Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 17053877 | MODULE AND METHODS OF ASSEMBLY FOR LARGE AREA FLAT PANEL DETECTORS | September 2021 | February 2024 | Allow | 39 | 0 | 0 | Yes | No |
| 17052861 | THREE-DIMENSIONAL INTEGRATED SYSTEM OF DRAM CHIP AND PREPARATION METHOD THEREOF | March 2021 | August 2023 | Allow | 33 | 0 | 1 | No | No |
| 17139867 | WAFER-LEVEL SIP MODULE STRUCTURE AND METHOD FOR PREPARING THE SAME | December 2020 | January 2023 | Abandon | 25 | 2 | 1 | No | No |
| 17138915 | DISPLAY PANEL, MASK, METHOD FOR MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE | December 2020 | March 2023 | Allow | 26 | 1 | 0 | No | No |
| 17138912 | DISPLAY PANEL, MASK, METHOD FOR MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE | December 2020 | October 2022 | Allow | 21 | 0 | 0 | No | No |
| 17139030 | TSV Structure and Method Forming Same | December 2020 | October 2022 | Allow | 21 | 1 | 1 | No | No |
| 17139388 | STACK OF DIES | December 2020 | January 2023 | Allow | 25 | 1 | 1 | No | No |
| 17138275 | ENGINEERED WAFER WITH SELECTIVE POROSIFICATION FOR MULTI-COLOR LIGHT EMISSION | December 2020 | October 2023 | Abandon | 33 | 1 | 1 | No | No |
| 17138606 | SEMICONDUCTOR DEVICE, IMAGE PICKUP DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | December 2020 | November 2022 | Allow | 23 | 1 | 0 | No | No |
| 17138258 | ENGINEERED SUBSTRATE ARCHITECTURE FOR INGAN RED MICRO-LEDS | December 2020 | February 2023 | Allow | 25 | 1 | 0 | Yes | No |
| 17138150 | INTEGRATED CIRCUIT | December 2020 | May 2022 | Allow | 17 | 0 | 1 | No | No |
| 17137704 | ELECTRICAL DEVICE WITH POWER QUALITY EVENT PROTECTION AND ASSOCIATED METHOD | December 2020 | September 2022 | Allow | 21 | 1 | 0 | No | No |
| 17137298 | SEMICONDUCTOR DIE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | December 2020 | December 2023 | Allow | 35 | 3 | 1 | No | No |
| 17136299 | DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS | December 2020 | January 2023 | Allow | 24 | 2 | 0 | Yes | No |
| 17134925 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | December 2020 | June 2023 | Allow | 29 | 4 | 1 | Yes | No |
| 17134710 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | December 2020 | July 2022 | Allow | 19 | 0 | 0 | No | No |
| 17256414 | FILM FORMING METHOD AND CRYSTALLINE MULTILAYER STRUCTURE | December 2020 | June 2022 | Allow | 18 | 0 | 0 | No | No |
| 17135584 | ELECTRICAL LEADS FOR TRENCHED QUBITS | December 2020 | September 2022 | Allow | 21 | 0 | 1 | No | No |
| 17133828 | DIELECTRIC POWDER AND MULTILAYER CAPACITOR USING THE SAME | December 2020 | October 2022 | Allow | 21 | 0 | 0 | No | No |
| 17132447 | INTEGRATED CIRCUIT STRUCTURE AND METHOD OF FORMING THE SAME | December 2020 | January 2023 | Allow | 24 | 0 | 1 | No | No |
| 17133096 | DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES | December 2020 | March 2023 | Allow | 27 | 2 | 1 | Yes | No |
| 17131329 | STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES | December 2020 | August 2022 | Allow | 19 | 1 | 0 | No | No |
| 17131588 | BONDED STRUCTURES | December 2020 | October 2022 | Allow | 21 | 2 | 0 | No | No |
| 17254960 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | December 2020 | April 2023 | Allow | 28 | 1 | 1 | No | No |
| 17128748 | Silicon Heat-Dissipation Package For Compact Electronic Devices | December 2020 | April 2023 | Allow | 28 | 1 | 1 | No | No |
| 17129308 | METHOD FOR MANUFACTURING LINEAR LIGHT SOURCE | December 2020 | June 2023 | Allow | 30 | 1 | 0 | Yes | No |
| 17129720 | VAPOR PHASE EPITAXY METHOD | December 2020 | January 2022 | Allow | 13 | 0 | 0 | No | No |
| 17129580 | MANUFACTURING METHOD OF DISPLAY APPARATUS UTILIZING DAM PORTION AND DISPLAY APPARATUS MANUFACTURED USING THE METHOD | December 2020 | February 2023 | Allow | 26 | 1 | 0 | No | No |
| 17129015 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | December 2020 | June 2022 | Allow | 18 | 0 | 0 | No | No |
| 17129080 | SPACER SCULPTING FOR FORMING SEMICONDUCTOR DEVICES | December 2020 | September 2022 | Allow | 21 | 1 | 0 | No | No |
| 17126957 | Stacking Via Structures for Stress Reduction | December 2020 | January 2023 | Allow | 25 | 2 | 1 | No | No |
| 17125848 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | December 2020 | August 2022 | Allow | 20 | 1 | 1 | No | No |
| 17253494 | METHOD FOR MANUFACTURING AN OPTOELECTRONIC DEVICE WITH SELF-ALIGNING LIGHT CONFINEMENT WALLS | December 2020 | September 2023 | Allow | 33 | 1 | 0 | No | No |
| 17253451 | METHOD FOR MANUFACTURING AN OPTOELECTRONIC DEVICE WITH SELF-ALIGNING LIGHT CONFINEMENT WALLS | December 2020 | April 2023 | Allow | 28 | 1 | 0 | No | No |
| 17124448 | PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF | December 2020 | July 2022 | Abandon | 19 | 1 | 0 | No | No |
| 17124329 | METHOD OF MANUFACTURING TRANSPARENT DISPLAY DEVICE | December 2020 | October 2022 | Allow | 22 | 0 | 0 | No | No |
| 17123664 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | December 2020 | October 2022 | Allow | 22 | 1 | 1 | No | No |
| 17123146 | DISPLAY PANEL AND HEAD MOUNTED DEVICE | December 2020 | August 2022 | Allow | 20 | 1 | 0 | No | No |
| 17123085 | MICRO LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS THEREOF | December 2020 | August 2023 | Abandon | 32 | 1 | 1 | No | No |
| 17122571 | MULTIROW SEMICONDUCTOR CHIP CONNECTIONS | December 2020 | June 2022 | Allow | 18 | 1 | 0 | No | No |
| 17121770 | POLISHING SLURRY COMPOSITION FOR SHALLOW TRENCH ISOLATION PROCESS | December 2020 | February 2024 | Abandon | 38 | 1 | 0 | No | No |
| 17120951 | SEMICONDUCTOR STORAGE DEVICE | December 2020 | August 2023 | Allow | 32 | 3 | 1 | Yes | No |
| 17121272 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | December 2020 | July 2022 | Allow | 19 | 0 | 0 | No | No |
| 17120668 | Wet Cleaning with Tunable Metal Recess for Via Plugs | December 2020 | September 2022 | Allow | 21 | 2 | 0 | No | No |
| 17121441 | DIELECTRIC EXTENSIONS IN STACKED MEMORY ARRAYS | December 2020 | April 2022 | Allow | 16 | 1 | 0 | Yes | No |
| 17121651 | METHOD OF REPAIRING LIGHT EMITTING DEVICE AND DISPLAY PANEL HAVING REPAIRED LIGHT EMITTING DEVICE | December 2020 | August 2022 | Allow | 21 | 1 | 0 | No | No |
| 17119139 | GROUP III-V LIGHT EMITTING DIODE | December 2020 | June 2023 | Allow | 30 | 1 | 0 | Yes | No |
| 17119129 | Integrated Assemblies, and Methods of Forming Integrated Assemblies | December 2020 | May 2022 | Allow | 17 | 1 | 0 | No | No |
| 17118078 | Semiconductor Devices Including Resistor Structures | December 2020 | July 2023 | Allow | 31 | 0 | 0 | No | No |
| 17118036 | SEMICONDUCTOR STRUCTURE CONTAINING MULTILAYER BONDING PADS AND METHODS OF FORMING THE SAME | December 2020 | August 2022 | Allow | 20 | 1 | 0 | No | No |
| 17117298 | SEMICONDUCTOR LIGHT-EMITTING DEVICE INCLUDING BUFFER STRUCTURE | December 2020 | July 2022 | Allow | 19 | 0 | 0 | Yes | No |
| 16978641 | SEMICONDUCTOR DEVICE FOR TRANSMITTING ELECTROMAGNETIC RADIATION AND METHOD FOR PRODUCTION THEREOF | December 2020 | December 2023 | Allow | 40 | 1 | 0 | Yes | No |
| 17117288 | INTEGRATED INDUCTOR WITH A STACKED METAL WIRE | December 2020 | February 2023 | Allow | 26 | 1 | 1 | No | No |
| 17117186 | SELF-ALIGNED TOP VIA | December 2020 | March 2022 | Allow | 15 | 1 | 1 | Yes | No |
| 17116638 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF | December 2020 | February 2024 | Abandon | 38 | 2 | 1 | No | No |
| 17116884 | Packaged Die and Assembling Method | December 2020 | December 2022 | Allow | 24 | 2 | 0 | No | No |
| 17116037 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | December 2020 | October 2022 | Allow | 23 | 1 | 1 | Yes | No |
| 17116158 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | December 2020 | October 2022 | Allow | 23 | 1 | 1 | No | No |
| 17116559 | RESISTIVE INTERFACE MATERIAL | December 2020 | August 2022 | Allow | 21 | 0 | 0 | No | No |
| 17114717 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT SYSTEM | December 2020 | September 2023 | Allow | 33 | 2 | 1 | No | No |
| 17114886 | Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same | December 2020 | April 2022 | Allow | 16 | 1 | 0 | No | No |
| 17115700 | PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME | December 2020 | March 2023 | Allow | 28 | 1 | 0 | Yes | No |
| 17114594 | PHASE CHANGE MEMORY CELL WITH A WRAP AROUND AND RING TYPE OF ELECTRODE CONTACT AND A PROJECTION LINER | December 2020 | June 2022 | Allow | 19 | 0 | 0 | No | No |
| 17113583 | METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT | December 2020 | March 2023 | Allow | 28 | 1 | 1 | No | No |
| 17113586 | SOLID-STATE TRANSDUCER DEVICES WITH SELECTIVE WAVELENGTH REFLECTORS AND ASSOCIATED SYSTEMS AND METHODS | December 2020 | October 2023 | Allow | 34 | 1 | 0 | No | No |
| 17113351 | FINFET DEVICE AND METHOD | December 2020 | April 2022 | Allow | 17 | 1 | 0 | No | No |
| 17111973 | BACKSIDE INTERCONNECT FOR INTEGRATED CIRCUIT PACKAGE INTERPOSER | December 2020 | October 2022 | Abandon | 22 | 2 | 0 | No | No |
| 17111198 | METHOD FOR MANUFACTURING ELECTRONIC CHIPS | December 2020 | March 2022 | Allow | 15 | 1 | 0 | Yes | No |
| 17110591 | COMPOSITE OXIDE SEMICONDUCTOR AND TRANSISTOR | December 2020 | August 2022 | Allow | 20 | 0 | 0 | No | No |
| 17111417 | STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH RESISTIVE ELEMENTS | December 2020 | April 2022 | Allow | 17 | 0 | 1 | No | No |
| 17110063 | METHOD FOR MANUFACTURING ELECTRONIC CHIPS | December 2020 | March 2022 | Allow | 15 | 1 | 0 | Yes | No |
| 17109244 | FIN FIELD EFFECT TRANSISTOR WITH MERGED DRIFT REGION | December 2020 | January 2023 | Allow | 25 | 1 | 1 | No | No |
| 17109147 | RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF | December 2020 | February 2022 | Allow | 15 | 0 | 0 | No | No |
| 17108471 | SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD | December 2020 | May 2022 | Allow | 17 | 0 | 1 | No | No |
| 17107614 | SEMICONDUCTOR PACKAGE STRUCTURE | November 2020 | October 2022 | Allow | 23 | 2 | 0 | No | No |
| 17106457 | FINFET HAVING NON-MERGING EPITAXIALLY GROWN SOURCE/DRAINS | November 2020 | June 2022 | Allow | 19 | 0 | 0 | Yes | No |
| 17106244 | Method of Forming Transistor | November 2020 | August 2022 | Allow | 20 | 0 | 0 | No | No |
| 17106766 | Via Structure and Methods Thereof | November 2020 | September 2023 | Allow | 33 | 2 | 0 | No | No |
| 17107001 | SEMICONDUCTOR DEVICE WITH PROGRAMMABLE UNIT AND METHOD FOR FABRICATING THE SAME | November 2020 | August 2022 | Allow | 20 | 1 | 1 | No | No |
| 17107799 | PACKAGING STRUCTURE, AND FORMING METHOD AND PACKAGING METHOD THEREOF | November 2020 | November 2022 | Abandon | 24 | 2 | 0 | No | No |
| 17106095 | SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE USING THE SAME | November 2020 | June 2022 | Allow | 19 | 0 | 0 | No | No |
| 17105736 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | November 2020 | April 2022 | Allow | 17 | 1 | 0 | Yes | No |
| 17104389 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | November 2020 | February 2023 | Allow | 27 | 1 | 0 | No | No |
| 17103633 | SEMICONDUCTOR DEVICE WITH BURIED METAL PAD, AND METHODS FOR MANUFACTURE | November 2020 | April 2022 | Allow | 16 | 0 | 1 | No | No |
| 17102253 | UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAVING DIFFERENT LATERAL DENSITIES AND RELATED TECHNOLOGY | November 2020 | August 2022 | Allow | 20 | 1 | 0 | No | No |
| 17102377 | SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | November 2020 | January 2022 | Allow | 14 | 0 | 0 | No | No |
| 17101209 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | November 2020 | December 2023 | Abandon | 37 | 4 | 0 | Yes | No |
| 17101189 | DISPLAY DEVICE INCLUDING A TEST UNIT | November 2020 | September 2022 | Allow | 22 | 1 | 0 | No | No |
| 17102344 | Carbon Enabled Vertical Organic Light Emitting Transistors | November 2020 | March 2023 | Allow | 28 | 1 | 1 | No | No |
| 16953786 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MEMORY DEVICE | November 2020 | February 2023 | Allow | 27 | 1 | 1 | No | No |
| 16953921 | INTEGRATED CHIP WITH A GATE STRUCTURE OVER A RECESS | November 2020 | March 2022 | Allow | 16 | 1 | 1 | No | No |
| 16953919 | MONOLITHIC NANOCOLUMN STRUCTURES | November 2020 | May 2022 | Abandon | 18 | 4 | 0 | Yes | No |
| 16952699 | GROUP-III NITRIDE LAMINATED SUBSTRATE AND SEMICONDUCTOR LIGHT-EMITTING ELEMENT | November 2020 | December 2022 | Allow | 25 | 1 | 0 | No | No |
| 16952345 | PATTERNING APPROACH FOR IMPROVED VIA LANDING PROFILE | November 2020 | March 2023 | Allow | 28 | 1 | 0 | No | No |
| 16952203 | RESISTIVE SWITCHING MEMORY CELL | November 2020 | August 2022 | Allow | 21 | 0 | 0 | No | No |
| 16951720 | INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE | November 2020 | November 2022 | Allow | 24 | 1 | 0 | No | No |
| 16951969 | DISPLAY DEVICE | November 2020 | July 2022 | Allow | 20 | 0 | 0 | No | No |
| 16950211 | SEMICONDUCTOR PACKAGE | November 2020 | July 2022 | Allow | 20 | 1 | 0 | No | No |
| 16950537 | HYBRID CONDUCTIVE STRUCTURES | November 2020 | October 2022 | Allow | 23 | 1 | 1 | Yes | No |
| 16950453 | TOPOLOGICAL SEMI-METAL INTERCONNECTS | November 2020 | May 2023 | Allow | 30 | 2 | 2 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for art-unit 2816.
With a 37.1% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 37.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Art Unit 2816 is part of Group 2810 in Technology Center 2800. This art unit has examined 21,841 patent applications in our dataset, with an overall allowance rate of 87.1%. Applications typically reach final disposition in approximately 20 months.
Art Unit 2816's allowance rate of 87.1% places it in the 85% percentile among all USPTO art units. This art unit has a significantly higher allowance rate than most art units at the USPTO.
Applications in Art Unit 2816 receive an average of 1.47 office actions before reaching final disposition (in the 20% percentile). The median prosecution time is 20 months (in the 94% percentile).
When prosecuting applications in this art unit, consider the following:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.