Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19015383 | PHOTOELECTRIC FLUID FIELD CLUSTER CATALYTIC METHOD FOR ATOMIC-SCALE DETERMINISTIC PROCESSING | January 2025 | May 2025 | Allow | 4 | 1 | 0 | No | No |
| 18733763 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLISHING METAL LAYER | June 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18665377 | ETCHING METHOD | May 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18594949 | POROUS SILICON MATERIAL AND METHOD OF MANUFACTURE | March 2024 | March 2025 | Allow | 12 | 1 | 1 | No | No |
| 18593811 | NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS | March 2024 | February 2025 | Allow | 12 | 1 | 0 | No | No |
| 18434121 | Semiconductor Patterning and Resulting Structures | February 2024 | May 2025 | Allow | 16 | 2 | 0 | No | No |
| 18543677 | METHOD FOR PROCESSING GLASS BY ALKALINE ETCHING | December 2023 | February 2025 | Allow | 14 | 2 | 0 | No | No |
| 18522052 | TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME | November 2023 | March 2025 | Allow | 16 | 1 | 1 | No | No |
| 18381516 | Ruthenium CMP Chemistry Based On Halogenation | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18483673 | METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE | October 2023 | December 2024 | Allow | 14 | 1 | 0 | No | No |
| 18242082 | DEFECT FREE GERMANIUM OXIDE GAP FILL | September 2023 | October 2024 | Allow | 14 | 1 | 0 | No | No |
| 18277177 | ETCHING SOLUTION, METHOD FOR TREATING SUBSTRATE WITH THE ETCHING SOLUTION, AND METHOD FOR MANUFACTURING SEMICONDUTOR DEVICE | August 2023 | February 2025 | Allow | 18 | 4 | 0 | Yes | No |
| 18357038 | PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD FOR SEMICONDUCTOR DEVICE FABRICATION | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18347198 | METHOD FOR FORMING PATTERNED MASK LAYER | July 2023 | December 2024 | Allow | 17 | 2 | 0 | No | No |
| 18214891 | METHOD OF POST-DEPOSITION TREATMENT FOR SILICON OXIDE FILM | June 2023 | August 2024 | Allow | 13 | 1 | 0 | Yes | No |
| 18340261 | DEPOSITION OF ORGANIC FILMS | June 2023 | January 2025 | Allow | 19 | 2 | 0 | No | No |
| 18198743 | VAPOR PHASE THERMAL ETCH SOLUTIONS FOR METAL OXO PHOTORESISTS | May 2023 | April 2024 | Allow | 11 | 2 | 0 | No | No |
| 18319330 | AREA SELECTIVE ORGANIC MATERIAL REMOVAL | May 2023 | October 2024 | Allow | 17 | 1 | 0 | No | No |
| 18195570 | METHOD AND DEVICE FOR ETCHING SILICON OXIDE | May 2023 | July 2024 | Allow | 14 | 1 | 0 | No | No |
| 18141530 | Polishing Compositions and Methods of Using Same | May 2023 | October 2023 | Allow | 6 | 6 | 1 | No | No |
| 18134784 | METHODS OF TEMPORARILY ENHANCING THE LUSTER AND BRILLIANCE OF JEWELRY AND GEM STONES | April 2023 | April 2024 | Allow | 12 | 1 | 0 | Yes | No |
| 18116556 | VAPOR PHASE THERMAL ETCH SOLUTIONS FOR METAL OXO PHOTORESISTS | March 2023 | March 2024 | Allow | 12 | 2 | 0 | No | No |
| 18160232 | METHODS AND SYSTEMS FOR CLEANING HIGH ASPECT RATIO STRUCTURES | January 2023 | August 2024 | Allow | 18 | 2 | 1 | Yes | No |
| 18087692 | METHOD AND SYSTEM FOR TREATING SURFACES OF SUBSTRATE | December 2022 | June 2025 | Allow | 30 | 1 | 1 | No | No |
| 18080497 | POROUS SILICON MATERIAL AND METHOD OF MANUFACTURE | December 2022 | November 2023 | Allow | 12 | 1 | 1 | No | No |
| 18072896 | Semiconductor Patterning and Resulting Structures | December 2022 | November 2023 | Allow | 11 | 1 | 0 | No | No |
| 17990011 | Method for selective etching Si in the presence of silicon nitride, its composition and application thereof | November 2022 | November 2023 | Abandon | 12 | 1 | 0 | No | No |
| 17999306 | CHEMICAL POLISHING BATH FOR ALUMINUM AND ALUMINUM ALLOYS, AND METHOD USING SUCH A BATH | November 2022 | April 2025 | Allow | 29 | 0 | 0 | No | No |
| 17998489 | CONTROLLED DEGRADATION OF A STIMULI-RESPONSIVE POLYMER FILM | November 2022 | July 2023 | Allow | 8 | 1 | 0 | No | No |
| 17923774 | VERTICALLY PHASE-SEPARATED LAYER OF A BLOCK COPOLYMER | November 2022 | April 2025 | Abandon | 29 | 0 | 1 | No | No |
| 17977674 | METHOD FOR MANUFACTURING HIGH TRANSMISSION LIGHT CONTROL FILM AND HIGH TRANSMISSION LIGHT CONTROL FILM | October 2022 | May 2025 | Allow | 31 | 1 | 0 | No | No |
| 17973610 | Laser Activated Luminescence System | October 2022 | May 2025 | Allow | 31 | 1 | 1 | No | No |
| 17973747 | METHODS FOR POLISHING SEMICONDUCTOR SUBSTRATES | October 2022 | April 2025 | Allow | 30 | 1 | 0 | No | No |
| 17973799 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND CHEMICAL LIQUID | October 2022 | April 2025 | Allow | 29 | 1 | 0 | Yes | No |
| 17938684 | METHODS OF FORMING SEMICONDUCTOR DEVICES | October 2022 | December 2024 | Allow | 26 | 0 | 0 | No | No |
| 17931374 | END POINT DETECTION METHOD AND APPARATUS FOR ANISOTROPIC ETCHING USING VARIABLE ETCH GAS FLOW | September 2022 | May 2025 | Allow | 32 | 1 | 1 | No | No |
| 17929786 | PROTECTIVE FILM AGENT AND PROCESSING METHOD OF WORKPIECE | September 2022 | April 2025 | Allow | 32 | 1 | 1 | Yes | No |
| 17898052 | TEMPLATE, METHOD FOR MANUFACTURING TEMPLATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | August 2022 | April 2025 | Allow | 32 | 1 | 1 | No | No |
| 17896073 | ETCHANT COMPOSITION AND METHODS FOR MANUFACTURING METAL PATTERN AND ARRAY SUBSTRATE USING THE SAME | August 2022 | September 2024 | Abandon | 24 | 4 | 0 | Yes | No |
| 17895534 | CHEMICAL LIQUID AND TREATMENT METHOD | August 2022 | September 2024 | Abandon | 25 | 2 | 0 | No | No |
| 17893955 | METHODS FOR POLISHING DIELECTRIC LAYER IN FORMING SEMICONDUCTOR DEVICE | August 2022 | August 2023 | Allow | 12 | 1 | 0 | Yes | No |
| 17882199 | METHOD FOR SELECTIVELY REMOVING NICKEL PLATINUM MATERIAL | August 2022 | August 2024 | Abandon | 25 | 4 | 0 | Yes | No |
| 17880479 | Metal Oxide Resists for EUV Patterning and Methods for Developing the Same | August 2022 | March 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 17879873 | DOUBLE HARDMASKS FOR SELF-ALIGNED MULTI-PATTERNING PROCESSES | August 2022 | June 2025 | Allow | 35 | 2 | 0 | No | No |
| 17877089 | METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE | July 2022 | November 2024 | Allow | 27 | 1 | 0 | No | No |
| 17875756 | METAL HARD MASK FOR PRECISE TUNING OF MANDRELS | July 2022 | April 2025 | Allow | 33 | 2 | 0 | No | No |
| 17872054 | In situ generation process and system | July 2022 | June 2025 | Allow | 35 | 2 | 1 | No | No |
| 17869970 | METHOD OF MANUFACTURING COLLECTIVE SUBSTRATE AND COLLECTIVE SUBSTRATE | July 2022 | March 2025 | Abandon | 32 | 0 | 1 | No | No |
| 17867608 | CONTINUOUS ANALYTE SENSORS AND METHODS OF MAKING SAME | July 2022 | May 2025 | Allow | 34 | 1 | 1 | No | No |
| 17812587 | SEMICONDUCTOR PROCESSING LIQUID AND METHOD FOR PROCESSING SUBSTRATE | July 2022 | July 2023 | Allow | 12 | 1 | 0 | No | No |
| 17862820 | Plasma Etching Techniques | July 2022 | July 2023 | Allow | 12 | 2 | 0 | No | No |
| 17860351 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING | July 2022 | March 2025 | Allow | 33 | 3 | 0 | Yes | No |
| 17788834 | METHOD OF TRANSFERRING SEMICONDUCTOR WAFER TO POLISHING APPARATUS AND METHOD OF PRODUCING SEMICONDUCTOR WAFER | June 2022 | July 2024 | Allow | 25 | 0 | 0 | No | No |
| 17808741 | DEPOSITION OF ORGANIC FILMS | June 2022 | September 2024 | Allow | 27 | 3 | 0 | No | No |
| 17847531 | SUBSTRATE PROCESSING METHOD | June 2022 | January 2025 | Allow | 31 | 1 | 0 | No | No |
| 17806367 | ELEMENT CHIP MANUFACTURING METHOD AND SUBSTRATE PROCESSING METHOD | June 2022 | December 2024 | Abandon | 31 | 1 | 0 | No | No |
| 17836562 | SELECTIVE ETCH OF A SUBSTRATE | June 2022 | November 2024 | Allow | 29 | 1 | 0 | No | No |
| 17836889 | METHODS FOR CONDITIONING A PROCESSING REACTOR | June 2022 | November 2023 | Allow | 18 | 2 | 0 | No | No |
| 17836578 | Etching Of Alkali Metal Compounds | June 2022 | January 2024 | Allow | 19 | 1 | 0 | No | No |
| 17836452 | SELECTIVE ETCHING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME | June 2022 | November 2024 | Allow | 29 | 1 | 0 | No | No |
| 17784094 | CHEMICAL MECHANICAL POLISHING SOLUTION | June 2022 | March 2025 | Allow | 34 | 3 | 0 | No | No |
| 17783641 | TIP-TO-TIP GRAPHIC PREPARATION METHOD | June 2022 | April 2024 | Allow | 22 | 0 | 0 | No | No |
| 17756979 | ETCHING METHOD AND ETCHING APPARATUS | June 2022 | December 2024 | Allow | 31 | 1 | 1 | No | No |
| 17805332 | ETCHING COMPOSITION FOR METAL NITRIDE LAYER AND ETCHING METHOD USING THE SAME | June 2022 | May 2024 | Allow | 24 | 2 | 1 | No | No |
| 17781376 | COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND METHOD FOR MANUFACTURING PARTICLES FOR CHEMICAL MECHANICAL POLISHING | June 2022 | October 2024 | Abandon | 28 | 0 | 1 | No | No |
| 17779520 | MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW CONTROL AND MASK SELECTIVITY | May 2022 | September 2024 | Allow | 28 | 1 | 0 | No | No |
| 17664732 | Processes for Reducing Line-End Spacing | May 2022 | April 2024 | Allow | 22 | 0 | 0 | No | No |
| 17752119 | DRY ETCHING METHOD USING POTENTIAL CONTROL OF GRID AND SUBSTRATE | May 2022 | September 2024 | Allow | 28 | 1 | 0 | No | No |
| 17749868 | COMPOSITIONS AND METHODS FOR SELECTIVELY ETCHING SILICON NITRIDE FILMS | May 2022 | February 2024 | Allow | 21 | 1 | 1 | No | No |
| 17746406 | ETCH PROCESS FOR OXIDE OF ALKALINE EARTH METAL | May 2022 | November 2024 | Allow | 30 | 2 | 0 | No | No |
| 17777046 | METHOD FOR POLISHING PARTS MADE OF ALUMINUM | May 2022 | May 2024 | Abandon | 24 | 1 | 0 | No | No |
| 17744050 | METHODS FOR FORMING ELONGATED CONTACT HOLE ENDS | May 2022 | August 2023 | Allow | 15 | 1 | 0 | Yes | No |
| 17743080 | SELECTIVE ETCHANT COMPOSITIONS AND METHODS | May 2022 | June 2024 | Allow | 25 | 3 | 1 | No | No |
| 17738030 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | May 2022 | January 2024 | Allow | 20 | 1 | 1 | No | No |
| 17730751 | AUTONOMOUS OPERATION OF PLASMA PROCESSING TOOL | April 2022 | January 2025 | Allow | 33 | 1 | 1 | Yes | No |
| 17728524 | ETCHING METHOD | April 2022 | February 2024 | Allow | 22 | 1 | 0 | No | No |
| 17725072 | Methods For Wet Atomic Layer Etching Of Copper | April 2022 | November 2023 | Allow | 18 | 0 | 0 | No | No |
| 17659283 | ION IMPLANTATION METHOD FOR REDUCING ROUGHNESS OF PATTERNED RESIST LINES | April 2022 | September 2024 | Allow | 29 | 1 | 0 | Yes | No |
| 17766651 | ETCHING DEVICE FOR SILICON CORE WIRE AND ETCHING METHOD FOR SILICON CORE WIRE | April 2022 | February 2024 | Allow | 23 | 0 | 0 | No | No |
| 17698593 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS | March 2022 | August 2024 | Allow | 29 | 2 | 1 | No | No |
| 17695022 | CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD OF POLISHING TUNGSTEN PATTERN WAFER USING THE SAME | March 2022 | May 2024 | Allow | 26 | 2 | 1 | No | No |
| 17688869 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLISHING METAL LAYER | March 2022 | February 2024 | Allow | 24 | 3 | 0 | Yes | No |
| 17680396 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | February 2022 | November 2023 | Allow | 20 | 2 | 0 | No | No |
| 17652320 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | February 2022 | December 2023 | Allow | 21 | 1 | 1 | Yes | No |
| 17678377 | ETCHANT COMPOSITION FOR PRODUCING GRAPHENE WITH LOW SHEET RESISTANCE | February 2022 | November 2023 | Abandon | 21 | 1 | 0 | No | No |
| 17676235 | STORAGE CONTAINER STORING TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR | February 2022 | October 2023 | Allow | 20 | 1 | 0 | No | No |
| 17636502 | METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER | February 2022 | November 2024 | Allow | 33 | 2 | 0 | Yes | No |
| 17753096 | MANUFACTURE OF SURFACE RELIEF STRUCTURES | February 2022 | July 2024 | Allow | 29 | 1 | 1 | No | No |
| 17674593 | Ruthenium CMP Chemistry Based On Halogenation | February 2022 | October 2023 | Allow | 19 | 1 | 1 | No | No |
| 17672217 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | February 2022 | July 2024 | Allow | 29 | 1 | 1 | Yes | No |
| 17635081 | SYSTEM AND METHOD FOR FABRICATING PHOTONIC DEVICE ELEMENTS | February 2022 | September 2023 | Allow | 19 | 1 | 0 | No | No |
| 17669556 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH LINING LAYER | February 2022 | December 2023 | Allow | 22 | 3 | 0 | No | No |
| 17632816 | COMPOSITIONS FOR TUNGSTEN ETCHING INHIBITION | February 2022 | March 2025 | Allow | 38 | 3 | 1 | No | No |
| 17627054 | ATOMIC LAYER ETCH AND ION BEAM ETCH PATTERNING | January 2022 | May 2024 | Allow | 28 | 1 | 1 | No | No |
| 17647756 | METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE | January 2022 | July 2023 | Allow | 18 | 1 | 0 | No | No |
| 17572162 | Semiconductor Fabrication System Embedded with Effective Baking Module | January 2022 | February 2024 | Allow | 25 | 1 | 0 | No | No |
| 17570386 | MXENE WITH EXCELLENT MECHANICAL STRENGTH AND FAST AND HIGH-YIELD ANHYDROUS SYNTHESIS METHOD THEREOF | January 2022 | August 2024 | Allow | 31 | 3 | 1 | Yes | No |
| 17625176 | RESIST UNDERLAYER FILM-FORMING COMPOSITION | January 2022 | March 2025 | Allow | 38 | 4 | 0 | No | No |
| 17624872 | COMPOSITION, ITS USE AND A PROCESS FOR SELECTIVELY ETCHING SILICON-GERMANIUM MATERIAL | January 2022 | December 2023 | Allow | 23 | 2 | 1 | No | No |
| 17623804 | PLASMA ETCHING METHOD | December 2021 | December 2024 | Allow | 36 | 3 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner LU, JIONG-PING.
With a 12.5% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 25.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner LU, JIONG-PING works in Art Unit 1713 and has examined 940 patent applications in our dataset. With an allowance rate of 84.1%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 21 months.
Examiner LU, JIONG-PING's allowance rate of 84.1% places them in the 53% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by LU, JIONG-PING receive 1.77 office actions before reaching final disposition. This places the examiner in the 53% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by LU, JIONG-PING is 21 months. This places the examiner in the 83% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +7.7% benefit to allowance rate for applications examined by LU, JIONG-PING. This interview benefit is in the 39% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 26.2% of applications are subsequently allowed. This success rate is in the 33% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 51.1% of cases where such amendments are filed. This entry rate is in the 72% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 100.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 68% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 50.0% of appeals filed. This is in the 11% percentile among all examiners. Of these withdrawals, 25.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 29.9% are granted (fully or in part). This grant rate is in the 22% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 0.4% of allowed cases (in the 58% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 4% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.