USPTO Art Unit 1713 Prosecution Statistics

Art Unit Information

Art Unit: 1713
Group: 1710
Tech Center: 1700
Total Cases: 16,186
Last Active: July 2025

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
19277913METHOD OF CLEANING A COLD BOXJuly 2025October 2025Allow300YesNo
19187281METHOD FOR COATING PRODUCTSApril 2025June 2025Allow210NoNo
19116142Method for Manufacturing Trench in Semiconductor Substrate, and Semiconductor DeviceMarch 2025July 2025Allow410NoNo
19015383PHOTOELECTRIC FLUID FIELD CLUSTER CATALYTIC METHOD FOR ATOMIC-SCALE DETERMINISTIC PROCESSINGJanuary 2025May 2025Allow410NoNo
19012636METHOD AND CONTROL SYSTEM FOR APPLYING A POLYMER COATING MATERIAL TO A WIRE USING A COATING APPARATUSJanuary 2025May 2025Allow410YesNo
18986067METHOD FOR CHEMICAL MECHANICAL POLISHING OF A SIC WAFER BASED ON A MAGNETORHEOLOGICAL ELASTIC METAL CONTACT CORROSION POLISHING PADDecember 2024April 2025Allow400NoNo
18972622SLIDING MEMBER AND METHOD OF MANUFACTURING SLIDING MEMBERDecember 2024August 2025Allow810YesNo
18890938POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATESeptember 2024March 2026Allow1810YesNo
18788171METHOD FOR WAFER BACKSIDE POLISHINGJuly 2024January 2026Allow1810NoNo
18784494INTEGRATED SEMICONDUCTOR DIE VESSEL PROCESSING WORKSTATIONSJuly 2024January 2026Allow1810YesNo
18772898PREPARATION FOR PRE-TREATING SURFACES BY CHEMICALLY CONVERTING OXIDE LAYERS OF TITANIUM OR TITANIUM ALLOYSJuly 2024December 2025Allow1711NoNo
18768449SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATIONJuly 2024January 2026Allow1820YesNo
18765990METHOD FOR COATING PRODUCTSJuly 2024October 2024Allow400NoNo
18749534METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRYJune 2024October 2025Allow1611NoNo
18746837METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPERJune 2024July 2025Allow1310NoNo
18744751COMPOSITIONS FOR REMOVING PHOTORESISTS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES USING THE COMPOSITIONSJune 2024April 2025Allow1010YesNo
18733763CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLISHING METAL LAYERJune 2024June 2025Allow1310NoNo
18731567METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND DRY ETCHING AND SEMICONDUCTOR DEVICEJune 2024September 2025Allow1610NoNo
18668703METHODS OF TEMPORARILY ENHANCING THE LUSTER AND BRILLIANCE OF JEWELRY AND GEM STONESMay 2024December 2025Allow1920YesNo
18665395Tapered Bi-Layer Near Field Transducer For Heat-Assisted Magnetic Recording Write HeadsMay 2024December 2025Allow1921NoNo
18665377ETCHING METHODMay 2024June 2025Allow1310NoNo
18706425SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODMay 2024August 2024Allow400NoNo
18645756UNIFIED RINSE AND DRY CLEANING APPARATUS AND METHODSApril 2024March 2026Allow2311NoNo
18644688SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODApril 2024February 2026Allow2211YesNo
18641911METHOD OF REDUCING LEAKAGE OF HEAT TRANSFER GAS AND PLASMA PROCESSING APPARATUSApril 2024June 2024Allow100YesNo
18636818METHODS FOR WET ATOMIC LAYER ETCHING OF MOLYBDENUM IN AQUEOUS SOLUTIONApril 2024February 2026Allow2200NoNo
18634376SHUNT DOOR FOR MAGNETS IN PLASMA PROCESS CHAMBERApril 2024March 2026Allow2300NoNo
18634408CLEANING SOLUTION AND METHOD OF CLEANING WAFERApril 2024August 2025Allow1710NoNo
18633581SUBSTRATE PROCESSING METHODApril 2024September 2025Allow1710NoNo
18628784COMPOSITION AND METHOD FOR CREATING NANOSCALE SURFACE GEOMETRY ON AN IMPLANTABLE DEVICEApril 2024December 2025Allow2020NoNo
18626295MAGNETORHEOLOGICAL-ELASTOMER POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING OF SEMICONDUCTOR WAFER, PREPARATION METHOD AND APPLICATION THEREOFApril 2024June 2024Allow300NoNo
18623586Waterproofing of a Modular Head Cleaning SystemApril 2024March 2025Allow1111YesNo
18619628METHOD FOR ION-ASSISTED SELF-LIMITED CONFORMAL ETCHMarch 2024February 2026Allow2200YesNo
18695439ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HOLE PROCESSING, COPPER-CLAD LAMINATE USING SAME, AND MANUFACTURING METHOD THEREFORMarch 2024February 2026Allow2211NoNo
18693555SELECTIVE THERMAL ATOMIC LAYER ETCHINGMarch 2024November 2025Allow2011NoNo
18611533METHOD FOR ETCHING A LAYER THROUGH A PATTERNED MASK LAYERMarch 2024February 2026Allow2300NoNo
18608191Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including SameMarch 2024July 2025Allow1610YesNo
18608163METHOD OF PROCESSING A SUBSTRATEMarch 2024January 2026Allow2200NoNo
18692792SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUSMarch 2024January 2026Allow2200NoNo
18605574TREATMENT SOLUTION AND TREATMENT METHODMarch 2024February 2026Allow2330NoNo
18603866METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICEMarch 2024July 2025Allow1610NoNo
18602858METHODS FOR WET ATOMIC LAYER ETCHING OF SILICON DIOXIDEMarch 2024January 2026Allow2200YesNo
18601642SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSMarch 2024January 2025Allow1010YesNo
18598859Additives for Grinding Semiconductor WorkpiecesMarch 2024December 2025Allow2141YesNo
18597615CONTAINER WITH TEXTURED SURFACEMarch 2024October 2024Allow712NoNo
18595554SEMICONDUCTOR DEVICE AND METHODMarch 2024January 2025Allow1110NoNo
18594949POROUS SILICON MATERIAL AND METHOD OF MANUFACTUREMarch 2024March 2025Allow1211NoNo
18593622CARRIER SYSTEM AND METHOD FOR LASER CLEANING ADHESIVE FASTENERS HAVING AXIAL COMPONENTSMarch 2024December 2025Allow2110YesNo
18593811NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONSMarch 2024February 2025Allow1210NoNo
18591060METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATEFebruary 2024April 2025Allow1311YesNo
18687465CONTROL METHOD FOR SIDEWALL CONTAMINATION OF MRAM MAGNETIC TUNNELFebruary 2024January 2026Allow2300NoNo
18686896ELECTRODE ARRANGEMENT FOR A ROTARY ATOMIZER AND ASSOCIATED OPERATING METHODFebruary 2024November 2025Allow2111YesNo
18588476METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICEFebruary 2024June 2025Allow1610NoNo
18587747NANO-FEATURED POROUS SILICON MATERIALSFebruary 2024October 2025Allow2010NoNo
18587477Methods for Forming Stacked Layers and Devices Formed ThereofFebruary 2024July 2025Allow1620NoNo
18686790SELF-ALIGNED BUILD-UP PROCESSINGFebruary 2024November 2025Allow2100NoNo
18584164METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH ISOLATION PATTERNS HAVING DIFFERENT HEIGHTSFebruary 2024November 2024Allow810NoNo
18685668SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSFebruary 2024December 2025Allow2100NoNo
18583263METHOD OF PATTERNING A SEMICONDUCTOR STRUCTUREFebruary 2024February 2026Allow2400NoNo
18583264ETCHING COMPOSITIONSFebruary 2024February 2026Abandon2421NoNo
18582263MICROLITHOGRAPHIC FABRICATION OF STRUCTURESFebruary 2024December 2025Allow2220NoNo
18582082SEMICONDUCTOR MEMORY DEVICE MANUFACTURING METHODFebruary 2024January 2026Allow2300NoNo
18684241SLURRY COMPOSITION FOR METAL POLISHINGFebruary 2024March 2026Allow2500NoNo
18435220METHODS TO REMOVE AN EBC FROM A SUBSTRATE AND TO REPAIR A COATED COMPONENTFebruary 2024January 2026Allow2300NoNo
18435232METHODS TO REMOVE AN EBC FROM A SUBSTRATE AND TO REPAIR A COATED COMPONENTFebruary 2024January 2026Allow2300YesNo
18435244ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCHFebruary 2024December 2024Allow1010NoNo
18435576ATOMIC LAYER ETCHING BY ELECTRON WAVEFRONTFebruary 2024August 2024Allow610NoNo
18682061DISTORTION OF PULSES FOR WAFER BIASINGFebruary 2024January 2025Allow1220YesNo
18434121Semiconductor Patterning and Resulting StructuresFebruary 2024May 2025Allow1620NoNo
18429554ENHANCED ETCH SELECTIVITY USING HALIDESFebruary 2024February 2025Allow1210YesNo
18430285METHODS FOR MAKING CUTTING TOOL INSERTS USING PROTECTIVE COATINGSFebruary 2024October 2025Allow2000YesNo
18425816APPARATUS AND METHOD FOR PROCESSING SUBSTRATEJanuary 2024August 2025Allow1920NoNo
18421845SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSJanuary 2024July 2025Allow1720YesNo
18413414BRACING STRUCTURE, SEMICONDUCTOR DEVICE WITH THE SAME, AND METHOD FOR FABRICATING THE SAMEJanuary 2024February 2026Allow2500NoNo
18414436Resonant Frequency Shift as Etch Stop of Gate Oxide of MOSFET TransistorJanuary 2024May 2024Allow411YesNo
18411210SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSJanuary 2024February 2025Allow1310YesNo
18406980FUEL CELL SEPARATOR MANUFACTURING METHODJanuary 2024April 2025Allow1610NoNo
18577590METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICESJanuary 2024January 2025Allow1321NoNo
18576486METHOD OF ETCHING OR DEPOSITING A THIN FILMJanuary 2024March 2026Allow2611YesNo
18402529ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHODS OF MANUFACTURING THEREOFJanuary 2024November 2024Allow1100NoNo
18400891METHOD OF FABRICATING DIFFRACTION GRATINGSDecember 2023April 2025Allow1510NoNo
18400869LOW-K AND TANTALUM NITRIDE BARRIER RECOVERY USING A SOAK PROCESSDecember 2023September 2025Allow2110NoNo
18575308SUPERHYDROPHILIC THICK-FILM pH SENSOR BASED ON CHEMICAL ETCHING, AND PREPARATION METHOD THEREOFDecember 2023July 2024Allow600NoNo
18398894METHODS FOR FORMING AND UTILIZING ANTIMONY CONTAINING FILMS, AND RELATED STRUCTURESDecember 2023January 2026Allow2511NoNo
18574802METHOD OF PRODUCING AN ETCHING MASK, METHOD OF ETCHING A STRUCTURE INTO A SUBSTRATE, USE OF A TETREL LAYER AND STRUCTURE FOR PRODUCING A MASKDecember 2023February 2026Allow2610NoNo
18397722METHODS FOR SELECTIVELY FORMING AND UTILIZING A PASSIVATION LAYER ON A SUBSTRATE AND RELATED STRUCTURES INCLUDING A PASSIVATION LAYERDecember 2023December 2025Allow2420NoNo
18396835METHODS AND ASSEMBLIES FOR SELECTIVELY DEPOSITING MOLYBDENUMDecember 2023February 2026Allow2520NoNo
18396818METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH LINING LAYERDecember 2023September 2025Abandon2040NoNo
18574204PATTERN FORMING METHOD AND PLASMA PROCESSING METHODDecember 2023January 2026Allow2510NoNo
18395006PROCESS CHAMBER VOLUME ADJUSTMENTDecember 2023October 2025Allow2201NoNo
18393632Plasma Etching Method and ApparatusDecember 2023March 2026Allow2701NoNo
18573182MICROFABRICATION TECHNIQUE FOR STRUCTURING NON-PLANAR ELECTROMAGNETIC WAVEGUIDESDecember 2023March 2026Allow2700NoNo
18572916METHODS OF ETCHING GLASS-BASED SHEETSDecember 2023September 2025Allow2100NoNo
18544468PLASMA PROCESSING APPARATUS AND CLEANING METHODDecember 2023August 2025Allow2010YesNo
18543426MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURESDecember 2023October 2025Allow2230NoNo
18544205METHODS AND SYSTEMS FOR IMPROVED DEPOSITION PRODUCTSDecember 2023March 2026Allow2711NoNo
18544237ETCHING METHOD AND PLASMA PROCESSING APPARATUSDecember 2023March 2026Allow2711YesNo
18543677METHOD FOR PROCESSING GLASS BY ALKALINE ETCHINGDecember 2023February 2025Allow1420NoNo
18542612CLEANING ANTI-REFLECTIVE COATING PROCESS CHAMBER PARTSDecember 2023April 2024Allow410YesNo
18542238RETRACTABLE WINDSHIELD DEICERDecember 2023January 2025Abandon1310NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 1713.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
229
Examiner Affirmed
163
(71.2%)
Examiner Reversed
66
(28.8%)
Reversal Percentile
30.4%
Lower than average

What This Means

With a 28.8% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.

Strategic Value of Filing an Appeal

Total Appeal Filings
791
Allowed After Appeal Filing
265
(33.5%)
Not Allowed After Appeal Filing
526
(66.5%)
Filing Benefit Percentile
56.3%
Higher than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 33.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.

Strategic Recommendations

⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.

✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.

Art Unit 1713 - Prosecution Statistics Summary

Executive Summary

Art Unit 1713 is part of Group 1710 in Technology Center 1700. This art unit has examined 16,186 patent applications in our dataset, with an overall allowance rate of 77.3%. Applications typically reach final disposition in approximately 26 months.

Comparative Analysis

Art Unit 1713's allowance rate of 77.3% places it in the 53% percentile among all USPTO art units. This art unit has an above-average allowance rate compared to other art units.

Prosecution Patterns

Applications in Art Unit 1713 receive an average of 1.69 office actions before reaching final disposition (in the 33% percentile). The median prosecution time is 26 months (in the 72% percentile).

Strategic Considerations

When prosecuting applications in this art unit, consider the following:

  • The art unit's allowance rate suggests a more favorable examination environment compared to the USPTO average.
  • With fewer office actions than average, plan for relatively streamlined prosecution.
  • The median prosecution time is shorter than average and should be factored into your continuation and client communication strategies.
  • Review individual examiner statistics within this art unit to identify examiners with particularly favorable or challenging prosecution patterns.

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.