Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18410619 | LAYERED MOLDED DIRECT CONTACT AND DIELECTRIC STRUCTURE AND METHOD FOR MAKING THE SAME | January 2024 | February 2026 | Allow | 25 | 3 | 1 | No | No |
| 18472269 | SOUND PRODUCING CELL | September 2023 | August 2024 | Allow | 11 | 1 | 1 | No | No |
| 18358907 | PACKAGE STRUCTURE, APPARATUS AND FORMING METHODS THEREOF | July 2023 | February 2026 | Allow | 30 | 3 | 1 | No | No |
| 18341151 | GATE STRUCTURE AND METHOD | June 2023 | February 2026 | Allow | 31 | 0 | 1 | No | No |
| 18328797 | SYSTEM-ON-WAFER STRUCTURE AND FABRICATION METHOD | June 2023 | November 2023 | Allow | 5 | 0 | 0 | No | No |
| 18179406 | Shielded Ball-Out and Via Patterns for Land Grid Array (LGA) Devices | March 2023 | October 2025 | Allow | 31 | 0 | 0 | No | No |
| 18174693 | ALLOY FOR METAL UNDERCUT REDUCTION | February 2023 | October 2025 | Allow | 31 | 0 | 1 | No | No |
| 18173283 | INTERCONNECT STRUCTURE | February 2023 | February 2026 | Allow | 36 | 1 | 1 | No | No |
| 18162183 | JOINT STRUCTURE | January 2023 | May 2025 | Allow | 28 | 1 | 0 | Yes | No |
| 18048027 | SOUND PRODUCING CELL AND MANUFACTURING METHOD THEREOF | October 2022 | February 2024 | Allow | 16 | 1 | 2 | No | No |
| 17941264 | METHODS FOR VFET CELL PLACEMENT AND CELL ARCHITECTURE | September 2022 | September 2025 | Allow | 36 | 0 | 0 | No | No |
| 17884301 | Interconnects including graphene capping and graphene barrier layers | August 2022 | July 2025 | Allow | 35 | 0 | 1 | No | No |
| 17873168 | SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | July 2022 | October 2025 | Allow | 39 | 1 | 1 | No | No |
| 17752567 | BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN | May 2022 | July 2025 | Allow | 38 | 0 | 1 | No | No |
| 17746702 | ADVANCED SPEECH ENCODING DUAL MICROPHONE CONFIGURATION (DMC) | May 2022 | September 2025 | Allow | 40 | 0 | 0 | No | No |
| 17661363 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | April 2022 | January 2026 | Abandon | 45 | 2 | 1 | No | No |
| 17722593 | TRENCH-GATE TRANSISTOR WITH GATE DIELECTRIC HAVING A FIRST THICKNESS BETWEEN THE GATE ELECTRODE AND THE CHANNEL REGION AND A SECOND GREATER THICKNESS BETWEEN THE GATE ELECTRODE AND THE SOURCE/DRAIN REGIONS | April 2022 | August 2023 | Allow | 16 | 3 | 0 | Yes | No |
| 17706277 | STRUCTURE AND METHOD FOR SRAM FINFET DEVICE HAVING AN OXIDE FEATURE | March 2022 | September 2023 | Allow | 17 | 0 | 0 | No | No |
| 17652847 | THIN-FILM TRANSISTOR ARRAY SUBSTRATE WITH CONNECTION NODE AND DISPLAY DEVICE INCLUDING THE SAME | February 2022 | July 2025 | Allow | 41 | 4 | 1 | Yes | No |
| 17648156 | Melt Anneal Source and Drain Regions | January 2022 | August 2023 | Allow | 19 | 0 | 1 | No | No |
| 17548205 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE WITH BUMP INTERCONNECTION | December 2021 | February 2024 | Allow | 27 | 1 | 1 | No | No |
| 17516864 | Arrays Of Capacitors, Methods Used In Forming Integrated Circuitry, And Methods Used In Forming An Array Of Capacitors | November 2021 | January 2026 | Allow | 51 | 2 | 1 | No | No |
| 17515678 | DISPLAY PANEL AND SMART CONTACT LENS INCLUDING THE DISPLAY PANEL | November 2021 | May 2025 | Allow | 42 | 1 | 1 | No | No |
| 17453045 | VERTICAL THIN FILM TRANSISTOR WITH PERFORATED OR COMB-GATE ELECTRODE CONFIGURATION AND FABRICATION METHODS FOR SAME | November 2021 | February 2026 | Allow | 52 | 0 | 1 | No | No |
| 17515017 | IMAGE SENSOR INCLUDING COLOR SEPARATING LENS ARRAY AND ELECTRONIC DEVICE INCLUDING THE IMAGE SENSOR | October 2021 | September 2025 | Allow | 46 | 1 | 1 | Yes | No |
| 17501464 | Gate-All-Around Floating-Gate Field Effect Memory Transistor Constructions Including Ferroelectric Gate Insulator | October 2021 | May 2023 | Allow | 19 | 0 | 1 | No | No |
| 17449352 | METHODS OF FORMING AN APPARATUS INCLUDING LAMINATE SPACER STRUCTURES | September 2021 | March 2023 | Allow | 18 | 0 | 0 | No | No |
| 17476663 | DRAM with a hydrogen-supply layer and a high-capacitance embedded capacitor with a cylindrical storage node | September 2021 | March 2023 | Allow | 18 | 0 | 0 | No | No |
| 17465590 | FORMING VIRTUAL MICROPHONE ARRAYS USING DUAL OMNIDIRECTIONAL MICROPHONE ARRAY (DOMA) | September 2021 | September 2023 | Allow | 25 | 1 | 0 | No | No |
| 17461963 | Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads | August 2021 | June 2025 | Allow | 45 | 1 | 1 | No | No |
| 17458867 | HIGH VOLTAGE PMOS (HVPMOS) TRANSISTOR WITH A COMPOSITE DRIFT REGION AND MANUFACTURE METHOD THEREOF | August 2021 | March 2026 | Abandon | 54 | 4 | 1 | Yes | No |
| 17412721 | TREATMENTS FOR CONTROLLING DEPOSITION DEFECTS | August 2021 | September 2023 | Allow | 25 | 0 | 1 | No | No |
| 17411599 | CHEMICAL MECHANICAL POLISHING FOR COPPER DISHING CONTROL | August 2021 | March 2024 | Allow | 30 | 2 | 0 | No | No |
| 17409900 | Three-dimensional memory stack structure with source line including an insulating dividing portion | August 2021 | March 2025 | Allow | 42 | 1 | 1 | No | No |
| 17407669 | Revising IC Layout Design to Eliminate Gaps Between Isolation Structures | August 2021 | August 2025 | Allow | 48 | 3 | 1 | Yes | No |
| 17408273 | INTEGRATION OF INDUCTORS WITH ADVANCED-NODE SYSTEM-ON-CHIP (SOC) USING GLASS WAFER WITH INDUCTORS AND WAFER-TO-WAFER JOINING | August 2021 | February 2026 | Abandon | 54 | 2 | 1 | No | No |
| 17406473 | Trench-gate power MOSFET with buried field plates | August 2021 | March 2025 | Allow | 43 | 3 | 1 | No | No |
| 17406861 | Structure and Method for Vertical Tunneling Field Effect Transistor with Leveled Source and Drain | August 2021 | September 2023 | Allow | 25 | 1 | 1 | No | No |
| 17404271 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | August 2021 | October 2024 | Abandon | 38 | 1 | 1 | No | No |
| 17403154 | SEMICONDUCTOR DEVICES INCLUDING THROUGH-SILICON-VIAS AND METHODS OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGES INCLUDING THE SEMICONDUCTOR DEVICES | August 2021 | February 2024 | Allow | 30 | 1 | 1 | Yes | No |
| 17401067 | Multi-Gate Field-Effect Transistors And Methods Of Forming The Same | August 2021 | August 2025 | Allow | 48 | 2 | 0 | Yes | No |
| 17399754 | Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials | August 2021 | August 2024 | Allow | 37 | 0 | 1 | No | No |
| 17398649 | Thin film transistor including a stacked multilayer graphene active layer | August 2021 | August 2024 | Allow | 36 | 1 | 1 | No | No |
| 17397777 | THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS | August 2021 | February 2025 | Allow | 43 | 1 | 1 | No | No |
| 17395195 | Radical Etching in Gate Formation | August 2021 | April 2025 | Allow | 44 | 3 | 0 | Yes | No |
| 17384832 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | July 2021 | September 2025 | Abandon | 50 | 2 | 1 | No | No |
| 17384667 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | July 2021 | April 2024 | Allow | 33 | 1 | 1 | No | No |
| 17380652 | Die Bonding Apparatus, Cleaning Head and Manufacturing Method for Semiconductor Device | July 2021 | April 2024 | Allow | 33 | 1 | 1 | No | No |
| 17381030 | SELF ALIGNED MULTIPLE PATTERNING | July 2021 | November 2023 | Allow | 28 | 0 | 1 | No | No |
| 17376580 | MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING IMPROVED SIGNAL DISTORTION | July 2021 | March 2026 | Allow | 56 | 3 | 1 | Yes | No |
| 17376539 | MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT | July 2021 | May 2025 | Allow | 46 | 2 | 1 | Yes | No |
| 17368887 | PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT OF PLASMA PROCESSING APPARATUS | July 2021 | July 2023 | Allow | 25 | 0 | 0 | Yes | No |
| 17354046 | Method of Manufacturing a Semiconductor Structure | June 2021 | May 2025 | Allow | 46 | 2 | 1 | No | No |
| 17304179 | WIDE-BASE MAGNETIC TUNNEL JUNCTION DEVICE WITH SIDEWALL POLYMER SPACER | June 2021 | March 2024 | Allow | 33 | 1 | 1 | Yes | No |
| 17349501 | SEMICONDUCTOR MEMORY DEVICE | June 2021 | January 2025 | Allow | 43 | 1 | 1 | No | No |
| 17343291 | VERTICALLY STACKED FIN SEMICONDUCTOR DEVICES | June 2021 | July 2025 | Allow | 49 | 4 | 1 | Yes | No |
| 17335502 | Gate-all-around transistor with reduced source/drain contact resistance | June 2021 | August 2024 | Allow | 39 | 2 | 0 | No | No |
| 17329484 | V-NAND STACKS WITH DIPOLE REGIONS | May 2021 | March 2024 | Allow | 34 | 1 | 1 | No | No |
| 17302769 | VERTICAL THIN FILM TRANSISTOR WITH SINGLE GATE ELECTRODE WITH MICRO-PERFORATIONS | May 2021 | September 2023 | Allow | 28 | 1 | 1 | No | No |
| 17221355 | CROSS-COUPLED GATE DESIGN FOR STACKED DEVICE WITH SEPARATED TOP-DOWN GATE | April 2021 | September 2024 | Allow | 42 | 3 | 1 | Yes | No |
| 17212509 | Display devices including conversion layers with quantum dots and low-refraction color filters | March 2021 | February 2025 | Allow | 47 | 3 | 1 | Yes | No |
| 17204678 | METHOD FOR FABRICATING A MAGNETORESISTIVE ELEMENT COMPRISING DISCONTINUOUS INTERCONNECT SEGMENTS | March 2021 | December 2024 | Allow | 45 | 3 | 1 | No | No |
| 17275202 | Display device with bending region having layers including high refractive particles | March 2021 | December 2024 | Allow | 45 | 1 | 3 | No | No |
| 17275242 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | March 2021 | May 2024 | Allow | 38 | 1 | 1 | Yes | No |
| 17199237 | SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY | March 2021 | October 2025 | Allow | 55 | 3 | 1 | No | No |
| 17274939 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | March 2021 | February 2024 | Allow | 35 | 0 | 1 | Yes | No |
| 17274871 | SUBSTRATE FOR DISPLAY | March 2021 | June 2025 | Abandon | 51 | 2 | 2 | No | No |
| 17275078 | Apparatus and Method for Forming a Layer of a Material Provided in a Flowable State on an Optoelectronic Light-Emitting Device | March 2021 | December 2024 | Allow | 45 | 1 | 3 | No | No |
| 17194694 | MAGNETORESISTANCE EFFECT ELEMENT | March 2021 | November 2023 | Allow | 32 | 1 | 1 | No | No |
| 17194364 | DISPLAY PANEL AND DISPLAY APPARATUS INCLUDING THE SAME | March 2021 | August 2025 | Allow | 53 | 0 | 2 | No | No |
| 17192603 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY-UNDULATING MEMORY MATERIAL LAYERS AND METHODS FOR FORMING THE SAME | March 2021 | September 2023 | Allow | 30 | 1 | 1 | No | No |
| 17087600 | SINGLE-CHIP CONTAINING POROUS-WAFER BATTERY AND DEVICE AND METHOD OF MAKING THE SAME | November 2020 | December 2024 | Abandon | 49 | 0 | 1 | No | No |
| 17086754 | Metal Contact Structure and Method of Forming the Same in a Semiconductor Device | November 2020 | September 2023 | Allow | 34 | 2 | 0 | No | No |
| 17064471 | DRY ETCH BACK SUBSTRATE INTERCONNECTIONS | October 2020 | February 2024 | Abandon | 40 | 0 | 1 | No | No |
| 16948745 | CONTACT FORMATION METHOD AND RELATED STRUCTURE | September 2020 | February 2023 | Allow | 28 | 1 | 1 | No | No |
| 17018031 | Fin field effect transistor having conformal and non-conformal gate dielectric layers | September 2020 | August 2024 | Allow | 47 | 1 | 1 | Yes | No |
| 17009693 | WIRING FORMATION METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | September 2020 | September 2023 | Allow | 36 | 2 | 1 | No | Yes |
| 17007241 | Trench vertical power MOSFET with channel including regions with different concentrations | August 2020 | December 2022 | Allow | 27 | 0 | 1 | No | No |
| 17007684 | Back Side Illuminated Image Sensor with Deep Trench Isolation Structures and Self-Aligned Color Filters | August 2020 | July 2022 | Allow | 22 | 4 | 1 | No | No |
| 17001212 | TRENCH-GATE TRANSISTOR WITH GATE DIELECTRIC HAVING A FIRST THICKNESS BETWEEN THE GATE ELECTRODE AND THE CHANNEL REGION AND A SECOND GREATER THICKNESS BETWEEN THE GATE ELECTRODE AND THE SOURCE/DRAIN REGIONS. | August 2020 | March 2022 | Allow | 19 | 1 | 1 | No | No |
| 16996010 | FIELD EFFECT TRANSISTOR WITH ASYMMETRIC GATE STRUCTURE AND METHOD | August 2020 | February 2022 | Allow | 18 | 0 | 1 | No | No |
| 16985242 | METHOD FOR FABRICATING A METAL GATE TRANSISTOR WITH A STACKED DOUBLE SIDEWALL SPACER STRUCTURE | August 2020 | April 2023 | Allow | 32 | 4 | 0 | No | No |
| 16942781 | FinFET having a gate dielectric comprising a multi-layer structure including an oxide layer with different thicknesses on side and top surfaces of the fins | July 2020 | August 2022 | Allow | 25 | 2 | 1 | No | No |
| 16942474 | MULTI-CHIP MODULES INCLUDING STACKED SEMICONDUCTOR DICE | July 2020 | April 2021 | Allow | 9 | 1 | 1 | No | No |
| 16933890 | Lateral Transistors and Methods with Low-Voltage-Drop Shunt to Body Diode | July 2020 | March 2023 | Allow | 32 | 0 | 0 | No | No |
| 16960349 | LOCKABLE SEMICONDUCTOR DIE, AN ELECTRONIC DEVICE INCLUDING LOCKABLE SEMICONDUCTOR DIES AND METHOD OF PRODUCTION | July 2020 | October 2023 | Abandon | 39 | 0 | 1 | No | No |
| 16920168 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD FOR FABRICATING THE SAME | July 2020 | March 2023 | Allow | 33 | 0 | 2 | No | No |
| 16913061 | Structure and Method for SRAM FinFET Device Having an Oxide Feature | June 2020 | November 2021 | Allow | 17 | 2 | 0 | No | No |
| 16899568 | MEMORY PACKAGE STRUCTURE | June 2020 | March 2022 | Allow | 21 | 1 | 0 | No | No |
| 16878031 | Bottom-gate TFT including gate sidewall spacers formed to relax the local electric field concentration | May 2020 | December 2022 | Allow | 31 | 2 | 1 | No | No |
| 16876460 | ELECTRONIC PACKAGE | May 2020 | February 2024 | Abandon | 45 | 5 | 0 | No | No |
| 16874722 | PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES | May 2020 | November 2022 | Allow | 30 | 2 | 2 | Yes | No |
| 16870642 | PACKAGE COMPRISING DISCRETE ANTENNA DEVICE | May 2020 | December 2023 | Allow | 43 | 4 | 2 | No | No |
| 16866390 | Magnetoresistive Random Access Memory Cell and Fabricating the Same | May 2020 | July 2022 | Allow | 26 | 2 | 1 | No | No |
| 16759608 | Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrier | April 2020 | September 2022 | Allow | 29 | 2 | 1 | No | No |
| 16845567 | SEMICONDUCTOR PACKAGE DEVICE | April 2020 | February 2022 | Allow | 22 | 1 | 1 | No | No |
| 16837299 | IMAGE SENSOR WITH ENHANCED MULTI-SUBSTRATE STRUCTURES AND INTERCONNECTS | April 2020 | May 2024 | Abandon | 49 | 2 | 1 | Yes | No |
| 16798404 | SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | February 2020 | October 2022 | Allow | 32 | 1 | 2 | No | No |
| 16793406 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | February 2020 | August 2022 | Abandon | 30 | 0 | 1 | No | No |
| 16792905 | CHIP PACKAGE STRUCTURE | February 2020 | February 2022 | Allow | 24 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner PIZARRO CRESPO, MARCOS D.
With a 19.5% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 29.1% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner PIZARRO CRESPO, MARCOS D works in Art Unit 2814 and has examined 901 patent applications in our dataset. With an allowance rate of 70.7%, this examiner has a below-average tendency to allow applications. Applications typically reach final disposition in approximately 33 months.
Examiner PIZARRO CRESPO, MARCOS D's allowance rate of 70.7% places them in the 33% percentile among all USPTO examiners. This examiner has a below-average tendency to allow applications.
On average, applications examined by PIZARRO CRESPO, MARCOS D receive 2.24 office actions before reaching final disposition. This places the examiner in the 62% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by PIZARRO CRESPO, MARCOS D is 33 months. This places the examiner in the 48% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +15.8% benefit to allowance rate for applications examined by PIZARRO CRESPO, MARCOS D. This interview benefit is in the 56% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 20.6% of applications are subsequently allowed. This success rate is in the 23% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.
This examiner enters after-final amendments leading to allowance in 28.7% of cases where such amendments are filed. This entry rate is in the 41% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 33.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 33% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 61.0% of appeals filed. This is in the 38% percentile among all examiners. Of these withdrawals, 35.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 68.0% are granted (fully or in part). This grant rate is in the 75% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 10.5% of allowed cases (in the 94% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 7.8% of allowed cases (in the 86% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.