Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18850990 | INTEGRATION OF DRY DEVELOPMENT AND ETCH PROCESSES FOR EUV PATTERNING IN A SINGLE PROCESS CHAMBER | September 2024 | April 2025 | Allow | 6 | 0 | 0 | No | No |
| 18826224 | PROCESSING AND RECYCLING METHOD AND PRODUCT OF ULTRATHIN LITHIUM FOIL | September 2024 | November 2024 | Allow | 2 | 0 | 0 | No | No |
| 18805861 | SUBSTRATE STRUCTURING METHOD | August 2024 | October 2024 | Allow | 2 | 0 | 0 | No | No |
| 18673409 | CHEMICAL LIQUID AND CHEMICAL LIQUID STORAGE BODY | May 2024 | July 2025 | Allow | 13 | 1 | 0 | No | No |
| 18671779 | SURFACE TREATMENT OF A SULFIDE GLASS SOLID ELECTROLYTE LAYER | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18670879 | POLISHING COMPOSITIONS AND METHODS OF USING THE SAME | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18670641 | ION BEAM ETCHING WITH SIDEWALL CLEANING | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18626719 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM | April 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18612807 | TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RANDOM ACCESS MEMORY (SRAM) AND DENSE LOGIC | March 2024 | February 2025 | Allow | 11 | 0 | 0 | No | No |
| 18693438 | METHOD FOR MANUFACTURING A MOULD FOR NANOPRINTING AND ASSOCIATED MOULD | March 2024 | October 2024 | Allow | 7 | 0 | 1 | No | No |
| 18400180 | PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM | December 2023 | February 2025 | Allow | 13 | 1 | 0 | No | No |
| 18392987 | Microneedle Fabrication and Device Implantation | December 2023 | September 2024 | Allow | 9 | 0 | 0 | No | No |
| 18529763 | POLISHING COMPOSITION | December 2023 | September 2024 | Allow | 9 | 2 | 0 | Yes | No |
| 18529465 | POLISHING METHOD AND POLISHING COMPOSITION | December 2023 | June 2024 | Allow | 6 | 1 | 0 | No | No |
| 18525473 | Semiconductor Device and Method | November 2023 | February 2025 | Allow | 14 | 1 | 0 | No | No |
| 18505043 | ALTERNATING ETCH AND PASSIVATION PROCESS | November 2023 | January 2025 | Allow | 14 | 2 | 0 | No | No |
| 18447943 | Plasma-Assisted Etching Of Metal Oxides | August 2023 | August 2024 | Allow | 12 | 2 | 0 | No | No |
| 18275266 | POLISHING COMPOSITION | August 2023 | July 2024 | Abandon | 11 | 1 | 0 | No | No |
| 18275285 | POLISHING METHOD AND POLISHING COMPOSITION | August 2023 | December 2024 | Abandon | 17 | 1 | 0 | No | No |
| 18362463 | Method of Forming a Semiconductor Device | July 2023 | March 2025 | Allow | 19 | 1 | 0 | No | No |
| 18357856 | THERMAL ATOMIC LAYER ETCHING PROCESSES | July 2023 | February 2025 | Allow | 18 | 1 | 0 | No | No |
| 18349444 | THERMAL ATOMIC LAYER ETCHING PROCESSES | July 2023 | October 2024 | Allow | 15 | 1 | 1 | No | No |
| 18269616 | POLYCRYSTALLINE SiC COMPACT AND METHOD FOR MANUFACTURING THE SAME | June 2023 | May 2025 | Allow | 23 | 0 | 0 | No | No |
| 18258555 | POLISHING COMPOSITION AND METHOD OF POLISHING SILICON WAFER | June 2023 | May 2025 | Allow | 23 | 0 | 0 | No | No |
| 18257751 | ETCHING METHOD WITH METAL HARD MASK | June 2023 | August 2024 | Allow | 14 | 0 | 0 | No | No |
| 18206037 | METHODS, SYSTEMS, AND APPARATUS FOR PROCESSING SUBSTRATES USING ONE OR MORE AMORPHOUS CARBON HARDMASK LAYERS | June 2023 | July 2024 | Allow | 13 | 1 | 0 | No | No |
| 18328790 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | June 2023 | August 2024 | Allow | 15 | 1 | 1 | No | No |
| 18038252 | COMPOSITION FOR POST-POLISHING TO BE USED AFTER PRIMARY POLISHING OF SILICON WAFERS | May 2023 | October 2023 | Allow | 5 | 0 | 0 | No | No |
| 18201061 | TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RANDOM ACCESS MEMORY (SRAM) AND DENSE LOGIC | May 2023 | February 2024 | Allow | 8 | 0 | 0 | Yes | No |
| 18143652 | ETCHING PROCESSES AND PROCESSING ASSEMBLIES | May 2023 | April 2025 | Allow | 23 | 0 | 0 | No | No |
| 18305875 | SELECTIVE DEPOSITION OF SIOC THIN FILMS | April 2023 | April 2024 | Allow | 12 | 1 | 0 | No | No |
| 18137131 | IDENTIFICATION CODES ON SEMICONDUCTOR CHIPS | April 2023 | April 2025 | Allow | 24 | 0 | 0 | No | No |
| 18247669 | ETCHING METHOD AND ETCHING APPARATUS | April 2023 | April 2025 | Allow | 24 | 0 | 0 | No | No |
| 18125936 | METHOD FOR FORMING PHOTORESIST PATTERN AND METHOD FOR FORMING PATTERN ON A SUBSTRATE | March 2023 | April 2025 | Allow | 25 | 0 | 0 | No | No |
| 18028262 | RECESS FILLING METHOD AND SUBSTRATE PROCESSING APPARATUS | March 2023 | April 2025 | Allow | 25 | 0 | 0 | No | No |
| 18124593 | ETCHING METHOD AND PLASMA PROCESSING SYSTEM | March 2023 | May 2025 | Allow | 26 | 0 | 1 | No | No |
| 18188255 | ATOMIC LAYER ETCHING PROCESSES | March 2023 | April 2024 | Allow | 13 | 1 | 0 | No | No |
| 18026095 | ETCHING PROCESSING METHOD | March 2023 | June 2025 | Allow | 28 | 1 | 0 | No | No |
| 18112302 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM | February 2023 | April 2025 | Allow | 26 | 0 | 1 | No | No |
| 18168448 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE | February 2023 | June 2025 | Allow | 28 | 0 | 1 | No | No |
| 18163522 | PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS | February 2023 | June 2024 | Allow | 17 | 2 | 1 | Yes | No |
| 18101336 | ETCHING GAS MIXTURE AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | January 2023 | February 2025 | Allow | 25 | 0 | 0 | No | No |
| 18156917 | IN-SITU FOCUS RING COATING | January 2023 | March 2025 | Allow | 25 | 0 | 0 | No | No |
| 18096032 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | January 2023 | May 2025 | Allow | 28 | 0 | 1 | No | No |
| 18013675 | Etch Rate Modulation of FinFET Through High-Temperature Ion Implantation | December 2022 | April 2025 | Allow | 28 | 1 | 0 | Yes | No |
| 18056468 | ALTERNATING ETCH AND PASSIVATION PROCESS | November 2022 | August 2023 | Allow | 9 | 1 | 0 | No | No |
| 18045003 | COMPOSITION AND METHOD FOR CONDUCTING A MATERIAL REMOVING OPERATION | October 2022 | August 2023 | Allow | 10 | 1 | 0 | No | No |
| 17910587 | Methods for Extreme Ultraviolet (EUV) Resist Patterning Development | September 2022 | September 2024 | Allow | 24 | 2 | 0 | No | No |
| 17930472 | METHOD OF ENHANCING THE REMOVAL RATE OF POLYSILICON | September 2022 | April 2024 | Abandon | 19 | 2 | 0 | No | Yes |
| 17895601 | METHOD OF PROCESSING SUBSTRATE HAVING SILICON NITRIDE LAYER | August 2022 | February 2025 | Allow | 30 | 0 | 0 | No | No |
| 17800611 | Method for Producing a Nanoscale Channel Structure | August 2022 | January 2025 | Allow | 29 | 1 | 0 | No | No |
| 17885228 | SUBSTRATE PROCESSING WITH SELECTIVE ETCHING | August 2022 | November 2024 | Allow | 27 | 0 | 0 | No | No |
| 17880727 | POLISHING COMPOSITIONS AND METHODS OF USING SAME | August 2022 | March 2024 | Abandon | 19 | 1 | 1 | No | No |
| 17880758 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | August 2022 | August 2023 | Allow | 12 | 1 | 0 | No | No |
| 17878132 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | August 2022 | May 2025 | Allow | 33 | 0 | 1 | No | No |
| 17877151 | METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE | July 2022 | September 2024 | Allow | 25 | 0 | 1 | No | No |
| 17875524 | TEMPERATURE-CONTROLLED PLASMA GENERATION SYSTEM | July 2022 | January 2025 | Allow | 30 | 0 | 0 | No | No |
| 17874614 | Semiconductor Device and Method | July 2022 | August 2023 | Allow | 13 | 1 | 0 | No | No |
| 17865052 | METHOD FOR MANUFACTURING VIBRATOR DEVICE | July 2022 | November 2024 | Allow | 28 | 0 | 0 | No | No |
| 17859700 | METHOD FOR INKJET PRINTING AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE SAME | July 2022 | June 2024 | Allow | 23 | 0 | 0 | No | No |
| 17856376 | HARD MASK TRIMMING IN METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | July 2022 | September 2024 | Allow | 27 | 0 | 0 | No | No |
| 17854112 | ATOMIC-SCALE PROCESSING METHOD BY COMBINING EXTREME ULTRAVIOLET LIGHT AND PLASMA | June 2022 | January 2023 | Allow | 6 | 0 | 0 | No | No |
| 17846929 | POLISHING OF TRANSITION METALS | June 2022 | June 2025 | Allow | 36 | 1 | 1 | No | No |
| 17807724 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | June 2022 | June 2023 | Allow | 12 | 0 | 1 | No | No |
| 17807374 | WET ETCHING APPARATUS | June 2022 | May 2024 | Allow | 23 | 0 | 0 | No | No |
| 17841443 | Method of Uniformity Control | June 2022 | January 2025 | Allow | 31 | 0 | 1 | No | No |
| 17839869 | ETCHING METHOD AND ETCHING APPARATUS | June 2022 | September 2024 | Allow | 27 | 0 | 1 | No | No |
| 17785000 | CHEMICAL MECHANICAL POLISHING LIQUID | June 2022 | November 2024 | Allow | 30 | 1 | 0 | No | No |
| 17829884 | OMNIPHOBIC COMPOSITIONS | June 2022 | November 2024 | Allow | 30 | 0 | 1 | No | No |
| 17724721 | TOOL FOR POLISHING GLASS, METHOD FOR MANUFACTURING GLASS-POLISHING TOOL, AND METHOD FOR POLISHING GLASS | April 2022 | January 2025 | Abandon | 33 | 0 | 1 | No | No |
| 17769841 | ETCHING METHOD, AIR-GAP DIELECTRIC LAYER, AND DYNAMIC RANDOM-ACCESS MEMORY | April 2022 | November 2023 | Allow | 19 | 1 | 0 | No | No |
| 17712561 | Low-k Feature Formation Processes and Structures Formed Thereby | April 2022 | February 2023 | Allow | 11 | 1 | 0 | No | No |
| 17760519 | PLASMA ETCHING METHOD | March 2022 | July 2024 | Allow | 28 | 1 | 0 | No | No |
| 17694145 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | March 2022 | August 2024 | Allow | 29 | 0 | 1 | No | No |
| 17693022 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | March 2022 | September 2023 | Allow | 18 | 1 | 1 | No | No |
| 17689236 | SILICON NITRIDE CHEMICAL MECHANICAL POLISHING SLURRY WITH SILICON NITRIDE REMOVAL RATE ENHANCERS AND METHODS OF USE THEREOF | March 2022 | February 2024 | Allow | 24 | 0 | 1 | No | No |
| 17685611 | MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | March 2022 | September 2024 | Allow | 30 | 0 | 0 | No | No |
| 17679415 | POLISHING COMPOSITION AND POLISHING METHOD | February 2022 | October 2024 | Allow | 31 | 1 | 1 | No | No |
| 17674158 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ETCHANT COMPOSITION HAVING HIGH ETCHING SELECTIVITY | February 2022 | November 2024 | Allow | 33 | 1 | 0 | No | No |
| 17673009 | POLISHING COMPOSITIONS CONTAINING CHARGED ABRASIVE | February 2022 | February 2023 | Allow | 12 | 1 | 0 | No | No |
| 17670844 | ETCHING METHOD AND ETCHING APPARATUS | February 2022 | July 2024 | Allow | 29 | 1 | 1 | No | No |
| 17666725 | METHOD OF RUNNING AN ETCH PROCESS IN HIGHER SELECTIVITY TO MASK AND POLYMER REGIME BY USING A CYCLIC ETCH PROCESS | February 2022 | October 2024 | Allow | 32 | 1 | 0 | No | No |
| 17648840 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | January 2022 | February 2024 | Allow | 25 | 0 | 1 | No | No |
| 17648836 | End Point Control in Etching Processes | January 2022 | August 2024 | Allow | 30 | 1 | 1 | No | No |
| 17580936 | Dynamically Adjusted Purge Timing In Wet Atomic Layer Etching | January 2022 | December 2023 | Allow | 23 | 0 | 0 | No | No |
| 17647737 | METHOD AND DEVICE FOR DETERMINING FABRICATION CHAMBER | January 2022 | September 2022 | Allow | 8 | 0 | 0 | No | No |
| 17646389 | THERMAL ATOMIC LAYER ETCHING PROCESSES | December 2021 | April 2023 | Allow | 15 | 1 | 0 | No | No |
| 17646274 | THERMAL ATOMIC LAYER ETCHING PROCESSES | December 2021 | April 2023 | Allow | 15 | 1 | 0 | No | No |
| 17562034 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | December 2021 | January 2025 | Abandon | 37 | 2 | 1 | No | No |
| 17596921 | ALTERNATING ETCH AND PASSIVATION PROCESS | December 2021 | May 2022 | Allow | 4 | 0 | 0 | No | No |
| 17645286 | TRANSISTORS WITH SOURCE-CONNECTED FIELD PLATES | December 2021 | August 2024 | Allow | 32 | 0 | 1 | No | No |
| 17620181 | CHEMICAL-MECHANICAL POLISHING COMPOSITION, RINSE COMPOSITION, CHEMICAL-MECHANICAL POLISHING METHOD, AND RINSING METHOD | December 2021 | July 2024 | Allow | 31 | 0 | 0 | No | No |
| 17537328 | PLASMA UNIFORMITY CONTROL IN PULSED DC PLASMA CHAMBER | November 2021 | July 2024 | Allow | 32 | 0 | 0 | No | No |
| 17528196 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM | November 2021 | January 2024 | Allow | 26 | 1 | 1 | No | No |
| 17595397 | ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | November 2021 | February 2025 | Allow | 39 | 2 | 0 | No | No |
| 17595416 | ETCHING METHOD | November 2021 | June 2024 | Allow | 31 | 0 | 0 | No | No |
| 17611074 | DEPOSITION OF SELF ASSEMBLED MONOLAYER FOR ENABLING SELECTIVE DEPOSITION AND ETCH | November 2021 | June 2022 | Allow | 7 | 0 | 0 | No | No |
| 17522403 | CD DEPENDENT GAP FILL AND CONFORMAL FILMS | November 2021 | August 2023 | Allow | 21 | 1 | 0 | No | No |
| 17609572 | Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method | November 2021 | April 2024 | Allow | 29 | 0 | 0 | No | No |
| 17514233 | Non-Atomic Layer Deposition (ALD) Method of Forming Sidewall Passivation Layer During High Aspect Ratio Carbon Layer Etch | October 2021 | February 2023 | Allow | 16 | 2 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CULBERT, ROBERTS P.
With a 30.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 38.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner CULBERT, ROBERTS P works in Art Unit 1716 and has examined 1,157 patent applications in our dataset. With an allowance rate of 89.5%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 18 months.
Examiner CULBERT, ROBERTS P's allowance rate of 89.5% places them in the 69% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by CULBERT, ROBERTS P receive 0.89 office actions before reaching final disposition. This places the examiner in the 9% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by CULBERT, ROBERTS P is 18 months. This places the examiner in the 94% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a -13.9% benefit to allowance rate for applications examined by CULBERT, ROBERTS P. This interview benefit is in the 1% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 32.2% of applications are subsequently allowed. This success rate is in the 60% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 45.4% of cases where such amendments are filed. This entry rate is in the 63% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 20.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 25% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.
This examiner withdraws rejections or reopens prosecution in 56.5% of appeals filed. This is in the 23% percentile among all examiners. Of these withdrawals, 30.8% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 41.3% are granted (fully or in part). This grant rate is in the 42% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 2.8% of allowed cases (in the 81% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 4% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.