USPTO Art Unit 2815 Prosecution Statistics

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18957406FORMATION OF AN ARRAY OF NANOSTRUCTURESNovember 2024April 2025Allow510YesNo
18763075SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS FOR MANUFACTURING THE SAMEJuly 2024March 2025Allow810NoNo
18747379SEMICONDUCTOR DEVICE, FERROELECTRIC CAPACITOR AND LAMINATED STRUCTUREJune 2024May 2025Allow1110NoNo
18743431SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS FOR MANUFACTURING THE SAMEJune 2024January 2025Allow700NoNo
18741063FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHODJune 2024April 2025Allow1010NoNo
18740603SEMICONDUCTOR DEVICEJune 2024March 2025Allow901NoNo
18740444IC PACKAGE WITH HEAT SPREADERJune 2024March 2025Allow900NoNo
18732725RRAM BOTTOM ELECTRODEJune 2024March 2025Allow910NoNo
18680253SOFT ASHING PROCESS FOR FORMING PROTECTIVE LAYER ON CONDUCTIVE CAP LAYER OF SEMICONDUCTOR DEVICEMay 2024May 2025Allow1100NoNo
18678270LEAD FRAME AND MANUFACTURING METHOD THEREOFMay 2024April 2025Allow1010YesNo
18669565SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAMEMay 2024March 2025Allow1010NoNo
18666035SEMICONDUCTOR MEMORY DEVICEMay 2024December 2024Allow700NoNo
18664656HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOFMay 2024February 2025Allow920NoNo
18659523SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MEMORY DEVICE, AND ELECTRONIC DEVICEMay 2024December 2024Allow700NoNo
18649840SELF-ASSEMBLED MONOLAYER FOR ELECTRODE MODIFICATION AND DEVICE COMPRISING SUCH SELF-ASSEMBLED MONOLAYERApril 2024March 2025Allow1010NoNo
18644330MULTI-LAYER DIELECTRIC REFILL FOR PROFILE CONTROL IN SEMICONDUCTOR DEVICESApril 2024April 2025Allow1110NoNo
18645366MANUFACTURING METHOD OF SEMICONDUCTOR DEVICEApril 2024January 2025Allow910NoNo
18641815MEMS RESONATOR INTEGRATED CICRUIT FABRICATIONApril 2024May 2025Allow1310NoNo
18631641BURIED GRID WITH SHIELD IN WIDE BAND GAP MATERIALApril 2024February 2025Allow1010NoNo
18632214DISPLAY DEVICEApril 2024April 2025Allow1210YesNo
18630676PACKAGE FOR AN INTEGRATED CIRCUIT AND MANUFACTURING METHODApril 2024November 2024Allow700NoNo
18627931A STRUCTURE AND METHODS OF FORMING THE STRUCTUREApril 2024February 2025Allow1010NoNo
18626472METHOD AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR LAYER AND SUBSTRATE PROVIDED THEREWITHApril 2024May 2025Allow1310YesNo
18625547SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEApril 2024February 2025Allow1010NoNo
18623766LATERAL FIN STATIC INDUCTION TRANSISTORApril 2024February 2025Allow1110NoNo
18619261SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEMarch 2024October 2024Allow700NoNo
18614757SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEMarch 2024November 2024Allow700NoNo
18608949Semiconductor structureMarch 2024February 2025Allow1120NoNo
18604713SEMICONDUCTOR DEVICEMarch 2024June 2025Abandon1510NoNo
18603246SEMICONDUCTOR STRUCTURE, METHOD FOR FABRICATING THEREOF, AND METHOD FOR FABRICATING SEMICONDUCTOR LAYOUTMarch 2024May 2025Allow1420NoNo
18595569LOW STRESS ASYMMETRIC DUAL SIDE MODULEMarch 2024March 2025Allow1210NoNo
18594215TRENCH CAPACITOR STRUCTURE WITH HYBRID FILLING LAYERMarch 2024January 2025Allow1110NoNo
18592704LOW STRESS ASYMMETRIC DUAL SIDE MODULEMarch 2024March 2025Allow1210NoNo
18589774METHOD TO INDUCE STRAIN IN FINFET CHANNELS FROM AN ADJACENT REGIONFebruary 2024October 2024Allow810NoNo
18586255THIN FILM TRANSISTOR AND VERTICAL NON-VOLATILE MEMORY DEVICE INCLUDING TRANSITION METAL-INDUCED POLYCRYSTALLINE METAL OXIDE CHANNEL LAYERFebruary 2024September 2024Allow700NoNo
18582809SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DETERMINING DETERIORATION DEGREE OF CONDUCTIVE PIPEFebruary 2024December 2024Allow1011NoNo
18444758SEMICONDUCTOR STRUCTUREFebruary 2024November 2024Allow910NoNo
18439785INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAMEFebruary 2024January 2025Allow1110YesNo
18440071Semiconductor Device and Methods of Forming SameFebruary 2024June 2025Allow1620NoNo
18440915SEMICONDUCTOR DEVICE PACKAGEFebruary 2024April 2025Allow1411NoNo
18438633IMAGING DEVICE COMPRISING NET SHAPE WIRINGFebruary 2024June 2025Allow1720NoNo
18420767SEMICONDUCTOR PACKAGEJanuary 2024November 2024Allow1010NoNo
18413057MEMORY DEVICEJanuary 2024August 2024Allow700NoNo
18412605SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFJanuary 2024August 2024Allow700NoNo
18406403Semiconductor Package Using A Coreless Signal Distribution StructureJanuary 2024February 2025Allow1310NoNo
18406745THREE-DIMENSIONAL MEMORY DEVICESJanuary 2024June 2025Allow1800NoNo
18405134MULTI-LAYER TRENCH CAPACITOR STRUCTUREJanuary 2024November 2024Allow1010NoNo
18405040SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAMEJanuary 2024April 2025Allow1521NoNo
18398162PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHODDecember 2023April 2025Allow1620NoNo
18398589LOW STRESS ASYMMETRIC DUAL SIDE MODULEDecember 2023March 2025Allow1410NoNo
18398499LOW STRESS ASYMMETRIC DUAL SIDE MODULEDecember 2023March 2025Allow1410NoNo
18396753SEMICONDUCTOR DEVICE WITH VOLTAGE RESISTANT STRUCTUREDecember 2023June 2025Allow1710YesNo
18395662SEMICONDUCTOR DEVICE AND MANUFACTURING METHODDecember 2023July 2024Allow700NoNo
18395617SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOFDecember 2023December 2024Allow1210NoNo
18395110MULTILAYER CAPACITOR ELECTRODEDecember 2023October 2024Allow1010NoNo
18543799Semiconductor Device and MethodDecember 2023March 2025Allow1530YesNo
18537236SPLIT SOURCE DRAIN TRANSISTORDecember 2023March 2025Allow1510NoNo
18535497DISPLAY APPARATUS AND METHOD OF FABRICATING THE SAMEDecember 2023June 2025Allow1810NoNo
18532975SCALABLE MPS DEVICE BASED ON SICDecember 2023October 2024Allow1010NoNo
18528748METHOD OF FABRICATING SEMICONDUCTOR DEVICEDecember 2023November 2024Allow1110NoNo
18526062Semiconductor Structure Cutting Process and Structures Formed TherebyDecember 2023June 2024Allow700NoNo
18526663THREE-DIMENSIONAL MEMORY DEVICE AND METHODDecember 2023March 2025Allow1600NoNo
18519460INTEGRATED CIRCUIT DEVICENovember 2023December 2024Allow1310NoNo
18515619HALL EFFECT SENSOR WITH LOW OFFSET AND HIGH LEVEL OF STABILITYNovember 2023November 2024Allow1110NoNo
18513942ROUGH BUFFER LAYER FOR GROUP III-V DEVICES ON SILICONNovember 2023May 2025Allow1811YesNo
18513431MOLDED DIRECT BONDED AND INTERCONNECTED STACKNovember 2023October 2024Allow1110NoNo
18513042ELECTRONIC DEVICES AND METHODS OF MANUFACTURING THE SAMENovember 2023September 2024Allow1010NoNo
18512096TRENCH PATTERN FOR TRENCH CAPACITOR YIELD IMPROVEMENTNovember 2023September 2024Allow1010NoNo
18510238LOW GATE CURRENT JUNCTION FIELD EFFECT TRANSISTOR DEVICE ARCHITECTURENovember 2023March 2025Allow1621YesNo
18508581METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURENovember 2023September 2024Allow1010NoNo
18388333IMAGE SENSORNovember 2023March 2025Allow1611YesNo
18505058DISPLAY DEVICE HAVING CONNECTION UNITNovember 2023January 2025Allow1420YesNo
18504140DISPLAY DEVICENovember 2023September 2024Allow1110NoNo
18386913ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES FOR SEMICONDUCTOR PACKAGESNovember 2023November 2024Allow1210NoNo
18501283Patterning Semiconductor Devices and Structures Resulting TherefromNovember 2023December 2024Allow1310NoNo
183864873D 1T1C STACKED DRAM STRUCTURE AND METHOD TO FABRICATENovember 2023February 2025Allow1500NoNo
18492689MICROELECTRONIC DEVICES INCLUDING PILLARS WITH PARTIALLY-CIRCULAR UPPER PORTIONS AND CIRCULAR LOWER PORTIONS, AND RELATED METHODSOctober 2023January 2025Allow1520YesNo
18382203SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEOctober 2023October 2024Allow1211NoNo
18382214SEMICONDUCTOR DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STRUCTURE USING TILTED ETCH PROCESSOctober 2023July 2024Allow910NoNo
18381791Integrated Assemblies and Methods of Forming Integrated AssembliesOctober 2023July 2024Allow900NoNo
18487177SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAMEOctober 2023May 2024Allow700NoNo
18378609An LED-filament comprising a light scattering material layerOctober 2023March 2025Allow1720YesNo
18482710THIN FILM TRANSISTOR ARRAY SUBSTRATE AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE INCLUDING THE SAMEOctober 2023August 2024Allow1110NoNo
18482070SEMICONDUCTOR DEVICEOctober 2023October 2024Abandon1210NoNo
18376994SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEOctober 2023January 2025Abandon1511NoNo
18479630SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODSOctober 2023August 2024Allow1110NoNo
18375193LEAD FRAME AND MANUFACTURING METHOD THEREOFSeptember 2023March 2024Allow620NoNo
18477290SEMICONDUCTOR DEVICESeptember 2023November 2024Allow1401NoNo
18372716SEMICONDUCTOR DEVICESeptember 2023September 2024Allow1220NoNo
18372226DIODESeptember 2023August 2024Allow1110NoNo
18372546STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUBSTRATE HEAT SINKS AND ASSOCIATED SYSTEMS AND METHODSSeptember 2023September 2024Allow1211NoNo
18474168PACKAGE STRUCTURESeptember 2023August 2024Allow1110NoNo
18371107DISPLAY DEVICESeptember 2023May 2025Allow2011NoNo
18471263INTEGRATED DESIGN FOR III-NITRIDE DEVICESSeptember 2023January 2025Allow1621YesNo
18469666SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICESeptember 2023August 2024Allow1101NoNo
18468284SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAMESeptember 2023June 2024Allow900NoNo
18244892SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAMESeptember 2023September 2024Allow1210NoNo
18465050SOI WAFERS AND DEVICES WITH BURIED STRESSORSSeptember 2023May 2025Allow2010NoNo
18463290METHOD FOR MANUFACTURING LIGHT EMITTING DEVICESSeptember 2023May 2024Allow800NoNo
18242717STANDALONE HIGH VOLTAGE GALVANIC ISOLATION CAPACITORSSeptember 2023October 2024Allow1310NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2815.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
166
Examiner Affirmed
118
(71.1%)
Examiner Reversed
48
(28.9%)
Reversal Percentile
31.9%
Lower than average

What This Means

With a 28.9% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.

Strategic Value of Filing an Appeal

Total Appeal Filings
782
Allowed After Appeal Filing
221
(28.3%)
Not Allowed After Appeal Filing
561
(71.7%)
Filing Benefit Percentile
25.6%
Lower than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 28.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.

Strategic Recommendations

Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.

Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.

Art Unit 2815 - Prosecution Statistics Summary

Executive Summary

Art Unit 2815 is part of Group 2810 in Technology Center 2800. This art unit has examined 16,887 patent applications in our dataset, with an overall allowance rate of 76.9%. Applications typically reach final disposition in approximately 27 months.

Comparative Analysis

Art Unit 2815's allowance rate of 76.9% places it in the 47% percentile among all USPTO art units. This art unit has a below-average allowance rate compared to other art units.

Prosecution Patterns

Applications in Art Unit 2815 receive an average of 1.90 office actions before reaching final disposition (in the 58% percentile). The median prosecution time is 27 months (in the 63% percentile).

Strategic Considerations

When prosecuting applications in this art unit, consider the following:

  • The art unit's allowance rate suggests a more challenging examination environment compared to the USPTO average.
  • With more office actions than average, plan for relatively streamlined prosecution.
  • The median prosecution time is shorter than average and should be factored into your continuation and client communication strategies.
  • Review individual examiner statistics within this art unit to identify examiners with particularly favorable or challenging prosecution patterns.

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.