Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18850990 | INTEGRATION OF DRY DEVELOPMENT AND ETCH PROCESSES FOR EUV PATTERNING IN A SINGLE PROCESS CHAMBER | September 2024 | April 2025 | Allow | 6 | 0 | 0 | No | No |
| 18826224 | PROCESSING AND RECYCLING METHOD AND PRODUCT OF ULTRATHIN LITHIUM FOIL | September 2024 | November 2024 | Allow | 2 | 0 | 0 | No | No |
| 18805861 | SUBSTRATE STRUCTURING METHOD | August 2024 | October 2024 | Allow | 2 | 0 | 0 | No | No |
| 18673409 | CHEMICAL LIQUID AND CHEMICAL LIQUID STORAGE BODY | May 2024 | July 2025 | Allow | 13 | 1 | 0 | No | No |
| 18670879 | POLISHING COMPOSITIONS AND METHODS OF USING THE SAME | May 2024 | February 2025 | Allow | 9 | 0 | 0 | No | No |
| 18671779 | SURFACE TREATMENT OF A SULFIDE GLASS SOLID ELECTROLYTE LAYER | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18670641 | ION BEAM ETCHING WITH SIDEWALL CLEANING | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18626719 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM | April 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18616493 | SELECTIVE IN-SITU CARBON-BASED MASK PROTECTION | March 2024 | February 2026 | Allow | 22 | 0 | 0 | No | No |
| 18612807 | TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RANDOM ACCESS MEMORY (SRAM) AND DENSE LOGIC | March 2024 | February 2025 | Allow | 11 | 0 | 0 | No | No |
| 18693438 | METHOD FOR MANUFACTURING A MOULD FOR NANOPRINTING AND ASSOCIATED MOULD | March 2024 | October 2024 | Allow | 7 | 0 | 1 | No | No |
| 18604167 | WET ANISOTROPIC ETCHING OF SILICON | March 2024 | March 2026 | Allow | 24 | 2 | 0 | No | No |
| 18593286 | PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS | March 2024 | January 2026 | Allow | 23 | 2 | 0 | No | No |
| 18592994 | PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS | March 2024 | October 2025 | Allow | 20 | 1 | 0 | No | No |
| 18431669 | PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS | February 2024 | January 2026 | Allow | 23 | 2 | 0 | Yes | No |
| 18409601 | Functionalized Carbon Particle CMP Slurry | January 2024 | March 2026 | Allow | 26 | 1 | 0 | No | No |
| 18400180 | PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM | December 2023 | February 2025 | Allow | 13 | 1 | 0 | No | No |
| 18392987 | Microneedle Fabrication and Device Implantation | December 2023 | September 2024 | Allow | 9 | 0 | 0 | No | No |
| 18545322 | SELECTIVE THERMAL DRY ETCH OF MEMORY DEVICES USING PHOSPHORIC ACID DERIVATIVES | December 2023 | January 2026 | Allow | 25 | 0 | 0 | No | No |
| 18534327 | WAFER TOTAL THICKNESS VARIATION USING MASKLESS IMPLANT | December 2023 | November 2025 | Allow | 23 | 0 | 1 | No | No |
| 18529465 | POLISHING METHOD AND POLISHING COMPOSITION | December 2023 | June 2024 | Allow | 6 | 1 | 0 | No | No |
| 18529763 | POLISHING COMPOSITION | December 2023 | September 2024 | Allow | 9 | 2 | 0 | Yes | No |
| 18525473 | Semiconductor Device and Method | November 2023 | February 2025 | Allow | 14 | 1 | 0 | No | No |
| 18514719 | METHODS OF PROCESSING WORKPIECES USING ORGANIC RADICALS | November 2023 | January 2026 | Allow | 26 | 0 | 1 | No | No |
| 18513489 | SULFUR-CONTAINING MOLECULES FOR HIGH ASPECT RATIO PLASMA ETCHING PROCESSES | November 2023 | August 2025 | Allow | 21 | 0 | 0 | No | No |
| 18560852 | LIQUID DISPERSION AND POWDER OF CERIUM BASED CORE-SHELL PARTICLES, PROCESS FOR PRODUCING THE SAME AND USES THEREOF IN POLISHING | November 2023 | September 2025 | Allow | 22 | 0 | 0 | No | No |
| 18560321 | METHOD FOR FABRICATING A BLAZED GRATING | November 2023 | October 2025 | Allow | 24 | 0 | 0 | No | No |
| 18388240 | METHODS FOR FORMING VERTICALLY LAYERED IONIC LIQUID CRYSTAL (ILC) STRUCTURES ON A SEMICONDUCTOR SUBSTRATE | November 2023 | September 2025 | Allow | 22 | 0 | 0 | No | No |
| 18505043 | ALTERNATING ETCH AND PASSIVATION PROCESS | November 2023 | January 2025 | Allow | 14 | 2 | 0 | No | No |
| 18376053 | LINE EDGE ROUGHNESS (LER) IMPROVEMENT OF RESIST PATTERNS | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18244863 | PLASMA ETCHING APPARATUS COMPONENT FOR MANUFACTURING SEMICONDUCTOR COMPRISING COMPOSITE SINTERED BODY AND MANUFACTURING METHOD THEREFOR | September 2023 | August 2025 | Allow | 23 | 0 | 0 | No | No |
| 18243776 | ELECTRO-OPTIC THZ EMITTER AND RECEIVER DEVICES AND METHOD OF FABRICATION | September 2023 | October 2025 | Allow | 25 | 1 | 0 | No | No |
| 18279827 | PLASMA PROCESSING METHOD | August 2023 | August 2025 | Allow | 23 | 0 | 0 | No | No |
| 18459173 | SLURRY COMPOSITION FOR A CHEMICAL MECHANICAL POLISHING | August 2023 | December 2025 | Allow | 27 | 0 | 1 | No | No |
| 18449996 | SUBSTRATE PROCESSING METHOD | August 2023 | January 2026 | Allow | 29 | 0 | 0 | No | No |
| 18447943 | Plasma-Assisted Etching Of Metal Oxides | August 2023 | August 2024 | Allow | 12 | 2 | 0 | No | No |
| 18275285 | POLISHING METHOD AND POLISHING COMPOSITION | August 2023 | December 2024 | Abandon | 17 | 1 | 0 | No | No |
| 18275266 | POLISHING COMPOSITION | August 2023 | July 2024 | Abandon | 11 | 1 | 0 | No | No |
| 18362608 | METHOD FOR LATERAL ETCH WITH BOTTOM PASSIVATION | July 2023 | November 2025 | Allow | 27 | 0 | 0 | No | No |
| 18362463 | Method of Forming a Semiconductor Device | July 2023 | March 2025 | Allow | 19 | 1 | 0 | No | No |
| 18357856 | THERMAL ATOMIC LAYER ETCHING PROCESSES | July 2023 | February 2025 | Allow | 18 | 1 | 0 | No | No |
| 18349444 | THERMAL ATOMIC LAYER ETCHING PROCESSES | July 2023 | October 2024 | Allow | 15 | 1 | 1 | No | No |
| 18218814 | ETCHING METHOD USING OXYGEN-CONTAINING HYDROFLUOROCARBON | July 2023 | February 2026 | Allow | 31 | 2 | 0 | No | No |
| 18343124 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | June 2023 | January 2026 | Allow | 30 | 1 | 1 | No | No |
| 18269616 | POLYCRYSTALLINE SiC COMPACT AND METHOD FOR MANUFACTURING THE SAME | June 2023 | May 2025 | Allow | 23 | 0 | 0 | No | No |
| 18213700 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | June 2023 | October 2025 | Allow | 28 | 1 | 1 | No | No |
| 18339021 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM | June 2023 | January 2026 | Allow | 31 | 1 | 1 | No | No |
| 18258555 | POLISHING COMPOSITION AND METHOD OF POLISHING SILICON WAFER | June 2023 | May 2025 | Allow | 23 | 0 | 0 | No | No |
| 18257751 | ETCHING METHOD WITH METAL HARD MASK | June 2023 | August 2024 | Allow | 14 | 0 | 0 | No | No |
| 18330501 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | June 2023 | July 2025 | Allow | 26 | 0 | 1 | No | No |
| 18328790 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | June 2023 | August 2024 | Allow | 15 | 1 | 1 | No | No |
| 18206037 | METHODS, SYSTEMS, AND APPARATUS FOR PROCESSING SUBSTRATES USING ONE OR MORE AMORPHOUS CARBON HARDMASK LAYERS | June 2023 | July 2024 | Allow | 13 | 1 | 0 | No | No |
| 18255783 | POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESSING POLISHING COMPOSITION PREPARATION METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD TO WHICH POLISHING COMPOSITION IS APPLIED | June 2023 | August 2025 | Allow | 27 | 0 | 1 | No | No |
| 18039155 | METHOD FOR ETCHING SILICON-CONTAINING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD COMPRISING SAME | May 2023 | March 2026 | Allow | 33 | 2 | 0 | No | No |
| 18254787 | PHOTORESIST DEVELOPMENT WITH ORGANIC VAPOR | May 2023 | November 2025 | Allow | 30 | 1 | 1 | No | No |
| 18038252 | COMPOSITION FOR POST-POLISHING TO BE USED AFTER PRIMARY POLISHING OF SILICON WAFERS | May 2023 | October 2023 | Allow | 5 | 0 | 0 | No | No |
| 18201061 | TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RANDOM ACCESS MEMORY (SRAM) AND DENSE LOGIC | May 2023 | February 2024 | Allow | 8 | 0 | 0 | Yes | No |
| 18199734 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | May 2023 | January 2026 | Allow | 32 | 1 | 1 | No | No |
| 18315091 | FABRICATION METHOD OF DEVICE WITH CAVITY | May 2023 | August 2023 | Allow | 4 | 0 | 0 | No | No |
| 18143652 | ETCHING PROCESSES AND PROCESSING ASSEMBLIES | May 2023 | April 2025 | Allow | 23 | 0 | 0 | No | No |
| 18305875 | SELECTIVE DEPOSITION OF SIOC THIN FILMS | April 2023 | April 2024 | Allow | 12 | 1 | 0 | No | No |
| 18137131 | IDENTIFICATION CODES ON SEMICONDUCTOR CHIPS | April 2023 | April 2025 | Allow | 24 | 0 | 0 | No | No |
| 18136407 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING A REPEATING PATTERN OF LINES AND SPACES | April 2023 | July 2025 | Allow | 27 | 0 | 1 | No | No |
| 18297152 | COMPOSITION FOR SEMICONDUCTOR PROCESSING AND POLISHING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME | April 2023 | July 2025 | Allow | 28 | 0 | 1 | No | No |
| 18247669 | ETCHING METHOD AND ETCHING APPARATUS | April 2023 | April 2025 | Allow | 24 | 0 | 0 | No | No |
| 18127668 | ETCHING METHOD AND PLASMA PROCESSING SYSTEM | March 2023 | October 2025 | Allow | 31 | 1 | 1 | Yes | No |
| 18191098 | HIGH ASPECT RATIO CONTACT ETCHING WITH ADDITIVE GAS | March 2023 | January 2026 | Allow | 34 | 1 | 1 | No | No |
| 18125936 | METHOD FOR FORMING PHOTORESIST PATTERN AND METHOD FOR FORMING PATTERN ON A SUBSTRATE | March 2023 | April 2025 | Allow | 25 | 0 | 0 | No | No |
| 18028262 | RECESS FILLING METHOD AND SUBSTRATE PROCESSING APPARATUS | March 2023 | April 2025 | Allow | 25 | 0 | 0 | No | No |
| 18124593 | ETCHING METHOD AND PLASMA PROCESSING SYSTEM | March 2023 | May 2025 | Allow | 26 | 0 | 1 | No | No |
| 18188255 | ATOMIC LAYER ETCHING PROCESSES | March 2023 | April 2024 | Allow | 13 | 1 | 0 | No | No |
| 18026095 | ETCHING PROCESSING METHOD | March 2023 | June 2025 | Allow | 28 | 1 | 0 | No | No |
| 18177304 | COMPOSITION AND METHOD FOR TREATING SUBSTRATE | March 2023 | February 2026 | Allow | 35 | 3 | 0 | Yes | No |
| 18114134 | ETCHING METHOD USING OXYGEN-CONTAINING HYDROFLUOROCARBON | February 2023 | January 2026 | Allow | 35 | 2 | 0 | No | No |
| 18174208 | COMPOSITION AND METHOD FOR TREATING SUBSTRATE | February 2023 | February 2026 | Allow | 35 | 2 | 0 | Yes | No |
| 18022929 | CERIUM OXIDE PARTICLES, CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION COMPRISING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | February 2023 | July 2025 | Allow | 29 | 0 | 1 | No | No |
| 18112302 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM | February 2023 | April 2025 | Allow | 26 | 0 | 1 | No | No |
| 18168448 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE | February 2023 | June 2025 | Allow | 28 | 0 | 1 | No | No |
| 18166879 | METHODS FOR FORMING SPACERS AND RELATED STRUCTURES | February 2023 | July 2025 | Allow | 29 | 0 | 1 | No | No |
| 18163522 | PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS | February 2023 | June 2024 | Allow | 17 | 2 | 1 | Yes | No |
| 18160730 | ETCHING METHOD AND ETCHING APPARATUS | January 2023 | October 2025 | Allow | 33 | 0 | 1 | No | No |
| 18101336 | ETCHING GAS MIXTURE AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | January 2023 | February 2025 | Allow | 25 | 0 | 0 | No | No |
| 18156917 | IN-SITU FOCUS RING COATING | January 2023 | March 2025 | Allow | 25 | 0 | 0 | No | No |
| 18098112 | ETCHING METHOD AND ETCHING APPARATUS | January 2023 | October 2025 | Allow | 33 | 1 | 1 | No | No |
| 18096032 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | January 2023 | May 2025 | Allow | 28 | 0 | 1 | No | No |
| 18096035 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | January 2023 | November 2025 | Allow | 34 | 1 | 1 | Yes | No |
| 18095279 | DIRECTIONAL SELECTIVE FILL FOR SILICON GAP FILL PROCESSES | January 2023 | July 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 18004051 | SELECTIVE SILICON TRIM BY THERMAL ETCHING | December 2022 | October 2025 | Allow | 34 | 1 | 1 | No | No |
| 18013675 | Etch Rate Modulation of FinFET Through High-Temperature Ion Implantation | December 2022 | April 2025 | Allow | 28 | 1 | 0 | Yes | No |
| 18008761 | PULSING REMOTE PLASMA FOR ION DAMAGE REDUCTION AND ETCH UNIFORMITY IMPROVEMENT | December 2022 | January 2026 | Allow | 38 | 1 | 1 | Yes | No |
| 18056468 | ALTERNATING ETCH AND PASSIVATION PROCESS | November 2022 | August 2023 | Allow | 9 | 1 | 0 | No | No |
| 17985021 | AMINE-BASED COMPOSITIONS FOR USE IN CMP WITH HIGH POLYSILICON RATE | November 2022 | March 2026 | Allow | 40 | 1 | 1 | No | No |
| 17921343 | AUTOMATED FEEDFORWARD AND FEEDBACK SEQUENCE FOR PATTERNING CD CONTROL | October 2022 | October 2025 | Allow | 36 | 1 | 0 | No | No |
| 18045003 | COMPOSITION AND METHOD FOR CONDUCTING A MATERIAL REMOVING OPERATION | October 2022 | August 2023 | Allow | 10 | 1 | 0 | No | No |
| 17910587 | Methods for Extreme Ultraviolet (EUV) Resist Patterning Development | September 2022 | September 2024 | Allow | 24 | 2 | 0 | No | No |
| 17930472 | METHOD OF ENHANCING THE REMOVAL RATE OF POLYSILICON | September 2022 | April 2024 | Abandon | 19 | 2 | 0 | No | Yes |
| 17895601 | METHOD OF PROCESSING SUBSTRATE HAVING SILICON NITRIDE LAYER | August 2022 | February 2025 | Allow | 30 | 0 | 0 | No | No |
| 17800611 | Method for Producing a Nanoscale Channel Structure | August 2022 | January 2025 | Allow | 29 | 1 | 0 | No | No |
| 17885228 | SUBSTRATE PROCESSING WITH SELECTIVE ETCHING | August 2022 | November 2024 | Allow | 27 | 0 | 0 | No | No |
| 17880758 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | August 2022 | August 2023 | Allow | 12 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CULBERT, ROBERTS P.
With a 36.4% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 42.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner CULBERT, ROBERTS P works in Art Unit 1716 and has examined 1,084 patent applications in our dataset. With an allowance rate of 89.3%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 18 months.
Examiner CULBERT, ROBERTS P's allowance rate of 89.3% places them in the 71% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by CULBERT, ROBERTS P receive 0.92 office actions before reaching final disposition. This places the examiner in the 7% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by CULBERT, ROBERTS P is 18 months. This places the examiner in the 96% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a -15.2% benefit to allowance rate for applications examined by CULBERT, ROBERTS P. This interview benefit is in the 2% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 31.8% of applications are subsequently allowed. This success rate is in the 66% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 44.1% of cases where such amendments are filed. This entry rate is in the 67% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 18.2% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 26% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 56.0% of appeals filed. This is in the 28% percentile among all examiners. Of these withdrawals, 28.6% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 46% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 3.0% of allowed cases (in the 80% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 4% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.