Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 17138227 | METHOD OF MAKING MOISTURE BARRIER FOR BOND PADS AND INTEGRATED CIRCUIT HAVING THE SAME | December 2020 | March 2022 | Allow | 14 | 1 | 0 | No | No |
| 17137643 | SEMICONDUCTOR DEVICE WITH A LIFETIME KILLER REGION IN THE SUBSTRATE | December 2020 | July 2022 | Allow | 18 | 1 | 0 | Yes | No |
| 17138825 | DISPLAY PANEL AND DISPLAY DEVICE | December 2020 | November 2023 | Allow | 34 | 0 | 1 | No | No |
| 17138394 | LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC APPLIANCE, AND LIGHTING DEVICE | December 2020 | September 2022 | Allow | 20 | 0 | 0 | No | No |
| 17137363 | POWER MODULE PACKAGE STRUCTURE | December 2020 | September 2022 | Allow | 20 | 1 | 0 | No | No |
| 17137300 | Image sensor and manufacturing method thereof | December 2020 | January 2023 | Allow | 24 | 1 | 0 | No | No |
| 17136169 | NANO MULTILAYER CARBON-RICH LOW-K SPACER | December 2020 | August 2023 | Allow | 32 | 2 | 0 | Yes | No |
| 17136286 | SPACER WITH PATTERN LAYOUT FOR DUAL SIDE COOLING POWER MODULE | December 2020 | September 2022 | Allow | 21 | 1 | 1 | Yes | No |
| 17135590 | METHOD FOR FORMING IMAGE SENSOR | December 2020 | June 2022 | Allow | 18 | 1 | 0 | Yes | No |
| 17135778 | INTER-LEVEL CONNECTION FOR MULTI-LAYER STRUCTURES | December 2020 | August 2022 | Allow | 20 | 1 | 0 | No | No |
| 17135486 | LIGHT EMITTING DEVICE INCLUDING LIGHT EMITTING UNIT ARRANGED IN A TUBE | December 2020 | July 2022 | Allow | 19 | 0 | 0 | No | No |
| 17256185 | METHOD FOR TRANSFERING CHIP, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE | December 2020 | October 2023 | Allow | 34 | 0 | 0 | No | No |
| 17133178 | SEMICONDUCTOR DEVICE WITH IMPROVED CONTACT RESISTANCE AND VIA CONNECTIVITY | December 2020 | January 2023 | Allow | 25 | 2 | 0 | Yes | No |
| 17131568 | JFET WITH IMPLANT ISOLATION | December 2020 | December 2022 | Allow | 24 | 0 | 1 | Yes | No |
| 17129971 | HIGH ASPECT RATIO VIAS FOR INTEGRATED CIRCUITS | December 2020 | February 2023 | Allow | 26 | 2 | 1 | No | No |
| 17128383 | REMOTELY CONTROLLING ASPECTS OF POOLS AND SPAS | December 2020 | April 2022 | Allow | 16 | 1 | 0 | No | No |
| 17129422 | AVALANCHE DIODE ALONG WITH VERTICAL PN JUNCTION AND METHOD FOR MANUFACTURING THE SAME FIELD | December 2020 | January 2022 | Allow | 13 | 0 | 0 | No | No |
| 17127083 | PAD-OUT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | December 2020 | March 2022 | Allow | 15 | 1 | 0 | Yes | No |
| 17127019 | PAD STRUCTURES FOR SEMICONDUCTOR DEVICES | December 2020 | April 2022 | Allow | 16 | 1 | 0 | No | No |
| 17127671 | SEMICONDUCTOR PACKAGE INCLUDING ALIGNMENT MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | December 2020 | August 2022 | Allow | 20 | 1 | 0 | No | No |
| 17127750 | FAN-OUT WAFER-LEVEL PACKAGING (FOWLP) INTEGRATED CIRCUITS (ICs) EMPLOYING AN ELECTRO-MAGNETIC INTERFERENCE (EMI) SHIELD STRUCTURE IN UNUSED FAN-OUT AREA FOR EMI SHIELDING, AND RELATED FABRICATION METHODS | December 2020 | April 2023 | Abandon | 28 | 1 | 1 | No | No |
| 17127230 | SEMICONDUCTOR DEVICE INCLUDING FIN-FET AND MISALIGNED SOURCE AND DRAIN CONTACTS | December 2020 | February 2023 | Allow | 26 | 2 | 0 | No | No |
| 17127323 | MICROSCALE METALLIC CNT TEMPLATED DEVICES AND RELATED METHODS | December 2020 | August 2022 | Allow | 20 | 1 | 0 | Yes | No |
| 17124762 | SEMICONDUCTOR DIE FOR DETERMINING LOAD OF THROUGH SILICON VIA AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | December 2020 | September 2021 | Allow | 9 | 0 | 0 | No | No |
| 17124801 | FUSES TO MEASURE ELECTROSTATIC DISCHARGE DURING DIE TO SUBSTRATE OR PACKAGE ASSEMBLY | December 2020 | July 2022 | Allow | 19 | 1 | 0 | No | No |
| 17125215 | Polarization Axis Attenuation and Cross Polarization Resistant Antenna Orientation Assembly for Tracked Object | December 2020 | February 2022 | Allow | 14 | 1 | 0 | No | No |
| 17125995 | RELIABLE SEMICONDUCTOR PACKAGES FOR SENSOR CHIPS | December 2020 | February 2023 | Allow | 26 | 3 | 1 | No | No |
| 17125593 | INTEGRATED CIRCUIT PACKAGES WITH CONDUCTIVE ELEMENT HAVING CAVITIES HOUSING ELECTRICALLY CONNECTED EMBEDDED COMPONENTS | December 2020 | September 2023 | Allow | 33 | 2 | 0 | No | No |
| 17122934 | SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING | December 2020 | August 2022 | Allow | 20 | 1 | 1 | Yes | No |
| 17252357 | METHOD FOR MANUFACTURING A MEMORY DEVICE AND MEMORY DEVICE MANUFACTURED THROUGH THE SAME METHOD | December 2020 | November 2023 | Allow | 35 | 1 | 1 | Yes | No |
| 17120524 | OPTOELECTRONIC ASSEMBLY AND METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY | December 2020 | April 2022 | Allow | 16 | 2 | 0 | Yes | No |
| 17120696 | Contact Plug With Impurity Variation | December 2020 | March 2022 | Allow | 15 | 1 | 0 | Yes | No |
| 17120932 | Short Circuit Protection Structure in MOS-Gated Power Devices | December 2020 | February 2023 | Allow | 26 | 1 | 0 | Yes | No |
| 17120902 | INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD SYSTEMS | December 2020 | September 2022 | Allow | 21 | 1 | 0 | Yes | No |
| 17120769 | CHIP PACKAGE WITH REDISTRIBUTION LAYERS | December 2020 | February 2022 | Allow | 14 | 1 | 0 | No | No |
| 17121222 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE | December 2020 | April 2022 | Allow | 16 | 1 | 0 | No | No |
| 17119771 | SEMICONDUCTOR DEVICE WITH CAPACITORS HAVING SHARED ELECTRODE AND METHOD FOR FABRICATING THE SAME | December 2020 | January 2023 | Allow | 25 | 1 | 1 | No | No |
| 17119095 | SEMICONDUCTOR MEMORY DEVICE | December 2020 | March 2022 | Allow | 16 | 0 | 0 | No | No |
| 17118502 | PROCESS OF FORMING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) AND HEMT FORMED BY THE SAME | December 2020 | April 2022 | Abandon | 16 | 1 | 0 | No | No |
| 17113170 | MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION | December 2020 | February 2022 | Allow | 14 | 0 | 0 | No | No |
| 17114391 | SILICON CONTROLLED RECTIFIER WITH A GATE ELECTRODE FOR ELECTROSTATIC DISCHARGE PROTECTION | December 2020 | March 2022 | Allow | 15 | 1 | 1 | No | No |
| 17113653 | METAL OXIDE FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE | December 2020 | February 2022 | Allow | 14 | 1 | 0 | Yes | No |
| 17113563 | SEMICONDUCTOR DEVICE ALONG WITH MULTI-FUNCTIONAL UNITS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | December 2020 | January 2023 | Allow | 25 | 0 | 0 | No | No |
| 17113345 | SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND METHOD THEREFOR | December 2020 | May 2023 | Allow | 29 | 2 | 0 | No | No |
| 17111335 | SEMICONDUCTOR DEVICE PACKAGE INCLUDING PROMOTERS AND METHOD OF MANUFACTURING THE SAME | December 2020 | July 2022 | Allow | 20 | 1 | 0 | No | No |
| 17110762 | TAILORING SENSOR EMISSION POWER TO MAP, VEHICLE STATE, AND ENVIRONMENT | December 2020 | January 2022 | Allow | 14 | 1 | 0 | No | No |
| 15734772 | SEMICONDUCTOR CHIP STACK ARRANGEMENT AND SEMICONDUCTOR CHIP FOR PRODUCING SUCH A SEMICONDUCTOR CHIP STACK ARRANGEMENT | December 2020 | March 2022 | Allow | 15 | 1 | 0 | No | No |
| 17111347 | SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING SHIELDING LAYER CONTACTING CONDUCTIVE CONTACT | December 2020 | May 2023 | Allow | 29 | 1 | 1 | Yes | No |
| 17247200 | CONNECTING CLIP DESIGN FOR PRESSURE SINTERING | December 2020 | June 2023 | Allow | 31 | 0 | 1 | Yes | No |
| 17109675 | PACKAGING OF A SEMICONDUCTOR DEVICE WITH A PLURALITY OF LEADS | December 2020 | June 2021 | Allow | 7 | 0 | 0 | No | No |
| 17109464 | BIPOLAR JUNCTION TRANSISTOR (BJT) STRUCTURE AND RELATED METHOD | December 2020 | October 2022 | Allow | 23 | 1 | 1 | Yes | No |
| 17109720 | HIGHLY STABLE ELECTRONIC DEVICE EMPLOYING HYDROPHOBIC COATING LAYER | December 2020 | June 2022 | Allow | 18 | 1 | 0 | No | No |
| 17108304 | DISPLAY DEVICE | December 2020 | June 2023 | Allow | 30 | 1 | 0 | No | No |
| 15734180 | OPTOELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING SAME | December 2020 | March 2024 | Abandon | 40 | 0 | 1 | No | No |
| 17108600 | SEMICONDUCTOR DEVICE HAVING STAGGERED GATE-STUB-SIZE PROFILE AND METHOD OF MANUFACTURING SAME | December 2020 | August 2023 | Allow | 32 | 1 | 1 | Yes | No |
| 17106350 | IMAGE SENSOR WITH A HIGH ABSORPTION LAYER | November 2020 | July 2023 | Allow | 32 | 1 | 1 | No | No |
| 17105524 | INDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME | November 2020 | January 2023 | Allow | 26 | 1 | 2 | No | No |
| 17104588 | THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES | November 2020 | September 2022 | Allow | 22 | 1 | 0 | No | No |
| 17105289 | ORGANIC LIGHT EMITTING DISPLAY DEVICE HAVING A RESONANCE STRUCTURE OF PROPER INTERNAL REFLECTION BY INCLUDING A LIGHT EXTRACTION REDUCTION PREVENTING LAYER | November 2020 | January 2022 | Allow | 14 | 1 | 0 | No | No |
| 17104850 | INORGANIC LIGHT EMITTING DISPLAY DEVICE WITH INORGANIC FILM | November 2020 | October 2023 | Allow | 35 | 1 | 0 | No | No |
| 17103887 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE FOR SUPPRESSING THE PROPAGATION OF CRACKS | November 2020 | December 2021 | Allow | 12 | 1 | 0 | No | No |
| 17103107 | MODULE-ROTATION LED DOME | November 2020 | March 2023 | Allow | 27 | 2 | 0 | No | No |
| 17101443 | SEMICONDUCTOR PACKAGE INCLUDING DUMMY BUMP | November 2020 | May 2022 | Allow | 18 | 1 | 0 | No | No |
| 17102104 | MULTILAYERED MEMORY DEVICE WITH THROUGH-SILICON VIA(TSV), SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | November 2020 | November 2021 | Allow | 11 | 1 | 0 | No | No |
| 17100923 | DISPLAY DEVICE INCLUDING FAN-OUT LINES | November 2020 | March 2022 | Allow | 15 | 1 | 0 | No | No |
| 17100933 | LIGHT EMITTING ARRAY STRUCTURE AND DISPLAY | November 2020 | January 2023 | Allow | 26 | 1 | 0 | No | No |
| 17100874 | THREE-DIMENSIONAL MEMORY DEVICE WITHOUT GATE LINE SLITS AND METHOD FOR FORMING THE SAME | November 2020 | April 2023 | Allow | 29 | 0 | 1 | No | No |
| 17100007 | Systems and Methods for Releveled Bump Planes for Chiplets | November 2020 | January 2022 | Allow | 14 | 0 | 0 | No | No |
| 17100544 | FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF | November 2020 | February 2022 | Allow | 15 | 1 | 0 | Yes | No |
| 17100610 | SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STACK SIGNAL ROUTING | November 2020 | August 2022 | Allow | 21 | 2 | 1 | Yes | No |
| 17057351 | CHIP TRANSFER METHOD, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE | November 2020 | November 2022 | Allow | 24 | 1 | 0 | No | No |
| 16953949 | SEMICONDUCTOR STRUCTURE WITH OXIDIZED RUTHENIUM | November 2020 | April 2023 | Allow | 29 | 1 | 0 | No | No |
| 16952272 | DISPLAY DEVICE INCLUDING CONCAVE/CONVEX STRUCTURE IN THE INORGANIC INSULATION LAYER | November 2020 | January 2022 | Allow | 14 | 1 | 0 | Yes | No |
| 16952438 | FIELD PLATE STRUCTURE FOR HIGH VOLTAGE DEVICE | November 2020 | January 2022 | Allow | 14 | 1 | 0 | No | No |
| 16952707 | VAPOR DEPOSITION MASK, VAPOR DEPOSITION METHOD, AND PRODUCTION METHOD FOR ORGANIC EL DISPLAY DEVICE | November 2020 | December 2023 | Abandon | 36 | 0 | 1 | No | No |
| 16952062 | PACKAGE STRUCTURE WITH PROTECTIVE STRUCTURE AND METHOD OF FABRICATING THE SAME | November 2020 | August 2022 | Allow | 21 | 0 | 0 | No | No |
| 16951595 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD | November 2020 | October 2022 | Allow | 23 | 0 | 1 | No | No |
| 16951511 | Multi-Chip Semiconductor Package | November 2020 | June 2022 | Allow | 19 | 2 | 0 | Yes | No |
| 16950248 | Radar-Based Gesture Enhancement for Voice Interfaces | November 2020 | March 2022 | Allow | 16 | 1 | 0 | Yes | No |
| 16950138 | X-RAY SHIELDING DEPOSITION METHOD FOR ELECTRON-BEAM DEPOSITED COATINGS | November 2020 | February 2022 | Allow | 15 | 1 | 0 | No | No |
| 16950295 | Selective EMI Shielding Using Preformed Mask | November 2020 | January 2023 | Allow | 26 | 1 | 0 | No | No |
| 16950115 | METHODS OF FORMING ASSEMBLIES HAVING HEAVILY DOPED REGIONS | November 2020 | January 2023 | Allow | 26 | 0 | 0 | No | No |
| 16950518 | SEMICONDUCTOR DEVICE WITH FUSE AND ANTI-FUSE STRUCTURES AND METHOD FOR FORMING THE SAME | November 2020 | September 2022 | Allow | 22 | 1 | 0 | No | No |
| 17099129 | SEMICONDUCTOR BONDING PAD DEVICE AND METHOD FOR FORMING THE SAME | November 2020 | December 2022 | Allow | 24 | 1 | 0 | No | No |
| 17099142 | Integrated Circuits with Channel-Strain Liner | November 2020 | April 2022 | Allow | 17 | 1 | 0 | No | No |
| 17094543 | BONDED ASSEMBLY FORMED BY HYBRID WAFER BONDING USING SELECTIVELY DEPOSITED METAL LINERS | November 2020 | April 2022 | Allow | 17 | 1 | 0 | No | No |
| 17093974 | SEMICONDUCTOR DEVICE STRUCTURE WITH BOTTLE-SHAPED THROUGH SILICON VIA AND METHOD FOR FORMING THE SAME | November 2020 | February 2022 | Allow | 15 | 0 | 0 | No | No |
| 16965603 | Method for Contacting and Packetising a Semiconductor Chip | November 2020 | June 2023 | Allow | 35 | 2 | 0 | No | No |
| 17094798 | METHOD FOR THE PRODUCTION OF AN ELECTRONIC ARRANGEMENT AND THE ELECTRONIC ARRANGEMENT | November 2020 | December 2022 | Allow | 25 | 2 | 1 | No | No |
| 17092765 | METHOD OF FORMING NANOWIRE CONNECTS ON (PHOTOVOLTIAC) PV CELLS | November 2020 | September 2022 | Allow | 23 | 0 | 0 | No | No |
| 17092350 | LED Display Screen with Rotated LED Modules | November 2020 | November 2022 | Allow | 24 | 1 | 0 | No | No |
| 17089958 | TESTING STRUCTURE AND DISPLAY DEVICE INCLUDING THE SAME | November 2020 | February 2023 | Allow | 28 | 1 | 0 | No | No |
| 17089900 | DISPLAY APPARATUS | November 2020 | March 2022 | Allow | 16 | 1 | 0 | No | No |
| 17053003 | COMPOSITE ASSEMBLY OF THREE STACKED JOINING PARTNERS | November 2020 | September 2022 | Allow | 23 | 1 | 0 | No | No |
| 17087667 | VERTICAL POWER PLANE MODULE FOR SEMICONDUCTOR PACKAGES | November 2020 | January 2022 | Allow | 15 | 0 | 0 | No | No |
| 17087326 | JUNCTION FIELD EFFECT TRANSISTOR ON SILICON-ON-INSULATOR SUBSTRATE | November 2020 | August 2022 | Allow | 21 | 2 | 1 | Yes | No |
| 17086532 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | November 2020 | August 2023 | Allow | 33 | 2 | 0 | No | No |
| 17086000 | FIELD-PLATE TRENCH FET AND ASSOCIATED METHOD FOR MANUFACTURING | October 2020 | June 2022 | Allow | 19 | 1 | 1 | No | No |
| 17085467 | SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME | October 2020 | January 2022 | Allow | 15 | 0 | 1 | No | No |
| 17086017 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | October 2020 | May 2023 | Allow | 30 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2819.
With a 34.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 37.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Art Unit 2819 is part of Group 2810 in Technology Center 2800. This art unit has examined 20,830 patent applications in our dataset, with an overall allowance rate of 92.1%. Applications typically reach final disposition in approximately 19 months.
Art Unit 2819's allowance rate of 92.1% places it in the 93% percentile among all USPTO art units. This art unit has a significantly higher allowance rate than most art units at the USPTO.
Applications in Art Unit 2819 receive an average of 1.19 office actions before reaching final disposition (in the 7% percentile). The median prosecution time is 19 months (in the 95% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.