Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19015383 | PHOTOELECTRIC FLUID FIELD CLUSTER CATALYTIC METHOD FOR ATOMIC-SCALE DETERMINISTIC PROCESSING | January 2025 | May 2025 | Allow | 4 | 1 | 0 | No | No |
| 18986067 | METHOD FOR CHEMICAL MECHANICAL POLISHING OF A SIC WAFER BASED ON A MAGNETORHEOLOGICAL ELASTIC METAL CONTACT CORROSION POLISHING PAD | December 2024 | April 2025 | Allow | 4 | 0 | 0 | No | No |
| 18765990 | METHOD FOR COATING PRODUCTS | July 2024 | October 2024 | Allow | 4 | 0 | 0 | No | No |
| 18744751 | COMPOSITIONS FOR REMOVING PHOTORESISTS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES USING THE COMPOSITIONS | June 2024 | April 2025 | Allow | 10 | 1 | 0 | Yes | No |
| 18733763 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLISHING METAL LAYER | June 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18665377 | ETCHING METHOD | May 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18706425 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | May 2024 | August 2024 | Allow | 4 | 0 | 0 | No | No |
| 18641911 | METHOD OF REDUCING LEAKAGE OF HEAT TRANSFER GAS AND PLASMA PROCESSING APPARATUS | April 2024 | June 2024 | Allow | 1 | 0 | 0 | Yes | No |
| 18626295 | MAGNETORHEOLOGICAL-ELASTOMER POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING OF SEMICONDUCTOR WAFER, PREPARATION METHOD AND APPLICATION THEREOF | April 2024 | June 2024 | Allow | 3 | 0 | 0 | No | No |
| 18623586 | Waterproofing of a Modular Head Cleaning System | April 2024 | March 2025 | Allow | 11 | 1 | 1 | Yes | No |
| 18601642 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | March 2024 | January 2025 | Allow | 10 | 1 | 0 | Yes | No |
| 18597615 | CONTAINER WITH TEXTURED SURFACE | March 2024 | October 2024 | Allow | 7 | 1 | 2 | No | No |
| 18595554 | SEMICONDUCTOR DEVICE AND METHOD | March 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18594949 | POROUS SILICON MATERIAL AND METHOD OF MANUFACTURE | March 2024 | March 2025 | Allow | 12 | 1 | 1 | No | No |
| 18593811 | NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS | March 2024 | February 2025 | Allow | 12 | 1 | 0 | No | No |
| 18591060 | METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE | February 2024 | April 2025 | Allow | 13 | 1 | 1 | Yes | No |
| 18588476 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | February 2024 | June 2025 | Allow | 16 | 1 | 0 | No | No |
| 18584164 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH ISOLATION PATTERNS HAVING DIFFERENT HEIGHTS | February 2024 | November 2024 | Allow | 8 | 1 | 0 | No | No |
| 18435244 | ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCH | February 2024 | December 2024 | Allow | 10 | 1 | 0 | No | No |
| 18435576 | ATOMIC LAYER ETCHING BY ELECTRON WAVEFRONT | February 2024 | August 2024 | Allow | 6 | 1 | 0 | No | No |
| 18682061 | DISTORTION OF PULSES FOR WAFER BIASING | February 2024 | January 2025 | Allow | 12 | 2 | 0 | Yes | No |
| 18434121 | Semiconductor Patterning and Resulting Structures | February 2024 | May 2025 | Allow | 16 | 2 | 0 | No | No |
| 18429554 | ENHANCED ETCH SELECTIVITY USING HALIDES | February 2024 | February 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18421845 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | January 2024 | July 2025 | Allow | 17 | 2 | 0 | Yes | No |
| 18414436 | Resonant Frequency Shift as Etch Stop of Gate Oxide of MOSFET Transistor | January 2024 | May 2024 | Allow | 4 | 1 | 1 | Yes | No |
| 18411210 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | January 2024 | February 2025 | Allow | 13 | 1 | 0 | No | No |
| 18406980 | FUEL CELL SEPARATOR MANUFACTURING METHOD | January 2024 | April 2025 | Allow | 16 | 1 | 0 | No | No |
| 18577590 | METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES | January 2024 | January 2025 | Allow | 13 | 2 | 1 | No | No |
| 18402529 | ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHODS OF MANUFACTURING THEREOF | January 2024 | November 2024 | Allow | 11 | 0 | 0 | No | No |
| 18400891 | METHOD OF FABRICATING DIFFRACTION GRATINGS | December 2023 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18575308 | SUPERHYDROPHILIC THICK-FILM pH SENSOR BASED ON CHEMICAL ETCHING, AND PREPARATION METHOD THEREOF | December 2023 | July 2024 | Allow | 6 | 0 | 0 | No | No |
| 18543677 | METHOD FOR PROCESSING GLASS BY ALKALINE ETCHING | December 2023 | February 2025 | Allow | 14 | 2 | 0 | No | No |
| 18542612 | CLEANING ANTI-REFLECTIVE COATING PROCESS CHAMBER PARTS | December 2023 | April 2024 | Allow | 4 | 1 | 0 | Yes | No |
| 18542238 | RETRACTABLE WINDSHIELD DEICER | December 2023 | January 2025 | Abandon | 13 | 1 | 0 | No | No |
| 18569324 | METHOD FOR MANUFACTURING ELECTRODE, AND ELECTRODE | December 2023 | December 2024 | Allow | 12 | 2 | 0 | No | No |
| 18534027 | REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER | December 2023 | September 2024 | Allow | 9 | 1 | 0 | No | No |
| 18525212 | Self-Aligned Semiconductor Device Contacts Having Widths Less Than Minimum Lithography Limits | November 2023 | October 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18522052 | TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME | November 2023 | March 2025 | Allow | 16 | 1 | 1 | No | No |
| 18519571 | COMPOSITION AND PROCESS FOR SELECTIVELY ETCHING A LAYER COMPRISING AN ALUMINIUM COMPOUND IN THE PRESENCE OF LAYERS OF LOW-K MATERIALS, COPPER AND/OR COBALT | November 2023 | February 2025 | Allow | 15 | 1 | 1 | No | No |
| 18516292 | PULSED LASER DEPOSITION METHOD | November 2023 | March 2025 | Allow | 16 | 0 | 0 | No | No |
| 18510137 | FABRICATION OF WAVEGUIDE STRUCTURES | November 2023 | May 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18496222 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | October 2023 | August 2024 | Allow | 10 | 1 | 0 | No | No |
| 18383378 | METAL PACKAGING POWDER COATING COMPOSITIONS, COATED METAL SUBSTRATES, AND METHODS | October 2023 | September 2024 | Allow | 11 | 1 | 0 | No | No |
| 18493386 | AUTOMOTIVE PART IDENTIFICATION MARKING SYSTEM | October 2023 | September 2024 | Allow | 11 | 1 | 1 | No | No |
| 18381516 | Ruthenium CMP Chemistry Based On Halogenation | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18381261 | APPARATUS AND METHOD OF SUBSTRATE EDGE CLEANING AND SUBSTRATE CARRIER HEAD GAP CLEANING | October 2023 | April 2025 | Allow | 18 | 2 | 0 | Yes | No |
| 18488057 | METHOD OF MANUFACTURING VIAS WITH PULSING PLASMA | October 2023 | December 2024 | Allow | 14 | 1 | 0 | No | No |
| 18486746 | CLEANING ANTI-REFLECTIVE COATING PROCESS CHAMBER PARTS | October 2023 | April 2024 | Allow | 6 | 1 | 1 | Yes | No |
| 18379228 | METHOD OF FORMING VANADIUM NITRIDE LAYER AND STRUCTURE INCLUDING THE VANADIUM NITRIDE LAYER | October 2023 | November 2024 | Allow | 14 | 1 | 0 | No | No |
| 18483673 | METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE | October 2023 | December 2024 | Allow | 14 | 1 | 0 | No | No |
| 18377466 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SUBSTRATE | October 2023 | November 2024 | Allow | 14 | 1 | 0 | No | No |
| 18377422 | METHOD OF PREPARING ACTIVE AREAS | October 2023 | July 2024 | Allow | 9 | 1 | 0 | No | No |
| 18480495 | SYSTEMS AND METHODS FOR REVERSE PULSING | October 2023 | June 2025 | Allow | 20 | 1 | 1 | No | No |
| 18373455 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | September 2023 | July 2025 | Allow | 21 | 0 | 0 | No | No |
| 18373514 | POLISHING COMPOSITION | September 2023 | May 2025 | Abandon | 20 | 3 | 0 | No | No |
| 18474114 | ATOMIC LAYER ETCHING BY ELECTRON WAVEFRONT | September 2023 | January 2024 | Allow | 4 | 1 | 0 | No | No |
| 18472551 | HYDROGEN PEROXIDE PLASMA ETCH OF ASHABLE HARD MASK | September 2023 | March 2024 | Allow | 6 | 0 | 0 | No | No |
| 18370921 | LAYOUT DESIGN METHOD AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | September 2023 | June 2025 | Allow | 21 | 0 | 0 | No | No |
| 18469263 | VERTICAL PROBE ARRAYS AND IMPROVED METHODS FOR MAKING USING TEMPORARY OR PERMANENT ALIGNMENT STRUCTURES FOR SETTING OR MAINTAINING PROBE-TO-PROBE RELATIONSHIPS | September 2023 | June 2025 | Allow | 21 | 0 | 0 | Yes | No |
| 18469253 | METHOD OF FORMULATING PEROVSKITE SOLAR CELL MATERIALS | September 2023 | January 2025 | Allow | 16 | 2 | 0 | No | No |
| 18368581 | CHEMICAL MECHANICAL POLISHING OF SUBSTRATES CONTAINING COPPER AND RUTHENIUM | September 2023 | April 2025 | Abandon | 19 | 2 | 0 | No | No |
| 18368032 | CHEMICAL MECHANICAL POLISHING OF SUBSTRATES CONTAINING COPPER AND RUTHENIUM | September 2023 | February 2025 | Allow | 17 | 2 | 0 | No | No |
| 18281447 | METHOD FOR MANUFACTURING MEMBRANE-ELECTRODE ASSEMBLY USING NANO-DISPERSED IONOMER BINDER, AND MEMBRANE-ELECTRODE ASSEMBLY MANUFACTURED THEREBY | September 2023 | March 2025 | Allow | 18 | 1 | 0 | No | No |
| 18242082 | DEFECT FREE GERMANIUM OXIDE GAP FILL | September 2023 | October 2024 | Allow | 14 | 1 | 0 | No | No |
| 18241705 | LITHOGRAPHY METHOD TO FORM STRUCTURES WITH SLANTED ANGLE | September 2023 | October 2024 | Allow | 13 | 1 | 0 | No | No |
| 18279443 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE | August 2023 | June 2025 | Allow | 22 | 0 | 0 | No | No |
| 18458146 | ONE CHAMBER MULTI-STATION SELECTIVE METAL REMOVAL | August 2023 | June 2025 | Allow | 21 | 0 | 0 | No | No |
| 18452511 | DEEP CLEANING METHOD FOR HIGHLY CONTAMINATED SOIL | August 2023 | September 2024 | Allow | 13 | 0 | 0 | Yes | No |
| 18451826 | ETCHING METHOD AND ETCHING APPARATUS | August 2023 | April 2025 | Allow | 20 | 1 | 0 | Yes | No |
| 18277177 | ETCHING SOLUTION, METHOD FOR TREATING SUBSTRATE WITH THE ETCHING SOLUTION, AND METHOD FOR MANUFACTURING SEMICONDUTOR DEVICE | August 2023 | February 2025 | Allow | 18 | 4 | 0 | Yes | No |
| 18233301 | Method and apparatus for dry-cleaning plastics contaminated with organics | August 2023 | March 2024 | Allow | 7 | 1 | 1 | Yes | No |
| 18232737 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND PATTERN FORMATION METHOD | August 2023 | March 2025 | Allow | 19 | 1 | 0 | No | No |
| 18230866 | METHOD AND APPARATUS FOR ENHANCED BLAST STREAM | August 2023 | October 2024 | Abandon | 14 | 1 | 0 | No | No |
| 18229285 | DIRECTIONAL SELECTIVE DEPOSITION | August 2023 | March 2025 | Allow | 19 | 1 | 1 | Yes | No |
| 18226855 | MICROFLUIDIC DEVICES AND METHODS FOR MANUFACTURING MICROFLUIDIC DEVICES | July 2023 | May 2025 | Allow | 22 | 0 | 0 | No | No |
| 18227231 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | July 2023 | December 2024 | Allow | 16 | 1 | 0 | No | No |
| 18226495 | METHOD AND APPARATUS FOR SEMICONDUCTOR WAFER | July 2023 | July 2024 | Allow | 12 | 1 | 0 | Yes | No |
| 18358056 | SEMICONDUCTOR STRUCTURE ETCHING SOLUTION AND METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE USING THE SAME ETCHING SOLUTION | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18225623 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES | July 2023 | December 2024 | Allow | 16 | 1 | 0 | No | No |
| 18357370 | ION BEAM ETCHING CHAMBER WITH ETCHING BY-PRODUCT REDISTRIBUTOR | July 2023 | May 2025 | Allow | 22 | 0 | 0 | Yes | No |
| 18225576 | METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS | July 2023 | August 2024 | Allow | 12 | 1 | 0 | No | No |
| 18357038 | PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD FOR SEMICONDUCTOR DEVICE FABRICATION | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18353624 | STENTS HAVING A HYBRID PATTERN AND METHODS OF MANUFACTURE | July 2023 | March 2025 | Allow | 20 | 1 | 0 | Yes | No |
| 18352529 | METHODS AND SYSTEMS FOR DETECTING AND CONTROLLING THE DOSAGE AND RESIDUAL CONCENTRATION OF HARD SURFACE CLEANERS AND RINSE AIDS IN AN AUTOMOTIVE PARTS WASHER | July 2023 | May 2025 | Allow | 22 | 1 | 1 | Yes | No |
| 18222328 | INTEGRATED SEMICONDUCTOR DIE VESSEL PROCESSING WORKSTATIONS | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18351245 | Bath Systems and Methods Thereof | July 2023 | October 2024 | Allow | 16 | 1 | 1 | No | No |
| 18349476 | Post-CMP Cleaning and Apparatus | July 2023 | August 2024 | Allow | 13 | 2 | 0 | No | No |
| 18347198 | METHOD FOR FORMING PATTERNED MASK LAYER | July 2023 | December 2024 | Allow | 17 | 2 | 0 | No | No |
| 18216800 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE WITH IMPROVED ETCHING PROCESS | June 2023 | November 2024 | Allow | 16 | 1 | 0 | No | No |
| 18215658 | METHOD OF CONTROLLING AN AIR BLOWING APPARATUS | June 2023 | March 2024 | Allow | 8 | 0 | 0 | No | No |
| 18342251 | METHOD FOR CLEANING ELECTROSTATIC CHUCK | June 2023 | March 2025 | Allow | 20 | 2 | 0 | Yes | No |
| 18341929 | CHEMICAL SOLUTION, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, AND METHOD FOR TREATING SUBSTRATE | June 2023 | October 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18214891 | METHOD OF POST-DEPOSITION TREATMENT FOR SILICON OXIDE FILM | June 2023 | August 2024 | Allow | 13 | 1 | 0 | Yes | No |
| 18213785 | LIQUID AMOUNT MEASURING METHOD AND COMPUTER-READABLE RECORDING MEDIUM | June 2023 | August 2024 | Allow | 14 | 1 | 1 | No | No |
| 18340261 | DEPOSITION OF ORGANIC FILMS | June 2023 | January 2025 | Allow | 19 | 2 | 0 | No | No |
| 18339675 | DEVICES, SYSTEMS, AND METHODS FOR SURGICAL INSTRUMENT REPROCESSING | June 2023 | September 2024 | Allow | 15 | 1 | 0 | No | No |
| 18268794 | SILICON ETCHING LIQUID, AND METHOD FOR PRODUCING SILICON DEVICES AND METHOD FOR PROCESSING SUBSTRATES, EACH USING SAID ETCHING LIQUID | June 2023 | June 2025 | Abandon | 24 | 1 | 0 | No | No |
| 18210762 | SYSTEMS AND METHODS FOR DETERMINING A LOCALIZED FLUID VELOCITY ON A SPINNING SUBSTRATE BY TRACKING MOVEMENT OF A TRACER ACROSS THE SPINNING SUBSTRATE | June 2023 | June 2025 | Allow | 24 | 1 | 1 | Yes | No |
| 18210651 | METAL OXIDE PRECLEAN FOR BOTTOM-UP GAPFILL IN MEOL AND BEOL | June 2023 | June 2025 | Allow | 24 | 2 | 0 | Yes | No |
| 18336070 | ETCHING GAS COMPOSITION, SUBSTRATE PROCESSING APPARATUS, AND PATTERN FORMING METHOD USING THE ETCHING GAS COMPOSITION | June 2023 | May 2025 | Allow | 23 | 1 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 1713.
With a 27.7% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 33.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Art Unit 1713 is part of Group 1710 in Technology Center 1700. This art unit has examined 16,179 patent applications in our dataset, with an overall allowance rate of 77.7%. Applications typically reach final disposition in approximately 26 months.
Art Unit 1713's allowance rate of 77.7% places it in the 50% percentile among all USPTO art units. This art unit has an above-average allowance rate compared to other art units.
Applications in Art Unit 1713 receive an average of 1.67 office actions before reaching final disposition (in the 36% percentile). The median prosecution time is 26 months (in the 66% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.