 2021September 2024Allow3301NoNo
17646426LOAD ASSEMBLIES FOR LOADING PARTS IN A FURNACEDecember 2021February 2024Allow2521YesNo
17644028ASYMMETRICAL SEALING AND GAS FLOW CONTROL DEVICEDecember 2021May 2024Allow3020YesNo
17643718SHOWERHEAD SHROUDDecember 2021March 2022Allow300NoNo
17519596PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODNovember 2021June 2024Allow3201YesNo
17517253RECIPE UPDATING METHODNovember 2021September 2024Allow3501NoNo
17605587GAS DISTRIBUTION UNIT IN CONNECTION WITH ALD REACTOROctober 2021March 2022Allow500YesNo
17604579WORKPIECE CARRIER DEVICE, METHOD FOR COATING A WORKPIECE, AND WORKPIECEOctober 2021April 2025Allow4230YesNo
17450886PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODOctober 2021July 2023Allow2101NoNo
17603429APPARATUSES AND METHOD FOR ORIENTED DEPOSITIONOctober 2021September 2024Allow3612NoNo
17477750IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUSSeptember 2021August 2024Allow3521YesNo
17468536METHOD AND APPARATUS FOR POST EXPOSURE PROCESSING OF PHOTORESIST WAFERSSeptember 2021October 2023Allow2500YesNo
17445562SUPPRESSION OF PARASITIC DEPOSITION IN A SUBSTRATE PROCESSING SYSTEM BY SUPPRESSING PRECURSOR FLOW AND PLASMA OUTSIDE OF SUBSTRATE REGIONAugust 2021March 2023Allow1900YesNo
17407641SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODAugust 2021June 2023Abandon2211NoNo
17430872MULTI-SHOWERHEAD CHEMICAL VAPOR DEPOSITION REACTOR, PROCESS AND PRODUCTSAugust 2021May 2025Abandon4520NoNo
17395240SUSCEPTOR WITH RING TO LIMIT BACKSIDE DEPOSITIONAugust 2021September 2023Allow2610YesNo
17424968SOLID VAPORIZATION/SUPPLY SYSTEM OF METAL HALIDE FOR THIN FILM DEPOSITIONJuly 2021December 2022Allow1630YesNo
17424974VAPORIZABLE SOURCE MATERIAL CONTAINER AND SOLID VAPORIZATION/SUPPLY SYSTEM USING THE SAMEJuly 2021October 2022Allow1420NoNo
17299958SHOWER PLATE, PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODJune 2021April 2024Allow3410NoNo
17334797SHOWER PLATE, SUBSTRATE TREATMENT DEVICE, AND SUBSTRATE TREATMENT METHODMay 2021February 2025Abandon4561YesNo
17294469ETCHING UNIFORMITY REGULATING DEVICE AND METHODMay 2021March 2024Allow3410NoNo
17242898LIDS AND LID ASSEMBLY KITS FOR ATOMIC LAYER DEPOSITION CHAMBERSApril 2021November 2023Allow3010NoNo
17309108SHIELD PLATE FOR A CVD REACTORApril 2021May 2023Allow2521YesNo
17224779GAS SUPPLY UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAMEApril 2021October 2024Abandon4321NoNo
17210018CLEANING ASSEMBLIES FOR SUBSTRATE PROCESSING CHAMBERSMarch 2021February 2024Allow3520YesNo
17200529CVD REACTOR CHAMBER WITH RESISTIVE HEATING FOR SILICON CARBIDE DEPOSITIONMarch 2021April 2023Abandon2510NoNo
17193961ATOMIC LAYER DEPOSITION DEVICEMarch 2021April 2023Allow2600YesNo
17250818APPARATUS AND ASSOCIATED ACCESSORIES, METHODS AND USES FOR VISUALISING A PRINT ON AN OBJECTMarch 2021October 2023Allow3201NoNo
17250809DEVICE AND METHOD FOR CONTROLLING THE CEILING TEMPERATURE OF A CVD REACTORMarch 2021April 2023Allow2501NoNo
17186149SUBSTRATE PROCESSING APPARATUS AND CLEANING METHODFebruary 2021February 2024Allow3621NoNo
17175315ELECTROSTATICALLY CLAMPED EDGE RINGFebruary 2021October 2023Allow3200NoNo
17166066PLASMA PROCESSING DEVICEFebruary 2021March 2023Allow2520YesNo
17162929SYSTEMS AND METHODS FOR ATOMIC LAYER DEPOSITIONJanuary 2021June 2023Allow2900NoNo
16958415DEVICE FOR FORMING DIAMOND FILM ETC. AND METHOD THEREFORJanuary 2021April 2025Allow5731YesNo
17117111DEPOSITION APPARATUSDecember 2020March 2023Allow2801NoNo
17108583ACTIVELY COOLED FORELINE TRAP TO REDUCE THROTTLE VALVE DRIFTDecember 2020April 2024Allow4021NoNo
17103697NOVEL AND EFFECTIVE HOMOGENIZE FLOW MIXING DESIGNNovember 2020March 2024Abandon3941NoNo
16951823THIN SUBSTRATE HANDLING VIA EDGE CLAMPINGNovember 2020January 2024Allow3821YesNo
17080560SEMICONDUCTOR CHAMBER COMPONENTS WITH HIGH-PERFORMANCE COATINGOctober 2020July 2022Allow2121YesNo
17075684ATOMIC LAYER DEPOSITION EQUIPMENT AND PROCESS METHODOctober 2020June 2022Allow2001NoNo
17047550NOZZLE HEAD AND APPARATUSOctober 2020April 2025Allow5441YesNo
17034369CONTROL SYSTEM FOR PLASMA CHAMBER HAVING CONTROLLABLE VALVESeptember 2020July 2023Allow3421NoNo
17028327INLINE THIN FILM PROCESSING DEVICESeptember 2020December 2021Allow1500YesNo
17016872ETCHING APPARATUS AND ETCHING METHODSeptember 2020February 2024Abandon4141YesNo
17011828HEATING ZONE SEPARATION FOR REACTANT EVAPORATION SYSTEMSeptember 2020December 2022Allow2711NoNo
17009218Substrate Processing Apparatus, Gas Nozzle and Method of Manufacturing Semiconductor DeviceSeptember 2020September 2024Allow4820YesNo
17008314Gas Cluster Assisted Plasma ProcessingAugust 2020July 2024Allow4632YesNo
16976544STAGE AND ELECTRODE MEMBERAugust 2020April 2022Allow1900NoNo
16983142SEMICONDUCTOR MANUFACTURING APPARATUSAugust 2020September 2023Allow3821YesNo
16939898FILM THICKNESS UNIFORMITY IMPROVEMENT USING EDGE RING AND BIAS ELECTRODE GEOMETRYJuly 2020April 2022Allow2000NoNo
16938468SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODJuly 2020August 2022Allow2511NoNo
16936110SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAMEJuly 2020December 2023Allow4121YesNo
16936343SUBSTRATE PROCESSING APPARATUSJuly 2020May 2022Allow2200NoNo
16912979SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUSJune 2020January 2024Abandon4250NoNo
16910825APPARATUS AND METHODS TO REDUCE PARTICLES IN A FILM DEPOSITION CHAMBERJune 2020February 2023Abandon3221NoNo
16901600FILM-FORMING DEVICEJune 2020April 2022Allow2220YesNo
16894256DEPOSITION PLATFORM FOR FLEXIBLE SUBSTRATES AND METHOD OF OPERATION THEREOFJune 2020December 2021Abandon1911NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner LUND, JEFFRIE ROBERT.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
29
Examiner Affirmed
18
(62.1%)
Examiner Reversed
11
(37.9%)
Reversal Percentile
58.8%
Higher than average

What This Means

With a 37.9% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.

Strategic Value of Filing an Appeal

Total Appeal Filings
71
Allowed After Appeal Filing
18
(25.4%)
Not Allowed After Appeal Filing
53
(74.6%)
Filing Benefit Percentile
33.8%
Lower than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 25.4% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.

Strategic Recommendations

Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.

Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.

Examiner LUND, JEFFRIE ROBERT - Prosecution Strategy Guide

Executive Summary

Examiner LUND, JEFFRIE ROBERT works in Art Unit 1716 and has examined 728 patent applications in our dataset. With an allowance rate of 69.4%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 39 months.

Allowance Patterns

Examiner LUND, JEFFRIE ROBERT's allowance rate of 69.4% places them in the 24% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.

Office Action Patterns

On average, applications examined by LUND, JEFFRIE ROBERT receive 2.25 office actions before reaching final disposition. This places the examiner in the 77% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by LUND, JEFFRIE ROBERT is 39 months. This places the examiner in the 9% percentile for prosecution speed. Applications take longer to reach final disposition with this examiner compared to most others.

Interview Effectiveness

Conducting an examiner interview provides a +22.9% benefit to allowance rate for applications examined by LUND, JEFFRIE ROBERT. This interview benefit is in the 72% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 16.7% of applications are subsequently allowed. This success rate is in the 8% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 28.7% of cases where such amendments are filed. This entry rate is in the 33% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 94.7% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 67% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 56.1% of appeals filed. This is in the 23% percentile among all examiners. Of these withdrawals, 35.1% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.

Petition Practice

When applicants file petitions regarding this examiner's actions, 54.4% are granted (fully or in part). This grant rate is in the 68% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 3.8% of allowed cases (in the 86% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 4% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • Prepare for rigorous examination: With a below-average allowance rate, ensure your application has strong written description and enablement support. Consider filing a continuation if you need to add new matter.
  • Expect multiple rounds of prosecution: This examiner issues more office actions than average. Address potential issues proactively in your initial response and consider requesting an interview early in prosecution.
  • Plan for extended prosecution: Applications take longer than average with this examiner. Factor this into your continuation strategy and client communications.
  • Examiner cooperation: This examiner frequently makes examiner's amendments to place applications in condition for allowance. If you are close to allowance, the examiner may help finalize the claims.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.