Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 17139388 | STACK OF DIES | December 2020 | January 2023 | Allow | 25 | 1 | 1 | No | No |
| 17137704 | ELECTRICAL DEVICE WITH POWER QUALITY EVENT PROTECTION AND ASSOCIATED METHOD | December 2020 | September 2022 | Allow | 21 | 1 | 0 | No | No |
| 17135584 | ELECTRICAL LEADS FOR TRENCHED QUBITS | December 2020 | September 2022 | Allow | 21 | 0 | 1 | No | No |
| 17133096 | DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES | December 2020 | March 2023 | Allow | 27 | 2 | 1 | Yes | No |
| 17129080 | SPACER SCULPTING FOR FORMING SEMICONDUCTOR DEVICES | December 2020 | September 2022 | Allow | 21 | 1 | 0 | No | No |
| 17123146 | DISPLAY PANEL AND HEAD MOUNTED DEVICE | December 2020 | August 2022 | Allow | 20 | 1 | 0 | No | No |
| 17121651 | METHOD OF REPAIRING LIGHT EMITTING DEVICE AND DISPLAY PANEL HAVING REPAIRED LIGHT EMITTING DEVICE | December 2020 | August 2022 | Allow | 21 | 1 | 0 | No | No |
| 17119129 | Integrated Assemblies, and Methods of Forming Integrated Assemblies | December 2020 | May 2022 | Allow | 17 | 1 | 0 | No | No |
| 17107799 | PACKAGING STRUCTURE, AND FORMING METHOD AND PACKAGING METHOD THEREOF | November 2020 | November 2022 | Abandon | 24 | 2 | 0 | No | No |
| 17101189 | DISPLAY DEVICE INCLUDING A TEST UNIT | November 2020 | September 2022 | Allow | 22 | 1 | 0 | No | No |
| 17102344 | Carbon Enabled Vertical Organic Light Emitting Transistors | November 2020 | March 2023 | Allow | 28 | 1 | 1 | No | No |
| 17097206 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | November 2020 | September 2023 | Allow | 34 | 2 | 1 | No | No |
| 17089750 | SEMICONDUCTOR PACKAGE WITH HYBRID THROUGH-SILICON-VIAS | November 2020 | February 2022 | Allow | 15 | 0 | 0 | No | No |
| 17086311 | CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS | October 2020 | February 2023 | Allow | 27 | 2 | 0 | No | No |
| 17084033 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | October 2020 | December 2022 | Allow | 25 | 2 | 0 | Yes | No |
| 17071030 | PACKAGE STRUCTURE WITH REINFORCED ELEMENT AND FORMATION METHOD THEREOF | October 2020 | November 2022 | Allow | 25 | 2 | 0 | Yes | No |
| 17068422 | SEMICONDUCTOR DEVICE | October 2020 | May 2023 | Allow | 31 | 2 | 1 | No | No |
| 17066049 | PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT | October 2020 | December 2022 | Allow | 26 | 2 | 1 | No | No |
| 17031477 | SEMICONDUCTOR DIE WITH DECOUPLING CAPACITOR AND MANUFACTURING METHOD THEREOF | September 2020 | June 2022 | Allow | 21 | 1 | 0 | No | No |
| 17028707 | CONFORMAL SHIELD FOR BLOCKING LIGHT IN AN INTEGRATED CIRCUIT PACKAGE | September 2020 | June 2023 | Abandon | 32 | 3 | 0 | No | No |
| 17022791 | Integrated Circuit Package and Method Forming Same | September 2020 | March 2023 | Allow | 30 | 3 | 0 | Yes | No |
| 17019375 | PACKAGE SUBSTRATE AND PACKAGE STRUCTURE | September 2020 | January 2022 | Allow | 16 | 0 | 0 | No | No |
| 17015301 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | September 2020 | April 2022 | Allow | 19 | 1 | 0 | Yes | No |
| 17015147 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | September 2020 | July 2023 | Allow | 34 | 3 | 1 | No | No |
| 17006439 | SECURE INTEGRATED-CIRCUIT SYSTEMS | August 2020 | March 2022 | Allow | 18 | 1 | 0 | No | No |
| 17002471 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE | August 2020 | September 2022 | Allow | 25 | 1 | 1 | No | No |
| 16999358 | METAL-INSULATOR-METAL (MIM) CAPACITOR | August 2020 | August 2022 | Allow | 24 | 1 | 1 | Yes | No |
| 16987440 | STACKED SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | August 2020 | September 2022 | Allow | 25 | 2 | 0 | No | No |
| 16983962 | DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF | August 2020 | February 2023 | Allow | 31 | 4 | 0 | No | No |
| 16940045 | SEMICONDUCTOR PACKAGE | July 2020 | December 2021 | Allow | 17 | 1 | 0 | No | No |
| 16922163 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | July 2020 | September 2021 | Allow | 14 | 0 | 0 | No | No |
| 16913593 | MICRO LED DISPLAY HAVING MULTI-COLOR PIXEL ARRAY AND METHOD OF FABRICATING THE SAME BASED ON INTEGRATION WITH DRIVING CIRCUIT THEREOF | June 2020 | March 2023 | Allow | 33 | 3 | 0 | Yes | No |
| 16910821 | SEMICONDUCTOR PACKAGES INCLUDING A BONDING WIRE BRANCH STRUCTURE | June 2020 | November 2021 | Allow | 17 | 0 | 1 | No | No |
| 16909517 | Packages with Thick RDLs and Thin RDLs Stacked Alternatingly | June 2020 | July 2022 | Allow | 25 | 1 | 1 | No | No |
| 16955667 | DEVICE AND METHOD FOR OBTAINING INFORMATION ABOUT LAYERS DEPOSITED IN A CVD METHOD | June 2020 | February 2023 | Allow | 32 | 2 | 1 | Yes | No |
| 16901891 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | June 2020 | September 2021 | Allow | 15 | 0 | 0 | No | No |
| 16946209 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | June 2020 | September 2022 | Allow | 28 | 3 | 0 | Yes | No |
| 16770786 | SEMICONDUCTOR DEVICE | June 2020 | October 2022 | Allow | 29 | 3 | 0 | No | No |
| 16893117 | SEMICONDUCTOR PACKAGES INCLUDING STACKED SUB-PACKAGES WITH INTERPOSING BRIDGES | June 2020 | August 2021 | Allow | 15 | 0 | 0 | No | No |
| 16885748 | SEMICONDUCTOR PACKAGES | May 2020 | February 2023 | Allow | 33 | 4 | 0 | Yes | No |
| 16884167 | SEMICONDUCTOR DEVICE | May 2020 | December 2021 | Allow | 18 | 1 | 0 | No | No |
| 16882995 | Integrated Circuit Package and Method | May 2020 | August 2021 | Allow | 15 | 1 | 0 | No | No |
| 16882624 | PRECISION THIN ELECTRONICS HANDLING INTEGRATION | May 2020 | March 2023 | Allow | 33 | 3 | 1 | No | No |
| 16881211 | Giga Interposer Integration through Chip-On-Wafer-On-Substrate | May 2020 | March 2023 | Allow | 34 | 2 | 1 | No | No |
| 16766616 | ELECTRONIC ASSEMBLY HAVING MULTIPLE SUBSTRATE SEGMENTS | May 2020 | February 2022 | Allow | 21 | 1 | 1 | No | No |
| 16880173 | Semiconductor Device and Method of Forming an Integrated SIP Module with Embedded Inductor or Package | May 2020 | March 2022 | Allow | 22 | 2 | 0 | No | No |
| 16876108 | STACKED DIE STRUCTURE AND METHOD OF FABRICATING THE SAME | May 2020 | October 2021 | Allow | 17 | 0 | 1 | No | No |
| 16869574 | SEMICONDUCTOR PACKAGE WITH DUMMY MIM CAPACITOR DIE | May 2020 | July 2022 | Allow | 26 | 2 | 0 | Yes | No |
| 16865649 | SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME | May 2020 | March 2023 | Allow | 34 | 4 | 1 | Yes | No |
| 16865452 | SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD AND STORAGE MEDIUM | May 2020 | June 2021 | Allow | 13 | 1 | 0 | No | No |
| 16851086 | TRANSISTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | April 2020 | July 2022 | Abandon | 27 | 2 | 0 | No | No |
| 16845615 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | April 2020 | October 2021 | Allow | 18 | 0 | 1 | No | No |
| 16837941 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | April 2020 | June 2022 | Allow | 26 | 2 | 1 | Yes | No |
| 16832118 | SEMICONDUCTOR DEVICE STRUCTURE WITH SERIES-CONNECTED TRANSISTOR AND RESISTOR AND METHOD FOR FORMING THE SAME | March 2020 | July 2022 | Allow | 28 | 3 | 1 | No | No |
| 16830603 | METHOD OF MANUFACTURING CZ SILICON WAFERS, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | March 2020 | July 2020 | Allow | 4 | 0 | 0 | No | No |
| 16831384 | FAN-OUT LIGHT-EMITTING DIODE (LED) DEVICE SUBSTRATE WITH EMBEDDED BACKPLANE, LIGHTING SYSTEM AND METHOD OF MANUFACTURE | March 2020 | October 2022 | Allow | 31 | 3 | 0 | No | No |
| 16831355 | Integrated Assemblies, and Methods of Forming Integrated Assemblies | March 2020 | September 2020 | Allow | 5 | 0 | 0 | No | No |
| 16829698 | SEMICONDUCTOR DEVICE WITH COMPOSITE CONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME | March 2020 | January 2022 | Allow | 22 | 2 | 0 | No | No |
| 16818826 | SEMICONDUCTOR PACKAGE FOR HIGH-SPEED DATA TRANSMISSION AND MANUFACTURING METHOD THEREOF | March 2020 | July 2022 | Allow | 28 | 2 | 1 | No | No |
| 16812270 | MODULE WITH BALL GRID ARRAY HAVING INCREASED DIE AREA | March 2020 | October 2023 | Abandon | 43 | 5 | 0 | No | No |
| 16805865 | PACKAGE COMPONENT, ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | March 2020 | July 2023 | Allow | 41 | 5 | 0 | Yes | No |
| 16801156 | PACKAGE AND MANUFACTURING METHOD THEREOF | February 2020 | February 2022 | Allow | 23 | 1 | 1 | No | No |
| 16801038 | INTEGRATED CIRCUIT COMPRISING A THREE-DIMENSIONAL CAPACITOR | February 2020 | January 2022 | Allow | 23 | 1 | 1 | No | No |
| 16797097 | VERTICAL TRANSISTOR INCLUDING SYMMETRICAL SOURCE/DRAIN EXTENSION JUNCTIONS | February 2020 | November 2021 | Allow | 21 | 1 | 1 | Yes | No |
| 16780087 | HIGH-FREQUENCY MODULE AND COMMUNICATION APPARATUS | February 2020 | January 2023 | Allow | 35 | 1 | 0 | Yes | No |
| 16779599 | SEMICONDUCTOR MEMORY DEVICE HAVING THREE-DIMENSIONAL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | February 2020 | February 2022 | Allow | 24 | 2 | 1 | Yes | No |
| 16749904 | SEMICONDUCTOR DEVICE | January 2020 | March 2022 | Allow | 26 | 2 | 0 | No | Yes |
| 16747922 | SECURE INTEGRATED-CIRCUIT SYSTEMS | January 2020 | November 2021 | Allow | 22 | 2 | 0 | No | No |
| 16744398 | Zero Mask High Density Capacitor | January 2020 | October 2022 | Allow | 33 | 4 | 0 | Yes | No |
| 16741138 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | January 2020 | October 2022 | Allow | 33 | 3 | 0 | No | No |
| 16733679 | VERTICAL FIELD EFFECT TRANSISTOR WITH BOTTOM SOURCE-DRAIN REGION | January 2020 | April 2022 | Allow | 27 | 2 | 1 | Yes | No |
| 16627790 | MICRO LIGHT EMITTING DIODE TRANSFER DEVICE AND TRANSFER METHOD | December 2019 | May 2022 | Allow | 29 | 1 | 1 | No | No |
| 16730192 | Integrated Circuit with a Fin and Gate Structure and Method Making the Same | December 2019 | January 2021 | Allow | 13 | 1 | 0 | No | No |
| 16728360 | LIGHT EMITTING DEVICE PACKAGE AND DISPLAY DEVICE HAVING THE SAME | December 2019 | July 2022 | Allow | 31 | 2 | 0 | No | No |
| 16717708 | EMBEDDED SHIELD FOR PROTECTION OF MEMORY CELLS | December 2019 | July 2022 | Allow | 31 | 2 | 1 | Yes | No |
| 16715926 | CONTROL OF WAFER BOW IN MULTIPLE STATIONS | December 2019 | July 2021 | Allow | 19 | 1 | 0 | No | No |
| 16704619 | FINFET ISOLATION STRUCTURE AND METHOD FOR FABRICATING THE SAME | December 2019 | December 2020 | Allow | 12 | 1 | 0 | No | No |
| 16702352 | LASER-FORMED INTERCONNECTS FOR REDUNDANT DEVICES | December 2019 | December 2021 | Allow | 25 | 2 | 0 | No | No |
| 16701795 | DISPLAY DEVICE | December 2019 | August 2020 | Allow | 9 | 1 | 0 | No | No |
| 16696258 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | November 2019 | November 2021 | Allow | 23 | 2 | 1 | Yes | No |
| 16689383 | LIGHT-EMITTING DEVICE WITH TRANSPARENT NANOPARTICLE ELECTRODE | November 2019 | June 2021 | Allow | 19 | 1 | 0 | No | No |
| 16689462 | SEMICONDUCTOR DEVICE WITH CRACK-DETECTING STRUCTURE AND METHOD FOR FABRICATING THE SAME | November 2019 | July 2021 | Allow | 20 | 1 | 1 | No | No |
| 16613435 | DISPLAY TRACE STRUCTURE AND DISPLAY PANEL STRUCTURE THEREOF | November 2019 | December 2021 | Abandon | 25 | 2 | 0 | No | No |
| 16684422 | DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF | November 2019 | January 2021 | Allow | 14 | 2 | 1 | No | No |
| 16680041 | Connector Formation Methods and Packaged Semiconductor Devices | November 2019 | April 2022 | Allow | 29 | 4 | 1 | Yes | No |
| 16677171 | MANUFACTURING PROCESS FOR AT LEAST ONE DIAPHRAGM UNIT OF A MEMS TRANSDUCER | November 2019 | September 2022 | Allow | 35 | 1 | 0 | No | No |
| 16670790 | SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME | October 2019 | December 2022 | Abandon | 37 | 4 | 0 | No | No |
| 16595729 | IMAGE SENSOR DEVICE | October 2019 | April 2021 | Allow | 18 | 2 | 0 | No | No |
| 16573234 | Method of Forming an Interconnect in a Semiconductor Device | September 2019 | June 2021 | Allow | 21 | 1 | 0 | Yes | No |
| 16573047 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | September 2019 | May 2021 | Allow | 20 | 1 | 0 | No | No |
| 16572831 | Residue Removal in Metal Gate Cutting Process | September 2019 | May 2021 | Allow | 20 | 1 | 0 | No | No |
| 16573653 | METHOD FOR ISOLATING GATES IN TRANSISTORS | September 2019 | January 2021 | Allow | 16 | 0 | 0 | No | No |
| 16572677 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | September 2019 | June 2021 | Abandon | 21 | 1 | 0 | No | No |
| 16572320 | Methods of Forming Air Spacers in Semiconductor Devices | September 2019 | September 2021 | Allow | 24 | 1 | 1 | No | No |
| 16571325 | METHOD FOR MANUFACTURING ACTIVE MATRIX SUBSTRATE AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE WITH TOUCH SENSOR | September 2019 | February 2021 | Allow | 17 | 0 | 1 | No | No |
| 16571944 | Controlling Threshold Voltages Through Blocking Layers | September 2019 | April 2022 | Allow | 31 | 3 | 1 | Yes | No |
| 16570686 | Metal Gate Process for FinFET Device Improvement | September 2019 | March 2020 | Allow | 6 | 0 | 0 | No | No |
| 16553812 | CLOSE PROXIMITY AND LATERAL RESISTANCE REDUCTION FOR BOTTOM SOURCE/DRAIN EPITAXY IN VERTICAL TRANSISTOR DEVICES | August 2019 | August 2020 | Allow | 12 | 1 | 0 | No | No |
| 16550135 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, ADJUSTMENT METHOD AND DISPLAY DEVICE | August 2019 | March 2021 | Abandon | 19 | 2 | 0 | No | No |
| 16541276 | METHOD AND STRUCTURE OF FORMING STRAINED CHANNELS FOR CMOS DEVICE FABRICATION | August 2019 | April 2020 | Allow | 8 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner TYNES JR., LAWRENCE C.
With a 50.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 53.8% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner TYNES JR., LAWRENCE C works in Art Unit 2816 and has examined 465 patent applications in our dataset. With an allowance rate of 90.1%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 20 months.
Examiner TYNES JR., LAWRENCE C's allowance rate of 90.1% places them in the 74% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by TYNES JR., LAWRENCE C receive 1.77 office actions before reaching final disposition. This places the examiner in the 36% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by TYNES JR., LAWRENCE C is 20 months. This places the examiner in the 92% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +3.1% benefit to allowance rate for applications examined by TYNES JR., LAWRENCE C. This interview benefit is in the 26% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 28.2% of applications are subsequently allowed. This success rate is in the 53% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 50.7% of cases where such amendments are filed. This entry rate is in the 77% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 88.9% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 68% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 83.3% of appeals filed. This is in the 76% percentile among all examiners. Of these withdrawals, 70.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 66.7% are granted (fully or in part). This grant rate is in the 71% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.4% of allowed cases (in the 58% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 1.0% of allowed cases (in the 62% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.