Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 17135590 | METHOD FOR FORMING IMAGE SENSOR | December 2020 | June 2022 | Allow | 18 | 1 | 0 | Yes | No |
| 17135778 | INTER-LEVEL CONNECTION FOR MULTI-LAYER STRUCTURES | December 2020 | August 2022 | Allow | 20 | 1 | 0 | No | No |
| 17256185 | METHOD FOR TRANSFERING CHIP, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE | December 2020 | October 2023 | Allow | 34 | 0 | 0 | No | No |
| 17129422 | AVALANCHE DIODE ALONG WITH VERTICAL PN JUNCTION AND METHOD FOR MANUFACTURING THE SAME FIELD | December 2020 | January 2022 | Allow | 13 | 0 | 0 | No | No |
| 17127750 | FAN-OUT WAFER-LEVEL PACKAGING (FOWLP) INTEGRATED CIRCUITS (ICs) EMPLOYING AN ELECTRO-MAGNETIC INTERFERENCE (EMI) SHIELD STRUCTURE IN UNUSED FAN-OUT AREA FOR EMI SHIELDING, AND RELATED FABRICATION METHODS | December 2020 | April 2023 | Abandon | 28 | 1 | 1 | No | No |
| 17125995 | RELIABLE SEMICONDUCTOR PACKAGES FOR SENSOR CHIPS | December 2020 | February 2023 | Allow | 26 | 3 | 1 | No | No |
| 17122934 | SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING | December 2020 | August 2022 | Allow | 20 | 1 | 1 | Yes | No |
| 17120769 | CHIP PACKAGE WITH REDISTRIBUTION LAYERS | December 2020 | February 2022 | Allow | 14 | 1 | 0 | No | No |
| 17113563 | SEMICONDUCTOR DEVICE ALONG WITH MULTI-FUNCTIONAL UNITS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | December 2020 | January 2023 | Allow | 25 | 0 | 0 | No | No |
| 17111347 | SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING SHIELDING LAYER CONTACTING CONDUCTIVE CONTACT | December 2020 | May 2023 | Allow | 29 | 1 | 1 | Yes | No |
| 17104588 | THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES | November 2020 | September 2022 | Allow | 22 | 1 | 0 | No | No |
| 17105289 | ORGANIC LIGHT EMITTING DISPLAY DEVICE HAVING A RESONANCE STRUCTURE OF PROPER INTERNAL REFLECTION BY INCLUDING A LIGHT EXTRACTION REDUCTION PREVENTING LAYER | November 2020 | January 2022 | Allow | 14 | 1 | 0 | No | No |
| 17100923 | DISPLAY DEVICE INCLUDING FAN-OUT LINES | November 2020 | March 2022 | Allow | 15 | 1 | 0 | No | No |
| 17100610 | SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STACK SIGNAL ROUTING | November 2020 | August 2022 | Allow | 21 | 2 | 1 | Yes | No |
| 17057351 | CHIP TRANSFER METHOD, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE | November 2020 | November 2022 | Allow | 24 | 1 | 0 | No | No |
| 16952272 | DISPLAY DEVICE INCLUDING CONCAVE/CONVEX STRUCTURE IN THE INORGANIC INSULATION LAYER | November 2020 | January 2022 | Allow | 14 | 1 | 0 | Yes | No |
| 16952438 | FIELD PLATE STRUCTURE FOR HIGH VOLTAGE DEVICE | November 2020 | January 2022 | Allow | 14 | 1 | 0 | No | No |
| 16950138 | X-RAY SHIELDING DEPOSITION METHOD FOR ELECTRON-BEAM DEPOSITED COATINGS | November 2020 | February 2022 | Allow | 15 | 1 | 0 | No | No |
| 16950295 | Selective EMI Shielding Using Preformed Mask | November 2020 | January 2023 | Allow | 26 | 1 | 0 | No | No |
| 16965603 | Method for Contacting and Packetising a Semiconductor Chip | November 2020 | June 2023 | Allow | 35 | 2 | 0 | No | No |
| 17092765 | METHOD OF FORMING NANOWIRE CONNECTS ON (PHOTOVOLTIAC) PV CELLS | November 2020 | September 2022 | Allow | 23 | 0 | 0 | No | No |
| 17085467 | SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME | October 2020 | January 2022 | Allow | 15 | 0 | 1 | No | No |
| 17083506 | MANUFACTURING METHOD OF HIGH FREQUENCY MODULE AND HIGH FREQUENCY MODULE HAVING GROOVE IN SEALING RESIN LAYER | October 2020 | December 2021 | Allow | 14 | 0 | 0 | No | No |
| 17084496 | BONDING STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE | October 2020 | March 2022 | Allow | 17 | 1 | 1 | No | No |
| 17082766 | SEMICONDUCTOR DEVICE | October 2020 | November 2021 | Allow | 13 | 0 | 1 | No | No |
| 17081238 | PATTERNED SHIELDING STRUCTURE AND INTEGRATED INDUCTOR | October 2020 | May 2022 | Allow | 18 | 1 | 1 | No | No |
| 17081945 | COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED CONTACT PAD | October 2020 | June 2022 | Allow | 19 | 1 | 1 | No | No |
| 17078583 | SPACER-DEFINED BACK-END TRANSISTOR AS MEMORY SELECTOR | October 2020 | November 2021 | Allow | 13 | 0 | 1 | No | No |
| 17076106 | ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE PACKAGE | October 2020 | September 2022 | Allow | 23 | 0 | 1 | No | No |
| 17072047 | DISPLAY DEVICE WITH IMPROVED IMAGE QUALITY DEGRADATION | October 2020 | March 2022 | Allow | 17 | 0 | 1 | No | No |
| 17066408 | ELECTRONIC PACKAGE WITH WETTABLE FLANK AND SHIELDING LAYER AND MANUFACTURING METHOD THEREOF | October 2020 | May 2022 | Allow | 20 | 1 | 1 | No | No |
| 17065635 | SEMICONDUCTOR DEVICE COMPRISING STACKED OXIDE SEMICONDUCTOR LAYERS | October 2020 | August 2021 | Allow | 11 | 1 | 0 | No | No |
| 17064700 | TECHNIQUES TO INCREASE CMOS IMAGE SENSOR WELL DEPTH BY CRYOGENIC ION CHANNELING OF ULTRA HIGH ENERGY IONS | October 2020 | July 2023 | Allow | 34 | 2 | 0 | Yes | No |
| 16948803 | MULTI-SEGMENT WIRE-BOND | October 2020 | July 2022 | Allow | 22 | 1 | 1 | Yes | No |
| 17038756 | Flip-Chip Die Package Structure and Electronic Device | September 2020 | October 2021 | Allow | 12 | 0 | 0 | No | No |
| 17038177 | SEMICONDUCTOR APPARATUS AND EQUIPMENT | September 2020 | February 2022 | Allow | 16 | 0 | 1 | No | No |
| 17032225 | SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR WAFER | September 2020 | February 2022 | Allow | 16 | 0 | 0 | No | No |
| 17030528 | PACKAGED CIRCUIT STRUCTURE INCLUDING CIRCUIT STRCUTRE WITH ANTENNA AND METHOD FOR MANUFACTURING THE SAME | September 2020 | January 2022 | Allow | 15 | 1 | 1 | No | No |
| 17040817 | MANUFACTURING METHOD OF ELECTRONIC-COMPONENT-MOUNTED MODULE | September 2020 | June 2022 | Allow | 21 | 2 | 0 | No | No |
| 17015140 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | September 2020 | March 2023 | Abandon | 30 | 4 | 1 | Yes | No |
| 17012490 | SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES | September 2020 | September 2021 | Allow | 12 | 0 | 1 | No | No |
| 17011099 | Enhanced Sensing Coil for Semiconductor Device | September 2020 | October 2023 | Allow | 37 | 2 | 0 | No | No |
| 16948100 | SCATTERING STRUCTURES FOR SINGLE-PHOTON AVALANCHE DIODES | September 2020 | June 2023 | Allow | 33 | 2 | 0 | Yes | No |
| 17010776 | STACKED BODY SEMICONDUCTOR STORAGE DEVICE HAVING AN ELECTRODE BETWEEN A PILLAR AND A WIRING AND INSULATING LAYERS HAVING DIFFERENT DIELECTRIC CONSTANTS BETWEEN THE ELECTRODE AND THE WIRING | September 2020 | April 2022 | Allow | 19 | 1 | 1 | No | No |
| 17009158 | Displays with Non-Periodic Opaque Structures | September 2020 | December 2023 | Allow | 39 | 3 | 1 | Yes | No |
| 17007357 | SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD | August 2020 | March 2022 | Allow | 18 | 1 | 1 | No | No |
| 17002790 | MICRO LIGHT-EMITTING DEVICE DISPLAY APPARATUS HAVING BUMP | August 2020 | December 2022 | Allow | 27 | 2 | 0 | Yes | No |
| 17002258 | DISPLAY DEVICE WITH DIFFERENT ELECTRODES AND LIGHT EMITTING ELEMENTS | August 2020 | September 2022 | Allow | 25 | 1 | 1 | No | No |
| 16971849 | METHOD FOR PRODUCING AN AT LEAST PARTLY PACKAGED SEMICONDUCTOR WAFER | August 2020 | March 2021 | Allow | 7 | 1 | 0 | No | No |
| 16996714 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | August 2020 | April 2022 | Allow | 20 | 0 | 1 | No | No |
| 16947696 | SEMICONDUCTOR DEVICE INCLUDING TOP GATE PLANAR TYPE THIN-FILM TRANSISTOR AND TOP GATE PLANAR SELF-ALIGNED TYPE THIN-FILM TRANSISTOR | August 2020 | September 2021 | Allow | 13 | 1 | 0 | No | No |
| 16991230 | SEMICONDUCTOR DEVICE HAVING METAL WIRE BONDED TO PLURAL METAL BLOCKS CONNECTED TO RESPECTIVE CIRCUIT PATTERNS | August 2020 | October 2021 | Allow | 14 | 1 | 1 | Yes | No |
| 16943297 | DISPLAY PANEL HAVING AN ARRANGEMENT BY UNIT PIXEL PAIRS | July 2020 | January 2023 | Allow | 30 | 1 | 1 | No | No |
| 16936882 | Semiconductor Packages Including Stacked Substrates and Penetration Electrodes | July 2020 | August 2021 | Allow | 13 | 0 | 1 | No | No |
| 16934338 | FABRICATION METHOD OF SEMICONDUCTOR DIE AND CHIP-ON-PLASTIC PACKAGING OF SEMICONDUCTOR DIE | July 2020 | April 2022 | Allow | 21 | 2 | 1 | No | No |
| 16933993 | SEMICONDUCTOR DEVICE | July 2020 | July 2021 | Allow | 12 | 0 | 0 | No | No |
| 16929378 | SOI SUBSTRATE AND RELATED METHODS | July 2020 | July 2022 | Allow | 24 | 2 | 0 | Yes | Yes |
| 16929109 | SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER AND METHOD OF MANUFACTURING THE SAME | July 2020 | January 2022 | Allow | 18 | 2 | 1 | No | No |
| 16929397 | SILICON-ON-INSULATOR (SOI) SUBSTRATE AND RELATED METHODS | July 2020 | October 2021 | Allow | 15 | 1 | 0 | No | No |
| 16962300 | ELECTRONIC COMPONENT PACKAGE INCLUDING STACKED SHIELD LAYERS AND METHOD FOR PRODUCING SAME | July 2020 | January 2022 | Allow | 18 | 3 | 0 | Yes | No |
| 16928562 | ARRAY SUBSTRATE AND DISPLAY DEVICE INCLUDING LIGHT SHIELDING LAYERS | July 2020 | October 2021 | Allow | 15 | 1 | 1 | No | No |
| 16962058 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | July 2020 | May 2021 | Allow | 10 | 0 | 0 | No | No |
| 16924144 | MOISTURE-RESISTANT ELECTRONIC COMPONENT AND PROCESS FOR PRODUCING SUCH A COMPONENT | July 2020 | September 2022 | Allow | 26 | 3 | 0 | Yes | No |
| 16917686 | INTEGRATED DEVICE PACKAGES WITH INTEGRATED DEVICE DIE AND DUMMY ELEMENT | June 2020 | January 2023 | Allow | 31 | 1 | 1 | Yes | No |
| 16917155 | Semiconductor Package Including Workpiece and Method for Fabricating the Semiconductor Package | June 2020 | March 2022 | Allow | 20 | 1 | 1 | No | No |
| 16916138 | Display Panel and Display Apparatus for Emitting White Light in Screen-off State | June 2020 | December 2021 | Allow | 17 | 0 | 0 | Yes | No |
| 16911872 | --DISPLAY APPARATUS INCLUDING A BLOCKING PORTION FOR REDUCING REFLECTION OF LIGHT-- | June 2020 | January 2022 | Allow | 18 | 1 | 1 | Yes | No |
| 16910707 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY DEVICE USING THE SAME | June 2020 | January 2021 | Allow | 7 | 1 | 0 | No | No |
| 16908277 | THREE-DIMENSIONAL ARRAY ARCHITECTURE FOR RESISTIVE CHANGE ELEMENT ARRAYS AND METHODS FOR MAKING SAME | June 2020 | May 2022 | Allow | 22 | 0 | 1 | No | No |
| 16906129 | ACTIVE ELECTRICAL ELEMENTS WITH LIGHT-EMITTING DIODES | June 2020 | February 2023 | Allow | 32 | 2 | 1 | No | No |
| 16904775 | SEMICONDUCTOR ELEMENT AND POWER AMPLIFICATION DEVICE | June 2020 | November 2021 | Allow | 17 | 0 | 1 | No | No |
| 16901310 | LEADFRAME CAPACITORS | June 2020 | August 2021 | Allow | 14 | 0 | 1 | No | No |
| 16900380 | TRIODE PACKAGING METHOD AND TRIODE | June 2020 | February 2022 | Allow | 20 | 0 | 1 | No | No |
| 16899980 | SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING AND METHOD OF MANUFACTURE | June 2020 | September 2023 | Allow | 39 | 5 | 1 | Yes | No |
| 16898096 | ADVANCED INTEGRATED PASSIVE DEVICE (IPD) WITH THIN-FILM HEAT SPREADER (TF-HS) LAYER FOR HIGH POWER HANDLING FILTERS IN TRANSMIT (TX) PATH | June 2020 | May 2022 | Allow | 24 | 1 | 0 | Yes | No |
| 16897867 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH CONDUCTIVE UNDERFILL DAMS FOR GROUNDING EMI SHIELDS AND METHODS FOR MAKING THE SAME | June 2020 | January 2022 | Allow | 20 | 2 | 0 | No | No |
| 16893440 | SEMICONDUCTOR PACKAGE INCLUDING SHIELDING PLATE IN REDISTRIBUTION STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE VIA IN REDISTRIBUTION STRUCTURE, AND MANUFACTURING METHOD THEREOF | June 2020 | August 2021 | Allow | 14 | 0 | 0 | No | No |
| 16893009 | STACK PACKAGES INCLUDING VERTICALLY STACKED SUB-PACKAGES WITH INTERPOSER BRIDGES | June 2020 | June 2021 | Allow | 12 | 0 | 0 | No | No |
| 16891916 | HIGH-FREQUENCY DEVICE AND MANUFACTURING METHOD THEREOF | June 2020 | March 2021 | Allow | 10 | 2 | 0 | No | No |
| 16890823 | METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING LOCATION ON A WIRE BONDING MACHINE | June 2020 | January 2023 | Allow | 31 | 1 | 1 | No | No |
| 15929925 | MECHANICAL PUNCHED VIA FORMATION IN ELECTRONICS PACKAGE AND ELECTRONICS PACKAGE FORMED THEREBY | May 2020 | May 2022 | Allow | 23 | 2 | 1 | No | No |
| 16765530 | DISPLAY BACKPLATE AND METHOD FOR MANUFACTURING SAME, DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE | May 2020 | February 2023 | Allow | 32 | 2 | 1 | No | No |
| 16765173 | DISPLAY MODULE, PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE | May 2020 | April 2023 | Abandon | 35 | 2 | 1 | No | No |
| 16878250 | ELECTRONIC PACKAGE HAVING ANTENNA FUNCTION AND FABRICATION METHOD THEREOF | May 2020 | October 2021 | Allow | 17 | 1 | 1 | No | No |
| 16876347 | HIGH RESOLUTION ORGANIC LIGHT-EMITTING DIODE DEVICES, DISPLAYS, AND RELATED METHODS | May 2020 | December 2020 | Allow | 7 | 0 | 0 | No | No |
| 16764971 | SEMICONDUCTOR APPARATUS INCLUDING LEADS AND BONDING WIRES | May 2020 | June 2021 | Allow | 13 | 1 | 0 | No | No |
| 15931896 | SEMICONDUCTOR DEVICE STRUCTURE WITH MULTIPLE RESISTANCE VARIABLE LAYERS | May 2020 | August 2020 | Allow | 4 | 0 | 0 | No | No |
| 16874524 | SEMICONDUCTOR DEVICE PACKAGE INCLUDING CONDUCTIVE LAYERS AS SHIELDING AND METHOD OF MANUFACTURING THE SAME | May 2020 | December 2021 | Allow | 19 | 1 | 0 | Yes | No |
| 15930618 | DISPLAY PANEL INCLUDING PLURALITY OF PIXEL APERTURES AND DISPLAY DEVICE | May 2020 | June 2021 | Allow | 14 | 0 | 0 | No | No |
| 16865533 | THROUGH HOLE SIDE WETTABLE FLANK | May 2020 | October 2021 | Allow | 17 | 1 | 1 | Yes | No |
| 15929371 | METAL MIRROR BASED MULTISPECTRAL FILTER ARRAY | April 2020 | May 2021 | Allow | 12 | 1 | 1 | Yes | No |
| 16860877 | SEMICONDUCTOR DEVICE INCLUDING METAL HOLDER AND METHOD OF MANUFACTURING THE SAME | April 2020 | December 2021 | Allow | 20 | 1 | 0 | No | No |
| 16858749 | PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | April 2020 | January 2021 | Allow | 9 | 1 | 1 | Yes | No |
| 16854412 | IMAGE DISPLAY ELEMENT WITH IMPROVED LIGHT EMISSION EFFICIENCY | April 2020 | March 2023 | Allow | 35 | 2 | 1 | No | No |
| 16854566 | SEMICONDUCTOR DEVICE WITH PROTECTION STRUCTURE AND AIR GAPS AND METHOD FOR FABRICATING THE SAME | April 2020 | June 2021 | Allow | 14 | 1 | 1 | No | No |
| 16853707 | DISPLAY PANEL SOLVING LIGHT DIFFRACTION PROBLEM AND MANUFACTURING METHOD THEREOF | April 2020 | August 2021 | Allow | 16 | 0 | 0 | No | No |
| 16852453 | SHIELDING FOR FLIP CHIP DEVICES | April 2020 | October 2021 | Allow | 18 | 1 | 0 | No | No |
| 16848770 | SEMICONDUCTOR DEVICE COMPRISING SEALING MEMBERS WITH DIFFERENT ELASTIC MODULUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | April 2020 | February 2022 | Allow | 22 | 2 | 0 | Yes | No |
| 16847256 | USING ELECTRICAL CONNECTIONS THAT TRAVERSE SCRIBE LINES TO CONNECT DEVICES ON A CHIP | April 2020 | April 2022 | Allow | 24 | 0 | 1 | No | No |
| 16843842 | ORGANIC LIGHT EMITTING DIODES DISPLAYS INCLUDING A POLARIZATION FILM AND MANUFACTURING METHOD THEREOF | April 2020 | November 2020 | Allow | 8 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner MAZUMDER, DIDARUL A.
With a 100.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 60.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner MAZUMDER, DIDARUL A works in Art Unit 2819 and has examined 548 patent applications in our dataset. With an allowance rate of 84.1%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 21 months.
Examiner MAZUMDER, DIDARUL A's allowance rate of 84.1% places them in the 60% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by MAZUMDER, DIDARUL A receive 1.78 office actions before reaching final disposition. This places the examiner in the 36% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by MAZUMDER, DIDARUL A is 21 months. This places the examiner in the 90% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +9.2% benefit to allowance rate for applications examined by MAZUMDER, DIDARUL A. This interview benefit is in the 41% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 29.4% of applications are subsequently allowed. This success rate is in the 59% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 24.1% of cases where such amendments are filed. This entry rate is in the 34% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 155.6% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 91% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 95.0% of appeals filed. This is in the 85% percentile among all examiners. Of these withdrawals, 78.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 43.9% are granted (fully or in part). This grant rate is in the 35% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.4% of allowed cases (in the 56% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 34.3% of allowed cases (in the 97% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.