Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18733945 | MULTI-TIER DEEP TRENCH CAPACITOR AND METHODS OF FORMING THE SAME | June 2024 | December 2025 | Allow | 18 | 1 | 1 | No | No |
| 18664656 | HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF | May 2024 | February 2025 | Allow | 9 | 2 | 0 | No | No |
| 18645366 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | April 2024 | January 2025 | Allow | 9 | 1 | 0 | No | No |
| 18625547 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18595569 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | March 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18592704 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | March 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18581813 | SEMICONDUCTOR DEVICE WITH CONDUCTIVE LAYERS HAVING DIFFERENT PATTERN DENSITIES AND METHOD FOR FABRICATING THE SAME | February 2024 | March 2026 | Abandon | 25 | 4 | 0 | No | No |
| 18440915 | SEMICONDUCTOR DEVICE PACKAGE | February 2024 | April 2025 | Allow | 14 | 1 | 1 | No | No |
| 18398589 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | December 2023 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18398499 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | December 2023 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18508581 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURE | November 2023 | September 2024 | Allow | 10 | 1 | 0 | No | No |
| 18505058 | DISPLAY DEVICE HAVING CONNECTION UNIT | November 2023 | January 2025 | Allow | 14 | 2 | 0 | Yes | No |
| 18372546 | STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUBSTRATE HEAT SINKS AND ASSOCIATED SYSTEMS AND METHODS | September 2023 | September 2024 | Allow | 12 | 1 | 1 | No | No |
| 18474168 | PACKAGE STRUCTURE | September 2023 | August 2024 | Allow | 11 | 1 | 0 | No | No |
| 18551372 | PHOTODETECTION DEVICE AND ELECTRONIC DEVICE | September 2023 | December 2025 | Allow | 27 | 0 | 0 | No | No |
| 18551374 | Buried Seam with Kirigami Pattern for 3D Micro LED Display | September 2023 | December 2025 | Allow | 27 | 0 | 0 | No | No |
| 18459793 | SEMICONDUCTOR LIGHT-EMITTING DEVICE | September 2023 | August 2024 | Allow | 12 | 1 | 0 | No | No |
| 18454413 | SEMICONDUCTOR DEVICE | August 2023 | August 2024 | Allow | 12 | 1 | 0 | No | No |
| 18235104 | Protector Cap for Package with Thermal Interface Material | August 2023 | August 2024 | Allow | 12 | 1 | 0 | No | No |
| 18234695 | ELECTRONIC MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC PACKAGE HAVING THE SAME | August 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18446755 | MOBILITY ENHANCEMENT BY SOURCE AND DRAIN STRESS LAYER OR IMPLANTATION IN THIN FILM TRANSISTORS | August 2023 | February 2025 | Allow | 18 | 2 | 1 | Yes | No |
| 18231254 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURE | August 2023 | December 2025 | Allow | 28 | 1 | 1 | No | No |
| 18446382 | METHOD OF MANUFACTURING LIGHT EMITTING DEVICE | August 2023 | February 2025 | Allow | 18 | 1 | 1 | No | No |
| 18230174 | METHOD FOR PHYSICALLY UNCLONABLE FUNCTION THROUGH GATE HEIGHT TUNING | August 2023 | January 2026 | Allow | 29 | 1 | 0 | No | No |
| 18364217 | PACKAGE STRUCTURE | August 2023 | March 2026 | Allow | 31 | 1 | 1 | No | No |
| 18227233 | THIN FILM TRANSISTORS HAVING DOUBLE GATES | July 2023 | June 2024 | Allow | 11 | 0 | 1 | No | No |
| 18357471 | Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusion Barrier Layer | July 2023 | March 2025 | Allow | 20 | 2 | 1 | No | No |
| 18340873 | SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE | June 2023 | March 2026 | Allow | 32 | 1 | 1 | No | No |
| 18339325 | MICROELECTRONIC DEVICE WITH TWO FIELD-EFFECT TRANSISTORS HAVING A COMMON ELECTRODE | June 2023 | September 2025 | Allow | 27 | 0 | 0 | No | No |
| 18331749 | SEMICONDUCTOR DEVICE | June 2023 | March 2026 | Abandon | 33 | 1 | 0 | No | No |
| 18207309 | Anti-Fuse Device by Ferroelectric Characteristic | June 2023 | March 2026 | Abandon | 33 | 1 | 0 | No | No |
| 18327112 | SEMICONDUCTOR DIE HAVING A SODIUM STOPPER IN AN INSULATION LAYER GROOVE AND METHOD OF MANUFACTURING THE SAME | June 2023 | September 2024 | Allow | 16 | 2 | 1 | No | No |
| 18327030 | SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME | May 2023 | September 2024 | Allow | 16 | 1 | 1 | No | No |
| 18254412 | SEMICONDUCTOR MODULE | May 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18311780 | SIC SEMICONDUCTOR DEVICE WITH CURRENT SENSING CAPABILITY | May 2023 | February 2025 | Allow | 21 | 2 | 0 | No | No |
| 18306006 | Image Sensor and Method of Fabricating Same | April 2023 | March 2025 | Allow | 22 | 2 | 1 | Yes | No |
| 18302769 | INTEGRATED CIRCUIT DEVICE WITH HIGH MOBILITY AND SYSTEM OF FORMING THE INTEGRATED CIRCUIT | April 2023 | June 2024 | Allow | 14 | 1 | 1 | No | No |
| 18193776 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | March 2023 | December 2025 | Allow | 32 | 1 | 1 | No | No |
| 18028182 | THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF AND CIRCUIT | March 2023 | February 2026 | Allow | 34 | 1 | 1 | No | No |
| 18186481 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | March 2023 | September 2025 | Allow | 30 | 0 | 1 | No | No |
| 18182390 | MICRO LIGHT-EMITTING DIODE DEVICE | March 2023 | July 2025 | Allow | 28 | 0 | 0 | No | No |
| 17910323 | DISPLAY DEVICE | February 2023 | January 2026 | Allow | 40 | 2 | 0 | No | No |
| 18173455 | LIGHT EMITTING DEVICE AND LIGHTING APPARATUS USING THE SAME | February 2023 | September 2025 | Allow | 31 | 0 | 1 | No | No |
| 18105226 | SEMICONDUCTOR DEVICE | February 2023 | July 2025 | Allow | 29 | 1 | 1 | No | No |
| 18019083 | SUPER JUNCTION SEMICONDUCTOR POWER DEVICE | January 2023 | September 2025 | Allow | 31 | 1 | 0 | No | No |
| 18004763 | LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS | January 2023 | October 2025 | Allow | 33 | 1 | 1 | No | No |
| 18150247 | ISOLATION STRUCTURE WITH MULTIPLE COMPONENTS TO INCREASE IMAGE SENSOR PERFORMANCE | January 2023 | September 2025 | Allow | 33 | 0 | 1 | No | No |
| 18088144 | Quantum Processor Design to Increase Control Footprint | December 2022 | January 2024 | Allow | 13 | 1 | 0 | No | No |
| 18085930 | Body-Source-Tied Transistor | December 2022 | November 2025 | Allow | 35 | 6 | 1 | No | No |
| 18085177 | SEMICONDUCTOR DEVICE | December 2022 | November 2025 | Allow | 35 | 1 | 0 | No | No |
| 17964375 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE | October 2022 | January 2024 | Allow | 15 | 1 | 0 | No | No |
| 17929898 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | September 2022 | December 2023 | Allow | 15 | 2 | 0 | No | No |
| 17929884 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | September 2022 | December 2023 | Allow | 15 | 2 | 0 | No | No |
| 17903006 | DISPLAY APPARATUS | September 2022 | January 2024 | Allow | 16 | 1 | 1 | No | No |
| 17823149 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | August 2022 | September 2023 | Allow | 13 | 1 | 0 | No | No |
| 17823164 | LOW STRESS ASYMMETRIC DUAL SIDE MODULE | August 2022 | September 2023 | Allow | 13 | 1 | 0 | No | No |
| 17896211 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | August 2022 | December 2023 | Allow | 15 | 1 | 0 | No | No |
| 17893543 | SEMICONDUCTOR DEVICE | August 2022 | June 2024 | Allow | 21 | 1 | 1 | No | No |
| 17817222 | SEMICONDUCTOR LAYOUT STRUCTURE AND SEMICONDUCTOR TEST STRUCTURE | August 2022 | February 2026 | Allow | 43 | 1 | 1 | No | No |
| 17816599 | STRUCTURE FOR RADIO FREQUENCY APPLICATIONS | August 2022 | July 2025 | Allow | 35 | 1 | 1 | No | No |
| 17873124 | WAVELENGTH CONVERSION COMPONENT | July 2022 | November 2023 | Allow | 16 | 1 | 1 | No | No |
| 17863925 | METHOD FOR MANUFACTURING BODY-SOURCE-TIED SOI TRANSISTOR | July 2022 | June 2023 | Allow | 11 | 1 | 0 | No | No |
| 17791596 | COOLING DEVICE | July 2022 | August 2025 | Allow | 37 | 1 | 0 | No | No |
| 17857166 | SEMICONDUCTOR PACKAGE, INTEGRATED OPTICAL COMMUNICATION SYSTEM | July 2022 | June 2023 | Allow | 12 | 1 | 1 | Yes | No |
| 17852327 | LIGHT EMITTING DEVICE | June 2022 | May 2023 | Allow | 10 | 1 | 0 | No | No |
| 17847006 | SOI Structures with Carbon in Body Regions for Improved RF-SOI Switches | June 2022 | October 2025 | Allow | 40 | 2 | 1 | No | No |
| 17807930 | MODULE | June 2022 | January 2026 | Abandon | 43 | 2 | 1 | Yes | No |
| 17845715 | SEMICONDUCTOR DEVICE COMPRISING A LATERAL SUPER JUNCTION FIELD EFFECT TRANSISTOR | June 2022 | July 2024 | Allow | 25 | 2 | 1 | No | No |
| 17840636 | INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURE | June 2022 | May 2024 | Allow | 23 | 2 | 1 | Yes | No |
| 17806282 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR MEMORY DEVICE MANUFACTURING METHOD, SEMICONDUCTOR MEMORY DEVICE, AND SUBSTRATE TREATMENT APPARATUS | June 2022 | November 2024 | Allow | 30 | 0 | 1 | No | No |
| 17830291 | Power Module with Multi-Layer Substrate and Second Insulation Layer to Increase Power Density | June 2022 | May 2025 | Allow | 35 | 1 | 1 | No | No |
| 17756576 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | May 2022 | May 2025 | Allow | 36 | 1 | 1 | No | No |
| 17752642 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA | May 2022 | October 2024 | Allow | 29 | 0 | 0 | No | No |
| 17749623 | SUBSTRATE INCLUDING BRIDGE AND ELECTRONIC DEVICE | May 2022 | October 2025 | Allow | 41 | 1 | 1 | No | No |
| 17748863 | Asymmetric Halo-Implant Body-Source-Tied Semiconductor-On-Insulator (SOI) Device | May 2022 | January 2025 | Allow | 32 | 1 | 1 | No | No |
| 17663931 | DISPLAY DEVICE | May 2022 | March 2025 | Allow | 34 | 0 | 0 | No | No |
| 17776696 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | May 2022 | October 2025 | Allow | 41 | 1 | 1 | No | No |
| 17735899 | LDMOS TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | May 2022 | June 2023 | Allow | 14 | 1 | 0 | No | No |
| 17735450 | SOI Structures Including an Indium Retrograde P-Well for Improved RF-SOI Switches | May 2022 | July 2023 | Abandon | 15 | 0 | 1 | No | No |
| 17731099 | MOTHER PANEL FOR DISPLAY PANEL | April 2022 | June 2025 | Allow | 38 | 1 | 1 | No | No |
| 17772242 | SENSOR SEMICONDUCTOR PACKAGE, ARTICLE COMPRISING THE SAME AND MANUFACTURING METHOD THEREOF | April 2022 | December 2024 | Allow | 32 | 1 | 1 | No | No |
| 17771565 | SEMICONDUCTOR DEVICE | April 2022 | April 2025 | Allow | 35 | 2 | 1 | No | No |
| 17728298 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | April 2022 | October 2025 | Abandon | 41 | 2 | 1 | No | No |
| 17711890 | DISPLAY DEVICE HAVING CONNECTION UNIT | April 2022 | July 2023 | Allow | 16 | 1 | 1 | No | No |
| 17707835 | METHOD AND SYSTEM FOR CONTROL OF SIDEWALL ORIENTATION IN VERTICAL GALLIUM NITRIDE FIELD EFFECT TRANSISTORS | March 2022 | October 2024 | Allow | 31 | 0 | 1 | No | No |
| 17764856 | SEMICONDUCTOR ENCAPSULATION METHOD AND SEMICONDUCTOR ENCAPSULATION STRUCTURE | March 2022 | December 2025 | Allow | 45 | 3 | 1 | No | No |
| 17764335 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE, WEARABLE DEVICE, AND DISPLAY METHOD | March 2022 | December 2025 | Allow | 45 | 2 | 1 | No | No |
| 17703400 | SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD | March 2022 | October 2025 | Allow | 43 | 1 | 0 | No | No |
| 17697141 | THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME | March 2022 | October 2024 | Allow | 31 | 3 | 1 | Yes | No |
| 17672241 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | February 2022 | August 2024 | Allow | 30 | 0 | 1 | No | No |
| 17670174 | SEMICONDUCTOR PACKAGES WITH INCREASED POWER HANDLING | February 2022 | October 2024 | Allow | 32 | 2 | 1 | No | No |
| 17668824 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | February 2022 | January 2025 | Allow | 35 | 0 | 1 | No | No |
| 17669306 | CURRENT-DISTRIBUTING PIN STRUCTURE AND METHOD OF FORMING SAME | February 2022 | June 2025 | Allow | 40 | 1 | 1 | No | No |
| 17650389 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | February 2022 | October 2025 | Abandon | 44 | 2 | 1 | No | No |
| 17632209 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHODS THEREOF | February 2022 | August 2024 | Allow | 30 | 0 | 1 | No | No |
| 17585777 | IMAGE SENSOR | January 2022 | April 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17582220 | METHOD OF FORMING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURE | January 2022 | July 2023 | Allow | 17 | 1 | 1 | No | No |
| 17578383 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | January 2022 | April 2024 | Allow | 27 | 2 | 1 | No | No |
| 17577879 | STACKED MODULE ARRANGEMENT | January 2022 | June 2025 | Allow | 41 | 2 | 1 | No | No |
| 17572858 | SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIVE SPACER | January 2022 | October 2024 | Allow | 33 | 1 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner LEE, EUGENE.
With a 27.8% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 38.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner LEE, EUGENE works in Art Unit 2815 and has examined 1,135 patent applications in our dataset. With an allowance rate of 80.8%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 29 months.
Examiner LEE, EUGENE's allowance rate of 80.8% places them in the 51% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by LEE, EUGENE receive 2.11 office actions before reaching final disposition. This places the examiner in the 56% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by LEE, EUGENE is 29 months. This places the examiner in the 65% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +6.8% benefit to allowance rate for applications examined by LEE, EUGENE. This interview benefit is in the 35% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 27.9% of applications are subsequently allowed. This success rate is in the 49% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 27.3% of cases where such amendments are filed. This entry rate is in the 38% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 115.4% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 81% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 70.0% of appeals filed. This is in the 56% percentile among all examiners. Of these withdrawals, 52.4% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 28.9% are granted (fully or in part). This grant rate is in the 16% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 7.1% of allowed cases (in the 89% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 7.0% of allowed cases (in the 85% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.