Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18957406 | FORMATION OF AN ARRAY OF NANOSTRUCTURES | November 2024 | April 2025 | Allow | 5 | 1 | 0 | Yes | No |
| 18763075 | SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS FOR MANUFACTURING THE SAME | July 2024 | March 2025 | Allow | 8 | 1 | 0 | No | No |
| 18747379 | SEMICONDUCTOR DEVICE, FERROELECTRIC CAPACITOR AND LAMINATED STRUCTURE | June 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18743431 | SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS FOR MANUFACTURING THE SAME | June 2024 | January 2025 | Allow | 7 | 0 | 0 | No | No |
| 18741063 | FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD | June 2024 | April 2025 | Allow | 10 | 1 | 0 | No | No |
| 18740603 | SEMICONDUCTOR DEVICE | June 2024 | March 2025 | Allow | 9 | 0 | 1 | No | No |
| 18740444 | IC PACKAGE WITH HEAT SPREADER | June 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18732725 | RRAM BOTTOM ELECTRODE | June 2024 | March 2025 | Allow | 9 | 1 | 0 | No | No |
| 18680253 | SOFT ASHING PROCESS FOR FORMING PROTECTIVE LAYER ON CONDUCTIVE CAP LAYER OF SEMICONDUCTOR DEVICE | May 2024 | May 2025 | Allow | 11 | 0 | 0 | No | No |
| 18678270 | LEAD FRAME AND MANUFACTURING METHOD THEREOF | May 2024 | April 2025 | Allow | 10 | 1 | 0 | Yes | No |
| 18669565 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18666035 | SEMICONDUCTOR MEMORY DEVICE | May 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18664656 | HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF | May 2024 | February 2025 | Allow | 9 | 2 | 0 | No | No |
| 18659523 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MEMORY DEVICE, AND ELECTRONIC DEVICE | May 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18649840 | SELF-ASSEMBLED MONOLAYER FOR ELECTRODE MODIFICATION AND DEVICE COMPRISING SUCH SELF-ASSEMBLED MONOLAYER | April 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18644330 | MULTI-LAYER DIELECTRIC REFILL FOR PROFILE CONTROL IN SEMICONDUCTOR DEVICES | April 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18645366 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | April 2024 | January 2025 | Allow | 9 | 1 | 0 | No | No |
| 18641815 | MEMS RESONATOR INTEGRATED CICRUIT FABRICATION | April 2024 | May 2025 | Allow | 13 | 1 | 0 | No | No |
| 18631641 | BURIED GRID WITH SHIELD IN WIDE BAND GAP MATERIAL | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18632214 | DISPLAY DEVICE | April 2024 | April 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18630676 | PACKAGE FOR AN INTEGRATED CIRCUIT AND MANUFACTURING METHOD | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18627931 | A STRUCTURE AND METHODS OF FORMING THE STRUCTURE | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18626472 | METHOD AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR LAYER AND SUBSTRATE PROVIDED THEREWITH | April 2024 | May 2025 | Allow | 13 | 1 | 0 | Yes | No |
| 18625547 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18623766 | LATERAL FIN STATIC INDUCTION TRANSISTOR | April 2024 | February 2025 | Allow | 11 | 1 | 0 | No | No |
| 18619261 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | March 2024 | October 2024 | Allow | 7 | 0 | 0 | No | No |
| 18614757 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | March 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18608949 | Semiconductor structure | March 2024 | February 2025 | Allow | 11 | 2 | 0 | No | No |
| 18604713 | SEMICONDUCTOR DEVICE | March 2024 | June 2025 | Abandon | 15 | 1 | 0 | No | No |
| 18603246 | SEMICONDUCTOR STRUCTURE, METHOD FOR FABRICATING THEREOF, AND METHOD FOR FABRICATING SEMICONDUCTOR LAYOUT | March 2024 | May 2025 | Allow | 14 | 2 | 0 | No | No |
| 18595569 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | March 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18594215 | TRENCH CAPACITOR STRUCTURE WITH HYBRID FILLING LAYER | March 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18592704 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | March 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18589774 | METHOD TO INDUCE STRAIN IN FINFET CHANNELS FROM AN ADJACENT REGION | February 2024 | October 2024 | Allow | 8 | 1 | 0 | No | No |
| 18586255 | THIN FILM TRANSISTOR AND VERTICAL NON-VOLATILE MEMORY DEVICE INCLUDING TRANSITION METAL-INDUCED POLYCRYSTALLINE METAL OXIDE CHANNEL LAYER | February 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18582809 | SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DETERMINING DETERIORATION DEGREE OF CONDUCTIVE PIPE | February 2024 | December 2024 | Allow | 10 | 1 | 1 | No | No |
| 18444758 | SEMICONDUCTOR STRUCTURE | February 2024 | November 2024 | Allow | 9 | 1 | 0 | No | No |
| 18439785 | INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME | February 2024 | January 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18440071 | Semiconductor Device and Methods of Forming Same | February 2024 | June 2025 | Allow | 16 | 2 | 0 | No | No |
| 18440915 | SEMICONDUCTOR DEVICE PACKAGE | February 2024 | April 2025 | Allow | 14 | 1 | 1 | No | No |
| 18438633 | IMAGING DEVICE COMPRISING NET SHAPE WIRING | February 2024 | June 2025 | Allow | 17 | 2 | 0 | No | No |
| 18420767 | SEMICONDUCTOR PACKAGE | January 2024 | November 2024 | Allow | 10 | 1 | 0 | No | No |
| 18413057 | MEMORY DEVICE | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18412605 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18406403 | Semiconductor Package Using A Coreless Signal Distribution Structure | January 2024 | February 2025 | Allow | 13 | 1 | 0 | No | No |
| 18406745 | THREE-DIMENSIONAL MEMORY DEVICES | January 2024 | June 2025 | Allow | 18 | 0 | 0 | No | No |
| 18405134 | MULTI-LAYER TRENCH CAPACITOR STRUCTURE | January 2024 | November 2024 | Allow | 10 | 1 | 0 | No | No |
| 18405040 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | January 2024 | April 2025 | Allow | 15 | 2 | 1 | No | No |
| 18398162 | PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD | December 2023 | April 2025 | Allow | 16 | 2 | 0 | No | No |
| 18398589 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | December 2023 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18398499 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | December 2023 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18396753 | SEMICONDUCTOR DEVICE WITH VOLTAGE RESISTANT STRUCTURE | December 2023 | June 2025 | Allow | 17 | 1 | 0 | Yes | No |
| 18395662 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD | December 2023 | July 2024 | Allow | 7 | 0 | 0 | No | No |
| 18395617 | SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF | December 2023 | December 2024 | Allow | 12 | 1 | 0 | No | No |
| 18395110 | MULTILAYER CAPACITOR ELECTRODE | December 2023 | October 2024 | Allow | 10 | 1 | 0 | No | No |
| 18543799 | Semiconductor Device and Method | December 2023 | March 2025 | Allow | 15 | 3 | 0 | Yes | No |
| 18537236 | SPLIT SOURCE DRAIN TRANSISTOR | December 2023 | March 2025 | Allow | 15 | 1 | 0 | No | No |
| 18535497 | DISPLAY APPARATUS AND METHOD OF FABRICATING THE SAME | December 2023 | June 2025 | Allow | 18 | 1 | 0 | No | No |
| 18532975 | SCALABLE MPS DEVICE BASED ON SIC | December 2023 | October 2024 | Allow | 10 | 1 | 0 | No | No |
| 18528748 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | December 2023 | November 2024 | Allow | 11 | 1 | 0 | No | No |
| 18526062 | Semiconductor Structure Cutting Process and Structures Formed Thereby | December 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18526663 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD | December 2023 | March 2025 | Allow | 16 | 0 | 0 | No | No |
| 18519460 | INTEGRATED CIRCUIT DEVICE | November 2023 | December 2024 | Allow | 13 | 1 | 0 | No | No |
| 18515619 | HALL EFFECT SENSOR WITH LOW OFFSET AND HIGH LEVEL OF STABILITY | November 2023 | November 2024 | Allow | 11 | 1 | 0 | No | No |
| 18513942 | ROUGH BUFFER LAYER FOR GROUP III-V DEVICES ON SILICON | November 2023 | May 2025 | Allow | 18 | 1 | 1 | Yes | No |
| 18513431 | MOLDED DIRECT BONDED AND INTERCONNECTED STACK | November 2023 | October 2024 | Allow | 11 | 1 | 0 | No | No |
| 18513042 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING THE SAME | November 2023 | September 2024 | Allow | 10 | 1 | 0 | No | No |
| 18512096 | TRENCH PATTERN FOR TRENCH CAPACITOR YIELD IMPROVEMENT | November 2023 | September 2024 | Allow | 10 | 1 | 0 | No | No |
| 18510238 | LOW GATE CURRENT JUNCTION FIELD EFFECT TRANSISTOR DEVICE ARCHITECTURE | November 2023 | March 2025 | Allow | 16 | 2 | 1 | Yes | No |
| 18508581 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURE | November 2023 | September 2024 | Allow | 10 | 1 | 0 | No | No |
| 18388333 | IMAGE SENSOR | November 2023 | March 2025 | Allow | 16 | 1 | 1 | Yes | No |
| 18505058 | DISPLAY DEVICE HAVING CONNECTION UNIT | November 2023 | January 2025 | Allow | 14 | 2 | 0 | Yes | No |
| 18504140 | DISPLAY DEVICE | November 2023 | September 2024 | Allow | 11 | 1 | 0 | No | No |
| 18386913 | ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES | November 2023 | November 2024 | Allow | 12 | 1 | 0 | No | No |
| 18501283 | Patterning Semiconductor Devices and Structures Resulting Therefrom | November 2023 | December 2024 | Allow | 13 | 1 | 0 | No | No |
| 18386487 | 3D 1T1C STACKED DRAM STRUCTURE AND METHOD TO FABRICATE | November 2023 | February 2025 | Allow | 15 | 0 | 0 | No | No |
| 18492689 | MICROELECTRONIC DEVICES INCLUDING PILLARS WITH PARTIALLY-CIRCULAR UPPER PORTIONS AND CIRCULAR LOWER PORTIONS, AND RELATED METHODS | October 2023 | January 2025 | Allow | 15 | 2 | 0 | Yes | No |
| 18382203 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | October 2023 | October 2024 | Allow | 12 | 1 | 1 | No | No |
| 18382214 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STRUCTURE USING TILTED ETCH PROCESS | October 2023 | July 2024 | Allow | 9 | 1 | 0 | No | No |
| 18381791 | Integrated Assemblies and Methods of Forming Integrated Assemblies | October 2023 | July 2024 | Allow | 9 | 0 | 0 | No | No |
| 18487177 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18378609 | An LED-filament comprising a light scattering material layer | October 2023 | March 2025 | Allow | 17 | 2 | 0 | Yes | No |
| 18482710 | THIN FILM TRANSISTOR ARRAY SUBSTRATE AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE INCLUDING THE SAME | October 2023 | August 2024 | Allow | 11 | 1 | 0 | No | No |
| 18482070 | SEMICONDUCTOR DEVICE | October 2023 | October 2024 | Abandon | 12 | 1 | 0 | No | No |
| 18376994 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | October 2023 | January 2025 | Abandon | 15 | 1 | 1 | No | No |
| 18479630 | SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS | October 2023 | August 2024 | Allow | 11 | 1 | 0 | No | No |
| 18375193 | LEAD FRAME AND MANUFACTURING METHOD THEREOF | September 2023 | March 2024 | Allow | 6 | 2 | 0 | No | No |
| 18477290 | SEMICONDUCTOR DEVICE | September 2023 | November 2024 | Allow | 14 | 0 | 1 | No | No |
| 18372716 | SEMICONDUCTOR DEVICE | September 2023 | September 2024 | Allow | 12 | 2 | 0 | No | No |
| 18372226 | DIODE | September 2023 | August 2024 | Allow | 11 | 1 | 0 | No | No |
| 18372546 | STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUBSTRATE HEAT SINKS AND ASSOCIATED SYSTEMS AND METHODS | September 2023 | September 2024 | Allow | 12 | 1 | 1 | No | No |
| 18474168 | PACKAGE STRUCTURE | September 2023 | August 2024 | Allow | 11 | 1 | 0 | No | No |
| 18371107 | DISPLAY DEVICE | September 2023 | May 2025 | Allow | 20 | 1 | 1 | No | No |
| 18471263 | INTEGRATED DESIGN FOR III-NITRIDE DEVICES | September 2023 | January 2025 | Allow | 16 | 2 | 1 | Yes | No |
| 18469666 | SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE | September 2023 | August 2024 | Allow | 11 | 0 | 1 | No | No |
| 18468284 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | September 2023 | June 2024 | Allow | 9 | 0 | 0 | No | No |
| 18244892 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | September 2023 | September 2024 | Allow | 12 | 1 | 0 | No | No |
| 18465050 | SOI WAFERS AND DEVICES WITH BURIED STRESSORS | September 2023 | May 2025 | Allow | 20 | 1 | 0 | No | No |
| 18463290 | METHOD FOR MANUFACTURING LIGHT EMITTING DEVICES | September 2023 | May 2024 | Allow | 8 | 0 | 0 | No | No |
| 18242717 | STANDALONE HIGH VOLTAGE GALVANIC ISOLATION CAPACITORS | September 2023 | October 2024 | Allow | 13 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2815.
With a 28.9% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 28.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Art Unit 2815 is part of Group 2810 in Technology Center 2800. This art unit has examined 16,887 patent applications in our dataset, with an overall allowance rate of 76.9%. Applications typically reach final disposition in approximately 27 months.
Art Unit 2815's allowance rate of 76.9% places it in the 47% percentile among all USPTO art units. This art unit has a below-average allowance rate compared to other art units.
Applications in Art Unit 2815 receive an average of 1.90 office actions before reaching final disposition (in the 58% percentile). The median prosecution time is 27 months (in the 63% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.