Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18890938 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | September 2024 | March 2026 | Allow | 18 | 1 | 0 | Yes | No |
| 18706425 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | May 2024 | August 2024 | Allow | 4 | 0 | 0 | No | No |
| 18641911 | METHOD OF REDUCING LEAKAGE OF HEAT TRANSFER GAS AND PLASMA PROCESSING APPARATUS | April 2024 | June 2024 | Allow | 1 | 0 | 0 | Yes | No |
| 18634376 | SHUNT DOOR FOR MAGNETS IN PLASMA PROCESS CHAMBER | April 2024 | March 2026 | Allow | 23 | 0 | 0 | No | No |
| 18619628 | METHOD FOR ION-ASSISTED SELF-LIMITED CONFORMAL ETCH | March 2024 | February 2026 | Allow | 22 | 0 | 0 | Yes | No |
| 18692792 | SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS | March 2024 | January 2026 | Allow | 22 | 0 | 0 | No | No |
| 18602858 | METHODS FOR WET ATOMIC LAYER ETCHING OF SILICON DIOXIDE | March 2024 | January 2026 | Allow | 22 | 0 | 0 | Yes | No |
| 18591060 | METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE | February 2024 | April 2025 | Allow | 13 | 1 | 1 | Yes | No |
| 18587747 | NANO-FEATURED POROUS SILICON MATERIALS | February 2024 | October 2025 | Allow | 20 | 1 | 0 | No | No |
| 18582263 | MICROLITHOGRAPHIC FABRICATION OF STRUCTURES | February 2024 | December 2025 | Allow | 22 | 2 | 0 | No | No |
| 18413414 | BRACING STRUCTURE, SEMICONDUCTOR DEVICE WITH THE SAME, AND METHOD FOR FABRICATING THE SAME | January 2024 | February 2026 | Allow | 25 | 0 | 0 | No | No |
| 18402529 | ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHODS OF MANUFACTURING THEREOF | January 2024 | November 2024 | Allow | 11 | 0 | 0 | No | No |
| 18400891 | METHOD OF FABRICATING DIFFRACTION GRATINGS | December 2023 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18531666 | OPTICAL ELEMENT | December 2023 | August 2025 | Abandon | 20 | 1 | 0 | No | No |
| 18526615 | POLISHING COMPOSITION, POLISHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE | December 2023 | March 2026 | Allow | 27 | 1 | 0 | Yes | No |
| 18519537 | A CHARACTERISTIC STUDY OF ACRYLIC POLYMER DISPERSANT COATED ON SURFACE OF POLISHING PARTICLE | November 2023 | March 2026 | Allow | 27 | 1 | 0 | Yes | No |
| 18510137 | FABRICATION OF WAVEGUIDE STRUCTURES | November 2023 | May 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18289982 | AQUEOUS DISPERSION COMPRISING INORGANIC PARTICLES | November 2023 | February 2026 | Allow | 27 | 1 | 0 | Yes | No |
| 18387877 | APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF PROCESSING SUBSTRATE | November 2023 | January 2026 | Allow | 26 | 1 | 1 | No | No |
| 18559783 | HIGH SELECTIVITY DOPED HARDMASK FILMS | November 2023 | November 2025 | Allow | 24 | 1 | 0 | Yes | No |
| 18559459 | MICROPROCESSING TREATMENT AGENT AND MICROPROCESSING TREATMENT METHOD | November 2023 | February 2026 | Allow | 27 | 1 | 0 | No | No |
| 18503922 | LOW-TEMPERATURE FABRICATION METHOD OF BULK METAMATERIAL STRUCTURES FOR HEAT-SENSITIVE MATERIALS | November 2023 | March 2026 | Allow | 28 | 1 | 0 | Yes | No |
| 18502531 | APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE | November 2023 | February 2026 | Allow | 27 | 1 | 0 | No | No |
| 18386364 | ETCHING COMPOSITIONS | November 2023 | October 2025 | Abandon | 23 | 2 | 0 | No | No |
| 18496823 | Inattentive HF Concentration Vapors Phase Release of Micro-electro-mechanical Systems and Optical Systems | October 2023 | March 2026 | Allow | 28 | 1 | 0 | Yes | No |
| 18380482 | LENS-BASED CONNECTOR ASSEMBLIES HAVING PRECISION ALIGNMENT FEATURES AND METHODS FOR FABRICATING THE SAME | October 2023 | January 2026 | Allow | 27 | 1 | 0 | No | No |
| 18380066 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | October 2023 | October 2025 | Allow | 25 | 0 | 1 | No | No |
| 18480495 | SYSTEMS AND METHODS FOR REVERSE PULSING | October 2023 | June 2025 | Allow | 20 | 1 | 1 | No | No |
| 18374878 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | September 2023 | February 2026 | Allow | 29 | 1 | 1 | No | No |
| 18373455 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | September 2023 | July 2025 | Allow | 21 | 0 | 0 | No | No |
| 18472551 | HYDROGEN PEROXIDE PLASMA ETCH OF ASHABLE HARD MASK | September 2023 | March 2024 | Allow | 6 | 0 | 0 | No | No |
| 18471239 | SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS | September 2023 | March 2026 | Allow | 30 | 1 | 1 | Yes | No |
| 18469263 | VERTICAL PROBE ARRAYS AND IMPROVED METHODS FOR MAKING USING TEMPORARY OR PERMANENT ALIGNMENT STRUCTURES FOR SETTING OR MAINTAINING PROBE-TO-PROBE RELATIONSHIPS | September 2023 | June 2025 | Allow | 21 | 0 | 0 | Yes | No |
| 18550617 | SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS | September 2023 | March 2026 | Allow | 30 | 1 | 1 | Yes | No |
| 18281558 | POLISHING SLURRY COMPOSITION | September 2023 | November 2025 | Allow | 26 | 1 | 0 | No | No |
| 18464041 | Plasma Processing Method and Plasma Processing Apparatus | September 2023 | November 2025 | Allow | 26 | 1 | 0 | No | No |
| 18241606 | SUBSTRATE PROCESSING METHOD | September 2023 | October 2025 | Allow | 26 | 1 | 0 | No | No |
| 18241705 | LITHOGRAPHY METHOD TO FORM STRUCTURES WITH SLANTED ANGLE | September 2023 | October 2024 | Allow | 13 | 1 | 0 | No | No |
| 18279692 | PLASMA PROCESSING METHOD | August 2023 | January 2026 | Allow | 29 | 1 | 0 | No | No |
| 18459362 | SYSTEM OF DETERMINING LEAKAGE OF SEMICONDUCTOR MANUFACTURING TOOL AND USAGE METHOD THEREOF | August 2023 | January 2026 | Allow | 29 | 1 | 1 | No | No |
| 18240008 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE | August 2023 | January 2026 | Allow | 28 | 1 | 1 | Yes | No |
| 18279443 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE | August 2023 | June 2025 | Allow | 22 | 0 | 0 | Yes | No |
| 18456650 | SYSTEM AND METHOD FOR FABRICATING HIGH-ASPECT-RATIO GRATINGS | August 2023 | February 2026 | Allow | 29 | 1 | 1 | Yes | No |
| 18456652 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | August 2023 | September 2025 | Allow | 24 | 0 | 1 | Yes | No |
| 18236975 | Fabrication Technique For Wire Grid Polarizer | August 2023 | September 2025 | Allow | 25 | 1 | 0 | Yes | No |
| 18237067 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | August 2023 | November 2025 | Allow | 27 | 1 | 1 | No | No |
| 18451826 | ETCHING METHOD AND ETCHING APPARATUS | August 2023 | April 2025 | Allow | 20 | 1 | 0 | Yes | No |
| 18226855 | MICROFLUIDIC DEVICES AND METHODS FOR MANUFACTURING MICROFLUIDIC DEVICES | July 2023 | May 2025 | Allow | 22 | 0 | 0 | No | No |
| 18359364 | Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture | July 2023 | August 2025 | Allow | 24 | 2 | 0 | No | No |
| 18225825 | HIGH TRANSPARENCY, HIGH HAZE NANOSTRUCTURED STRUCTURES | July 2023 | March 2026 | Allow | 32 | 2 | 0 | Yes | No |
| 18358056 | SEMICONDUCTOR STRUCTURE ETCHING SOLUTION AND METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE USING THE SAME ETCHING SOLUTION | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18225454 | GAS DISTRIBUTION ASSEMBLIES FOR SEMICONDUCTOR DEVICES | July 2023 | January 2026 | Allow | 30 | 1 | 1 | Yes | No |
| 18225623 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES | July 2023 | December 2024 | Allow | 16 | 1 | 0 | No | No |
| 18357370 | ION BEAM ETCHING CHAMBER WITH ETCHING BY-PRODUCT REDISTRIBUTOR | July 2023 | May 2025 | Allow | 22 | 0 | 0 | Yes | No |
| 18354055 | ETCHANT COMPOSITION FOR ETCHING SILICON AND SILICON GERMANIUM, AND PREPARATION METHOD OF PATTERN USING THE SAME | July 2023 | January 2026 | Allow | 30 | 1 | 1 | Yes | No |
| 18353624 | STENTS HAVING A HYBRID PATTERN AND METHODS OF MANUFACTURE | July 2023 | March 2025 | Allow | 20 | 1 | 0 | Yes | No |
| 18334604 | METHOD FOR PRODUCING STRUCTURED GLASS ARTICLES BY ALKALINE ETCHING | June 2023 | January 2026 | Allow | 31 | 1 | 1 | Yes | No |
| 18333154 | COMPOSITION FOR SURFACE TREATMENT AND SURFACE TREATMENT METHOD USING THE SAME | June 2023 | August 2025 | Allow | 27 | 1 | 1 | Yes | No |
| 18205593 | GLASS ARTICLE AND METHOD FOR PRODUCING THE SAME | June 2023 | March 2025 | Allow | 21 | 1 | 1 | No | No |
| 18255695 | Structured Film and Method of Using Same to Form a Pattern on a Substrate | June 2023 | January 2026 | Allow | 32 | 1 | 1 | Yes | No |
| 18036932 | PLASMA ETCHING METHOD | May 2023 | January 2025 | Allow | 20 | 1 | 0 | Yes | No |
| 18036710 | METHOD FOR MANUFACTURING ULTRA-THIN GLASS SUBSTRATES AND METHOD FOR MANUFACTURING DISPLAY PANEL | May 2023 | May 2025 | Allow | 24 | 1 | 0 | No | No |
| 18139559 | TREATMENT LIQUID FOR SEMICONDUCTOR WITH RUTHENIUM AND METHOD OF PRODUCING THE SAME | April 2023 | December 2024 | Allow | 20 | 1 | 0 | No | No |
| 18032025 | METHOD FOR MANUFACTURING ULTRA-THIN GLASS SUBSTRATES AND METHOD FOR MANUFACTURING DISPLAY PANEL | April 2023 | May 2025 | Allow | 26 | 0 | 0 | Yes | No |
| 18131464 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE | April 2023 | September 2025 | Allow | 29 | 1 | 0 | Yes | No |
| 18030378 | POLISHING LIQUID COMPOSITION FOR SILICON OXIDE FILMS | April 2023 | January 2026 | Abandon | 34 | 1 | 1 | No | No |
| 18189793 | ETCHING A DESIGN ON A METAL SURFACE COVERED WITH A PIGMENTED LAYER | March 2023 | April 2025 | Allow | 25 | 0 | 1 | Yes | No |
| 18187805 | ATTRACTING METHOD | March 2023 | April 2025 | Allow | 25 | 0 | 0 | Yes | No |
| 18123068 | OPERATION METHOD OF ETCHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | March 2023 | July 2025 | Allow | 28 | 0 | 0 | Yes | No |
| 18122337 | ETCHANT COMPOSITION AND MANUFACTURING METHOD OF DISPLAY DEVICE USING THE SAME | March 2023 | February 2026 | Allow | 35 | 1 | 1 | No | No |
| 18179919 | ETCHANT | March 2023 | August 2025 | Allow | 29 | 1 | 1 | Yes | No |
| 18113078 | ETCHING METHOD | February 2023 | July 2024 | Allow | 16 | 0 | 0 | Yes | No |
| 18172563 | METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVING FLUID GUIDING STRUCTURE | February 2023 | November 2024 | Allow | 20 | 1 | 0 | No | No |
| 18003246 | ETCH SELECTIVITY CONTROL IN ATOMIC LAYER ETCHING | December 2022 | December 2024 | Allow | 24 | 0 | 0 | No | No |
| 18003257 | ETCHING OF INDIUM GALLIUM ZINC OXIDE | December 2022 | January 2026 | Allow | 36 | 1 | 1 | Yes | No |
| 18068888 | ETCHANT COMPOSITION FOR SILICON LAYER AND ETCHING METHOD USING THE SAME | December 2022 | August 2025 | Allow | 31 | 1 | 1 | No | No |
| 18010531 | PLASMA REACTION DEVICE AND COOLING METHOD THEREOF | December 2022 | July 2025 | Allow | 31 | 1 | 0 | No | No |
| 17783262 | CHEMICAL-MECHANICAL POLISHING LIQUID | December 2022 | May 2025 | Allow | 35 | 1 | 0 | No | No |
| 18077171 | METHOD FOR REACTIVE ION ETCHING | December 2022 | August 2025 | Allow | 32 | 1 | 1 | No | No |
| 18076511 | ETCHANTS FOR MAKING TEXTURED GLASS ARTICLES | December 2022 | July 2025 | Abandon | 31 | 0 | 1 | No | No |
| 18057233 | OPTICAL ELEMENT AND METHOD FOR MANUFACTURING OPTICAL ELEMENT | November 2022 | July 2025 | Allow | 32 | 1 | 1 | No | No |
| 17986147 | METHOD OF PROCESSING SUBSTRATE | November 2022 | April 2025 | Allow | 29 | 1 | 0 | Yes | No |
| 17998517 | Low Dishing Oxide CMP Polishing Compositions For Shallow Trench Isolation Applications And Methods Of Making Thereof | November 2022 | November 2024 | Allow | 24 | 0 | 0 | Yes | No |
| 18052813 | METHODS OF FORMING PATTERNS USING HARD MASK | November 2022 | April 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 17923123 | PLASMA ETCHING METHOD USING PENTAFLUOROPROPANOL | November 2022 | January 2025 | Allow | 26 | 1 | 0 | No | No |
| 17997505 | METHOD FOR ETCHING CURVED SUBSTRATE | October 2022 | June 2023 | Allow | 8 | 0 | 0 | No | No |
| 17970804 | FABRICATION OF WAVEGUIDE STRUCTURES | October 2022 | August 2023 | Allow | 10 | 0 | 0 | Yes | No |
| 17917155 | PLASMA ETCHING METHOD USING PERFLUOROISOPROPYL VINYL ETHER | October 2022 | September 2024 | Allow | 23 | 0 | 0 | Yes | No |
| 17937123 | Method for Manufacturing an Integrated MEMS Transducer Device and Integrated MEMS Transducer Device | September 2022 | November 2023 | Allow | 13 | 1 | 0 | No | No |
| 17914821 | POLISHING COMPOSITION | September 2022 | January 2026 | Abandon | 40 | 2 | 1 | Yes | No |
| 17950774 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | September 2022 | July 2025 | Allow | 33 | 1 | 1 | Yes | No |
| 17946609 | METHODS TO PREVENT SURFACE CHARGE INDUCED CD-DEPENDENT ETCHING OF MATERIAL FORMED WITHIN FEATURES ON A PATTERNED SUBSTRATE | September 2022 | September 2024 | Allow | 24 | 1 | 0 | No | No |
| 17933075 | STRUCTURE AND MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE FILTER WITH BACK ELECTRODE OF PIEZOELECTRIC LAYER | September 2022 | May 2024 | Allow | 20 | 0 | 0 | Yes | No |
| 17932341 | FILM-FORMING METHOD AND FILM-FORMING SYSTEM | September 2022 | May 2025 | Allow | 32 | 1 | 1 | Yes | No |
| 17944540 | METHODS OF HIGHLY SELECTIVE SILICON OXIDE REMOVAL | September 2022 | January 2025 | Allow | 29 | 1 | 0 | Yes | No |
| 17942369 | METHODS FOR PLANARIZING A SUBSTRATE USING A COMBINED WET ETCH AND CHEMICAL MECHANICAL POLISHING (CMP) PROCESS | September 2022 | August 2024 | Allow | 23 | 1 | 0 | No | No |
| 17942387 | WET ETCH PROCESS AND METHOD TO CONTROL FIN HEIGHT AND CHANNEL AREA IN A FIN FIELD EFFECT TRANSISTOR (FINFET) | September 2022 | September 2024 | Allow | 24 | 1 | 0 | No | No |
| 17942359 | WET ETCH PROCESS AND METHOD TO PROVIDE UNIFORM ETCHING OF MATERIAL FORMED WITHIN FEATURES HAVING DIFFERENT CRITICAL DIMENSION (CD) | September 2022 | August 2024 | Allow | 23 | 1 | 0 | No | No |
| 17903417 | CONTROL METHOD OF MULTI-STAGE ETCHING PROCESS AND PROCESSING DEVICE USING THE SAME | September 2022 | October 2025 | Allow | 37 | 2 | 1 | Yes | No |
| 17902507 | POLISHING METHOD, AND POLISHING COMPOSITION AND METHOD FOR PRODUCING THE SAME | September 2022 | June 2024 | Abandon | 21 | 2 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner AHMED, SHAMIM.
With a 15.4% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 29.8% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner AHMED, SHAMIM works in Art Unit 1713 and has examined 1,140 patent applications in our dataset. With an allowance rate of 82.0%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 26 months.
Examiner AHMED, SHAMIM's allowance rate of 82.0% places them in the 54% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by AHMED, SHAMIM receive 1.50 office actions before reaching final disposition. This places the examiner in the 26% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by AHMED, SHAMIM is 26 months. This places the examiner in the 75% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +21.1% benefit to allowance rate for applications examined by AHMED, SHAMIM. This interview benefit is in the 65% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 31.8% of applications are subsequently allowed. This success rate is in the 66% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 24.4% of cases where such amendments are filed. This entry rate is in the 33% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 121.7% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 83% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 69.0% of appeals filed. This is in the 55% percentile among all examiners. Of these withdrawals, 62.1% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 56.6% are granted (fully or in part). This grant rate is in the 59% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 3.9% of allowed cases (in the 83% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.6% of allowed cases (in the 57% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.