Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18598859 | Additives for Grinding Semiconductor Workpieces | March 2024 | December 2025 | Allow | 21 | 4 | 1 | Yes | No |
| 18583264 | ETCHING COMPOSITIONS | February 2024 | February 2026 | Abandon | 24 | 2 | 1 | No | No |
| 18574204 | PATTERN FORMING METHOD AND PLASMA PROCESSING METHOD | December 2023 | January 2026 | Allow | 25 | 1 | 0 | No | No |
| 18473362 | Method For Manufacturing Device | September 2023 | January 2026 | Allow | 28 | 2 | 0 | No | No |
| 18319187 | MANUFACTURING METHOD OF PACKAGE SUBSTRATE | May 2023 | December 2025 | Allow | 31 | 1 | 0 | No | No |
| 18133532 | MAGNETIC MEMORY DEVICE AND MANUFACTURING METHOD OF MAGNETIC MEMORY DEVICE | April 2023 | August 2025 | Allow | 29 | 1 | 0 | No | No |
| 18131044 | METHOD OF MANUFACTURE OF ACOUSTIC WAVE DEVICE WITH TRENCH PORTIONS FOR TRANSVERSE MODE SUPPRESSION | April 2023 | March 2026 | Allow | 35 | 1 | 0 | No | No |
| 18129285 | DENSIFIED SEAM-FREE SILICON GAP FILL PROCESSES | March 2023 | September 2025 | Abandon | 30 | 1 | 0 | No | No |
| 18192909 | MULTISTAGE MICROMECHANICAL TIMEPIECE AND METHOD FOR MAKING SAME | March 2023 | September 2025 | Abandon | 30 | 1 | 0 | No | No |
| 18192820 | METHOD OF ETCHING THIN FILM AND SUBSTRATE PROCESSING APPARATUS | March 2023 | January 2026 | Allow | 34 | 2 | 1 | No | No |
| 18192983 | ATOMIC LAYER DEPOSITION AND ETCHING OF TRANSITION METAL DICHALCOGENIDE THIN FILMS | March 2023 | April 2025 | Allow | 24 | 4 | 0 | Yes | No |
| 18186643 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | March 2023 | October 2025 | Allow | 31 | 1 | 1 | Yes | No |
| 18121201 | AREA SELECTIVE DEPOSITION TEMPLATED BY HYDROGEN AND HALOGEN RESISTS | March 2023 | December 2025 | Allow | 33 | 2 | 0 | No | No |
| 18118559 | PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD | March 2023 | February 2026 | Abandon | 35 | 1 | 1 | No | No |
| 18159842 | POST-PROCESSING OPTICAL LOSS RECOVERY METHODS | January 2023 | September 2025 | Abandon | 32 | 0 | 1 | No | No |
| 18080838 | ETCHING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | December 2022 | February 2024 | Abandon | 14 | 1 | 0 | No | No |
| 17983341 | Method of Plasma Etching | November 2022 | March 2026 | Allow | 40 | 2 | 0 | No | No |
| 17967298 | SELECTIVE GAS PHASE ETCH OF SILICON GERMANIUM ALLOYS | October 2022 | December 2025 | Allow | 38 | 4 | 0 | Yes | Yes |
| 17935062 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | September 2022 | September 2025 | Abandon | 36 | 2 | 0 | No | No |
| 17912954 | ETCHING METHOD FOR RESIN MOLDED ARTICLE AND ETCHING PROCESS SYSTEM FOR RESIN MOLDED ARTICLE | September 2022 | March 2025 | Abandon | 30 | 0 | 1 | No | No |
| 17912943 | ETCHING METHOD AND ETCHING APPARATUS | September 2022 | March 2026 | Abandon | 42 | 3 | 1 | No | No |
| 17902751 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | September 2022 | September 2025 | Abandon | 36 | 2 | 0 | No | No |
| 17869013 | POLISHING COMPOSITION COMPRISING POLISHING PARTICLES HAVING HIGH WATER AFFINITY | July 2022 | September 2024 | Allow | 26 | 3 | 0 | Yes | No |
| 17757026 | SUBSTRATE PROCESSING METHOD | June 2022 | April 2025 | Allow | 34 | 2 | 0 | Yes | No |
| 17827652 | LOW TEMPERATURE SILICON OXIDE GAP FILL | May 2022 | October 2025 | Abandon | 41 | 4 | 0 | Yes | No |
| 17661581 | PROTECTIVE FILM SUBSTANCE FOR LASER PROCESSING AND METHOD OF PROCESSING WORKPIECE | May 2022 | December 2025 | Allow | 43 | 2 | 1 | Yes | No |
| 17714150 | FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE | April 2022 | November 2024 | Abandon | 31 | 3 | 0 | Yes | No |
| 17711136 | METHOD FOR MAKING A RECESS OR OPENING INTO A PLANAR WORKPIECE USING SUCCESSIVE ETCHING | April 2022 | February 2026 | Allow | 46 | 3 | 1 | No | Yes |
| 17754373 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | March 2022 | February 2025 | Allow | 35 | 1 | 1 | No | No |
| 17670670 | METHODS AND SYSTEMS FOR COOLING PLASMA TREATMENT COMPONENTS | February 2022 | April 2024 | Allow | 26 | 1 | 1 | No | No |
| 17666368 | METHOD AND EQUIPMENT FOR FORMING GAPS IN A MATERIAL LAYER | February 2022 | February 2024 | Allow | 24 | 2 | 1 | No | No |
| 17632727 | METHOD FOR MANUFACTURING SiC SUBSTRATE | February 2022 | November 2024 | Allow | 34 | 2 | 0 | No | No |
| 17632359 | METHOD FOR PREPARING A METAL POWDER FOR AN ADDITIVE MANUFACTURING PROCESS AND USE OF SUCH POWDER | February 2022 | August 2024 | Allow | 30 | 1 | 0 | No | No |
| 17585549 | METHOD FOR TREATING A WAFER SURFACE | January 2022 | December 2024 | Abandon | 35 | 4 | 0 | No | No |
| 17574733 | Etching of Metal Oxides Using Fluorine and Metal Halides | January 2022 | March 2025 | Allow | 38 | 2 | 0 | Yes | No |
| 17568427 | METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A PCB SUBSTRATE | January 2022 | August 2025 | Allow | 43 | 2 | 0 | Yes | No |
| 17617151 | MANUFACTURING METHODS FOR DUAL PORE SENSORS | December 2021 | February 2025 | Abandon | 39 | 1 | 0 | No | No |
| 17595053 | Method for Making Burnout Fabric | November 2021 | August 2024 | Allow | 33 | 2 | 0 | No | No |
| 17519292 | Methods of Forming Patterns | November 2021 | January 2026 | Allow | 50 | 4 | 1 | No | No |
| 17516096 | Self-Aligned Double Patterning With Spatial Atomic Layer Deposition | November 2021 | July 2025 | Allow | 45 | 5 | 0 | No | No |
| 17509290 | METHOD AND DEVICE FOR DEPOSITING SILICON ONTO SUBSTRATES | October 2021 | October 2023 | Allow | 23 | 1 | 1 | Yes | No |
| 17496611 | METHOD FOR ETCHING AN ETCH LAYER | October 2021 | September 2025 | Abandon | 48 | 4 | 0 | Yes | No |
| 17496174 | ETCHANT COMPOSITION | October 2021 | February 2026 | Allow | 52 | 4 | 0 | Yes | No |
| 17600189 | POLISHING HEAD, POLISHING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER | September 2021 | January 2025 | Allow | 40 | 3 | 1 | Yes | No |
| 17488169 | SYSTEMS AND METHODS FOR UNPRECEDENTED CRYSTALLINE QUALITY IN PHYSICAL VAPOR DEPOSITION-BASED ULTRA-THIN ALUMINUM NITRIDE FILMS | September 2021 | May 2025 | Abandon | 44 | 4 | 1 | Yes | No |
| 17484144 | APPARATUS AND METHOD FOR ETCHING METAL NITRIDES | September 2021 | February 2024 | Allow | 29 | 2 | 1 | Yes | No |
| 17480399 | CMP SLURRIES | September 2021 | June 2025 | Allow | 45 | 2 | 1 | Yes | No |
| 17471971 | Focus Ring Regeneration | September 2021 | January 2026 | Abandon | 52 | 5 | 0 | Yes | No |
| 17463435 | PATTERN FORMATION METHOD AND TEMPLATE MANUFACTURING METHOD | August 2021 | June 2025 | Abandon | 45 | 2 | 0 | No | No |
| 17445625 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | August 2021 | July 2023 | Abandon | 23 | 1 | 1 | Yes | No |
| 17406801 | PLASMA ETCHING METHOD, AND PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT | August 2021 | March 2025 | Abandon | 43 | 2 | 0 | No | No |
| 17398013 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | August 2021 | November 2023 | Abandon | 28 | 1 | 1 | No | No |
| 17391075 | METHOD FOR CLEAN PROCEDURE DURING MANUFACTURING SEMICONDUCTOR DEVICE | August 2021 | March 2024 | Allow | 32 | 2 | 0 | Yes | No |
| 17376337 | METAL OXIDE DIRECTIONAL REMOVAL | July 2021 | December 2024 | Allow | 41 | 4 | 0 | Yes | No |
| 17373161 | SELECTIVE REMOVAL OF TRANSITION METAL NITRIDE MATERIALS | July 2021 | March 2024 | Allow | 32 | 2 | 0 | Yes | No |
| 17365916 | HARD ABRASIVE PARTICLE-FREE POLISHING OF HARD MATERIALS | July 2021 | August 2023 | Allow | 25 | 2 | 0 | Yes | No |
| 17356195 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | June 2021 | May 2024 | Allow | 34 | 2 | 0 | Yes | No |
| 17355981 | SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICAL PLANARIZATION | June 2021 | December 2024 | Allow | 42 | 3 | 1 | Yes | No |
| 17344700 | CONTROLLED HARDMASK SHAPING TO CREATE TAPERED SLANTED FINS | June 2021 | December 2022 | Allow | 18 | 1 | 0 | No | No |
| 17303806 | ATOMIC LAYER DEPOSITION AND ETCHING OF TRANSITION METAL DICHALCOGENIDE THIN FILMS | June 2021 | March 2023 | Allow | 21 | 2 | 0 | No | No |
| 17330729 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | May 2021 | August 2023 | Allow | 27 | 1 | 1 | Yes | No |
| 17244957 | SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | April 2021 | July 2023 | Abandon | 27 | 2 | 0 | Yes | No |
| 17237704 | CORRECTION METHOD AND PLASMA PROCESSING APPARATUS | April 2021 | June 2025 | Abandon | 50 | 6 | 1 | Yes | No |
| 17235241 | CATALYTIC THERMAL DEPOSITION OF CARBON-CONTAINING MATERIALS | April 2021 | February 2023 | Allow | 22 | 2 | 0 | Yes | No |
| 17217019 | Processing of Workpieces Using Flourocarbon Plasma | March 2021 | March 2023 | Allow | 23 | 1 | 1 | Yes | No |
| 17280065 | SELECTIVELY ETCHING FOR NANOWIRES | March 2021 | July 2022 | Allow | 16 | 1 | 0 | No | No |
| 17206902 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | March 2021 | August 2025 | Allow | 52 | 6 | 1 | Yes | No |
| 17203192 | MANUFACTURING METHOD OF LIQUID EJECTING HEAD AND MANUFACTURING METHOD OF FLOW PATH COMPONENT | March 2021 | April 2024 | Allow | 37 | 1 | 0 | No | No |
| 17200141 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | March 2021 | June 2024 | Abandon | 40 | 4 | 1 | No | No |
| 17194840 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | March 2021 | November 2023 | Abandon | 32 | 2 | 1 | Yes | No |
| 17272081 | WATER SOLUBLE POLYMERS FOR PATTERN COLLAPSE MITIGATION | February 2021 | November 2022 | Abandon | 21 | 1 | 1 | No | No |
| 17185320 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | February 2021 | November 2023 | Allow | 33 | 3 | 1 | Yes | No |
| 17184279 | WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD USING THE SAME | February 2021 | March 2024 | Allow | 36 | 2 | 0 | Yes | No |
| 17269602 | TREATMENT METHOD | February 2021 | March 2023 | Allow | 25 | 4 | 0 | Yes | No |
| 17171894 | RECONDITIONING OF REACTIVE PROCESS CHAMBER COMPONENTS FOR REDUCED SURFACE OXIDATION | February 2021 | March 2025 | Abandon | 49 | 3 | 1 | No | No |
| 17267462 | PLASMA ETCHING METHOD USING FARADAY CAGE | February 2021 | September 2022 | Allow | 19 | 1 | 0 | No | No |
| 17163102 | METHOD FOR ETCHING OXIDE SEMICONDUCTOR FILM AND PLASMA PROCESSING APPARATUS | January 2021 | April 2024 | Allow | 39 | 2 | 1 | Yes | No |
| 17155551 | DEPOSITION METHOD AND DEPOSITION APPARATUS | January 2021 | March 2023 | Allow | 25 | 2 | 1 | Yes | No |
| 17156068 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM | January 2021 | December 2023 | Abandon | 35 | 3 | 1 | No | No |
| 17149232 | PLASMA PROCESSING WITH INDEPENDENT TEMPERATURE CONTROL | January 2021 | June 2023 | Allow | 29 | 4 | 0 | Yes | No |
| 17144628 | BY-SITE-COMPENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | January 2021 | February 2024 | Allow | 38 | 2 | 1 | Yes | No |
| 17257241 | SELECTIVELY ETCHING FOR NANOWIRES | December 2020 | October 2025 | Allow | 57 | 5 | 1 | Yes | No |
| 17133048 | METHOD OF MAKING A THERMALLY STABLE POLYCRYSTALLINE SUPER HARD CONSTRUCTION | December 2020 | December 2023 | Abandon | 36 | 2 | 0 | No | Yes |
| 17130503 | Mask and Reticle Protection with Atomic Layer Deposition (ALD) | December 2020 | August 2024 | Allow | 44 | 4 | 1 | Yes | No |
| 17128215 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | December 2020 | December 2024 | Abandon | 48 | 4 | 1 | Yes | No |
| 17253789 | SUBSTRATE PROCESSING METHOD | December 2020 | April 2022 | Allow | 16 | 1 | 0 | No | No |
| 17090717 | ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME | November 2020 | June 2023 | Allow | 31 | 1 | 1 | No | No |
| 17087617 | METHOD OF FABRICATING POROUS WAFER BATTERY | November 2020 | January 2024 | Abandon | 39 | 1 | 0 | No | No |
| 17079116 | MANUFACTURING METHOD OF A SEMICONDUCTOR SUBSTRATE | October 2020 | December 2022 | Abandon | 25 | 2 | 0 | No | No |
| 17064978 | Plasma Source Configuration | October 2020 | October 2024 | Abandon | 49 | 9 | 1 | Yes | No |
| 17060453 | ETCHING SOLUTION, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE | October 2020 | January 2025 | Abandon | 52 | 7 | 1 | No | No |
| 17028984 | Methods of Forming Tungsten Pillars | September 2020 | March 2023 | Abandon | 30 | 2 | 0 | No | No |
| 17024766 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | September 2020 | February 2026 | Abandon | 60 | 8 | 1 | Yes | Yes |
| 16981560 | POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD | September 2020 | October 2022 | Allow | 25 | 4 | 0 | Yes | No |
| 17018169 | PATTERN-FORMING METHOD AND COMPOSITION | September 2020 | November 2021 | Allow | 14 | 1 | 1 | No | No |
| 16979799 | PLASMA ETCHING METHOD AND PLASMA ETCHING DEVICE | September 2020 | November 2024 | Abandon | 50 | 2 | 1 | No | No |
| 16944563 | Systems and Methods for Improving Planarity using Selective Atomic Layer Etching (ALE) | July 2020 | July 2023 | Allow | 36 | 4 | 1 | No | No |
| 16940589 | PATTERN-FORMING METHOD, AND COMPOSITION | July 2020 | January 2022 | Allow | 18 | 3 | 0 | Yes | Yes |
| 16934762 | WARM WAFER AFTER ION CRYO-IMPLANTATION | July 2020 | October 2025 | Allow | 60 | 5 | 1 | Yes | No |
| 16933116 | SURFACE TREATMENT METHOD OF A POLYMER FOR 5G | July 2020 | January 2024 | Allow | 42 | 1 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner PHAM, THOMAS T.
With a 41.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 29.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner PHAM, THOMAS T works in Art Unit 1713 and has examined 551 patent applications in our dataset. With an allowance rate of 51.5%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 36 months.
Examiner PHAM, THOMAS T's allowance rate of 51.5% places them in the 13% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.
On average, applications examined by PHAM, THOMAS T receive 3.23 office actions before reaching final disposition. This places the examiner in the 90% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.
The median time to disposition (half-life) for applications examined by PHAM, THOMAS T is 36 months. This places the examiner in the 35% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +15.3% benefit to allowance rate for applications examined by PHAM, THOMAS T. This interview benefit is in the 55% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 12.7% of applications are subsequently allowed. This success rate is in the 8% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.
This examiner enters after-final amendments leading to allowance in 21.0% of cases where such amendments are filed. This entry rate is in the 26% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 64.5% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 52% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 51.2% of appeals filed. This is in the 22% percentile among all examiners. Of these withdrawals, 36.6% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 74.4% are granted (fully or in part). This grant rate is in the 80% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 4% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 2.1% of allowed cases (in the 69% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.