USPTO Examiner PHAM THOMAS T - Art Unit 1713

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18598859Additives for Grinding Semiconductor WorkpiecesMarch 2024December 2025Allow2141YesNo
18583264ETCHING COMPOSITIONSFebruary 2024February 2026Abandon2421NoNo
18574204PATTERN FORMING METHOD AND PLASMA PROCESSING METHODDecember 2023January 2026Allow2510NoNo
18473362Method For Manufacturing DeviceSeptember 2023January 2026Allow2820NoNo
18319187MANUFACTURING METHOD OF PACKAGE SUBSTRATEMay 2023December 2025Allow3110NoNo
18133532MAGNETIC MEMORY DEVICE AND MANUFACTURING METHOD OF MAGNETIC MEMORY DEVICEApril 2023August 2025Allow2910NoNo
18131044METHOD OF MANUFACTURE OF ACOUSTIC WAVE DEVICE WITH TRENCH PORTIONS FOR TRANSVERSE MODE SUPPRESSIONApril 2023March 2026Allow3510NoNo
18129285DENSIFIED SEAM-FREE SILICON GAP FILL PROCESSESMarch 2023September 2025Abandon3010NoNo
18192909MULTISTAGE MICROMECHANICAL TIMEPIECE AND METHOD FOR MAKING SAMEMarch 2023September 2025Abandon3010NoNo
18192820METHOD OF ETCHING THIN FILM AND SUBSTRATE PROCESSING APPARATUSMarch 2023January 2026Allow3421NoNo
18192983ATOMIC LAYER DEPOSITION AND ETCHING OF TRANSITION METAL DICHALCOGENIDE THIN FILMSMarch 2023April 2025Allow2440YesNo
18186643SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODMarch 2023October 2025Allow3111YesNo
18121201AREA SELECTIVE DEPOSITION TEMPLATED BY HYDROGEN AND HALOGEN RESISTSMarch 2023December 2025Allow3320NoNo
18118559PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHODMarch 2023February 2026Abandon3511NoNo
18159842POST-PROCESSING OPTICAL LOSS RECOVERY METHODSJanuary 2023September 2025Abandon3201NoNo
18080838ETCHING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEDecember 2022February 2024Abandon1410NoNo
17983341Method of Plasma EtchingNovember 2022March 2026Allow4020NoNo
17967298SELECTIVE GAS PHASE ETCH OF SILICON GERMANIUM ALLOYSOctober 2022December 2025Allow3840YesYes
17935062METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURESeptember 2022September 2025Abandon3620NoNo
17912954ETCHING METHOD FOR RESIN MOLDED ARTICLE AND ETCHING PROCESS SYSTEM FOR RESIN MOLDED ARTICLESeptember 2022March 2025Abandon3001NoNo
17912943ETCHING METHOD AND ETCHING APPARATUSSeptember 2022March 2026Abandon4231NoNo
17902751METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICESeptember 2022September 2025Abandon3620NoNo
17869013POLISHING COMPOSITION COMPRISING POLISHING PARTICLES HAVING HIGH WATER AFFINITYJuly 2022September 2024Allow2630YesNo
17757026SUBSTRATE PROCESSING METHODJune 2022April 2025Allow3420YesNo
17827652LOW TEMPERATURE SILICON OXIDE GAP FILLMay 2022October 2025Abandon4140YesNo
17661581PROTECTIVE FILM SUBSTANCE FOR LASER PROCESSING AND METHOD OF PROCESSING WORKPIECEMay 2022December 2025Allow4321YesNo
17714150FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATEApril 2022November 2024Abandon3130YesNo
17711136METHOD FOR MAKING A RECESS OR OPENING INTO A PLANAR WORKPIECE USING SUCCESSIVE ETCHINGApril 2022February 2026Allow4631NoYes
17754373SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICEMarch 2022February 2025Allow3511NoNo
17670670METHODS AND SYSTEMS FOR COOLING PLASMA TREATMENT COMPONENTSFebruary 2022April 2024Allow2611NoNo
17666368METHOD AND EQUIPMENT FOR FORMING GAPS IN A MATERIAL LAYERFebruary 2022February 2024Allow2421NoNo
17632727METHOD FOR MANUFACTURING SiC SUBSTRATEFebruary 2022November 2024Allow3420NoNo
17632359METHOD FOR PREPARING A METAL POWDER FOR AN ADDITIVE MANUFACTURING PROCESS AND USE OF SUCH POWDERFebruary 2022August 2024Allow3010NoNo
17585549METHOD FOR TREATING A WAFER SURFACEJanuary 2022December 2024Abandon3540NoNo
17574733Etching of Metal Oxides Using Fluorine and Metal HalidesJanuary 2022March 2025Allow3820YesNo
17568427METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A PCB SUBSTRATEJanuary 2022August 2025Allow4320YesNo
17617151MANUFACTURING METHODS FOR DUAL PORE SENSORSDecember 2021February 2025Abandon3910NoNo
17595053Method for Making Burnout FabricNovember 2021August 2024Allow3320NoNo
17519292Methods of Forming PatternsNovember 2021January 2026Allow5041NoNo
17516096Self-Aligned Double Patterning With Spatial Atomic Layer DepositionNovember 2021July 2025Allow4550NoNo
17509290METHOD AND DEVICE FOR DEPOSITING SILICON ONTO SUBSTRATESOctober 2021October 2023Allow2311YesNo
17496611METHOD FOR ETCHING AN ETCH LAYEROctober 2021September 2025Abandon4840YesNo
17496174ETCHANT COMPOSITIONOctober 2021February 2026Allow5240YesNo
17600189POLISHING HEAD, POLISHING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFERSeptember 2021January 2025Allow4031YesNo
17488169SYSTEMS AND METHODS FOR UNPRECEDENTED CRYSTALLINE QUALITY IN PHYSICAL VAPOR DEPOSITION-BASED ULTRA-THIN ALUMINUM NITRIDE FILMSSeptember 2021May 2025Abandon4441YesNo
17484144APPARATUS AND METHOD FOR ETCHING METAL NITRIDESSeptember 2021February 2024Allow2921YesNo
17480399CMP SLURRIESSeptember 2021June 2025Allow4521YesNo
17471971Focus Ring RegenerationSeptember 2021January 2026Abandon5250YesNo
17463435PATTERN FORMATION METHOD AND TEMPLATE MANUFACTURING METHODAugust 2021June 2025Abandon4520NoNo
17445625ETCHING METHOD AND PLASMA PROCESSING APPARATUSAugust 2021July 2023Abandon2311YesNo
17406801PLASMA ETCHING METHOD, AND PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENTAugust 2021March 2025Abandon4320NoNo
17398013SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSAugust 2021November 2023Abandon2811NoNo
17391075METHOD FOR CLEAN PROCEDURE DURING MANUFACTURING SEMICONDUCTOR DEVICEAugust 2021March 2024Allow3220YesNo
17376337METAL OXIDE DIRECTIONAL REMOVALJuly 2021December 2024Allow4140YesNo
17373161SELECTIVE REMOVAL OF TRANSITION METAL NITRIDE MATERIALSJuly 2021March 2024Allow3220YesNo
17365916HARD ABRASIVE PARTICLE-FREE POLISHING OF HARD MATERIALSJuly 2021August 2023Allow2520YesNo
17356195PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHODJune 2021May 2024Allow3420YesNo
17355981SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICAL PLANARIZATIONJune 2021December 2024Allow4231YesNo
17344700CONTROLLED HARDMASK SHAPING TO CREATE TAPERED SLANTED FINSJune 2021December 2022Allow1810NoNo
17303806ATOMIC LAYER DEPOSITION AND ETCHING OF TRANSITION METAL DICHALCOGENIDE THIN FILMSJune 2021March 2023Allow2120NoNo
17330729PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUSMay 2021August 2023Allow2711YesNo
17244957SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUSApril 2021July 2023Abandon2720YesNo
17237704CORRECTION METHOD AND PLASMA PROCESSING APPARATUSApril 2021June 2025Abandon5061YesNo
17235241CATALYTIC THERMAL DEPOSITION OF CARBON-CONTAINING MATERIALSApril 2021February 2023Allow2220YesNo
17217019Processing of Workpieces Using Flourocarbon PlasmaMarch 2021March 2023Allow2311YesNo
17280065SELECTIVELY ETCHING FOR NANOWIRESMarch 2021July 2022Allow1610NoNo
17206902METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUMMarch 2021August 2025Allow5261YesNo
17203192MANUFACTURING METHOD OF LIQUID EJECTING HEAD AND MANUFACTURING METHOD OF FLOW PATH COMPONENTMarch 2021April 2024Allow3710NoNo
17200141SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSMarch 2021June 2024Abandon4041NoNo
17194840SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSMarch 2021November 2023Abandon3221YesNo
17272081WATER SOLUBLE POLYMERS FOR PATTERN COLLAPSE MITIGATIONFebruary 2021November 2022Abandon2111NoNo
17185320METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUMFebruary 2021November 2023Allow3331YesNo
17184279WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD USING THE SAMEFebruary 2021March 2024Allow3620YesNo
17269602TREATMENT METHODFebruary 2021March 2023Allow2540YesNo
17171894RECONDITIONING OF REACTIVE PROCESS CHAMBER COMPONENTS FOR REDUCED SURFACE OXIDATIONFebruary 2021March 2025Abandon4931NoNo
17267462PLASMA ETCHING METHOD USING FARADAY CAGEFebruary 2021September 2022Allow1910NoNo
17163102METHOD FOR ETCHING OXIDE SEMICONDUCTOR FILM AND PLASMA PROCESSING APPARATUSJanuary 2021April 2024Allow3921YesNo
17155551DEPOSITION METHOD AND DEPOSITION APPARATUSJanuary 2021March 2023Allow2521YesNo
17156068SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEMJanuary 2021December 2023Abandon3531NoNo
17149232PLASMA PROCESSING WITH INDEPENDENT TEMPERATURE CONTROLJanuary 2021June 2023Allow2940YesNo
17144628BY-SITE-COMPENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENTJanuary 2021February 2024Allow3821YesNo
17257241SELECTIVELY ETCHING FOR NANOWIRESDecember 2020October 2025Allow5751YesNo
17133048METHOD OF MAKING A THERMALLY STABLE POLYCRYSTALLINE SUPER HARD CONSTRUCTIONDecember 2020December 2023Abandon3620NoYes
17130503Mask and Reticle Protection with Atomic Layer Deposition (ALD)December 2020August 2024Allow4441YesNo
17128215SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSDecember 2020December 2024Abandon4841YesNo
17253789SUBSTRATE PROCESSING METHODDecember 2020April 2022Allow1610NoNo
17090717ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAMENovember 2020June 2023Allow3111NoNo
17087617METHOD OF FABRICATING POROUS WAFER BATTERYNovember 2020January 2024Abandon3910NoNo
17079116MANUFACTURING METHOD OF A SEMICONDUCTOR SUBSTRATEOctober 2020December 2022Abandon2520NoNo
17064978Plasma Source ConfigurationOctober 2020October 2024Abandon4991YesNo
17060453ETCHING SOLUTION, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICEOctober 2020January 2025Abandon5271NoNo
17028984Methods of Forming Tungsten PillarsSeptember 2020March 2023Abandon3020NoNo
17024766POLISHING COMPOSITIONS AND METHODS OF USE THEREOFSeptember 2020February 2026Abandon6081YesYes
16981560POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHODSeptember 2020October 2022Allow2540YesNo
17018169PATTERN-FORMING METHOD AND COMPOSITIONSeptember 2020November 2021Allow1411NoNo
16979799PLASMA ETCHING METHOD AND PLASMA ETCHING DEVICESeptember 2020November 2024Abandon5021NoNo
16944563Systems and Methods for Improving Planarity using Selective Atomic Layer Etching (ALE)July 2020July 2023Allow3641NoNo
16940589PATTERN-FORMING METHOD, AND COMPOSITIONJuly 2020January 2022Allow1830YesYes
16934762WARM WAFER AFTER ION CRYO-IMPLANTATIONJuly 2020October 2025Allow6051YesNo
16933116SURFACE TREATMENT METHOD OF A POLYMER FOR 5GJuly 2020January 2024Allow4210YesNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner PHAM, THOMAS T.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
39
Examiner Affirmed
23
(59.0%)
Examiner Reversed
16
(41.0%)
Reversal Percentile
63.7%
Higher than average

What This Means

With a 41.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.

Strategic Value of Filing an Appeal

Total Appeal Filings
75
Allowed After Appeal Filing
22
(29.3%)
Not Allowed After Appeal Filing
53
(70.7%)
Filing Benefit Percentile
44.0%
Lower than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 29.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.

Strategic Recommendations

Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.

Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.

Examiner PHAM, THOMAS T - Prosecution Strategy Guide

Executive Summary

Examiner PHAM, THOMAS T works in Art Unit 1713 and has examined 551 patent applications in our dataset. With an allowance rate of 51.5%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 36 months.

Allowance Patterns

Examiner PHAM, THOMAS T's allowance rate of 51.5% places them in the 13% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.

Office Action Patterns

On average, applications examined by PHAM, THOMAS T receive 3.23 office actions before reaching final disposition. This places the examiner in the 90% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by PHAM, THOMAS T is 36 months. This places the examiner in the 35% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.

Interview Effectiveness

Conducting an examiner interview provides a +15.3% benefit to allowance rate for applications examined by PHAM, THOMAS T. This interview benefit is in the 55% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 12.7% of applications are subsequently allowed. This success rate is in the 8% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 21.0% of cases where such amendments are filed. This entry rate is in the 26% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 64.5% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 52% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 51.2% of appeals filed. This is in the 22% percentile among all examiners. Of these withdrawals, 36.6% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.

Petition Practice

When applicants file petitions regarding this examiner's actions, 74.4% are granted (fully or in part). This grant rate is in the 80% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 4% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 2.1% of allowed cases (in the 69% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • Prepare for rigorous examination: With a below-average allowance rate, ensure your application has strong written description and enablement support. Consider filing a continuation if you need to add new matter.
  • Expect multiple rounds of prosecution: This examiner issues more office actions than average. Address potential issues proactively in your initial response and consider requesting an interview early in prosecution.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.